KR20240151193A - 표면 처리 조성물, 및 웨이퍼의 제조 방법 - Google Patents

표면 처리 조성물, 및 웨이퍼의 제조 방법 Download PDF

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Publication number
KR20240151193A
KR20240151193A KR1020247030369A KR20247030369A KR20240151193A KR 20240151193 A KR20240151193 A KR 20240151193A KR 1020247030369 A KR1020247030369 A KR 1020247030369A KR 20247030369 A KR20247030369 A KR 20247030369A KR 20240151193 A KR20240151193 A KR 20240151193A
Authority
KR
South Korea
Prior art keywords
surface treatment
treatment composition
mass
wafer
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020247030369A
Other languages
English (en)
Korean (ko)
Inventor
유조 오쿠무라
요시하루 데루이
아야카 요시다
Original Assignee
샌트랄 글래스 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 샌트랄 글래스 컴퍼니 리미티드 filed Critical 샌트랄 글래스 컴퍼니 리미티드
Publication of KR20240151193A publication Critical patent/KR20240151193A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • H01L21/02104—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
KR1020247030369A 2022-04-11 2023-04-05 표면 처리 조성물, 및 웨이퍼의 제조 방법 Withdrawn KR20240151193A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2022-065098 2022-04-11
JP2022065098 2022-04-11
JP2022128657 2022-08-12
JPJP-P-2022-128657 2022-08-12
PCT/JP2023/014102 WO2023199824A1 (ja) 2022-04-11 2023-04-05 表面処理組成物、およびウェハの製造方法

Publications (1)

Publication Number Publication Date
KR20240151193A true KR20240151193A (ko) 2024-10-17

Family

ID=88329634

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247030369A Withdrawn KR20240151193A (ko) 2022-04-11 2023-04-05 표면 처리 조성물, 및 웨이퍼의 제조 방법

Country Status (6)

Country Link
US (1) US20250210375A1 (https=)
EP (1) EP4510171A1 (https=)
JP (1) JPWO2023199824A1 (https=)
KR (1) KR20240151193A (https=)
TW (1) TW202347482A (https=)
WO (1) WO2023199824A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019193967A1 (ja) 2018-04-05 2019-10-10 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9244358B2 (en) * 2008-10-21 2016-01-26 Tokyo Ohka Kogyo Co., Ltd. Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate
JP5482192B2 (ja) * 2009-01-21 2014-04-23 セントラル硝子株式会社 シリコンウェハ用洗浄剤
JP5648053B2 (ja) * 2010-06-30 2015-01-07 セントラル硝子株式会社 ウェハパターンの保護膜形成用薬液、薬液の調製方法およびウェハ処理方法
CN112951250B (zh) 2014-09-12 2025-02-07 索尼公司 发送装置、发送方法、接收装置以及接收方法
JP6703256B2 (ja) * 2016-03-15 2020-06-03 セントラル硝子株式会社 撥水性保護膜形成剤、撥水性保護膜形成用薬液、及びウェハの洗浄方法
JP6963166B2 (ja) * 2017-04-17 2021-11-05 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物
JP2019080009A (ja) * 2017-10-27 2019-05-23 セントラル硝子株式会社 ウェハの洗浄方法
JP7277700B2 (ja) * 2018-01-15 2023-05-19 セントラル硝子株式会社 撥水性保護膜形成用薬液、及びウェハの表面処理方法
CN111699546B (zh) * 2018-02-13 2023-09-12 中央硝子株式会社 拒水性保护膜形成剂和拒水性保护膜形成用化学溶液
JP7292020B2 (ja) * 2018-08-27 2023-06-16 東京応化工業株式会社 表面処理剤及び表面処理方法
JP2022128657A (ja) 2021-02-24 2022-09-05 トヨタ自動車東日本株式会社 ワイパーモジュール
KR20230093311A (ko) * 2021-02-26 2023-06-27 샌트랄 글래스 컴퍼니 리미티드 표면 처리 조성물, 및 웨이퍼의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019193967A1 (ja) 2018-04-05 2019-10-10 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物

Also Published As

Publication number Publication date
US20250210375A1 (en) 2025-06-26
TW202347482A (zh) 2023-12-01
EP4510171A1 (en) 2025-02-19
WO2023199824A1 (ja) 2023-10-19
JPWO2023199824A1 (https=) 2023-10-19

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