TW202435672A - 印刷配線板 - Google Patents

印刷配線板 Download PDF

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Publication number
TW202435672A
TW202435672A TW113103566A TW113103566A TW202435672A TW 202435672 A TW202435672 A TW 202435672A TW 113103566 A TW113103566 A TW 113103566A TW 113103566 A TW113103566 A TW 113103566A TW 202435672 A TW202435672 A TW 202435672A
Authority
TW
Taiwan
Prior art keywords
insulating layer
wiring
aforementioned
conductor
wiring board
Prior art date
Application number
TW113103566A
Other languages
English (en)
Chinese (zh)
Inventor
中島太久哉
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202435672A publication Critical patent/TW202435672A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
TW113103566A 2023-01-31 2024-01-30 印刷配線板 TW202435672A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-012570 2023-01-31
JP2023012570 2023-01-31

Publications (1)

Publication Number Publication Date
TW202435672A true TW202435672A (zh) 2024-09-01

Family

ID=92146707

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113103566A TW202435672A (zh) 2023-01-31 2024-01-30 印刷配線板

Country Status (3)

Country Link
JP (1) JP7817459B2 (https=)
TW (1) TW202435672A (https=)
WO (1) WO2024162191A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341803A (ja) * 1989-07-07 1991-02-22 Hitachi Chem Co Ltd 信号線相互間のクロストークノイズを低減した配線板およびその製造法
JP4371065B2 (ja) 2005-03-03 2009-11-25 日本電気株式会社 伝送線路、通信装置及び配線形成方法
CN110602883B (zh) 2014-09-26 2022-10-21 株式会社村田制作所 传输线路及电子设备
WO2022124179A1 (ja) 2020-12-07 2022-06-16 株式会社村田製作所 回路基板及び回路基板の製造方法

Also Published As

Publication number Publication date
JP7817459B2 (ja) 2026-02-18
JPWO2024162191A1 (https=) 2024-08-08
WO2024162191A1 (ja) 2024-08-08

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