WO2022215521A1 - 二液硬化型樹脂組成物及びその硬化物 - Google Patents
二液硬化型樹脂組成物及びその硬化物 Download PDFInfo
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- WO2022215521A1 WO2022215521A1 PCT/JP2022/013414 JP2022013414W WO2022215521A1 WO 2022215521 A1 WO2022215521 A1 WO 2022215521A1 JP 2022013414 W JP2022013414 W JP 2022013414W WO 2022215521 A1 WO2022215521 A1 WO 2022215521A1
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- ZFDXZGUFUMAREO-UHFFFAOYSA-N [1-(hydroxymethyl)-2-phenylimidazol-4-yl]methanol Chemical compound OCC1=CN(CO)C(C=2C=CC=CC=2)=N1 ZFDXZGUFUMAREO-UHFFFAOYSA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 1
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- MQQXUGFEQSCYIA-OAWHIZORSA-M aluminum;(z)-4-ethoxy-4-oxobut-2-en-2-olate;propan-2-olate Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CCOC(=O)\C=C(\C)[O-] MQQXUGFEQSCYIA-OAWHIZORSA-M 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- XMSVKICKONKVNM-UHFFFAOYSA-N bicyclo[2.2.1]heptane-3,4-diamine Chemical compound C1CC2(N)C(N)CC1C2 XMSVKICKONKVNM-UHFFFAOYSA-N 0.000 description 1
- SMTOKHQOVJRXLK-UHFFFAOYSA-N butane-1,4-dithiol Chemical compound SCCCCS SMTOKHQOVJRXLK-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- UOQACRNTVQWTFF-UHFFFAOYSA-N decane-1,10-dithiol Chemical compound SCCCCCCCCCCS UOQACRNTVQWTFF-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- KEIQPMUPONZJJH-UHFFFAOYSA-N dicyclohexylmethanediamine Chemical compound C1CCCCC1C(N)(N)C1CCCCC1 KEIQPMUPONZJJH-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- QMHNQZGXPNCMCO-UHFFFAOYSA-N n,n-dimethylhexan-1-amine Chemical compound CCCCCCN(C)C QMHNQZGXPNCMCO-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical class NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Definitions
- the present invention relates to a two-part curable resin composition and its cured product.
- Epoxy resins have traditionally been used as adhesives, encapsulants, sealants, potting agents, coating agents, conductive pastes, etc., due to their excellent adhesive strength, sealing properties, high strength, heat resistance, electrical properties, and chemical resistance. has been used for various purposes. However, although such a cured epoxy resin exhibits high mechanical strength, it has a problem of poor extensibility.
- JP-A-2007-099806 describes liquid A containing an epoxy resin and a modified silicone-based polymer curing catalyst, a modified silicone-based polymer having an alkoxysilyl group at the end, and an epoxy resin curing agent.
- a two-component curable resin composition consisting of a B component in which is blended.
- the two-component curing resin composition disclosed in JP-A-2007-099806 uses a dibutyltin catalyst as a curing agent for modified silicone resins. Since the dibutyltin catalyst has a large environmental load, there is a movement to restrict its use in various countries. Therefore, there is a strong demand for alternative catalysts to dibutyltin catalysts.
- Zirconium catalysts, phosphoric acid, etc. can be cited as alternatives to dibutyltin catalysts.
- the resin composition using zirconium has a problem of poor storage stability as shown in Comparative Example 3 of this specification.
- the resin composition using phosphoric acid has a problem that the catalyst is deactivated by the epoxy resin curing agent, and the curability after mixing the two components is impaired. there were.
- An object of the present invention is to provide a two-component curable resin composition that does not use a dibutyltin catalyst, has excellent storage stability, rapidly cures when mixed, and provides a cured product with high elongation and high strength. do.
- a two-pack curable resin composition comprising the following agents A and B.
- Agent A Composition containing components (a) and (b) Component (a): hydrogenated epoxy resin
- Component (c) organic polymer having two or more hydrolyzable silyl groups
- component curing agent for component (a)
- the two-component curing according to [1] which contains 0.1 to 20 parts by mass of component (b) with respect to 100 parts by mass of component (c).
- X to Y means a range including the numerical values (X and Y) described before and after it as lower and upper limits, and means “X or more and Y or less”.
- concentration “%” represents mass concentration “mass %” unless otherwise specified, and the ratio is a mass ratio unless otherwise specified.
- operations and measurements of physical properties are performed under the conditions of room temperature (20 to 25° C.)/relative humidity of 40 to 50% RH.
- a two-component curable resin composition according to one embodiment of the present invention comprises an agent A, which is a composition containing components (a) and (b) described later, and components (c) and (d) described later. It consists of B agent which is a composition to contain. Furthermore, agent A of the two-component curable resin composition according to one embodiment of the present invention may contain any component other than components (a) and (b), and agent B may contain components (c) and (d). ) component can be included. For example, agent A may contain component (e) and/or component (f), and agent B may contain component (e).
- a two-pack curable resin composition according to one embodiment of the present invention comprises the following agents A and B.
- Agent A Composition containing components (a) and (b) Component (a): hydrogenated epoxy resin
- Agent B Composition containing components (c) and (d) Component (c): organic polymer having two or more hydrolyzable silyl groups
- Component Curing Agent for Component (a)
- a cured product having excellent storage stability, rapid curing upon mixing, high elongation and high strength can be obtained without using a dibutyltin catalyst. It is possible to provide the resulting two-component curable resin composition.
- the A agent of the two-component curable resin composition of this embodiment contains a hydrogenated epoxy resin as the component (a).
- the two-component curing resin composition of the present embodiment has excellent storage stability, cures quickly by mixing the A agent and the B agent, and has a high It is elongation, and a cured product having high strength can be obtained.
- the (a) component is not particularly limited, but for example, a hydrogenated bisphenol A epoxy resin (also referred to as a hydrogenated bisphenol A epoxy resin.
- hydrogenation is also referred to as “hydrogenation"
- Hydrogenated bisphenol F type epoxy resin Hydrogenated bisphenol E type epoxy resin, hydrogenated bisphenol type epoxy resin; hydrogenated cresol novolac type epoxy resin; hydrogenated phenol novolac type epoxy resin; Epoxy resins are preferred, and hydrogenated bisphenol A type epoxy resins are more preferred.
