JP7849072B2 - 焼結プレス機 - Google Patents

焼結プレス機

Info

Publication number
JP7849072B2
JP7849072B2 JP2024501755A JP2024501755A JP7849072B2 JP 7849072 B2 JP7849072 B2 JP 7849072B2 JP 2024501755 A JP2024501755 A JP 2024501755A JP 2024501755 A JP2024501755 A JP 2024501755A JP 7849072 B2 JP7849072 B2 JP 7849072B2
Authority
JP
Japan
Prior art keywords
press machine
load cell
cell body
silicon wafer
lower plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024501755A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024529344A5 (enExample
JP2024529344A (ja
Inventor
スキヴァロッキ，ニコラ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMX Automatrix SRL
Original Assignee
AMX Automatrix SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMX Automatrix SRL filed Critical AMX Automatrix SRL
Publication of JP2024529344A publication Critical patent/JP2024529344A/ja
Publication of JP2024529344A5 publication Critical patent/JP2024529344A5/ja
Application granted granted Critical
Publication of JP7849072B2 publication Critical patent/JP7849072B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/007—Means for maintaining the press table, the press platen or the press ram against tilting or deflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0094—Press load monitoring means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/026—Mounting of dies, platens or press rams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/308—Adjustable moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Silicon Compounds (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2024501755A 2021-07-13 2021-12-28 焼結プレス機 Active JP7849072B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT102021000018458A IT202100018458A1 (it) 2021-07-13 2021-07-13 Pressa di sinterizzazione
IT102021000018458 2021-07-13
PCT/IB2021/062386 WO2023285876A1 (en) 2021-07-13 2021-12-28 Sintering press

Publications (3)

Publication Number Publication Date
JP2024529344A JP2024529344A (ja) 2024-08-06
JP2024529344A5 JP2024529344A5 (enExample) 2024-10-25
JP7849072B2 true JP7849072B2 (ja) 2026-04-21

Family

ID=78086672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024501755A Active JP7849072B2 (ja) 2021-07-13 2021-12-28 焼結プレス機

Country Status (9)

Country Link
US (1) US20240339343A1 (enExample)
EP (1) EP4370320A1 (enExample)
JP (1) JP7849072B2 (enExample)
CN (1) CN117715746A (enExample)
CA (1) CA3224468A1 (enExample)
IT (1) IT202100018458A1 (enExample)
MX (1) MX2024000677A (enExample)
TW (1) TW202302332A (enExample)
WO (1) WO2023285876A1 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014003245A (ja) 2012-06-20 2014-01-09 Tokyo Ohka Kogyo Co Ltd 貼付装置
JP2016060209A (ja) 2014-09-18 2016-04-25 エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド 成形プレス及び成形プレス用プラテン
JP2022510932A (ja) 2018-12-20 2022-01-28 エイエムエックス － オートマトリックス・ソチエタ・ア・レスポンサビリタ・リミタータ 基板上の電子部品を焼結するための焼結プレス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076780A (en) * 1977-01-27 1978-02-28 General Motors Corporation Programmable velocity and force control method for compression molding
JP3490606B2 (ja) * 1998-03-20 2004-01-26 富士通株式会社 半導体装置製造用金型

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014003245A (ja) 2012-06-20 2014-01-09 Tokyo Ohka Kogyo Co Ltd 貼付装置
JP2016060209A (ja) 2014-09-18 2016-04-25 エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド 成形プレス及び成形プレス用プラテン
JP2022510932A (ja) 2018-12-20 2022-01-28 エイエムエックス － オートマトリックス・ソチエタ・ア・レスポンサビリタ・リミタータ 基板上の電子部品を焼結するための焼結プレス

Also Published As

Publication number Publication date
EP4370320A1 (en) 2024-05-22
WO2023285876A1 (en) 2023-01-19
CN117715746A (zh) 2024-03-15
TW202302332A (zh) 2023-01-16
MX2024000677A (es) 2024-07-22
IT202100018458A1 (it) 2023-01-13
CA3224468A1 (en) 2023-01-19
JP2024529344A (ja) 2024-08-06
US20240339343A1 (en) 2024-10-10

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