TW202328383A - 暫時保護材 - Google Patents

暫時保護材 Download PDF

Info

Publication number
TW202328383A
TW202328383A TW111134938A TW111134938A TW202328383A TW 202328383 A TW202328383 A TW 202328383A TW 111134938 A TW111134938 A TW 111134938A TW 111134938 A TW111134938 A TW 111134938A TW 202328383 A TW202328383 A TW 202328383A
Authority
TW
Taiwan
Prior art keywords
layer
polyvinyl alcohol
weight
based resin
boric acid
Prior art date
Application number
TW111134938A
Other languages
English (en)
Chinese (zh)
Inventor
米田義和
山田佑
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202328383A publication Critical patent/TW202328383A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW111134938A 2021-09-16 2022-09-15 暫時保護材 TW202328383A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021-151027 2021-09-16
JP2021-151028 2021-09-16
JP2021151027 2021-09-16
JP2021151028 2021-09-16

Publications (1)

Publication Number Publication Date
TW202328383A true TW202328383A (zh) 2023-07-16

Family

ID=85602900

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111134938A TW202328383A (zh) 2021-09-16 2022-09-15 暫時保護材

Country Status (3)

Country Link
JP (1) JPWO2023042840A1 (https=)
TW (1) TW202328383A (https=)
WO (1) WO2023042840A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024068717A (ja) * 2022-11-09 2024-05-21 日東電工株式会社 保護シート、及び、電子部品装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060144514A1 (en) * 2005-01-03 2006-07-06 Yongcai Wang Polarizing plate laminated with an improved glue composition and a method of manufacturing the same
JP2007334228A (ja) * 2006-06-19 2007-12-27 Nippon Synthetic Chem Ind Co Ltd:The 偏光板および接着剤
EP2793061A4 (en) * 2011-12-12 2015-09-16 Konica Minolta Inc OPTICAL LAMINATED FOIL, INFRARED PROTECTION FILM AND INFRARED VISOR BODY
JP5788923B2 (ja) * 2012-03-23 2015-10-07 富士フイルム株式会社 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池
WO2016076261A1 (ja) * 2014-11-11 2016-05-19 富士フイルム株式会社 仮接着膜の製造方法、仮接着膜、積層体、デバイスウエハ付き積層体、仮接着用組成物
JP7153459B2 (ja) * 2018-03-28 2022-10-14 日東電工株式会社 粘着剤層、粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法

Also Published As

Publication number Publication date
JPWO2023042840A1 (https=) 2023-03-23
WO2023042840A1 (ja) 2023-03-23

Similar Documents

Publication Publication Date Title
JP5841536B2 (ja) 透明粘着テープ、金属薄膜付フィルム積層体、カバーパネル−タッチパネルモジュール積層体、カバーパネル−ディスプレイパネルモジュール積層体、タッチパネルモジュール−ディスプレイパネルモジュール積層体、及び、画像表示装置
TWI546275B (zh) Adhesive for the manufacture of inorganic sintered bodies
JP3485412B2 (ja) 積層セラミックコンデンサ積層工程用の仮止め粘着テープ及び積層セラミックコンデンサの製造方法
CN105143384B (zh) 感压式粘接剂组合物、以及使用其而成的感压式粘接薄片
WO2011007861A1 (ja) 粘着テープ、積層体及び画像表示装置
CN106574161A (zh) 粘合剂组合物、使其交联而成的粘合剂、遮蔽薄膜用粘合剂、耐热粘合薄膜用粘合剂、遮蔽用耐热粘合薄膜和其使用方法
JP2001040301A (ja) 接着シート類
JP7540470B2 (ja) 離型層、離型層を備える成形体および離型剤
CN107635946A (zh) 无机烧结体制造用粘合剂
CN108473830A (zh) 粘接性树脂层以及粘接性树脂膜
JP2023155293A (ja) 粘着テープ
TW202328383A (zh) 暫時保護材
TW202146614A (zh) 黏合劑組成物、黏合層及黏合膜
JP2023174688A (ja) 離型フィルム及び半導体パッケージの製造方法
JP7185086B1 (ja) 仮保護材
CN105683324B (zh) 光学用粘合剂、光学用粘合带及层叠体
JPWO2009037990A1 (ja) 表面保護粘着シート
CN118516069A (zh) 粘接胶膜及其制备方法、复合组件及电子设备
CN103387800A (zh) 金属面保护用粘合片
JP5525779B2 (ja) 接着剤組成物、及び接着フィルム
JP2015040215A (ja) タッチパネル用粘着剤組成物及びタッチパネル用粘着テープ
CN115991967A (zh) 成胶组合物、粘胶及柔性显示装置
TW202330846A (zh) 暫時保護材
TWI797152B (zh) 黏著劑組成物、黏著帶及半導體裝置之保護方法
JP2014234493A (ja) 粘着シート及び電子機器