WO2023042840A1 - 仮保護材 - Google Patents
仮保護材 Download PDFInfo
- Publication number
- WO2023042840A1 WO2023042840A1 PCT/JP2022/034338 JP2022034338W WO2023042840A1 WO 2023042840 A1 WO2023042840 A1 WO 2023042840A1 JP 2022034338 W JP2022034338 W JP 2022034338W WO 2023042840 A1 WO2023042840 A1 WO 2023042840A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- polyvinyl alcohol
- weight
- protective material
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/02—Homopolymers or copolymers of unsaturated alcohols
- C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Definitions
- the present disclosure (4) is a temporary protective material in any combination with any of the present disclosures (1) to (3), wherein the polyvinyl alcohol resin has a weight average molecular weight of 8000 or more and 150000 or less.
- the present disclosure (5) is a temporary protective material in any combination with any of the present disclosure (1) to (4), wherein the content of boric acid in the temporary protective material is 0.025% by weight or more and 15% by weight or less. is.
- the present disclosure (6) is any combination with any of the present disclosure (1) to (5), wherein the content of the structural unit having a polar group in the modified polyvinyl alcohol resin is 1 mol% or more and 20 mol% or less. is a temporary protective material.
- the modified polyvinyl alcohol-based resin can be produced by saponifying a polymer of a vinyl ester and another unsaturated monomer having a polar group.
- unsaturated monomers include monomers other than the above vinyl esters and having unsaturated double bonds such as vinyl groups.
- the polyvinyl alcohol-based resin (A'') may be a mixed resin of a plurality of polyvinyl alcohol-based resins having different compositions, as long as the saponification degree satisfies the above range.
- boric acid examples include the same ones as in the layer A described above.
- the thickness of the base material is not particularly limited, but the preferred lower limit is 20 ⁇ m, the more preferred lower limit is 25 ⁇ m, and the preferred upper limit is 250 ⁇ m. If the thickness of the base material is within the above range, the adhesive tape can be excellent in handleability. In addition, if the base material is thin, the base material is deformed during drying by heating, making it difficult to obtain a temporary protective material with a constant thickness. A more preferable lower limit of the thickness of the base material is 50 ⁇ m, and a more preferable upper limit thereof is 125 ⁇ m.
- the adhesive primer is used as an adhesive primer for a polyvinyl alcohol-based resin for bonding a protective sheet containing a polyvinyl alcohol-based resin as a main component to an electronic substrate.
- the adhesion primer can be used in the manufacturing process of electronic components such as semiconductor devices and display devices.
- a polyvinyl alcohol resin PVA-2 was used as the polyvinyl alcohol resin. Further, an aqueous solution for a temporary protective material was prepared by mixing an aqueous solution of a polyvinyl alcohol-based resin and an aqueous solution of boric acid so that 2.061 parts by weight of boric acid was added to 100 parts by weight of the polyvinyl alcohol-based resin. A temporary protective material was produced in the same manner as in Example 1 except for the above.
- aqueous polyvinyl alcohol-based resin solution and an aqueous boric acid solution were mixed so that 0.108 parts by weight of boric acid was added to 100 parts by weight of polyvinyl alcohol-based resin, and defoamed to obtain an aqueous solution for layer B.
- Example 16 A layer A' was prepared in the same manner as in Example 15, except that in (Preparation of layer A'), the aqueous solution was applied so that the thickness of the layer A' was 60 ⁇ m. Another layer A' was prepared in the same manner. A layer A'' was prepared in the same manner as in Example 15, except that in (preparation of layer A''), the aqueous solution was applied so that the thickness of the layer A'' was 280 ⁇ m. Further, a layer B was produced in the same manner as in Example 15.
- Layers A' and A'' are peeled off from the PET film, and layers A and A'' are laminated in this order using a laminator and bonded together to form a temporary structure having a two-layer structure of layer A'/layer A''.
- a protective material was produced.
- the obtained aqueous solution for layer A′′ was applied onto the non-release-treated surface of a polyethylene terephthalate (PET) film that had been subjected to release treatment on one side so that the thickness after drying was 280 ⁇ m, and the temperature was maintained at 80°C.
