WO2023011080A1 - 片材键合对位系统及片材键合方法 - Google Patents
片材键合对位系统及片材键合方法 Download PDFInfo
- Publication number
- WO2023011080A1 WO2023011080A1 PCT/CN2022/103748 CN2022103748W WO2023011080A1 WO 2023011080 A1 WO2023011080 A1 WO 2023011080A1 CN 2022103748 W CN2022103748 W CN 2022103748W WO 2023011080 A1 WO2023011080 A1 WO 2023011080A1
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- WO
- WIPO (PCT)
- Prior art keywords
- sheet
- end surface
- heating element
- alignment system
- sheet bonding
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 79
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 114
- 238000003825 pressing Methods 0.000 claims description 106
- 238000001179 sorption measurement Methods 0.000 claims description 87
- 238000012546 transfer Methods 0.000 claims description 87
- 238000010030 laminating Methods 0.000 claims 2
- 239000000463 material Substances 0.000 description 16
- 238000012937 correction Methods 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000002452 interceptive effect Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 241000309551 Arthraxon hispidus Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present application relates to the technical field of bonding equipment, in particular to a sheet bonding alignment system and a sheet bonding method.
- micro light-emitting diode (micro LED) display panels as a new generation of display technology, have the advantages of higher brightness, better luminous efficiency, and lower power consumption, making micro LEDs widely used.
- a Micro-LED display panel generally includes a plurality of pixel areas, and each pixel area includes a red LED chip, a blue LED chip and a green LED chip.
- the current transfer method is: use a temporary substrate to bond the red LED chip to a temporary substrate; then laser peel off the growth substrate of the red LED chip, and then transfer the red LED chip to the temporary substrate; then use The transfer substrate transfers the red LED chips to the display backplane on a temporary substrate.
- the process of transferring LED chips to the display backplane is called mass transfer.
- the alignment accuracy is difficult to guarantee, and the bonding efficiency is low.
- the purpose of this application is to provide a sheet bonding alignment system and sheet bonding method, which improves the alignment accuracy involved in the bonding process in the mass transfer process, such as LED chips And the alignment accuracy of the display backplane can improve the bonding efficiency.
- the first aspect of the present application provides a sheet bonding alignment system, including: an alignment mechanism; the alignment mechanism includes a support platform and a pressing head; the support platform is provided with a support end surface, and a The first vacuum adsorption hole; the pressing head is provided with a pressing surface; the pressing surface faces the supporting end surface, and the distance between the pressing surface and the supporting end surface is adjustable; the first The vacuum suction hole is used for absorbing the sheets to be bonded, and the pressing head is used for pressing the sheets adsorbed by the first vacuum suction hole.
- a first vacuum suction hole is provided on the support platform, and the first vacuum suction hole can absorb the sheet to be bonded placed on the support end surface, that is, the first vacuum suction hole.
- the adsorption hole can fix the sheets to be bonded, so when another sheet is stacked on the adsorbed sheet, the adsorbed sheet will not shift, and the alignment accuracy of the two sheets can be guaranteed.
- the supporting platform is provided with a plurality of the first vacuum adsorption holes
- the chamber is provided with a plurality of the heating elements corresponding to the plurality of the first vacuum adsorption holes one-to-one. Because the quantity of mass transfer is very large, a plurality of first vacuum adsorption holes are set correspondingly, and each first vacuum adsorption hole corresponds to absorbing a first sheet, which can be processed in batches, thereby increasing efficiency.
- a plurality of the first vacuum adsorption holes are evenly distributed on the support platform. Therefore, the space utilization rate is high, and as many first vacuum adsorption holes as possible can be provided in a limited area, so that a large number of sheets to be bonded can be adsorbed and fixed at one time, and the bonding efficiency can be improved.
- the support platform is further provided with a chamber communicating with the first vacuum adsorption hole; a heating element is provided in the chamber, and the heating element corresponds to the first vacuum adsorption hole, The heating element can move toward or away from the first vacuum suction hole; the heating element is used to heat the sheets to be bonded.
- the heating element can heat the bonded sheets, so that the sheets can be bonded smoothly; in addition, the heating element is installed in the chamber, which makes reasonable use of the space of the supporting platform, improves the space utilization rate, and reduces the volume of the entire equipment .
- a heat conduction element is further provided in the chamber, and the heat conduction element is fixedly connected with the heating element, and the heat conduction element is provided with a second vacuum absorption hole corresponding to the first vacuum absorption hole. hole; the heating element and the heat conduction element can move towards or away from the first vacuum adsorption hole at the same time; the second vacuum adsorption hole is used for absorbing the sheet to be bonded, and the heat conduction element is used for The heat of the heating element is transferred to the sheet to be bonded.
- the heat conduction element can transfer the heat emitted by the heating element to the sheet, and the second vacuum suction hole strengthens the stability of the sheet. As a result, it can not only provide heat for sheet bonding smoothly, but also increase sheet stability, thereby ensuring alignment accuracy.
- the heating element is provided with a heating end surface, the heating end surface faces the first vacuum adsorption hole, and is parallel to the support end surface; the heating end surface is used for contacting the first sheet.
- the heating element can be in surface contact with the sheet, thereby increasing the contact area, so that the heat of the heating element can be better transferred to the sheet, and the bonding reliability can be improved.
- the sheet bonding alignment system further includes: a transfer mechanism, the transfer mechanism includes a gripping end surface, and a third vacuum adsorption hole is provided on the gripping end surface; the third vacuum adsorption The hole is used to absorb the sheet to be bonded to the gripping end surface, and the transfer mechanism is used to transfer the adsorbed sheet to be bonded to the support end surface.
