TW202330488A - 感放射線性樹脂組成物、抗蝕劑圖案形成方法及化合物 - Google Patents

感放射線性樹脂組成物、抗蝕劑圖案形成方法及化合物 Download PDF

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Publication number
TW202330488A
TW202330488A TW111147079A TW111147079A TW202330488A TW 202330488 A TW202330488 A TW 202330488A TW 111147079 A TW111147079 A TW 111147079A TW 111147079 A TW111147079 A TW 111147079A TW 202330488 A TW202330488 A TW 202330488A
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TW
Taiwan
Prior art keywords
group
radiation
resin composition
formula
sensitive resin
Prior art date
Application number
TW111147079A
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English (en)
Chinese (zh)
Inventor
木下奈津子
谷口拓弘
錦織克聡
桐山和也
Original Assignee
日商Jsr股份有限公司
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Application filed by 日商Jsr股份有限公司 filed Critical 日商Jsr股份有限公司
Publication of TW202330488A publication Critical patent/TW202330488A/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW111147079A 2022-01-25 2022-12-08 感放射線性樹脂組成物、抗蝕劑圖案形成方法及化合物 TW202330488A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-009714 2022-01-25
JP2022009714 2022-01-25

Publications (1)

Publication Number Publication Date
TW202330488A true TW202330488A (zh) 2023-08-01

Family

ID=87475253

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111147079A TW202330488A (zh) 2022-01-25 2022-12-08 感放射線性樹脂組成物、抗蝕劑圖案形成方法及化合物

Country Status (3)

Country Link
JP (1) JP2023108593A (ko)
KR (1) KR20230114697A (ko)
TW (1) TW202330488A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024059353A (ja) * 2022-10-18 2024-05-01 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、及び化合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5292078B2 (ja) 2008-12-05 2013-09-18 富士フイルム株式会社 感活性光線または感放射線性樹脂組成物及び該組成物を用いたパターン形成方法
JP6287369B2 (ja) 2013-03-08 2018-03-07 Jsr株式会社 フォトレジスト組成物、レジストパターン形成方法、化合物及び重合体
JP6450660B2 (ja) 2014-08-25 2019-01-09 住友化学株式会社 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法

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KR20230114697A (ko) 2023-08-01
JP2023108593A (ja) 2023-08-04

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