JPWO2023199824A1 - - Google Patents
Info
- Publication number
- JPWO2023199824A1 JPWO2023199824A1 JP2024514922A JP2024514922A JPWO2023199824A1 JP WO2023199824 A1 JPWO2023199824 A1 JP WO2023199824A1 JP 2024514922 A JP2024514922 A JP 2024514922A JP 2024514922 A JP2024514922 A JP 2024514922A JP WO2023199824 A1 JPWO2023199824 A1 JP WO2023199824A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022065098 | 2022-04-11 | ||
| JP2022128657 | 2022-08-12 | ||
| PCT/JP2023/014102 WO2023199824A1 (ja) | 2022-04-11 | 2023-04-05 | 表面処理組成物、およびウェハの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023199824A1 true JPWO2023199824A1 (https=) | 2023-10-19 |
| JPWO2023199824A5 JPWO2023199824A5 (https=) | 2024-12-24 |
Family
ID=88329634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024514922A Pending JPWO2023199824A1 (https=) | 2022-04-11 | 2023-04-05 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250210375A1 (https=) |
| EP (1) | EP4510171A1 (https=) |
| JP (1) | JPWO2023199824A1 (https=) |
| KR (1) | KR20240151193A (https=) |
| TW (1) | TW202347482A (https=) |
| WO (1) | WO2023199824A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9244358B2 (en) * | 2008-10-21 | 2016-01-26 | Tokyo Ohka Kogyo Co., Ltd. | Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate |
| JP5482192B2 (ja) * | 2009-01-21 | 2014-04-23 | セントラル硝子株式会社 | シリコンウェハ用洗浄剤 |
| JP5648053B2 (ja) * | 2010-06-30 | 2015-01-07 | セントラル硝子株式会社 | ウェハパターンの保護膜形成用薬液、薬液の調製方法およびウェハ処理方法 |
| CN112951250B (zh) | 2014-09-12 | 2025-02-07 | 索尼公司 | 发送装置、发送方法、接收装置以及接收方法 |
| JP6703256B2 (ja) * | 2016-03-15 | 2020-06-03 | セントラル硝子株式会社 | 撥水性保護膜形成剤、撥水性保護膜形成用薬液、及びウェハの洗浄方法 |
| JP6963166B2 (ja) * | 2017-04-17 | 2021-11-05 | セントラル硝子株式会社 | ウェハの表面処理方法及び該方法に用いる組成物 |
| JP2019080009A (ja) * | 2017-10-27 | 2019-05-23 | セントラル硝子株式会社 | ウェハの洗浄方法 |
| JP7277700B2 (ja) * | 2018-01-15 | 2023-05-19 | セントラル硝子株式会社 | 撥水性保護膜形成用薬液、及びウェハの表面処理方法 |
| CN111699546B (zh) * | 2018-02-13 | 2023-09-12 | 中央硝子株式会社 | 拒水性保护膜形成剂和拒水性保护膜形成用化学溶液 |
| SG11202009171XA (en) | 2018-04-05 | 2020-10-29 | Central Glass Co Ltd | Surface treatment method of wafer and composition used for said method |
| JP7292020B2 (ja) * | 2018-08-27 | 2023-06-16 | 東京応化工業株式会社 | 表面処理剤及び表面処理方法 |
| JP2022128657A (ja) | 2021-02-24 | 2022-09-05 | トヨタ自動車東日本株式会社 | ワイパーモジュール |
| KR20230093311A (ko) * | 2021-02-26 | 2023-06-27 | 샌트랄 글래스 컴퍼니 리미티드 | 표면 처리 조성물, 및 웨이퍼의 제조 방법 |
-
2023
- 2023-04-05 US US18/845,594 patent/US20250210375A1/en active Pending
- 2023-04-05 JP JP2024514922A patent/JPWO2023199824A1/ja active Pending
- 2023-04-05 KR KR1020247030369A patent/KR20240151193A/ko not_active Withdrawn
- 2023-04-05 WO PCT/JP2023/014102 patent/WO2023199824A1/ja not_active Ceased
- 2023-04-05 EP EP23788243.6A patent/EP4510171A1/en not_active Withdrawn
- 2023-04-07 TW TW112113142A patent/TW202347482A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20250210375A1 (en) | 2025-06-26 |
| TW202347482A (zh) | 2023-12-01 |
| EP4510171A1 (en) | 2025-02-19 |
| WO2023199824A1 (ja) | 2023-10-19 |
| KR20240151193A (ko) | 2024-10-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240723 |