TW202328243A - 半導體基板的製造方法及組成物 - Google Patents

半導體基板的製造方法及組成物 Download PDF

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Publication number
TW202328243A
TW202328243A TW111147078A TW111147078A TW202328243A TW 202328243 A TW202328243 A TW 202328243A TW 111147078 A TW111147078 A TW 111147078A TW 111147078 A TW111147078 A TW 111147078A TW 202328243 A TW202328243 A TW 202328243A
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TW
Taiwan
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ring
compound
aromatic
composition
group
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TW111147078A
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English (en)
Chinese (zh)
Inventor
中津大貴
植田嘉奈子
田中亮太郎
真弓公佑
永縄温子
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日商Jsr股份有限公司
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Publication of TW202328243A publication Critical patent/TW202328243A/zh

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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D209/00Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/02Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom condensed with one carbocyclic ring
    • C07D209/04Indoles; Hydrogenated indoles
    • C07D209/08Indoles; Hydrogenated indoles with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to carbon atoms of the hetero ring
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D209/00Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/02Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom condensed with one carbocyclic ring
    • C07D209/04Indoles; Hydrogenated indoles
    • C07D209/10Indoles; Hydrogenated indoles with substituted hydrocarbon radicals attached to carbon atoms of the hetero ring
    • C07D209/14Radicals substituted by nitrogen atoms, not forming part of a nitro radical
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW111147078A 2021-12-15 2022-12-08 半導體基板的製造方法及組成物 TW202328243A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-203109 2021-12-15
JP2021203109 2021-12-15

Publications (1)

Publication Number Publication Date
TW202328243A true TW202328243A (zh) 2023-07-16

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ID=86774186

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TW111147078A TW202328243A (zh) 2021-12-15 2022-12-08 半導體基板的製造方法及組成物

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JP (1) JPWO2023112672A1 (https=)
TW (1) TW202328243A (https=)
WO (1) WO2023112672A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025010495A (ja) * 2023-07-07 2025-01-21 信越化学工業株式会社 レジスト下層膜形成方法及びパターン形成方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5387935B2 (ja) * 2006-03-09 2014-01-15 株式会社リコー π共役ポリマー
WO2018164267A1 (ja) * 2017-03-10 2018-09-13 Jsr株式会社 レジスト下層膜形成用組成物、レジスト下層膜及びその形成方法並びにパターニングされた基板の製造方法
WO2019208212A1 (ja) * 2018-04-23 2019-10-31 Jsr株式会社 レジスト下層膜形成用組成物、レジスト下層膜及びその形成方法並びにパターン形成方法
CN110156616B (zh) * 2019-05-22 2022-02-25 吉林师范大学 基于芴乙烯桥联芳香环核的免掺杂空穴传输材料的合成方法及其在钙钛矿电池中的应用
KR102776927B1 (ko) * 2019-09-17 2025-03-10 제이에스알 가부시키가이샤 조성물, 레지스트 하층막, 레지스트 하층막의 형성 방법, 패터닝된 기판의 제조 방법 및 화합물

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WO2023112672A1 (ja) 2023-06-22
JPWO2023112672A1 (https=) 2023-06-22

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