JPWO2024162191A1 - - Google Patents

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Publication number
JPWO2024162191A1
JPWO2024162191A1 JP2024574848A JP2024574848A JPWO2024162191A1 JP WO2024162191 A1 JPWO2024162191 A1 JP WO2024162191A1 JP 2024574848 A JP2024574848 A JP 2024574848A JP 2024574848 A JP2024574848 A JP 2024574848A JP WO2024162191 A1 JPWO2024162191 A1 JP WO2024162191A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024574848A
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Japanese (ja)
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JP7817459B2 (ja
JPWO2024162191A5 (https=
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Publication of JPWO2024162191A1 publication Critical patent/JPWO2024162191A1/ja
Publication of JPWO2024162191A5 publication Critical patent/JPWO2024162191A5/ja
Application granted granted Critical
Publication of JP7817459B2 publication Critical patent/JP7817459B2/ja
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024574848A 2023-01-31 2024-01-26 印刷配線板 Active JP7817459B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023012570 2023-01-31
JP2023012570 2023-01-31
PCT/JP2024/002344 WO2024162191A1 (ja) 2023-01-31 2024-01-26 印刷配線板

Publications (3)

Publication Number Publication Date
JPWO2024162191A1 true JPWO2024162191A1 (https=) 2024-08-08
JPWO2024162191A5 JPWO2024162191A5 (https=) 2025-09-16
JP7817459B2 JP7817459B2 (ja) 2026-02-18

Family

ID=92146707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574848A Active JP7817459B2 (ja) 2023-01-31 2024-01-26 印刷配線板

Country Status (3)

Country Link
JP (1) JP7817459B2 (https=)
TW (1) TW202435672A (https=)
WO (1) WO2024162191A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341803A (ja) * 1989-07-07 1991-02-22 Hitachi Chem Co Ltd 信号線相互間のクロストークノイズを低減した配線板およびその製造法
JP2006245291A (ja) * 2005-03-03 2006-09-14 Nec Corp 伝送線路及び配線形成方法
JP2017108455A (ja) * 2014-09-26 2017-06-15 株式会社村田製作所 伝送線路および電子機器
WO2022124179A1 (ja) * 2020-12-07 2022-06-16 株式会社村田製作所 回路基板及び回路基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341803A (ja) * 1989-07-07 1991-02-22 Hitachi Chem Co Ltd 信号線相互間のクロストークノイズを低減した配線板およびその製造法
JP2006245291A (ja) * 2005-03-03 2006-09-14 Nec Corp 伝送線路及び配線形成方法
JP2017108455A (ja) * 2014-09-26 2017-06-15 株式会社村田製作所 伝送線路および電子機器
WO2022124179A1 (ja) * 2020-12-07 2022-06-16 株式会社村田製作所 回路基板及び回路基板の製造方法

Also Published As

Publication number Publication date
JP7817459B2 (ja) 2026-02-18
WO2024162191A1 (ja) 2024-08-08
TW202435672A (zh) 2024-09-01

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