- the transfer mechanism can automatically transfer the bonded sheet to the support end surface, realizing automatic operation and high feasibility of mass production.
- the sheet bonding alignment system further includes: an image acquisition device; the image acquisition device is used to acquire an image of the sheet to be bonded by the third vacuum suction hole, and the image is obtained by It is used for correcting the position where the transfer mechanism places the sheet to be bonded on the supporting end surface. Setting the image acquisition device can correct the position of the two sheets to be bonded and improve the alignment accuracy.
- the sheet bonding alignment system further includes: a lifter; the pressing head is connected to the lifter, and the lifter can drive the pressing head closer to or away from the The direction of the supporting platform is moved so that the distance between the pressing surface and the supporting end surface can be adjusted.
- the press head is driven by the lifter to move so that the press head can move towards or away from the support platform, which increases the degree of automation and improves the bonding efficiency.
- the sheet bonding alignment system further includes: a lifter; the support platform is connected to the lifter, and the lifter can drive the support platform closer to or away from the press The direction of the fitting head is moved so that the distance between the pressing surface and the supporting end surface can be adjusted.
- the support platform is driven by the lifter to move, so that the support platform can move toward or away from the pressing head, increasing the degree of automation and improving the bonding efficiency.
- the alignment mechanism further includes: a first lifter and a second lifter; the pressing head is connected to the first lifter, and the first lifter can drive the press
- the closing head moves closer to or away from the support platform; the support platform is connected to the second lifter, and the second lifter can drive the support platform to move closer to or away from the pressing head moving; the distance between the pressing surface and the supporting end surface can be adjusted. Therefore, when pressing is required, the distance between the pressing surface and the supporting end surface can be quickly shortened; after the pressing is completed, the distance between the pressing surface and the supporting end surface can be quickly opened to prevent the pressing head from interfering with the transfer organization, thereby being able to speed up production efficiency.
- the sheet bonding alignment system further includes: a loading platform and an unloading platform, the loading platform is used to support the sheets to be bonded; the unloading platform is used to support the bonding Finished sheet.
- the loading table can support the sheets to be bonded before the sheets to be bonded are transferred to the supporting end surface.
- the unloading table can temporarily store the bonded sheets after the sheet bonding is completed, thereby increasing the convenience of use and improving the preparation efficiency.
- the second aspect of the present application provides a sheet bonding method, wherein the sheet bonding alignment method is implemented using a sheet bonding alignment system, and the sheet bonding alignment system includes: an alignment mechanism;
- the alignment mechanism includes a supporting platform and a pressing head; the supporting platform is provided with a supporting end surface and a first vacuum adsorption hole penetrating through the supporting end surface;
- the pressing head is provided with a pressing surface; the The pressing surface faces the supporting end surface, and the distance between the pressing surface and the supporting end surface is adjustable.
- the sheet bonding method includes: placing a first sheet on the support end surface, so that the first sheet corresponds to the first vacuum adsorption hole, and the first vacuum adsorption hole pre-adsorbs the The first sheet; stacking the second sheet on the first sheet; adjusting the distance between the pressing surface and the supporting end surface, so that the distance between the pressing surface and the supporting end surface shortened so that the pressing surface and the supporting end face press the first sheet and the second sheet.
- the first vacuum suction hole can absorb the sheet to be bonded placed on the end surface of the support, that is, the first vacuum suction hole can fix the sheet to be bonded, then in When another sheet is stacked on the adsorbed sheet, the adsorbed sheet will not be displaced, and the alignment accuracy of the two sheets can be guaranteed.
- the support platform is further provided with a chamber communicating with the first vacuum adsorption hole; a heating element is provided in the chamber, and the heating element corresponds to the first vacuum adsorption hole, The heating element can move toward or away from the first vacuum suction hole; after the second sheet is stacked on the first sheet, the sheet bonding method further includes: making the heating element move to contact with the first sheet to make the heating element generate heat; while the pressing surface and the supporting end face pressurize the first sheet and the second sheet, the The heating element heats the first sheet and the second sheet.
- the heating element can heat the bonded sheets, so that the sheets can be bonded smoothly.
- a heat conduction element is further provided in the chamber, and the heat conduction element is fixedly connected with the heating element, and the heat conduction element is provided with a second vacuum absorption hole corresponding to the first vacuum absorption hole. hole; the heating element and the heat conduction element can move toward or away from the first vacuum adsorption hole at the same time; the moving of the heating element to contact with the first sheet includes: making the The heating element and the heat-conducting element move toward the first vacuum suction hole at the same time until the heat-conducting element contacts the first sheet, and the second vacuum adsorption hole absorbs the first sheet .
- the heat conduction element can transfer the heat emitted by the heating element to the sheet, and the second vacuum suction hole strengthens the stability of the sheet. As a result, it can not only provide heat for sheet bonding smoothly, but also increase sheet stability, thereby ensuring alignment accuracy.
- the sheet bonding alignment system further includes: a transfer mechanism, the transfer mechanism includes a gripping end surface, and a third vacuum adsorption hole is provided on the gripping end surface; Placing the first sheet includes: the grabbing end surface uses the third vacuum suction hole to grab the first sheet, and the transfer mechanism places the first sheet grabbed by the grabbing end surface On the support end surface; stacking the second sheet on the first sheet includes: the grasping end surface uses the third vacuum suction hole to grasp the second sheet, and the transfer mechanism transfers the second sheet The second sheet material grasped by the grasping end surface is stacked on the first sheet material.
- the transfer mechanism can automatically transfer the bonded sheet to the support end surface, realizing automatic operation and high feasibility of mass production.
