TW202347482A - 表面處理組成物及晶圓的製造方法 - Google Patents

表面處理組成物及晶圓的製造方法 Download PDF

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Publication number
TW202347482A
TW202347482A TW112113142A TW112113142A TW202347482A TW 202347482 A TW202347482 A TW 202347482A TW 112113142 A TW112113142 A TW 112113142A TW 112113142 A TW112113142 A TW 112113142A TW 202347482 A TW202347482 A TW 202347482A
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TW
Taiwan
Prior art keywords
surface treatment
treatment composition
mass
wafer
solvent
Prior art date
Application number
TW112113142A
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English (en)
Chinese (zh)
Inventor
奥村雄三
照井貴陽
吉田彩香
Original Assignee
日商中央硝子股份有限公司
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Filing date
Publication date
Application filed by 日商中央硝子股份有限公司 filed Critical 日商中央硝子股份有限公司
Publication of TW202347482A publication Critical patent/TW202347482A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
TW112113142A 2022-04-11 2023-04-07 表面處理組成物及晶圓的製造方法 TW202347482A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022-065098 2022-04-11
JP2022065098 2022-04-11
JP2022-128657 2022-08-12
JP2022128657 2022-08-12

Publications (1)

Publication Number Publication Date
TW202347482A true TW202347482A (zh) 2023-12-01

Family

ID=88329634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112113142A TW202347482A (zh) 2022-04-11 2023-04-07 表面處理組成物及晶圓的製造方法

Country Status (6)

Country Link
US (1) US20250210375A1 (https=)
EP (1) EP4510171A1 (https=)
JP (1) JPWO2023199824A1 (https=)
KR (1) KR20240151193A (https=)
TW (1) TW202347482A (https=)
WO (1) WO2023199824A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9244358B2 (en) * 2008-10-21 2016-01-26 Tokyo Ohka Kogyo Co., Ltd. Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate
JP5482192B2 (ja) * 2009-01-21 2014-04-23 セントラル硝子株式会社 シリコンウェハ用洗浄剤
JP5648053B2 (ja) * 2010-06-30 2015-01-07 セントラル硝子株式会社 ウェハパターンの保護膜形成用薬液、薬液の調製方法およびウェハ処理方法
CN112951250B (zh) 2014-09-12 2025-02-07 索尼公司 发送装置、发送方法、接收装置以及接收方法
JP6703256B2 (ja) * 2016-03-15 2020-06-03 セントラル硝子株式会社 撥水性保護膜形成剤、撥水性保護膜形成用薬液、及びウェハの洗浄方法
JP6963166B2 (ja) * 2017-04-17 2021-11-05 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物
JP2019080009A (ja) * 2017-10-27 2019-05-23 セントラル硝子株式会社 ウェハの洗浄方法
JP7277700B2 (ja) * 2018-01-15 2023-05-19 セントラル硝子株式会社 撥水性保護膜形成用薬液、及びウェハの表面処理方法
CN111699546B (zh) * 2018-02-13 2023-09-12 中央硝子株式会社 拒水性保护膜形成剂和拒水性保护膜形成用化学溶液
SG11202009171XA (en) 2018-04-05 2020-10-29 Central Glass Co Ltd Surface treatment method of wafer and composition used for said method
JP7292020B2 (ja) * 2018-08-27 2023-06-16 東京応化工業株式会社 表面処理剤及び表面処理方法
JP2022128657A (ja) 2021-02-24 2022-09-05 トヨタ自動車東日本株式会社 ワイパーモジュール
KR20230093311A (ko) * 2021-02-26 2023-06-27 샌트랄 글래스 컴퍼니 리미티드 표면 처리 조성물, 및 웨이퍼의 제조 방법

Also Published As

Publication number Publication date
US20250210375A1 (en) 2025-06-26
EP4510171A1 (en) 2025-02-19
WO2023199824A1 (ja) 2023-10-19
KR20240151193A (ko) 2024-10-17
JPWO2023199824A1 (https=) 2023-10-19

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