CN117715746A - 烧结压制结构 - Google Patents

烧结压制结构 Download PDF

Info

Publication number
CN117715746A
CN117715746A CN202180100562.1A CN202180100562A CN117715746A CN 117715746 A CN117715746 A CN 117715746A CN 202180100562 A CN202180100562 A CN 202180100562A CN 117715746 A CN117715746 A CN 117715746A
Authority
CN
China
Prior art keywords
lower plate
pressing structure
plate
load cell
silicon wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180100562.1A
Other languages
English (en)
Chinese (zh)
Inventor
尼古拉·斯基瓦洛基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMX Automatrix SRL
Original Assignee
AMX Automatrix SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMX Automatrix SRL filed Critical AMX Automatrix SRL
Publication of CN117715746A publication Critical patent/CN117715746A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/007—Means for maintaining the press table, the press platen or the press ram against tilting or deflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0094—Press load monitoring means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/026—Mounting of dies, platens or press rams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/308—Adjustable moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Silicon Compounds (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN202180100562.1A 2021-07-13 2021-12-28 烧结压制结构 Pending CN117715746A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT102021000018458A IT202100018458A1 (it) 2021-07-13 2021-07-13 Pressa di sinterizzazione
IT102021000018458 2021-07-13
PCT/IB2021/062386 WO2023285876A1 (en) 2021-07-13 2021-12-28 Sintering press

Publications (1)

Publication Number Publication Date
CN117715746A true CN117715746A (zh) 2024-03-15

Family

ID=78086672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180100562.1A Pending CN117715746A (zh) 2021-07-13 2021-12-28 烧结压制结构

Country Status (9)

Country Link
US (1) US20240339343A1 (enExample)
EP (1) EP4370320A1 (enExample)
JP (1) JP7849072B2 (enExample)
CN (1) CN117715746A (enExample)
CA (1) CA3224468A1 (enExample)
IT (1) IT202100018458A1 (enExample)
MX (1) MX2024000677A (enExample)
TW (1) TW202302332A (enExample)
WO (1) WO2023285876A1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076780A (en) * 1977-01-27 1978-02-28 General Motors Corporation Programmable velocity and force control method for compression molding
JP3490606B2 (ja) * 1998-03-20 2004-01-26 富士通株式会社 半導体装置製造用金型
JP5977592B2 (ja) 2012-06-20 2016-08-24 東京応化工業株式会社 貼付装置
US9427893B2 (en) 2014-09-18 2016-08-30 Asm Technology Singapore Pte Ltd Molding press and a platen for a molding press
IT201800020272A1 (it) 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato

Also Published As

Publication number Publication date
EP4370320A1 (en) 2024-05-22
WO2023285876A1 (en) 2023-01-19
JP7849072B2 (ja) 2026-04-21
TW202302332A (zh) 2023-01-16
MX2024000677A (es) 2024-07-22
IT202100018458A1 (it) 2023-01-13
CA3224468A1 (en) 2023-01-19
JP2024529344A (ja) 2024-08-06
US20240339343A1 (en) 2024-10-10

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