- Component (a) can be used either alone or in combination of two or more.
- component (a) examples include YX8000 (hydrogenated bisphenol A type epoxy resin), YX8034 (hydrogenated bisphenol A type epoxy resin) (both manufactured by Mitsubishi Chemical Corporation), HBE-100 (hydrogenated bisphenol A type epoxy resin) (manufactured by Shin Nippon Rika Co., Ltd.), ST-3000 (hydrogenated bisphenol A type epoxy resin) (manufactured by Nippon Steel Chemical & Materials Co., Ltd.) and the like, but are not limited to these. These may be used alone or in combination of two or more.
- the content of component (a) in the two-component curing resin composition of the present embodiment is preferably 1 to 500 parts by mass, more preferably 10 to 300 parts by mass, with respect to 100 parts by mass of component (c). is more preferable, 50 to 200 parts by mass is more preferable, and 70 to 150 parts by mass is particularly preferable.
- the cured product of the two-component curing resin composition according to the present embodiment has higher elongation and higher strength.
- Component (b) contained in agent A of the two-component curable resin composition of the present embodiment is selected from the group consisting of titanium dialkoxybis(acetylacetonate), titanium tetraisopropoxide, tetra-tertiary-butyl titanate and an aluminum catalyst. is one or more compounds that are By combining these (b) components with the other components of the present embodiment, the two-part curable resin composition of the present embodiment has excellent storage stability, cures quickly by mixing Agent A and Agent B, and , a cured product having high elongation and high strength can be obtained.
- Component (b) has excellent storage stability, cures quickly by mixing agent A and agent B, and provides a cured product with higher elongation and higher strength. Titanium dialkoxybis ( Acetylacetonate), titanium tetraisopropoxide, and one or more compounds selected from the group consisting of an aluminum catalyst.
- component (b) contains titanium dialkoxybis(acetylacetonate) from the viewpoint that the mixture of agent A and agent B cures more rapidly and obtains a cured product with sufficiently high elongation.
- the titanium dialkoxybis(acetylacetonate) is more preferably titanium diisopropoxybis(acetylacetonate). These may be used alone or in combination of two or more.
- component (b) Commercially available products of component (b) are not particularly limited, but examples include titanium tetraisopropoxide such as TA-8 (manufactured by Matsumoto Fine Chemicals Co., Ltd.), and tetratertiarybutyl titanate such as TA-80 (Matsumoto Fine Chemical Co., Ltd.), and examples of titanium dialkoxybis (acetylacetonate) include titanium diisopropoxy bis (acetylacetonate) such as TC-100 and TC-120 (Matsumoto Fine Chemical Co., Ltd.).
- DX-9740 Shin-Etsu Chemical Co., Ltd.
- AMD As an aluminum catalyst, DX-9740 (Shin-Etsu Chemical Co., Ltd.), AMD, ASBD, AIPD, ALCH, ALCH-TR, aluminum chelate M, aluminum chelate D, aluminum chelate A (manufactured by Kawaken Fine Chemicals Co., Ltd.), etc. mentioned.
- the content of component (b) in agent A of the present embodiment is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 15 parts by mass, per 100 parts by mass of component (a). parts, more preferably 1 to 10 parts by mass, and particularly preferably 2 to 5 parts by mass.
- the cured product of the two-part curable resin composition according to the present embodiment has sufficiently high elongation and high strength.
- the content of the component (b) in the two-component curable resin composition of the present embodiment is preferably 0.1 to 20 parts by mass of the component (b) with respect to 100 parts by mass of the component (c) described later. , more preferably 0.3 to 17 parts by mass, still more preferably 0.5 to 13 parts by mass, and particularly preferably 1 to 7 parts by mass. Within the above range, when the agent A and the agent B are mixed, they are cured more rapidly and have excellent storage stability.
- the component (c) contained in the B agent of the two-component curable resin composition of this embodiment is an organic polymer having two or more hydrolyzable silyl groups.
- Component (c) includes, for example, an organic polymer having a dimethoxysilyl group, an organic polymer having a trimethoxysilyl group, an organic polymer having a diethoxysilyl group, or an organic polymer having a triethoxysilyl group. . These compounds can be used singly or in combination of two or more.
- the component (c) preferably contains an organic polymer having a trimethoxysilyl group, more preferably a combination of an organic polymer having a dimethoxysilyl group and an organic polymer having a trimethoxysilyl group.
- an organic polymer having a dimethoxysilyl group and an organic polymer having a trimethoxysilyl group in combination, the storage stability of agent B can be further improved without using a dibutyltin catalyst, and furthermore, agent A and B It can cure more quickly when mixed with the agent.
- the hydrolyzable silyl group of component (c) may be bonded to the terminal or side chain of the organic polymer. is preferably attached to the terminal of the organic polymer, and more preferably the hydrolyzable silyl group is attached to both terminals of the organic polymer.
- the component (c) is preferably liquid at 25°C from the viewpoint of handling.
- (c) component may be used individually by 1 type, and may mix and use 2 or more types.
- Examples of the organic polymer having a dimethoxysilyl group include polyoxyalkylene containing both terminal dimethoxysilyl groups, (meth)acrylic polymer containing both terminal dimethoxysilyl groups, polyisobutylene containing both terminal dimethoxysilyl groups, and both terminal dimethoxysilyl groups.
- Group-containing polyurethanes may be mentioned.
- Examples of the organic polymer having a trimethoxysilyl group include polyoxyalkylene containing trimethoxysilyl groups at both ends, (meth)acrylic polymer containing trimethoxysilyl groups at both ends, polyisobutylene containing trimethoxysilyl groups at both ends, Examples include polyurethanes containing trimethoxysilyl groups at both ends.
- Examples of the organic polymer having diethoxysilyl groups include (meth)acrylic polymers containing diethoxysilyl groups at both ends, polyisobutylene containing diethoxysilyl groups at both ends, and polyurethanes containing diethoxysilyl groups at both ends. .
- Organic polymers having triethoxysilyl groups include (meth)acrylic polymers containing triethoxysilyl groups at both ends, polyisobutylene containing triethoxysilyl groups at both ends, and polyurethanes containing triethoxysilyl groups at both ends.