- PET polyethylene terephthalate
- the film was dried in a hot air circulating oven to remove water, and an A'' layer was produced on the PET film. Since it is difficult to obtain a predetermined thickness at once, coating and drying were repeated several times to obtain a predetermined thickness.
- Sd is the degree of saponification (mol%) of the polyvinyl alcohol resin constituting each layer
- Mw is the weight average molecular weight of the polyvinyl alcohol resin constituting each layer
- C is boric acid in each layer.
- the content (% by weight) of Gu is 70 and Gd is 5.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022557730A JPWO2023042840A1 (https=) | 2021-09-16 | 2022-09-14 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-151027 | 2021-09-16 | ||
| JP2021-151028 | 2021-09-16 | ||
| JP2021151027 | 2021-09-16 | ||
| JP2021151028 | 2021-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023042840A1 true WO2023042840A1 (ja) | 2023-03-23 |
Family
ID=85602900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2022/034338 Ceased WO2023042840A1 (ja) | 2021-09-16 | 2022-09-14 | 仮保護材 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023042840A1 (https=) |
| TW (1) | TW202328383A (https=) |
| WO (1) | WO2023042840A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024101170A1 (ja) * | 2022-11-09 | 2024-05-16 | 日東電工株式会社 | 保護シート、及び、電子部品装置の製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007334228A (ja) * | 2006-06-19 | 2007-12-27 | Nippon Synthetic Chem Ind Co Ltd:The | 偏光板および接着剤 |
| JP2008527412A (ja) * | 2005-01-03 | 2008-07-24 | イーストマン コダック カンパニー | 改善されたグルーの組成物を含む偏光プレート |
| WO2013089066A1 (ja) * | 2011-12-12 | 2013-06-20 | コニカミノルタ株式会社 | 光学積層フィルム、赤外遮蔽フィルムおよび赤外遮蔽体 |
| JP2013225498A (ja) * | 2012-03-23 | 2013-10-31 | Fujifilm Corp | 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池 |
| WO2016076261A1 (ja) * | 2014-11-11 | 2016-05-19 | 富士フイルム株式会社 | 仮接着膜の製造方法、仮接着膜、積層体、デバイスウエハ付き積層体、仮接着用組成物 |
| JP2019172839A (ja) * | 2018-03-28 | 2019-10-10 | 日東電工株式会社 | 粘着剤層、粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法 |
-
2022
- 2022-09-14 WO PCT/JP2022/034338 patent/WO2023042840A1/ja not_active Ceased
- 2022-09-14 JP JP2022557730A patent/JPWO2023042840A1/ja active Pending
- 2022-09-15 TW TW111134938A patent/TW202328383A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008527412A (ja) * | 2005-01-03 | 2008-07-24 | イーストマン コダック カンパニー | 改善されたグルーの組成物を含む偏光プレート |
| JP2007334228A (ja) * | 2006-06-19 | 2007-12-27 | Nippon Synthetic Chem Ind Co Ltd:The | 偏光板および接着剤 |
| WO2013089066A1 (ja) * | 2011-12-12 | 2013-06-20 | コニカミノルタ株式会社 | 光学積層フィルム、赤外遮蔽フィルムおよび赤外遮蔽体 |
| JP2013225498A (ja) * | 2012-03-23 | 2013-10-31 | Fujifilm Corp | 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池 |
| WO2016076261A1 (ja) * | 2014-11-11 | 2016-05-19 | 富士フイルム株式会社 | 仮接着膜の製造方法、仮接着膜、積層体、デバイスウエハ付き積層体、仮接着用組成物 |
| JP2019172839A (ja) * | 2018-03-28 | 2019-10-10 | 日東電工株式会社 | 粘着剤層、粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024101170A1 (ja) * | 2022-11-09 | 2024-05-16 | 日東電工株式会社 | 保護シート、及び、電子部品装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023042840A1 (https=) | 2023-03-23 |
| TW202328383A (zh) | 2023-07-16 |
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