TW202435671A - 基材、基材之製造方法、以及使用此基材之配線基板 - Google Patents

基材、基材之製造方法、以及使用此基材之配線基板 Download PDF

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Publication number
TW202435671A
TW202435671A TW112151025A TW112151025A TW202435671A TW 202435671 A TW202435671 A TW 202435671A TW 112151025 A TW112151025 A TW 112151025A TW 112151025 A TW112151025 A TW 112151025A TW 202435671 A TW202435671 A TW 202435671A
Authority
TW
Taiwan
Prior art keywords
substrate
film
cte
linear expansion
expansion coefficient
Prior art date
Application number
TW112151025A
Other languages
English (en)
Chinese (zh)
Inventor
阿久津良
野宮薫
鈴木雅弘
山尾俊介
Original Assignee
日商潤工社股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商潤工社股份有限公司 filed Critical 日商潤工社股份有限公司
Publication of TW202435671A publication Critical patent/TW202435671A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
TW112151025A 2022-12-28 2023-12-27 基材、基材之製造方法、以及使用此基材之配線基板 TW202435671A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-211414 2022-12-28
JP2022211414 2022-12-28

Publications (1)

Publication Number Publication Date
TW202435671A true TW202435671A (zh) 2024-09-01

Family

ID=91717906

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112151025A TW202435671A (zh) 2022-12-28 2023-12-27 基材、基材之製造方法、以及使用此基材之配線基板

Country Status (4)

Country Link
JP (1) JPWO2024143298A1 (enrdf_load_stackoverflow)
CN (1) CN120435387A (enrdf_load_stackoverflow)
TW (1) TW202435671A (enrdf_load_stackoverflow)
WO (1) WO2024143298A1 (enrdf_load_stackoverflow)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2783359B2 (ja) * 1994-11-16 1998-08-06 日本ピラー工業株式会社 フッ素樹脂多層回路基板
JP4014964B2 (ja) * 2001-10-24 2007-11-28 三井・デュポンフロロケミカル株式会社 フッ素樹脂積層体及びその製造方法
JP3942489B2 (ja) * 2002-05-22 2007-07-11 株式会社巴川製紙所 フッ素樹脂プリント配線板及びその製造方法
KR20220162146A (ko) * 2020-03-27 2022-12-07 로저스코포레이션 이축-배향된 폴리테트라플루오로에틸렌 강화층을 포함하는 가요성 유전체 물질

Also Published As

Publication number Publication date
WO2024143298A1 (ja) 2024-07-04
JPWO2024143298A1 (enrdf_load_stackoverflow) 2024-07-04
CN120435387A (zh) 2025-08-05

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