- the structure of the organic polymer of component (c) is not particularly limited, but examples include polyoxyalkylene, polyester, polycarbonate, polyurethane, polyamide, polyurea, polyimide, polyethylene, polypropylene, polyisobutylene, (meth)acrylic polymer, and polystyrene. , polyvinyl chloride, polybutadiene, polyisoprene, polyvinyl butyral, polyvinyl ether, and the like. Among them, from the viewpoint that a cured product having high elongation and high strength can be obtained by mixing agent A and agent B, the structure of the organic polymer of component (c) is polyoxyalkylene or polyisobutylene. , (meth)acrylic polymer and the like are preferred, and polyoxyalkylene is more preferred. Further, the structure of the organic polymer of the component (c) may be one type alone or a mixture of two or more types.
- polyoxyalkylene products include SAT010, SAX115, SAT030, SAT030, SAT200, SAT350, SAT400, SAX220, SAX510, SAX530, SAX575, SAX580, SAX710, SAX720, SAX725, SAX750, SAX770, S203, S303, S303H303H , S943S, S911S, MA440, MA447, MA451, MA903, MA903M, MA904, S943, MAX923, MAX951, SAX510, SAX520, SAX530, SAX580, etc.
- the content of component (c) in the two-component curable resin composition of the present embodiment is preferably 0.1 to 200 parts by mass of component (c) per 100 parts by mass of component (a). It is more preferably 150 parts by mass, and still more preferably in the range of 10 to 120 parts by mass. Further, when the two-component curable resin composition of the present embodiment contains component (f), which will be described later, the total amount of component (a) and component (f) is 100 parts by mass, and component (c) is 30 parts by mass. It is preferably in the range of up to 200 parts by mass, more preferably in the range of 50 to 150 parts by mass, even more preferably in the range of 70 to 120 parts by mass. When the content is within the above range, mixing of the A agent and the B agent causes rapid curing, and a cured product having high elongation and high strength can be obtained.
- the (d) component contained in the B component of the two-component curable resin composition of the present embodiment is a curing agent for the (a) component, and cures the hydrogenated epoxy resin which is the (a) component contained in the A component. It is a compound that can Component (d) is not particularly limited as long as component (a) can be cured. Examples include primary amines, secondary amines, tertiary amines, polyamides, imidazoles, polymercaptans, and acid anhydride compounds. . Moreover, (d) component may use these independently, or may use 2 or more types together.
- the primary amine is not particularly limited, but includes aliphatic primary amines, alicyclic primary amines, aromatic primary amines, and the like.
- aliphatic primary amines include, but are not limited to, ethylenediamine, diethylenetriamine, triethylenetetramine, hexamethylenediamine, and the like.
- the alicyclic primary amines are not particularly limited, but include mencenediamine, isophoronediamine, N-aminoethylpiperazine, diaminodicyclohexylmethane, norbornanediamine, and the like.
- the aromatic primary amines are not particularly limited, but include metaxylylenediamine, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiethyldiphenylmethane, and the like.
- the amino group-containing silane coupling agent shall not be included in the (d) component, but shall be handled as the (e) component mentioned later.
- Secondary amines and tertiary amines are not particularly limited, but examples include 2,4,6-tris(dimethylaminomethyl)phenol, piperidine, pyridine, benzyldimethylamine, 2-(dimethylaminomethyl)phenol, and triethylenediamine. , dimethylcyclohexylamine, dimethylbenzylamine, dimethylhexylamine, dimethylaminomethylphenol, bis(dimethylaminomethyl)phenol, dimethylaminophenol, dimethylamino p-cresol. Examples of commercially available products include Ankamin K54 (Air Products Japan Co., Ltd.). As secondary amines and tertiary amines, compounds having an aromatic ring are preferable from the viewpoint of excellent curability.
- the component (d) is preferably an amine compound that is liquid at 25°C from the viewpoint of workability and curability after mixing the agents A and B.
- examples of those that are liquid at 25° C. include 2,4,6-trisdimethylaminomethylphenol, polyamidoamine, and dimer diamine.
- imidazole is not particularly limited, but examples include 2-methylimidazole, 1,2-dimethylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-isobutyl-2-methylimidazole.
- polymercaptans include, but are not limited to, 3,3′-dithiodipropionic acid, trimethylolpropane tris (thioglycolate), pentaerythritol tetrakis (thioglycolate), ethylene glycol dithioglycolate, 1,4 -bis(3-mercaptobutyryloxy)butane, tris[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (TEMPIC), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3 ,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolpropane tris(3-mercaptopropionate) (TMMP), pentaerythritol tetrakis(3-mercaptopropionate) (PEMP) , pentaerythritol tetrakis(3-
- Alkyl polythiols of; terminal thiol group-containing polythioethers, and the like are preferable because the curability is remarkably improved by using a tertiary amine or the like in combination.
- acid anhydride compounds include, but are not limited to, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylendoethylenetetrahydrophthalic anhydride, and trialkyltetrahydrophthalic anhydride. acids, methyl nadic anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride and the like.
- the content of component (d) in the two-component curing resin composition of the present embodiment is preferably 1 to 150 parts by mass of component (d) with respect to 100 parts by mass of component (a), and 1 to 100 parts by mass. It is more preferably 3 to 50 parts by mass.
- the content of the component (d) is 1 per 100 parts by mass of the total amount of the components (a) and (f). It is preferably up to 180 parts by mass, more preferably 3 to 140 parts by mass, even more preferably 5 to 100 parts by mass. Within the above range, the curability after mixing the agents A and B is good, and the storage stability is excellent.
- the content of the component (d) in the B agent of the two-part curable resin composition of the present embodiment is 1 to 150 parts by mass of the component (d) with respect to 100 parts by mass of the component (c). It is preferably from 1 to 100 parts by mass, and even more preferably from 3 to 50 parts by mass. Within the above range, the curability after mixing the agents A and B is excellent, and the storage stability of the agent B is excellent.
- the A agent and/or the B agent of the two-component curable resin composition according to this embodiment may contain a silane coupling agent as the (e) component.
- a silane coupling agent in the A agent and/or the B agent, the storage stability becomes more excellent, and a cured product with high elongation can be obtained.
