TW202302332A - 燒結機 - Google Patents

燒結機 Download PDF

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Publication number
TW202302332A
TW202302332A TW111105249A TW111105249A TW202302332A TW 202302332 A TW202302332 A TW 202302332A TW 111105249 A TW111105249 A TW 111105249A TW 111105249 A TW111105249 A TW 111105249A TW 202302332 A TW202302332 A TW 202302332A
Authority
TW
Taiwan
Prior art keywords
press
lower plate
load cell
plate
silicon wafers
Prior art date
Application number
TW111105249A
Other languages
English (en)
Chinese (zh)
Inventor
尼古拉 希瓦洛基
Original Assignee
義大利商亞姆艾克斯自動矩陣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 義大利商亞姆艾克斯自動矩陣股份有限公司 filed Critical 義大利商亞姆艾克斯自動矩陣股份有限公司
Publication of TW202302332A publication Critical patent/TW202302332A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0094—Press load monitoring means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/007—Means for maintaining the press table, the press platen or the press ram against tilting or deflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/026—Mounting of dies, platens or press rams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/308—Adjustable moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Silicon Compounds (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW111105249A 2021-07-13 2022-02-14 燒結機 TW202302332A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102021000018458A IT202100018458A1 (it) 2021-07-13 2021-07-13 Pressa di sinterizzazione
IT102021000018458 2021-07-13

Publications (1)

Publication Number Publication Date
TW202302332A true TW202302332A (zh) 2023-01-16

Family

ID=78086672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105249A TW202302332A (zh) 2021-07-13 2022-02-14 燒結機

Country Status (9)

Country Link
US (1) US20240339343A1 (enExample)
EP (1) EP4370320A1 (enExample)
JP (1) JP7849072B2 (enExample)
CN (1) CN117715746A (enExample)
CA (1) CA3224468A1 (enExample)
IT (1) IT202100018458A1 (enExample)
MX (1) MX2024000677A (enExample)
TW (1) TW202302332A (enExample)
WO (1) WO2023285876A1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076780A (en) * 1977-01-27 1978-02-28 General Motors Corporation Programmable velocity and force control method for compression molding
JP3490606B2 (ja) * 1998-03-20 2004-01-26 富士通株式会社 半導体装置製造用金型
JP5977592B2 (ja) 2012-06-20 2016-08-24 東京応化工業株式会社 貼付装置
US9427893B2 (en) 2014-09-18 2016-08-30 Asm Technology Singapore Pte Ltd Molding press and a platen for a molding press
IT201800020272A1 (it) 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato

Also Published As

Publication number Publication date
EP4370320A1 (en) 2024-05-22
WO2023285876A1 (en) 2023-01-19
CN117715746A (zh) 2024-03-15
JP7849072B2 (ja) 2026-04-21
MX2024000677A (es) 2024-07-22
IT202100018458A1 (it) 2023-01-13
CA3224468A1 (en) 2023-01-19
JP2024529344A (ja) 2024-08-06
US20240339343A1 (en) 2024-10-10

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