- the sheet bonding alignment system further includes: an image acquisition device; the transfer mechanism Before placing the first sheet captured by the grabbing end face on the supporting end face, the sheet bonding method further includes: the image acquisition device acquires a first image, and the first image is The third vacuum suction hole adsorbs the first sheet to the image of the grasping end surface; identifies the first coordinate of the first sheet in the first image, and compares the first coordinate with the reference coordinate comparing, determining a first position compensation coefficient based on the comparison result, and correcting the position where the transfer mechanism will place the first sheet on the support end surface according to the first position compensation coefficient.
- the sheet bonding method further includes: the image acquisition device acquires a second image, and the second image is that the third vacuum suction hole adsorbs the second sheet to the said grabbing the image of the end face; identifying a second coordinate of the second sheet in the second image, comparing the second coordinate with a reference coordinate, and confirming a second position compensation coefficient based on the comparison result, according to the The second position compensation coefficient corrects the position where the transfer mechanism will place the second sheet on the support end face.
- the image acquisition device to correct the positions of the two sheets to be bonded to improve the alignment accuracy.
- a first vacuum suction hole is provided on the support platform, and the first vacuum suction hole can absorb the sheet to be bonded placed on the support end surface, that is, the first vacuum suction hole.
- the adsorption hole can fix the sheets to be bonded, so when another sheet is stacked on the adsorbed sheet, the adsorbed sheet will not shift, and the alignment accuracy of the two sheets can be guaranteed.
- FIG. 1 is a schematic structural view of a sheet bonding alignment system provided by an embodiment of the present application.
- FIG. 2 is a schematic structural view of a support platform of a sheet bonding alignment system provided in an embodiment of the present application.
- Fig. 3 is a schematic diagram of the arrangement structure of the heating element and the heat conducting element provided by the embodiment of the present application.
- Fig. 4 is a schematic structural diagram of a sheet bonding alignment system provided by another embodiment of the present application.
- FIG. 5 is a schematic flowchart of a sheet bonding method provided in an embodiment of the present application.
- Figure 1 is a schematic structural diagram of a sheet bonding alignment system provided by an embodiment of the present application
- Figure 2 is a schematic view of the supporting platform of the sheet bonding alignment system provided by an embodiment of this application Schematic.
- the embodiment of the present application provides a sheet bonding alignment system, including: an alignment mechanism 100 ; the alignment mechanism 100 includes a support platform 110 and a pressing head 120 .
- the support platform 110 is provided with a support end surface 111 and a first vacuum adsorption hole 112 passing through the support end surface 111; the pressing head 120 is provided with a pressing surface 121; The distance between them is adjustable.
- the first vacuum suction hole 112 is used for absorbing the sheets to be bonded, and the pressing head 120 is used for pressing the sheets sucked by the first vacuum suction hole 112 .
- Step S100 placing a first sheet on the support end surface 111 , the first sheet corresponds to the first vacuum suction hole 112 ; the first vacuum suction hole 112 pre-adsorbs the first sheet.
- Step S110 stacking a second sheet on the first sheet.
- Step S120 Shorten the distance between the pressing surface 121 and the supporting end surface 111, and pressurize the first sheet and the second sheet.
- the above-mentioned first sheet can be an LED wafer
- the second sheet can be a display backplane
- the display backplane is stacked on the LED wafer, and after heating and pressure, the LED wafer can be bonded to the display backplane On, that is, the bonding of the LED wafer and the display backplane is completed.
- silicon wafer bonding technology is usually used in the processing technology of micro-electro-mechanical system (MEMS), and silicon wafer and sapphire wafer bonding is a common silicon wafer bonding technology.
- MEMS micro-electro-mechanical system
- the above-mentioned first sheet material may be a silicon wafer
- the second sheet material may be sapphire.
- the above-mentioned first sheet can be a silicon sheet
- the second sheet can also be a silicon sheet.
- it may also be glass-glass bonding, silicon wafer-silicon wafer bonding, metal-metal bonding, or silicon wafer-glass bonding, silicon wafer-metal bonding and so on.
- the metal may be gold (Au). That is to say, the sheet bonding alignment system provided in the embodiment of the present application can be applied to any bonding process, which is not limited in this application.
- the first vacuum adsorption hole 112 can pre-adsorb the needs placed on the support end surface 111.
- the bonded sheet that is, the first vacuum adsorption hole 112 can fix the sheet to be bonded, so that when another sheet is stacked on the adsorbed sheet, the adsorbed sheet will not be displaced, Therefore, the alignment accuracy can be guaranteed.
- the second sheet is a display backplane.
- a first vacuum adsorption hole 112 is provided on the support platform 110, and the first vacuum adsorption hole 112 can pre-adsorb the LED chips placed on the support end surface 111, that is, The first vacuum suction hole 112 can fix the LED chip, so when the display backplane is stacked on the LED chip, the LED chip will not be displaced, so the alignment accuracy of the LED chip and the display backplane can be guaranteed.
- the support platform 110 is provided with a plurality of first vacuum adsorption holes 112 , and a plurality of heating elements 130 corresponding to the plurality of first vacuum adsorption holes 112 are arranged in the chamber.
- a plurality means more than two, because the quantity of mass transfer is very large, so a plurality of first vacuum adsorption holes 112 are correspondingly provided, and each first vacuum adsorption hole 112 corresponds to absorbing a first sheet, which can be carried out in batches. processing, thereby increasing efficiency.
- the chamber in the support platform 110 communicates with all the first vacuum adsorption holes 112, and the chamber is relatively sealed. Therefore, it is only necessary to connect the vacuum source to the chamber to provide all the first vacuum adsorption holes. 112 provides suction.