- Silane coupling agents include, for example, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, glycidylpropyltrimethoxysilane ( 3-glycidoxypropyltrimethoxysilane), 3-glycidoxypropylmethyldiethoxysilane and other glycidyl group-containing silane coupling agents; vinyltris( ⁇ -methoxyethoxy)silane, vinyltriethoxysilane, vinyltrimethoxysilane, etc.
- vinyl group-containing silane coupling agents ⁇ -methacryloxypropyltrimethoxysilane and other (meth)acrylic group-containing silane coupling agents; amino group-containing silane coupling agents such as ethyl)- ⁇ -aminopropyltrimethoxysilane), ⁇ -aminopropyltriethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane; ⁇ -mercaptopropyltrimethoxysilane, ⁇ -chloropropyltrimethoxysilane, styrylsilane, ureidosilane, sulfidesilane, isocyanatesilane, and the like.
- glycidyl group-containing silane coupling agents vinyl group-containing silane coupling agents, and amino group-containing silane coupling agents are preferable as the silane coupling agent.
- the agent A more preferably contains a glycidyl group-containing silane coupling agent, and the glycidyl group-containing silane coupling agent is more preferably glycidylpropyltrimethoxysilane.
- agent B more preferably contains an amino group-containing silane coupling agent, and the amino group-containing silane coupling agent is further preferably 3-(2-aminoethylamino)propyltrimethoxysilane.
- One of the silane coupling agents may be used alone, or two or more thereof may be used in combination.
- the content of component (e) in agent A is not particularly limited, but is preferably 0.1 to 20 parts by mass, more preferably 0.2 to 15 parts by mass, relative to 100 parts by mass of component (a). is more preferable, and the range of 0.3 to 10 parts by mass is even more preferable. Within the above range, the storage stability of the agent A is further improved, and a cured product having a high elongation can be obtained.
- the content of component (e) in agent B is preferably 0.1 to 20 parts by mass, preferably 0.2 to 15 parts by mass, based on 100 parts by mass of component (c). .3 to 10 parts by weight is particularly preferred. Within the above range, the storage stability of agent B is further improved, and a cured product with sufficiently high elongation can be obtained.
- the two-pack curable resin composition of the present embodiment may contain an aromatic epoxy resin as the (f) component in the A agent.
- component (f) in agent A the mixing of agent A and agent B causes rapid curing, resulting in a cured product with sufficiently high elongation and high strength, and excellent adhesion to metals.
- a two-part curable resin composition can be obtained.
- Component (f) is not particularly limited, but for example, bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin; phenol novolac type epoxy resin; Novolak type epoxy resins such as cresol novolac type epoxy resins; Glycidylamine compounds such as xylylenediamine; naphthalene-type epoxy resins; These compounds may be used alone, or two or more of them may be mixed and used.
- bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin
- phenol novolac type epoxy resin Novolak type epoxy resins such as cresol novolac type epoxy resins
- Glycidylamine compounds such as xylylenediamine
- naphthalene-type epoxy resins These compounds may be used alone, or two or more of them may be mixed and used.
- the content of component (f) in agent A is not particularly limited, but for example, it is preferably 5 to 95 parts by mass with respect to 100 parts by mass of the total amount of components (a) and (f). It is more preferably up to 80 parts by mass, and even more preferably 20 to 70 parts by mass.
- the content of component (f) in the two-part curable resin composition of the present embodiment is not particularly limited, but for example, it is preferably 5 to 95 parts by mass with respect to 100 parts by mass of component (c). , more preferably 10 to 80 parts by mass, even more preferably 20 to 70 parts by mass.
- the two-component curable resin composition can adhere adherends such as metals more satisfactorily.
- the two-component curable resin composition according to one aspect of the present invention contains a curing accelerator, a filler, various elastomers such as styrene copolymers, a filler, a storage stabilizer, Antioxidants, flame retardants, light stabilizers, heavy metal deactivators, plasticizers, defoaming agents, pigments, rust inhibitors, leveling agents, dispersants, rheology modifiers, flame retardants, surfactants, etc. of additives can be included.
- the curing accelerator that can be included in the two-part curable resin composition according to one embodiment of the present invention is a curing accelerator that accelerates the reaction between components (a) and (d).
- the curing accelerator is preferably solid at room temperature, and a compound having a solid imidazole skeleton or a fine powder obtained by pulverizing an epoxy adduct compound, which is added to an epoxy resin with a tertiary amine to stop the reaction, can be used. is more preferable in consideration of storage stability and curability.
- epoxy adduct compounds include the Amicure series manufactured by Ajinomoto Fine-Techno Co., Ltd., the Fujicure series manufactured by T&K Toka Co., Ltd., and the Novacure series manufactured by Asahi Kasei Chemicals Corporation.
- Organic phosphorus compounds and the like are also known as curing accelerators that are liquid at room temperature.
- a hardening accelerator may be used individually by 1 type, and may be used in multiple combination.
- the two-part curable resin composition according to one embodiment of the present invention may contain a filler for the purpose of improving the elastic modulus, fluidity, etc. of the cured product.
- a filler for the purpose of improving the elastic modulus, fluidity, etc. of the cured product.
- Specific examples include organic powders, inorganic powders, and metallic powders.
- inorganic powder fillers include glass, fumed silica, mica, ceramics, silicone rubber powder, calcium carbonate, carbon powder, kaolin clay, dried clay minerals, and dried diatomaceous earth.
- organic powder fillers include polyethylene, polypropylene, nylon, crosslinked acrylic, crosslinked polystyrene, polyester, polyvinyl alcohol, polyvinyl butyral, and polycarbonate.
- gold, silver, copper, alumina, aluminum nitride etc. are mentioned as a filler of metallic powder.
- the content of the filler is not particularly limited, but when it is contained in agent A, it is preferably 0.1 to 300 parts by mass with respect to 100 parts by weight of component (a), and when it is contained in agent B, ( It is preferably 0.1 to 300 parts by mass per 100 parts by mass of component c). Within the above range, a cured product having high elongation and high strength can be obtained, and the workability of the two-component curable resin composition can be improved.
- fumed silica can be suitably used from the viewpoint of adjusting the viscosity of the two-component curing resin composition or improving the mechanical strength of the cured product.
