JP7817459B2 - 印刷配線板 - Google Patents

印刷配線板

Info

Publication number
JP7817459B2
JP7817459B2 JP2024574848A JP2024574848A JP7817459B2 JP 7817459 B2 JP7817459 B2 JP 7817459B2 JP 2024574848 A JP2024574848 A JP 2024574848A JP 2024574848 A JP2024574848 A JP 2024574848A JP 7817459 B2 JP7817459 B2 JP 7817459B2
Authority
JP
Japan
Prior art keywords
insulating layer
wiring
groove
ground conductor
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024574848A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024162191A1 (https=
JPWO2024162191A5 (https=
Inventor
太久哉 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2024162191A1 publication Critical patent/JPWO2024162191A1/ja
Publication of JPWO2024162191A5 publication Critical patent/JPWO2024162191A5/ja
Application granted granted Critical
Publication of JP7817459B2 publication Critical patent/JP7817459B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024574848A 2023-01-31 2024-01-26 印刷配線板 Active JP7817459B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023012570 2023-01-31
JP2023012570 2023-01-31
PCT/JP2024/002344 WO2024162191A1 (ja) 2023-01-31 2024-01-26 印刷配線板

Publications (3)

Publication Number Publication Date
JPWO2024162191A1 JPWO2024162191A1 (https=) 2024-08-08
JPWO2024162191A5 JPWO2024162191A5 (https=) 2025-09-16
JP7817459B2 true JP7817459B2 (ja) 2026-02-18

Family

ID=92146707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574848A Active JP7817459B2 (ja) 2023-01-31 2024-01-26 印刷配線板

Country Status (3)

Country Link
JP (1) JP7817459B2 (https=)
TW (1) TW202435672A (https=)
WO (1) WO2024162191A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245291A (ja) 2005-03-03 2006-09-14 Nec Corp 伝送線路及び配線形成方法
JP2017108455A (ja) 2014-09-26 2017-06-15 株式会社村田製作所 伝送線路および電子機器
WO2022124179A1 (ja) 2020-12-07 2022-06-16 株式会社村田製作所 回路基板及び回路基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341803A (ja) * 1989-07-07 1991-02-22 Hitachi Chem Co Ltd 信号線相互間のクロストークノイズを低減した配線板およびその製造法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245291A (ja) 2005-03-03 2006-09-14 Nec Corp 伝送線路及び配線形成方法
JP2017108455A (ja) 2014-09-26 2017-06-15 株式会社村田製作所 伝送線路および電子機器
WO2022124179A1 (ja) 2020-12-07 2022-06-16 株式会社村田製作所 回路基板及び回路基板の製造方法

Also Published As

Publication number Publication date
JPWO2024162191A1 (https=) 2024-08-08
WO2024162191A1 (ja) 2024-08-08
TW202435672A (zh) 2024-09-01

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