- a plurality of first vacuum suction holes 112 are evenly distributed on the supporting end surface 111 .
- the plurality of first vacuum adsorption holes 112 can be distributed into two circles, three circles, etc., and are specifically set according to the area of the support end surface 111 and the size of the first vacuum adsorption holes 112 .
- the distance from the first vacuum suction holes 112 in the middle circle to the first vacuum suction holes 112 in the outer circle is equal to the distance from the first vacuum suction holes 112 in the inner circle.
- a plurality of first vacuum adsorption holes 112 can be arranged in a matrix, for example, 100 first vacuum adsorption holes 112 are arranged in 10 rows and 10 columns, and any two adjacent first vacuum adsorption holes The distances between 112 are all equal.
- a plurality of first vacuum adsorption holes 112 can be arranged in a matrix, for example, 80 first vacuum adsorption holes 112 are arranged in 8 rows and 10 columns, and any two adjacent first vacuum adsorption holes The distances between 112 are all equal.
- first vacuum adsorption holes 112 as possible can be provided in a limited area, so that a large number of sheets to be bonded can be adsorbed and fixed at one time, and the bonding efficiency can be improved.
- the support platform 110 is also provided with a chamber communicated with the first vacuum adsorption hole 112, a heating element 130 is arranged in the chamber, and the heating element 130 corresponds to the first vacuum adsorption hole 112, and the heating element 130 can Moving towards or away from the first vacuum suction hole 112; the heating element 130 can heat the sheets to be bonded.
- the heating element 130 can heat the bonded sheets, so that the sheets can be bonded smoothly; in addition, the heating element 130 is set in the chamber, which makes reasonable use of the space of the supporting platform 110, improves the space utilization rate, and reduces the overall The volume of the device.
- using the first vacuum suction hole 112 to pre-adsorb the LED chip can also prevent the heating element 130 from touching the first sheet when it moves upwards, causing the first sheet to shift, increasing the position accuracy of the LED chip .
- the specific bonding steps are as follows: continue to take the first sheet and the second sheet as an example, wherein, after the first sheet is placed on the supporting end surface 111, the first vacuum suction hole 112 absorbs the first sheet material; the second sheet is stacked on the adsorbed first sheet, and the heating element 130 moves toward the direction close to the first vacuum suction hole 112 to contact with the first sheet, the heating element 130 generates heat, and the pressing surface
- the distance between 121 and the supporting end surface 111 is shortened, so that the pressing surface 121 exerts pressure on the second sheet.
- the heating element 130 starts to generate heat, shortens the distance between the pressing surface 121 and the supporting end surface 111, and heats and presses the first sheet and the second sheet. It can be understood that, after the heating element 130 moves to contact with the first sheet and starts to generate heat, the heating element 130 can also be controlled to continue to move upwards to slightly protrude from the first vacuum adsorption hole 112, so that the heating element 130 can play a role The function of supporting and pressing the first sheet and the second sheet. Of course, the heating element 130 can also move upwards until more parts protrude from the first vacuum suction hole 112 to drive the first sheet to move upward, so that the first sheet can quickly approach the pressing surface 121 .
- a first vacuum suction hole 112 is provided on the support platform 110, and the first vacuum suction hole 112 can pre-adsorb the LED chips placed on the support end surface 111, that is, the first The vacuum suction hole 112 can fix the LED chip, so when the display backplane is stacked on the LED chip, the LED chip will not be displaced, so the alignment accuracy of the LED chip and the display backplane can be guaranteed.
- pre-absorbing the LED chip by using the first vacuum suction hole 112 can also prevent the heating element 130 from touching the first sheet when moving upwards, causing the first sheet to shift, and increasing the positional accuracy of the LED chip.
- the heating member 130 can be moved to be in contact with the first sheet, thereby heating the first sheet and the second sheet to be bonded, and the pressing head 120 can be moved to be in contact with the second sheet.
- the pressing head 120 and the heating element 130 cooperate with each other to apply pressure to the first sheet and the second sheet, while the heating element 130 presses the first sheet and the second sheet.
- the second sheet is heated.
- the bonding of the first sheet and the second sheet is completed.
- the sheet bonding alignment system provided in this embodiment increases the alignment accuracy of the two sheets to be bonded by providing the first vacuum suction hole 112 on the support platform 110 .
- the sheets to be bonded are heated and pressurized, thereby quickly completing the bonding process and improving the bonding efficiency.
- the heating element 130 has a heating end surface, which faces the first vacuum adsorption hole 112 and is parallel to the supporting end surface 111 ; the heating end surface is used for contacting the first sheet.
- the heating end surface By setting the heating end surface, the heating element 130 can be in surface-to-face contact with the sheet, thereby increasing the contact area, so that the heat of the heating element 130 can be better transferred to the sheet, and the bonding reliability can be improved. More specifically, by setting the heating end surface, the heating element 130 can be in surface contact with the first sheet, thereby increasing the contact area, so that the heat of the heating element 130 can be better transferred to the first sheet, and through the second sheet Transfer to the second sheet, so that the first sheet and the second sheet are heated evenly, and the bonding reliability is improved.
- FIG. 3 is a schematic diagram of the arrangement of the heating element and the heat conducting element provided by the embodiment of the present application.
- a heat conduction element 160 is also provided in the chamber, and the heat conduction element 160 is fixedly connected with the heating element 130.
- the heat conduction element 160 is provided with a second vacuum adsorption hole 161 corresponding to the first vacuum absorption hole 112; the heating element 130 and the heat conducting member 160 can move toward or away from the first vacuum suction hole 112 at the same time.