- fumed silica fumed silica surface-treated with dimethylsilane, trimethylsilane, alkylsilane, methacryloxysilane, organochlorosilane, polydimethylsiloxane, hexamethyldisilazane, or the like can be used more preferably.
- fumed silica Commercial products of fumed silica include, for example, Aerosil R972, R972V, R972CF, R974, R976, R976S, R9200, RX50, NAX50, NX90, RX200, RX300, R812, R812S, R8200, RY50, NY50, RY200S, RY200, RY300, R104, R106, R202, R805, R816, T805, R711, RM50, R7200 (manufactured by Nippon Aerosil Co., Ltd.) and TS720 (Cabonet Corporation).
- Examples of storage stabilizers include tetrafunctional alkoxysilanes such as tetramethoxysilane and tetraethoxysilane, silicate compounds typified by methyltrimethoxysilane, methyltriethoxysilane, ethyl silicate, propyl silicate and butyl silicate. be done. These may be used alone or in combination of two or more.
- a two-part curable resin composition according to one embodiment of the present invention contains an agent A and an agent B, and the agent A is a composition containing components (a) and (b), and B The agent is a composition containing components (c) and (d).
- agent A and agent B By dividing the components into two compositions, agent A and agent B, wasteful reactions during storage can be suppressed, and storage stability can be improved.
- the A agent and the B agent can be mixed by a well-known method and produced. Then, when used, the A agent and the B agent can be mixed by a well-known method and used.
- the amount of agent B is preferably in the range of 10 to 300 parts by mass, and 30 to 200 parts by mass when agent A is 100 parts by mass. It is more preferably 50 to 150 parts by mass.
- Another aspect of the present invention is a cured product obtained by curing the above-described two-component curable resin composition (cured product of the two-component curable resin composition).
- a cured product which is another embodiment of the present invention, is obtained by mixing the two-component curable resin composition with A and B to cure the two-component curable resin composition.
- the two-component curable resin composition of one embodiment of the present invention has excellent storage stability without using a dibutyltin catalyst, cures rapidly by mixing the A agent and the B agent, and produces a cured product having high elongation and high strength. Since it can be obtained, it is preferably used for various purposes such as adhesives, sealants, sealants, potting agents, coating agents, lining materials, heat radiation materials, and conductive pastes. Among these, it can be suitably used as a structural adhesive because it is a cured product with high elongation and high strength and has excellent adhesion to adherends such as metals. Specific applications of structural adhesives are not particularly limited, but examples include adhesion between panels constituting automobile doors, pillars, and roofs, adhesion between a body and a roof, adhesion of motor magnets, and the like. .
- ⁇ Complex> Another aspect of the present invention is a composite formed by bonding an adherend with a two-component curing resin composition.
- the adherend to be adhered with the two-component curable resin composition that is one embodiment of the present invention is not particularly limited, but for example, metals, metals and plastics, metals and rubber, metals and glass, plastics and rubber, plastics and Examples include glass, plastic to rubber, rubber to glass, and glass to glass. Among these, metal-to-metal, metal-to-plastic, and plastic-to-plastic are preferred.
- the metal is not particularly limited, but examples include gold, silver, iron, aluminum, magnesium, copper, stainless steel, and titanium.
- the plastic is not particularly limited, but for example, fiber reinforced plastic (FRP), carbon fiber reinforced plastic (CFRP), polyacrylic, polyester, polyamide, acrylonitrile-butadiene-styrene, nylon 6, polycarbonate, polyacetal, polyethylene terephthalate. , polybutylene terephthalate, polyphenylene sulfide, polyphenylene ether, polyetheretherketone, polyethylene, and polypropylene.
- the rubber is not particularly limited, but examples thereof include nitrile rubber, butyl rubber, urethane rubber, silicone rubber, and EPDM. Adhesion between two or more adherends selected at least from these may be mentioned.
- the surface of the material may be surface-treated in advance, or may be left untreated.
- ⁇ (a) component> a1 Hydrogenated bisphenol A type epoxy resin (manufactured by Shin Nippon Rika Co., Ltd., Rikaresin (registered trademark) HBE-100) ⁇ Component (b) and Component (b′) which is a comparative component of Component (b)>
- b1 Titanium tetraisopropoxide (manufactured by Matsumoto Fine Chemicals Co., Ltd., Orgatics (registered trademark) TA-8, component concentration of 99% by mass or more)
- b2 Titanium diisopropoxybis(acetylacetonate) (manufactured by Matsumoto Fine Chemicals Co., Ltd., Orgatics (registered trademark) TC-100, component concentration of 75% by mass or more)
- b3 aluminum catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., DX-9740)
- b'1 Dibutyltin compound (
- tensile strength (MPa)
- Table 1 shows the results. Details comply with JIS K 6251 (2010).
- the tensile strength is preferably 5.0 MPa or more, more preferably 6.0 MPa or more, as a sufficient strength to withstand the use as a cured product of the two-component curing type resin composition.
- "-" in Table 1 means unimplemented.
- Method for measuring elongation of cured product 100 g of agent A and 100 g of agent B of each two-component curable resin composition were mixed under an environment of 25° C. to obtain a resin composition. Next, the thickness of the resin composition was set to 1 mm, and cured by curing for 168 hours under an environment of 25° C. and 50% RH to prepare a sheet-like cured product. The cured product was punched out with a No. 3 dumbbell to prepare a test piece, and marked lines at intervals of 20 mm were drawn on the test piece.
- the elongation rate is preferably 200% or more, more preferably 300% or more, and still more preferably 350% or more, as sufficient elongation to withstand use as a cured product of the two-component curable resin composition.
- "-" in Table 1 means unimplemented.
- the two-component curable resin composition of the present embodiment has excellent storage stability of agent A and agent B, and can be rapidly cured by mixing agent A and agent B. It could be confirmed. Moreover, it was confirmed that a cured product having high elongation and high strength can be obtained from the two-component curable resin composition of the present embodiment.
- Reference Example 1 is excellent in curability after mixing and storage stability of each agent constituting the two-part curable resin composition, but it is not preferable in consideration of environmental load because it contains a dibutyltin catalyst. It is a resin composition.
