JPWO2024143298A1 - - Google Patents
Info
- Publication number
- JPWO2024143298A1 JPWO2024143298A1 JP2024567819A JP2024567819A JPWO2024143298A1 JP WO2024143298 A1 JPWO2024143298 A1 JP WO2024143298A1 JP 2024567819 A JP2024567819 A JP 2024567819A JP 2024567819 A JP2024567819 A JP 2024567819A JP WO2024143298 A1 JPWO2024143298 A1 JP WO2024143298A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022211414 | 2022-12-28 | ||
| PCT/JP2023/046501 WO2024143298A1 (ja) | 2022-12-28 | 2023-12-25 | 基材、及びその製造方法、並びにそれを用いた配線基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024143298A1 true JPWO2024143298A1 (enrdf_load_stackoverflow) | 2024-07-04 |
Family
ID=91717906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567819A Pending JPWO2024143298A1 (enrdf_load_stackoverflow) | 2022-12-28 | 2023-12-25 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024143298A1 (enrdf_load_stackoverflow) |
| CN (1) | CN120435387A (enrdf_load_stackoverflow) |
| TW (1) | TW202435671A (enrdf_load_stackoverflow) |
| WO (1) | WO2024143298A1 (enrdf_load_stackoverflow) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2783359B2 (ja) * | 1994-11-16 | 1998-08-06 | 日本ピラー工業株式会社 | フッ素樹脂多層回路基板 |
| JP4014964B2 (ja) * | 2001-10-24 | 2007-11-28 | 三井・デュポンフロロケミカル株式会社 | フッ素樹脂積層体及びその製造方法 |
| JP3942489B2 (ja) * | 2002-05-22 | 2007-07-11 | 株式会社巴川製紙所 | フッ素樹脂プリント配線板及びその製造方法 |
| KR20220162146A (ko) * | 2020-03-27 | 2022-12-07 | 로저스코포레이션 | 이축-배향된 폴리테트라플루오로에틸렌 강화층을 포함하는 가요성 유전체 물질 |
-
2023
- 2023-12-25 WO PCT/JP2023/046501 patent/WO2024143298A1/ja active Application Filing
- 2023-12-25 JP JP2024567819A patent/JPWO2024143298A1/ja active Pending
- 2023-12-25 CN CN202380089706.7A patent/CN120435387A/zh active Pending
- 2023-12-27 TW TW112151025A patent/TW202435671A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024143298A1 (ja) | 2024-07-04 |
| TW202435671A (zh) | 2024-09-01 |
| CN120435387A (zh) | 2025-08-05 |