JPWO2023042840A1 - - Google Patents
Info
- Publication number
- JPWO2023042840A1 JPWO2023042840A1 JP2022557730A JP2022557730A JPWO2023042840A1 JP WO2023042840 A1 JPWO2023042840 A1 JP WO2023042840A1 JP 2022557730 A JP2022557730 A JP 2022557730A JP 2022557730 A JP2022557730 A JP 2022557730A JP WO2023042840 A1 JPWO2023042840 A1 JP WO2023042840A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/02—Homopolymers or copolymers of unsaturated alcohols
- C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021151027 | 2021-09-16 | ||
| JP2021151028 | 2021-09-16 | ||
| PCT/JP2022/034338 WO2023042840A1 (ja) | 2021-09-16 | 2022-09-14 | 仮保護材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042840A1 true JPWO2023042840A1 (https=) | 2023-03-23 |
| JPWO2023042840A5 JPWO2023042840A5 (https=) | 2024-06-06 |
Family
ID=85602900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022557730A Pending JPWO2023042840A1 (https=) | 2021-09-16 | 2022-09-14 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023042840A1 (https=) |
| TW (1) | TW202328383A (https=) |
| WO (1) | WO2023042840A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024068717A (ja) * | 2022-11-09 | 2024-05-21 | 日東電工株式会社 | 保護シート、及び、電子部品装置の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060144514A1 (en) * | 2005-01-03 | 2006-07-06 | Yongcai Wang | Polarizing plate laminated with an improved glue composition and a method of manufacturing the same |
| JP2007334228A (ja) * | 2006-06-19 | 2007-12-27 | Nippon Synthetic Chem Ind Co Ltd:The | 偏光板および接着剤 |
| EP2793061A4 (en) * | 2011-12-12 | 2015-09-16 | Konica Minolta Inc | OPTICAL LAMINATED FOIL, INFRARED PROTECTION FILM AND INFRARED VISOR BODY |
| JP5788923B2 (ja) * | 2012-03-23 | 2015-10-07 | 富士フイルム株式会社 | 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池 |
| WO2016076261A1 (ja) * | 2014-11-11 | 2016-05-19 | 富士フイルム株式会社 | 仮接着膜の製造方法、仮接着膜、積層体、デバイスウエハ付き積層体、仮接着用組成物 |
| JP7153459B2 (ja) * | 2018-03-28 | 2022-10-14 | 日東電工株式会社 | 粘着剤層、粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法 |
-
2022
- 2022-09-14 WO PCT/JP2022/034338 patent/WO2023042840A1/ja not_active Ceased
- 2022-09-14 JP JP2022557730A patent/JPWO2023042840A1/ja active Pending
- 2022-09-15 TW TW111134938A patent/TW202328383A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202328383A (zh) | 2023-07-16 |
| WO2023042840A1 (ja) | 2023-03-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220922 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250611 |