- Comparative Examples 1 to 4 are resins using the catalysts b'2 to 5, which are the (b') components, instead of the (b) component of the present invention in the A agent constituting the two-component curable resin composition. Regarding the composition, it can be seen that in Comparative Examples 1 to 3, the storage stability of agent A is poor. Moreover, in Comparative Example 4, it is found that the curability after mixing is poor. Comparative Example 5 was a resin composition that did not contain component (a) in agent A of the present invention and used f1 instead, but the cured product was inferior in elongation and strength.
- the two-component curable resin composition of the present invention does not use a dibutyltin catalyst, has excellent storage stability, cures rapidly by mixing agent A and agent B, and provides a cured product with high elongation and high strength. Therefore, it is suitable for various applications such as adhesives, sealants, sealants, potting agents, coating agents, and conductive pastes. Therefore, it is industrially useful because it can be applied to a wide range of fields.
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Abstract
Description
[1]下記のA剤及びB剤からなる二液硬化型樹脂組成物。
A剤:(a)成分及び(b)成分を含有する組成物
(a)成分:水素化エポキシ樹脂
(b)成分:チタンジアルコキシビス(アセチルアセトネート)、チタンテトライソプロポキシド、テトラターシャリーブチルチタネートおよびアルミニウム触媒からなる群から1以上選択される化合物
B剤:(c)成分及び(d)成分を含有する組成物
(c)成分:加水分解性シリル基を2以上有する有機重合体
(d)成分:(a)成分用硬化剤
[2]前記(c)成分100質量部に対し、前記(b)成分を0.1~20質量部含有する、[1]に記載の二液硬化型樹脂組成物。
[3]前記(a)成分が、水素化ビスフェノール型エポキシ樹脂である、[1]または[2]に記載の二液硬化型樹脂組成物。
[4]前記(c)成分が、トリメトキシシリル基を有する有機重合体を含む、[1]~[3]のいずれかに記載の二液硬化型樹脂組成物。
[5]前記(c)成分が、ジメトキシシリル基を有する有機重合体を更に含む[4]に記載の二液硬化型樹脂組成物。
[6]前記(d)成分が、25℃で液状であるアミン化合物である、[1]~[5]のいずれかに記載の二液硬化型樹脂組成物。
[7]前記(b)成分が、チタンジアルコキシビス(アセチルアセトネート)を含む、[1]~[6]のいずれかに記載の二液硬化型樹脂組成物。
[8]前記チタンジアルコキシビス(アセチルアセトネート)が、チタンジイソプロポキシビス(アセチルアセトネート)である、[7]に記載の二液硬化型樹脂組成物。
[9]前記A剤及び/又は前記B剤が、(e)成分としてシランカップリング剤を更に含む、[1]~[8]のいずれかに記載の二液硬化型樹脂組成物。
[10]前記A剤が、(f)成分として芳香族エポキシ樹脂を更に含む、[1]~[9]のいずれか1項に記載の二液硬化型樹脂組成物。
[11][1]~[10]のいずれかに記載の二液硬化型樹脂組成物を硬化してなる硬化物。
[12]被着体を[1]~[10]のいずれかに記載の二液硬化型樹脂組成物で接着してなる複合体。
本発明の一形態に係る二液硬化型樹脂組成物は、下記のA剤及びB剤からなる。
(a)成分:水素化エポキシ樹脂
(b)成分:チタンジアルコキシビス(アセチルアセトネート)、チタンテトライソプロポキシド、テトラターシャリーブチルチタネートおよびアルミニウム触媒からなる群から1以上選択される化合物
B剤:(c)成分及び(d)成分を含有する組成物
(c)成分:加水分解性シリル基を2以上有する有機重合体
(d)成分:(a)成分用硬化剤
本発明の一形態によれば、ジブチルスズ触媒を用いずに、貯蔵安定性が優れ、混合により速やかに硬化し、高伸張、高強度である硬化物が得られる二液硬化型樹脂組成物を提供することができる。
本形態の二液硬化型樹脂組成物のA剤は、(a)成分として、水素化エポキシ樹脂を含む。水素化エポキシ樹脂を本形態のその他の成分と組み合わせることで、本形態の二液硬化型樹脂組成物は、貯蔵安定性に優れ、A剤とB剤の混合により速やかに硬化し、更に、高伸張であり、高強度である硬化物が得られるものとなる。(a)成分としては、特に制限されないが、例えば、水素化ビスフェノールA型エポキシ樹脂(水添ビスフェノールA型エポキシ樹脂ともいう。本明細書において、「水素化」を「水添」ともいう)、水添ビスフェノールF型エポキシ樹脂、水添ビスフェノールE型エポキシ樹脂等の水素化ビスフェノール型エポキシ樹脂;水添クレゾールノボラック型エポキシ樹脂;水添フェノールノボラック型エポキシ樹脂などが挙げられ、中でも、水素化ビスフェノール型エポキシ樹脂が好ましく、水素化ビスフェノールA型エポキシ樹脂であることがより好ましい。(a)成分は、これらの成分を単独で、あるいは2種以上を混合して使用することができる。
本形態の二液硬化型樹脂組成物のA剤に含まれる(b)成分はチタンジアルコキシビス(アセチルアセトネート)、チタンテトライソプロポキシド、テトラターシャリーブチルチタネートおよびアルミニウム触媒からなる群から選択される1以上の化合物である。これらの(b)成分を本形態のその他の成分と組み合わせることで、本形態の二液硬化型樹脂組成物は、貯蔵安定性が優れ、A剤とB剤の混合により速やかに硬化し、かつ、高伸張であり、高強度である硬化物が得られるものとなる。
