TW202415706A - 樹脂組成物、硬化物、半導體元件及乾膜抗蝕劑 - Google Patents

樹脂組成物、硬化物、半導體元件及乾膜抗蝕劑 Download PDF

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Publication number
TW202415706A
TW202415706A TW112112114A TW112112114A TW202415706A TW 202415706 A TW202415706 A TW 202415706A TW 112112114 A TW112112114 A TW 112112114A TW 112112114 A TW112112114 A TW 112112114A TW 202415706 A TW202415706 A TW 202415706A
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TW
Taiwan
Prior art keywords
resin composition
diamine
group
carbon atoms
dianhydride
Prior art date
Application number
TW112112114A
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English (en)
Chinese (zh)
Inventor
竹田麻央
鍔本麻衣
山本和義
飯塚真之
Original Assignee
日商日本化藥股份有限公司
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Publication date
Application filed by 日商日本化藥股份有限公司 filed Critical 日商日本化藥股份有限公司
Publication of TW202415706A publication Critical patent/TW202415706A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymerisation Methods In General (AREA)
TW112112114A 2022-10-14 2023-03-30 樹脂組成物、硬化物、半導體元件及乾膜抗蝕劑 TW202415706A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022165848 2022-10-14
JP2022-165848 2022-10-14

Publications (1)

Publication Number Publication Date
TW202415706A true TW202415706A (zh) 2024-04-16

Family

ID=90669240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112112114A TW202415706A (zh) 2022-10-14 2023-03-30 樹脂組成物、硬化物、半導體元件及乾膜抗蝕劑

Country Status (5)

Country Link
JP (1) JPWO2024079925A1 (https=)
KR (1) KR20250088484A (https=)
CN (1) CN119855851A (https=)
TW (1) TW202415706A (https=)
WO (1) WO2024079925A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1124271A (ja) 1997-06-30 1999-01-29 Kurarianto Japan Kk 高耐熱性放射線感応性レジスト組成物
JP5598041B2 (ja) 2010-03-19 2014-10-01 ソニー株式会社 画像処理装置および画像処理方法
JP6694231B2 (ja) 2014-12-15 2020-05-13 シャープ株式会社 加熱調理器
JP6635403B2 (ja) 2014-12-26 2020-01-22 荒川化学工業株式会社 樹脂付銅箔、銅張積層板、プリント配線板及び多層配線板
TWI761375B (zh) 2016-09-26 2022-04-21 日商昭和電工材料股份有限公司 樹脂組成物、半導體用配線層積層體及半導體裝置
JP2019104843A (ja) 2017-12-13 2019-06-27 Ａｇｃ株式会社 樹脂組成物、積層体、金属積層板及びプリント配線板
WO2020203834A1 (ja) * 2019-04-02 2020-10-08 日本化薬株式会社 ビスマレイミド化合物、それを用いた感光性樹脂組成物、その硬化物及び半導体素子
JP7365574B2 (ja) * 2019-07-29 2023-10-20 三菱瓦斯化学株式会社 マレイミド化合物及びその製造方法、アミド酸化合物及びその製造方法、樹脂組成物、硬化物、樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料、接着剤、並びに半導体装置
KR20230074064A (ko) * 2020-09-23 2023-05-26 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 가고정재, 및 전자 부품의 제조 방법

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Publication number Publication date
WO2024079925A1 (ja) 2024-04-18
JPWO2024079925A1 (https=) 2024-04-18
KR20250088484A (ko) 2025-06-17
CN119855851A (zh) 2025-04-18

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