- the second vacuum suction hole 161 is used to absorb the sheet to be bonded, and the heat conducting element 160 is used to transfer the heat of the heating element 130 to the sheet to be bonded.
- the heating element 130 and the heat conduction element 160 move toward the first vacuum adsorption hole 112 at the same time until the heat conduction element 160 contacts the first sheet, And the second vacuum suction hole 161 sucks the first sheet; then the heating element 130 generates heat.
- the heat-conducting element 160 can be made of heat-conducting metal, the heat-conducting element 160 and the heating element 130 are fixed, and the heating element 130 can move up and down, so the heat-conducting element 160 can follow the heating element 130 and move up and down simultaneously.
- the heating element 130 and the heat conducting element 160 move upward at the same time until the heat conducting element 160 contacts the first sheet and the second vacuum suction hole 161 absorbs the first sheet.
- the heat conduction element 160 can transfer the heat emitted by the heating element 130 to the first sheet, and the second vacuum suction holes 161 enhance the stability of the first sheet.
- heat can be smoothly provided for the bonding of the first sheet and the second sheet, and the stability of the first sheet can be increased, thereby ensuring alignment accuracy.
- the heat conduction element 160 may be located between the heating element 130 and the first vacuum adsorption hole 112 , and the heat conduction element 160 faces away from the heating element 130 , that is, the second vacuum absorption hole 161 is provided on the side facing the first vacuum absorption hole 112 .
- the second vacuum suction hole 161 communicates with a relatively sealed cavity on the heating element 130 , and then a vacuum source is connected to the cavity to provide suction force for the second vacuum suction hole 161 .
- FIG. 4 is a schematic structural diagram of a sheet bonding alignment system provided by another embodiment of the present application.
- the sheet bonding alignment system also includes a transfer mechanism 200, the transfer mechanism 200 includes a gripping end surface 210, and a third vacuum adsorption hole 220 is provided on the gripping end surface 210; the third vacuum adsorption hole 220 is used to absorb the sheets to be bonded On the grabbing end surface 210 , the transfer mechanism 200 is used to place the absorbed sheet on the supporting end surface 111 .
- the third vacuum suction hole 220 first adsorbs the first sheet to the gripping end surface 210, and then the transfer mechanism 200 puts the adsorbed first sheet on the supporting end surface 111 , the first sheet corresponds to the first vacuum suction hole 112 .
- the third vacuum suction hole 220 then adsorbs the second sheet to the gripping end surface 210 , and the transfer mechanism 200 then stacks the adsorbed second sheet on the first sheet.
- the transfer mechanism 200 can be a six-axis robot, and the mechanical arm of the six-axis robot can move in six dimensions.
- the six-axis robot has six axes, and each axis is driven by a motor equipped with a reducer. The movement modes and directions of each axis are different, and each axis simulates the movement of each joint of a human hand.
- the first sheet and the second sheet can be grasped more accurately, the first sheet can be more accurately matched to the first vacuum suction hole 112 , and the second sheet can be stacked correspondingly to the first sheet.
- the transfer mechanism 200 can automatically transfer the first sheet to the support end surface 111 , and can automatically transfer the second sheet to be stacked on the first sheet, which realizes automatic operation and has high feasibility for mass production.
- the shape of the gripping end surface 210 and the support end surface 111 can be set to be the same, and the distribution of the third vacuum suction holes 220 on the support end surface 111 can be set to be the same as that of the first vacuum suction holes 112 on the gripping surface.
- the distribution on the end face 210 is the same, so when the grabbing end face 210 grabs the first sheet, align the grabbing end face 210 with the supporting end face 111, that is, when the projection of the grabbing end face 210 coincides with the supporting end face 111, the second The suction force of the first vacuum suction hole 112 is eliminated, and the first sheet is placed on the support end surface 111 .
- the first sheet just corresponds to the third vacuum suction hole 220 .
- the distribution of the first vacuum suction holes 112 and the third vacuum suction holes 220 includes shapes, sizes, intervals and the like.
- the second sheet is laminated on the first sheet in the same manner. It can be seen from the above that by setting the shape of the grasping end surface 210 and the supporting end surface 111 to be the same, and setting the distribution of the third vacuum suction holes 220 on the supporting end surface 111 to be the same as the distribution of the first vacuum suction holes 112 on the grasping end surface 210 , can increase the alignment accuracy of the first sheet and the second sheet.
- the shapes of the grasping end surface 210 and the supporting end surface 111 are different.
- the transfer mechanism needs to place the first sheet on the support end surface 111 or stack the second sheet on the first sheet, there needs to be a sufficient distance between the pressing head 120 and the support platform 110 , to prevent the pressing head 120 from interfering with the transfer mechanism. That is to say, the distance between the pressing head 120 and the supporting platform 110 needs to be adjusted farther.
- the transfer mechanism 200 places the first sheet on the support end surface 111, the first sheet corresponds to the first vacuum adsorption hole 112; the first vacuum adsorption hole 112 adsorbs the first sheet.
- the grasping end surface 210 utilizes the third vacuum suction hole 220 to grasp the second sheet.
- S23 The transfer mechanism 200 stacks the second sheet on the first sheet.
- the heating element 130 starts to generate heat, so that the distance between the pressing surface 121 and the supporting end surface 111 is shortened, and heats and presses the first sheet and the second sheet.
- the sheet bonding alignment system further includes an image acquisition device 300, and the image acquisition device 300 is used to acquire an image of the third vacuum suction hole 220 absorbing the sheet to be bonded, and the image is used for The correction transfer mechanism 200 places the sheet to be bonded to the position on the supporting end surface 111 .