本形態の二液硬化型樹脂組成物のB剤に含まれる(c)成分は、加水分解性シリル基を2以上有する有機重合体である。(c)成分としては、例えば、ジメトキシシリル基を有する有機重合体、トリメトキシシリル基を有する有機重合体、ジエトキシシリル基を有する有機重合体またはトリエトキシシリル基を有する有機重合体が挙げられる。これらの化合物は1種単独でも、2種以上を併用することもできる。中でも、(c)成分は、トリメトキシシリル基を有する有機重合体を含むことが好ましく、ジメトキシシリル基を有する有機重合体とトリメトキシシリル基を有する有機重合体を併用することがより好ましい。ジメトキシシリル基を有する有機重合体とトリメトキシシリル基を有する有機重合体を併用することで、ジブチルスズ触媒を用いずとも、B剤の貯蔵安定性がより優れたものとなり得、更にA剤とB剤とを混合した際により速やかに硬化し得る。
本形態の二液硬化型樹脂組成物のB剤に含まれる(d)成分は、(a)成分用硬化剤であり、A剤に含まれる(a)成分である水素化エポキシ樹脂を硬化させることができる化合物である。(d)成分としては、(a)成分を硬化することができれば特に制限されないが、例えば、1級アミン、2級アミン、3級アミン、ポリアミド、イミダゾール、ポリメルカプタン、酸無水化合物などが挙げられる。また、(d)成分は、これらを単独で用いても、2種以上を併用してもよい。
本形態に係る二液硬化型樹脂組成物のA剤及び/又はB剤は、(e)成分としてシランカップリング剤を含み得る。A剤及び/又はB剤がシランカップリング剤を含むことにより、貯蔵安定性がより優れたものになり、更に高伸張である硬化物が得られ得る。また、(e)成分は、A剤及びB剤の両方に含めることが好ましい。
更に、本形態の二液硬化型樹脂組成物は、A剤に(f)成分として芳香族エポキシ樹脂を含み得る。A剤が(f)成分を含むことで、A剤とB剤の混合により速やかに硬化し、より十分に高伸張、高強度である硬化物が得られ、且つ、金属に対する接着力が優れた二液硬化型樹脂組成物が得られ得る。
本発明の一形態に係る二液硬化型樹脂組成物は、本発明の目的を損なわない範囲で、硬化促進剤、充填剤、スチレン系共重合体等の各種エラストマー、充填材、保存安定剤、酸化防止剤、難燃性付与剤、光安定剤、重金属不活性剤、可塑剤、消泡剤、顔料、防錆剤、レベリング剤、分散剤、レオロジー調整剤、難燃剤、及び界面活性剤等の添加剤を含むことができる。
本発明の他の形態は、上記した二液硬化型樹脂組成物を硬化してなる硬化物(二液硬化型樹脂組成物の硬化物)である。本発明の他の形態である硬化物は、二液硬化型樹脂組成物を構成するA剤とB剤を混合することにより、二液硬化型樹脂組成物が硬化することによって得られる。
本発明の一形態の二液硬化型樹脂組成物は、ジブチルスズ触媒を用いずに貯蔵安定性が優れ、A剤とB剤の混合により速やかに硬化し、高伸張、高強度である硬化物が得られるので、接着剤、封止剤、シーラント剤、ポッティング剤、コーティング剤、ライニング材、放熱材、導電性ペースト等の各種用途に好ましく用いられる。これらの中でも、高伸張、高強度である硬化物でありつつ、金属などの被着体に対して優れた接着力を有することから、構造用接着剤として好適に用いることができる。構造用接着剤の具体的な用途としては、特に制限されないが、例えば、自動車のドア、ピラー、ルーフを構成するパネル同士の接着、ボディとルーフとの接着、モータのマグネットの接着などが挙げられる。
本発明の他の形態は、被着体を二液硬化型樹脂組成物で接着してなる複合体である。
以下に示す各成分を表1に示す割合(質量部)で採取し、常温にてミキサーで60分間混合し、二液硬化型樹脂組成物に該当するA剤、B剤をそれぞれ調製した。なお、各成分の詳細は以下の通りである。
a1:水素化ビスフェノールA型エポキシ樹脂(新日本理化株式会社製、リカレジン(登録商標) HBE-100)
<(b)成分と、(b)成分の比較成分である(b’)成分>
b1:チタンテトライソプロポキシド(マツモトファインケミカル株式会社製、オルガチックス(登録商標) TA-8、成分濃度99質量%以上)
b2:チタンジイソプロポキシビス(アセチルアセトネート)(マツモトファインケミカル株式会社製、オルガチックス(登録商標) TC-100、成分濃度75質量%以上)
b3:アルミニウム触媒(信越化学工業株式会社製、DX-9740)
b’1:ジブチルスズ化合物(日東化成株式会社製、ネオスタン(登録商標)U-100)
b’2:、チタンジイソプロポキシビス(エチルアセトアセテート)(マツモトファインケミカル株式会社製、オルガチックス(登録商標) TC-750、成分濃度95質量%以上)
b’3:オクチル酸ジルコニウム化合物(マツモトファインケミカル株式会社製、オルガチックス(登録商標) ZC-200、成分濃度80質量%以上)
b’4:テトラn-ブチルチタネート(マツモトファインケミカル株式会社製、オルガチックス(登録商標) TA-25)
b’5:リン酸触媒(信越化学工業株式会社製、X-40-2309A)
<(c)成分>
c1:両末端トリメトキシシリル基含有ポリオキシアルキレン(カネカ株式会社製、SAX-575、25℃で液状である)
c2:両末端ジメトキシシリル基含有ポリオキシアルキレン(カネカ株式会社製、SAX-750、25℃で液状である)
<(d)成分>
d1:2,4,6-トリス(ジメチルアミノメチル)フェノール(エアープロダクツジャパン株式会社製、アンカミン(登録商標) K54、25℃で液状である)
<(e)成分>
e1:グリシジルプロピルトリメトキシシラン(信越化学株式会社製、KBM-403)
e2:3-(2-アミノエチルアミノ)プロピルトリメトキシシラン(ダウ・東レ株式会社製、DOWSIL(商標登録)Z-6094 Silane)
<(f)成分>
f1:ビスフェノールA型エポキシ樹脂(三菱ケミカル会社製、jER(商標登録)828)
表1の実施例、比較例における試験方法は下記の通りである。
上記で調製した各A剤をガラス製容器に充填し、蓋で密閉した状態で、25℃環境下で1ヶ月間保存した。その後、容器を開封し、容器を傾けて、流動性があるかどうかを目視で確認し、下記基準に基づき評価した。その結果を表1に示す。
○:組成物の流動性が確認できた。
×:組成物がゲル化して流動しなくなっていた。
上記で調製した各B剤をガラス製容器に充填し、蓋で密閉した状態で、25℃環境下で1ヶ月間保存した。その後、容器を開封し、下記基準に基づき評価した。その結果を表1に示す。
○:組成物の流動性が確認できた。
×:組成物がゲル化して流動しなくなっていた。
