TW202328383A - 暫時保護材 - Google Patents

暫時保護材 Download PDF

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Publication number
TW202328383A
TW202328383A TW111134938A TW111134938A TW202328383A TW 202328383 A TW202328383 A TW 202328383A TW 111134938 A TW111134938 A TW 111134938A TW 111134938 A TW111134938 A TW 111134938A TW 202328383 A TW202328383 A TW 202328383A
Authority
TW
Taiwan
Prior art keywords
layer
polyvinyl alcohol
weight
based resin
boric acid
Prior art date
Application number
TW111134938A
Other languages
English (en)
Chinese (zh)
Inventor
米田義和
山田佑
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202328383A publication Critical patent/TW202328383A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111134938A 2021-09-16 2022-09-15 暫時保護材 TW202328383A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021-151027 2021-09-16
JP2021151028 2021-09-16
JP2021-151028 2021-09-16
JP2021151027 2021-09-16

Publications (1)

Publication Number Publication Date
TW202328383A true TW202328383A (zh) 2023-07-16

Family

ID=85602900

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111134938A TW202328383A (zh) 2021-09-16 2022-09-15 暫時保護材

Country Status (3)

Country Link
JP (1) JPWO2023042840A1 (https=)
TW (1) TW202328383A (https=)
WO (1) WO2023042840A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024068717A (ja) * 2022-11-09 2024-05-21 日東電工株式会社 保護シート、及び、電子部品装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060144514A1 (en) * 2005-01-03 2006-07-06 Yongcai Wang Polarizing plate laminated with an improved glue composition and a method of manufacturing the same
JP2007334228A (ja) * 2006-06-19 2007-12-27 Nippon Synthetic Chem Ind Co Ltd:The 偏光板および接着剤
WO2013089066A1 (ja) * 2011-12-12 2013-06-20 コニカミノルタ株式会社 光学積層フィルム、赤外遮蔽フィルムおよび赤外遮蔽体
JP5788923B2 (ja) * 2012-03-23 2015-10-07 富士フイルム株式会社 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池
KR101906879B1 (ko) * 2014-11-11 2018-10-11 후지필름 가부시키가이샤 가접착막의 제조 방법, 가접착막, 적층체, 디바이스 웨이퍼 부착 적층체, 가접착용 조성물
JP7153459B2 (ja) * 2018-03-28 2022-10-14 日東電工株式会社 粘着剤層、粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法

Also Published As

Publication number Publication date
JPWO2023042840A1 (https=) 2023-03-23
WO2023042840A1 (ja) 2023-03-23

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