- both the transfer mechanism 200 and the image acquisition device 300 need to be controlled by a control system, which will be described in detail below: before the transfer mechanism 200 places the adsorbed first sheet on the support end surface 111, the image acquisition device 300 acquires the first image of the third vacuum suction hole 220 absorbing the first sheet to the gripping end surface 210, and then sends the first image to the control system; after the control system receives the first image, it recognizes the first sheet in the first image The first coordinate of the sheet is compared with the reference coordinate, and the first position correction coefficient is determined based on the comparison result. The first position correction coefficient is used to correct the position where the transfer mechanism 200 places the first sheet on the support end surface 111 .
- the image acquisition device 300 Before the transfer mechanism 200 stacks the adsorbed second sheet on the first sheet, the image acquisition device 300 also acquires a second image in which the third vacuum suction hole 220 adsorbs the second sheet to the gripping end surface 210, and then transfers the second
- the second image is sent to the control system; after the control system receives the second image, it recognizes the second coordinate of the second sheet in the second image, compares the second coordinate with the reference coordinate, and confirms the second position correction coefficient based on the comparison result.
- the two position correction coefficients are used to correct the position where the transfer mechanism 200 stacks the second sheet on the first sheet.
- the above-mentioned image acquisition device 300 may be a camera, a video camera, a mobile phone with a camera, a tablet computer with a camera, and the like. No limitation is set in this application.
- the aforementioned camera may be a charge coupled device (charge coupled device, CCD) camera.
- the image acquisition device 300 is set, before the transfer mechanism 200 places the first sheet on the supporting end surface, the transfer mechanism 200 first passes through the image acquisition device 300, so that the image acquisition device 300 takes a picture of the grasping end surface 210 of the transfer mechanism 200, Thereby, the image of the grasping end surface 210 on which the first sheet is adsorbed is acquired, and after the image is sent to the control system, the control system can identify the coordinates of the first sheet relative to the grasping end surface 210, and then compare the coordinates with the reference coordinates, If there is a deviation, it is necessary to adjust the position where the transfer mechanism 200 places the first sheet on the supporting end surface 111 .
- the first position correction coefficient may be calculated based on the comparison result, and the position of the transfer mechanism 200 when transferring the first sheet to the support end surface 111 is controlled by using the first position correction coefficient.
- the position of the second sheet is corrected in the same manner, and details are not repeated here. Thereby, alignment accuracy can be increased.
- the identified coordinates of the first sheet are 1.1X-1Y, but the reference coordinates are 1X-1Y, that is, the coordinate error of the first sheet is 0.1X.
- the first position correction coefficient may be -0.1X. More specifically, 0.1X is the value of the rightward deviation of the first sheet, then the first position correction coefficient is 0.1X to the left. Thus, the position correction can be completed and the alignment accuracy can be increased.
- control system After receiving the image, the control system identifies the coordinates of the first sheet, compares the identified coordinates with the reference coordinates, and calculates the first position correction coefficient according to the comparison result.
- the control system controls the transfer mechanism 200 to place the first sheet on the support end surface 111, the first sheet corresponds to the first vacuum adsorption hole 112; the first vacuum adsorption hole 112 absorbs the first sheet material.
- the grabbing end surface 210 uses the third vacuum suction hole 220 to grab the second sheet.
- S35 The mechanical arm of the transfer mechanism 200 moves so that the grasping end surface 210 faces the lens of the image acquisition device 300, and the image acquisition device 300 acquires an image of the grasping end surface 210 on which the second sheet is adsorbed, and then sends the image to the control system.
- control system After receiving the image, the control system identifies the coordinates of the second sheet, compares the identified coordinates with the reference coordinates, and calculates a second position correction coefficient according to the comparison result.
- S37 The control system uses the second position correction coefficient to control the transfer mechanism 200 to stack the second sheet on the first sheet.
- S38 the control system controls the heating element 130 to move to contact with the first sheet.
- control system controls the heating element 130 to start heating, and controls the distance between the pressing surface 121 and the supporting end surface 111 to shorten, so as to heat and press the first sheet and the second sheet.
- the distance between the pressing surface 121 and the supporting end surface 111 is adjustable, and it needs to be adjusted by moving the pressing head 120 and the supporting platform 110 .
- the alignment mechanism 100 also includes a lifter 140; the press head 120 is connected to the lifter 140, and the lifter 140 can drive the press head 120 to move closer to or away from the support platform 110, so that the press fit
- the distance between the surface 121 and the supporting end surface 111 is adjustable.
- the lifter 140 can drive the pressing head 120 to move toward the support platform 110; when the pressing is completed, The lifter 140 can drive the pressing head 120 away from the support platform 110 to prevent the pressing head 120 from interfering with the work of the transfer mechanism 200 . That is, the lifter 140 drives the pressure-bonding head 120 to move, so that the pressure-bonding head 120 can move toward or away from the support platform 110 , increasing the degree of automation and improving the bonding efficiency.
- the alignment mechanism 100 further includes a lifter 140; the support platform 110 is connected to the lifter 140, and the lifter 140 can drive the support platform 110 to move closer to or away from the pressing head 120,
- the distance between the pressing surface 121 and the supporting end surface 111 is adjustable.
- the lifter 140 can drive the support platform 110 to move towards the direction of the pressing head 120; when the pressing is completed, The lifter 140 can drive the supporting platform 110 away from the pressing head 120 to prevent the pressing head 120 from interfering with the work of the transfer mechanism 200 . That is, the lifter 140 drives the support platform 110 to move, so that the support platform 110 can move toward or away from the bonding head 120, thereby increasing the degree of automation and improving the bonding efficiency.