A剤10gとB剤10gを25℃環境下で混合した。次いで、混合後の樹脂組成物を25℃、50%RH環境下で1日、2日、3日、5日、7日放置し、金属棒を用いて表面を指触し、べたつきの有無により硬化を確認した。下記評価基準に基づき評価した。結果を表1に示す。
[評価基準]
◎:1日経過時点で硬化していることが確認されたもの
○:2~7日経過時点で硬化していることが確認されたもの
×:7日経過時点で未硬化であることが確認されたもの
<(4)硬化物の引張強さ測定>
各二液硬化型樹脂組成物のA剤100gとB剤100gを25℃環境下で混合し、樹脂組成物を得た。次いで、樹脂組成物の厚さを1mmに設定し、25℃50%RH環境下で168時間養生させることで硬化させてシート状の硬化物を作製した。当該硬化物を3号ダンベルで打ち抜いてテストピースを作製した。テストピースの長軸とチャックの中心が一直線になるように、テストピースの両端をチャックに固定した。引張速度500mm/minでテストピースを引張り、最大荷重を測定した。当該最大荷重時の強度を「引張強さ(MPa)」とした。結果を表1に示す。詳細はJIS K 6251(2010)に従う。なお、二液硬化型樹脂組成物の硬化物として用途に耐えうる十分な強度としては、引張強さが5.0MPa以上であること好ましく、6.0MPa以上であることより好ましい。なお、表1の「-」とあるものは、未実施を意味する。
各二液硬化型樹脂組成物のA剤100gとB剤100gを25℃環境下で混合し、樹脂組成物を得た。次いで、樹脂組成物の厚さを1mmに設定し、25℃、50%RH環境下で168時間養生させることで硬化させてシート状の硬化物を作製した。当該硬化物を3号ダンベルで打ち抜いてテストピースを作製し、20mm間隔の標線をテストピースに記入した。
幅25mm×長さ100mm×厚さ1.6mmのSUS304製テストピースに実施例1、2及び4のA剤100gとB剤100gを25℃環境下で混合した樹脂組成物を塗布し、その後、同様サイズのSUS304製のテストピースを接着面が幅25mm×長さ10mmになるように貼り合わせてクリップで固定した後、25℃×50%RHで168時間養生することで二液硬化型樹脂組成物を硬化して試験片を作成した。
Claims (12)
- 下記のA剤及びB剤からなる二液硬化型樹脂組成物;
A剤:(a)成分及び(b)成分を含有する組成物
(a)成分:水素化エポキシ樹脂
(b)成分:チタンジアルコキシビス(アセチルアセトネート)、チタンテトライソプロポキシド、テトラターシャリーブチルチタネートおよびアルミニウム触媒からなる群から1以上選択される化合物
B剤:(c)成分及び(d)成分を含有する組成物
(c)成分:加水分解性シリル基を2以上有する有機重合体
(d)成分:(a)成分用硬化剤。 - 前記(c)成分100質量部に対し、前記(b)成分を0.1~20質量部含有する、請求項1に記載の二液硬化型樹脂組成物。
- 前記(a)成分が、水素化ビスフェノール型エポキシ樹脂である、請求項1または2に記載の二液硬化型樹脂組成物。
- 前記(c)成分が、トリメトキシシリル基を有する有機重合体を含む、請求項1~3のいずれか1項に記載の二液硬化型樹脂組成物。
- 前記(c)成分が、ジメトキシシリル基を有する有機重合体を更に含む、請求項4に記載の二液硬化型樹脂組成物。
- 前記(d)成分が、25℃で液状であるアミン化合物である、請求項1~5のいずれか1項に記載の二液硬化型樹脂組成物。
- 前記(b)成分が、チタンジアルコキシビス(アセチルアセトネート)を含む、請求項1~6のいずれか1項に記載の二液硬化型樹脂組成物。
- 前記チタンジアルコキシビス(アセチルアセトネート)が、チタンジイソプロポキシビス(アセチルアセトネート)である、請求項7に記載の二液硬化型樹脂組成物。
- 前記A剤及び/又は前記B剤が、(e)成分としてシランカップリング剤を更に含む、請求項1~8のいずれか1項に記載の二液硬化型樹脂組成物。
- 前記A剤が、(f)成分として芳香族エポキシ樹脂を更に含む、請求項1~9のいずれか1項に記載の二液硬化型樹脂組成物。
- 請求項1~10のいずれか1項に記載の二液硬化型樹脂組成物を硬化してなる硬化物。
- 被着体を請求項1~10のいずれか1項に記載の二液硬化型樹脂組成物で接着してなる複合体。
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JP2007099806A (ja) | 2005-09-30 | 2007-04-19 | Aica Kogyo Co Ltd | 接着剤 |
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JP2011001492A (ja) * | 2009-06-19 | 2011-01-06 | Asahi Kasei Chemicals Corp | ハイブリッド硬化体及び樹脂組成物並びにこれらを用いた複合透明シート |
WO2014017218A1 (ja) * | 2012-07-25 | 2014-01-30 | セメダイン株式会社 | 2液型硬化性組成物 |
JP2015003950A (ja) * | 2013-06-19 | 2015-01-08 | Dic株式会社 | 新規ポリエステルポリウレタンポリオール、2液型ラミネート接着剤用ポリオール剤、樹脂組成物、硬化性樹脂組成物、2液型ラミネート用接着剤、及び太陽電池用バックシート |
JP2021065803A (ja) | 2019-10-17 | 2021-04-30 | 栗田工業株式会社 | フッ素含有排水の処理方法 |
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JP2007099806A (ja) | 2005-09-30 | 2007-04-19 | Aica Kogyo Co Ltd | 接着剤 |
JP2009270069A (ja) * | 2008-05-12 | 2009-11-19 | Sumitomo Bakelite Co Ltd | 樹脂組成物 |
JP2011001492A (ja) * | 2009-06-19 | 2011-01-06 | Asahi Kasei Chemicals Corp | ハイブリッド硬化体及び樹脂組成物並びにこれらを用いた複合透明シート |
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JP2021065803A (ja) | 2019-10-17 | 2021-04-30 | 栗田工業株式会社 | フッ素含有排水の処理方法 |
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