JP2023156160A - 基板重ね合わせ装置及び基板重ね合わせ方法 - Google Patents
基板重ね合わせ装置及び基板重ね合わせ方法 Download PDFInfo
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
Description
実施形態に係る基板重ね合わせ装置100について説明する。図1は、実施形態に係る基板重ね合わせ装置100の一例を示す図である。基板重ね合わせ装置100は、接着層Fを形成した基板S1と、接着層Fを形成した基板S2とを、互いの接着層Fを当接させて貼り付ける。なお、接着層Fは、基板S1及び基板S2の双方に形成されることに限定されず、いずれか一方の基板S1又は基板S2に形成される形態であってもよい。接着層Fは、基板重ね合わせ装置100に搬入される前に、例えば塗布装置等により基板S1、基板S2に塗布、乾燥されることで形成される。なお、この塗布装置は、基板重ね合わせ装置100に備える形態であってもよい。
次に、本実施形態に係る基板重ね合わせ方法について説明する。図7は、本実施形態に係る基板重ね合わせ方法の一例を示すフローチャートである。図8は、図7に続いて、本実施形態に係る基板重ね合わせ方法の一例を示すフローチャートである。この基板重ね合わせ方法は、例えば、制御部Cからの指示により実行される。図9から図18は、基板重ね合わせ装置100の動作の一例を示す工程図である。なお、これらの工程図では、各部の動きが分かり易くなるように、記載を簡略化している。以下、図7、図8のフローチャートに沿って説明する。
20・・・基板支持部
30・・・吸着部
32a・・・吸着面
33・・・吸着溝
41・・・リフトピン
51・・・軸部(支持部)
60・・・アライメント機構
80・・・支持部材
100・・・基板重ね合わせ装置
F1・・・下面外周部
S、S1、S2・・・基板
Claims (11)
- 大気圧雰囲気下で2枚の基板を重ね合わせる基板重ね合わせ装置であって、
搬送された前記基板を支持して昇降するリフトピンと、
前記リフトピンが下降した際に、前記基板を位置決めするアライメント機構と、
前記リフトピンで支持する前記基板の上面を吸着して前記基板を前記リフトピンから受け取る吸着部と、を備える、基板重ね合わせ装置。 - 前記吸着部は、上下方向に交差する面に沿って延びる板状であり、下面に前記基板の上面を吸着可能な吸着面を有している、請求項1に記載の基板重ね合わせ装置。
- 前記吸着部は、前記吸着面から上方に窪み、前記吸着面に沿って延びる吸着溝を有している、請求項2に記載の基板重ね合わせ装置。
- 前記吸着部は、上方から見て、少なくとも前記リフトピンと重なる位置に配置されている、請求項1から請求項3のいずれか一項に記載の基板重ね合わせ装置。
- 前記吸着部は、前記リフトピンよりも大きな外形寸法を有している、請求項1から請求項3のいずれか一項に記載の基板重ね合わせ装置。
- 前記吸着部を所定高さに支持する支持部を備える、請求項1から請求項3のいずれか一項に記載の基板重ね合わせ装置。
- 前記吸着部は、前記支持部に揺動可能に設けられている、請求項6に記載の基板重ね合わせ装置。
- 前記リフトピンが下降した際に、前記基板を支持する基板支持部をさらに備えている、請求項1から請求項3のいずれか一項に記載の基板重ね合わせ装置。
- 前記基板支持部は、前記リフトピンが下降した際に前記基板の下面外周部に当接して前記基板を支持する支持部材を備え、
前記アライメント機構は、前記支持部材に支持された前記基板を、前記基板の表面に沿った方向に挟み込むことで前記基板を位置決めする、請求項8に記載の基板重ね合わせ装置。 - 前記基板支持部及び前記吸着部を収容するチャンバを備える、請求項8に記載の基板重ね合わせ装置。
- 大気圧雰囲気下で2枚の基板を重ね合わせる方法であって、
搬送された前記基板をリフトピンにより支持することと、
前記リフトピンに支持された前記基板を支持部材で支持することと、
前記支持部材に支持された前記基板を位置決めすることと、
位置決めされた前記基板を前記リフトピンで支持することと、
前記リフトピンで支持した前記基板の上面を吸着して前記基板を前記リフトピンから受け取ることと、を含む、基板重ね合わせ方法。
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JP2022065854A JP2023156160A (ja) | 2022-04-12 | 2022-04-12 | 基板重ね合わせ装置及び基板重ね合わせ方法 |
KR1020230046770A KR20230146468A (ko) | 2022-04-12 | 2023-04-10 | 기판 중합 장치 및 기판 중합 방법 |
TW112113424A TW202401507A (zh) | 2022-04-12 | 2023-04-11 | 基板層疊裝置及基板層疊方法 |
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JP2022065854A JP2023156160A (ja) | 2022-04-12 | 2022-04-12 | 基板重ね合わせ装置及び基板重ね合わせ方法 |
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KR (1) | KR20230146468A (ja) |
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JP4781802B2 (ja) | 2005-12-06 | 2011-09-28 | 東京応化工業株式会社 | サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法 |
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- 2022-04-12 JP JP2022065854A patent/JP2023156160A/ja active Pending
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- 2023-04-10 KR KR1020230046770A patent/KR20230146468A/ko unknown
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TW202401507A (zh) | 2024-01-01 |
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