- the alignment mechanism 100 also includes a first lifter and a second lifter; the pressing head 120 is connected to the first lifter, and the first lifter can drive the pressing head 120 to move closer to or away from the support platform 110; the support platform 110 is connected with the second lifter, and the second lifter can drive the support platform 110 to move closer to or away from the direction of the pressing head 120; so that the distance between the pressing surface 121 and the supporting end surface 111 adjustable.
- the first lifter can drive the pressing head 120 to move closer to the support platform 110, and the second lifter can The supporting platform 110 is driven to move toward the pressing head 120; when the pressing is completed, the first lifter can drive the pressing head 120 away from the supporting platform 110, and the second lifter can drive the supporting platform 110 away from the pressing head 120.
- the distance between the pressing surface 121 and the supporting end surface 111 can be quickly shortened; The joint head 120 interferes with the transfer mechanism 200, so that the production efficiency can be accelerated.
- the sheet bonding alignment system further includes a loading table 400 for placing sheets to be bonded.
- the loading platform 400 is used to support and fix the first base material with the first sheet before the first sheet is placed on the supporting end surface 111; the loading platform 400 is also used to stack the second sheet to the first substrate Before the one sheet is placed on, the second sheet is supported and fixed or the second substrate on which the second sheet is supported.
- the second sheet is a display backplane
- the second base material may not be needed for support, and the display backplane can be directly fixed on the loading platform 400 .
- the second sheet is other materials that are not convenient to be directly fixed on the loading table 400, a second base material needs to be provided for support.
- the loading table 400 may be provided with clips, and when the first base material is placed on the loading table 400, the clips may clamp the first base material, thereby fixing the first base material.
- the first substrate can be a transfer substrate carrying LED chips.
- the clip can clamp the second base material, thereby fixing the second base material.
- the sheet bonding alignment system further includes a blanking table 500, which is used to support the bonded sheets, specifically, the blanking table 500 is used to After the sheet and the second sheet are bonded by heating and pressing, the bonded first sheet and the second sheet are supported. After the first sheet and the second sheet are bonded, the transfer mechanism 200 can use the grabbing end surface 210 and the third vacuum suction hole 220 to transfer the bonded finished product to the unloading table 500 for temporary storage, thereby increasing Ease of operation.
- a pressure sensor is provided on the pressing head 120, and the pressure sensor is used to detect the pressure value exerted by the pressing surface 121 on the second sheet.
- the heating element 130 is provided with a temperature sensor, and the temperature sensor is used to detect the temperature value of the heating element 130 after heating.
- both the pressure sensor and the temperature sensor are electrically connected to the above-mentioned control system, and the detected pressure value and temperature value can be fed back to the control system, and when the control system detects that the pressure value is within the reference pressure range, it can control the pressing head 120
- the control system detects that the temperature of the heating element 130 is within the reference temperature range, it controls the heating element 130 to stop heating. Thereby, damage to the first sheet and the second sheet due to overheating or overpressure can be prevented.
- the alignment mechanism 100 may further include a base 150 , which may be used for installing a control system, carrying the supporting platform 110 , the lifter 140 , the pressing head 120 and so on.
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Abstract
本申请涉及一种片材键合对位系统及片材键合方法，片材键合对位系统包括对位机构；对位机构包括支撑平台和压合头；支撑平台设有支撑端面、贯穿支撑端面的第一真空吸附孔；压合头设有压合面；压合面面对支撑端面，压合面与支撑端面之间的距离可调；第一真空吸附孔用于吸附需键合片材，压合头用于对第一真空吸附孔吸附的片材进行压合。
Description
本申请涉及键合设备技术领域，尤其涉及一种片材键合对位系统及片材键合方法。
目前，微型发光二极管（micro light-emitting diode，micro LED）显示面板作为新一代显示技术，具有亮度更高、发光效率更好以及功耗更低等优势，使得micro LED被广泛使用。
Micro-LED显示面板上一般包括多个像素区域，每个像素区域包括红光LED芯片、蓝光LED芯片和绿光LED芯片。在显示面板制备过程中，需要将三种芯片从各自的生长基板上转移到显示背板上。目前采用的转移方式为：利用一个临时基板将红光LED芯片粘合到一个临时基板上；然后激光剥离红光LED芯片的生长基板，此时将红光LED芯片转移到了临时基板上；接着利用转移基板在临时基板上将红光LED芯片转移到显示背板上。利用相同的方式分别转移蓝光LED芯片和绿光LED芯片。将LED芯片转移到显示背板的多次键合对位转移过程也即巨量转移。然而，目前的键合对位方式，对位精度难以保证，且键合效率较低。
鉴于上述现有技术的不足，本申请的目的在于提供一种片材键合对位系统及片材键合方法，提升了巨量转移制程中，涉及键合过程的对位精度，如LED芯片和显示背板的对位精度，可以提高键合效率。
本申请第一方面提供一种片材键合对位系统，包括：对位机构；所述对位机构包括支撑平台和压合头；所述支撑平台设有支撑端面、贯穿所述支撑端面的第一真空吸附孔；所述压合头设有压合面；所述压合面面对所述支撑端面，所述压合面与所述支撑端面之间的距离可调；所述第一真空吸附孔用于吸附需键合片材，所述压合头用于对所述第一真空吸附孔吸附的片材进行压合。
本申请实施例提供的片材键合对位系统，在支撑平台上设置第一真空吸附孔，该第一真空吸附孔可以吸附放置在支撑端面上的需键合片材，也即第一真空吸附孔可以将需键合片材固定住，那么在层叠另一片材至被吸附的片材上时，被吸附的片材不会发生移位，两个片材的对位精度得以保障。
在一些实施例中，所述支撑平台设有多个所述第一真空吸附孔，所述腔室内设有与多个所述第一真空吸附孔一一对应的多个所述加热件。因巨量转移数量非常庞大，因此相应的设置多个第一真空吸附孔，每个第一真空吸附孔对应吸附一个第一片材，可以进行批量加工，从而增加效率。
在一些实施例中，多个所述第一真空吸附孔均匀分布于所述支撑平台上。由此，空间利用率较高，可以在有限的面积上设置尽可能多的第一真空吸附孔，从而一次性可以吸附固定较多数量的需键合片材，可以提升键合效率。
在一些实施例中，所述支撑平台还设有与所述第一真空吸附孔连通的腔室；所述腔室内设有加热件，所述加热件与所述第一真空吸附孔相对应，所述加热件能够向靠拢或者远离所述第一真空吸附孔的方向移动；所述加热件用于对需键合片材进行加热。加热件可以对键合片材进行加热，使得片材顺利完成键合；另外，将加热件设于腔室内，合理利用率了支撑平台的空间，提升了空间利用率，缩小了整个设备的体积。
在一些实施例中，所述腔室内还设有导热件，所述导热件与所述加热件固定连接，所述导热件上设有与所述第一真空吸附孔相对应的第二真空吸附孔；所述加热件和所述导热件能够同时向靠拢或者远离所述第一真空吸附孔的方向移动；所述第二真空吸附孔用于吸附需键合片材，所述导热件用于将所述加热件的热量传递至需键合片材上。导热件可将加热件发出的热量传递至片材，第二真空吸附孔加强片材的稳固性。由此，既能顺利为片材键合提供热量，又能增加片材稳定性，从而确保对位精准性。
在一些实施例中，所述加热件设有加热端面，所述加热端面面对所述第一真空吸附孔，且与所述支撑端面平行；所述加热端面用于与第一片材接触。通过设置加热端面，使得加热件可以与片材面面接触，从而增加接触面积，使得加热件的热量更好的传递至片材，提升键合可靠性。
在一些实施例中，所述片材键合对位系统还包括：转运机构，所述转运机构包括抓取端面，所述抓取端面上设有第三真空吸附孔；所述第三真空吸附孔用于吸附需键合片材至所述抓取端面上，所述转运机构用于将吸附的需键合片材转移至所述支撑端面上。转运机构可以自动需键合片材转运至支撑端面上，实现了自动化操作，量产可行性较高。
在一些实施例中，所述片材键合对位系统还包括：图像获取设备；所述图像获取设备用于获取所述第三真空吸附孔吸附需键合片材的图像，所述图像被用于校正所述转运机构放置需键合片材至所述支撑端面上的位置。设置图像获取设备，可以对需键合的两个片材的位置进行校正，提升对位精度。
在一些实施例中，所述片材键合对位系统还包括：升降器；所述压合头与所述升降器连接，所述升降器能够带动所述压合头向靠拢或者远离所述支撑平台的方向移动，以使所述压合面与所述支撑端面之间的距离可调。通过升降器带动压合头移动，以使压合头可以朝向或者远离支撑平台，增加自动化程度，提升键合效率。
在另一些实施例中，所述片材键合对位系统还包括：升降器；所述支撑平台与所述升降器连接，所述升降器能够带动所述支撑平台向靠拢或者远离所述压合头的方向移动，以使所述压合面与所述支撑端面之间的距离可调。通过升降器带动支撑平台移动，以使支撑平台可以朝向或者远离压合头，增加自动化程度，提升键合效率。
在又一些实施例中，所述对位机构还包括：第一升降器和第二升降器；所述压合头与所述第一升降器连接，所述第一升降器能够带动所述压合头向靠拢或者远离所述支撑平台的方向移动；所述支撑平台与所述第二升降器连接，所述第二升降器能够带动所述支撑平台向靠拢或者远离所述压合头的方向移动；以使所述压合面与所述支撑端面之间的距离可调。由此，在需要压合时，压合面和支撑端面之间的距离可以快速缩短；完成压合后，压合面和支撑端面之间的距离可以快速拉开，以防止压合头干扰转运机构，从而能够加快生产效率。
在一些实施例中，所述片材键合对位系统还包括：上料台和下料台，所述上料台用于支撑需键合片材；所述下料台用于支撑键合完成的片材。上料台可以在需键合片材转移至支撑端面上之前，支撑需键合片材。下料台可以在片材键合完成后，暂存键合完成的片材，从而增加使用便利性，提升制备效率。
本申请第二方面提供一种片材键合方法，其中，所述片材键合对位方法使用片材键合对位系统实现，所述片材键合对位系统包括：对位机构；所述对位机构包括支撑平台和压合头；所述支撑平台设有支撑端面、以及设有贯穿所述支撑端面的第一真空吸附孔；所述压合头设有压合面；所述压合面面对所述支撑端面，所述压合面与所述支撑端面之间的距离可调。
所述片材键合方法包括：在所述支撑端面上放置第一片材，使得所述第一片材与所述第一真空吸附孔相对应，所述第一真空吸附孔预吸附所述第一片材；在所述第一片材上层叠第二片材；调整所述压合面和所述支撑端面之间的距离，使得所述压合面与所述支撑端面之间的距离缩短，以使所述压合面与所述支撑端面对所述第一片材和所述第二片材加压。
本申请实施例提供的片材键合方法，第一真空吸附孔可以吸附放置在支撑端面上的需键合片材，也即第一真空吸附孔可以将需键合片材固定住，那么在层叠另一片材至被吸附的片材上时，被吸附的片材不会发生移位，两个片材的对位精度得以保障。
在一些实施例中，所述支撑平台还设有与所述第一真空吸附孔连通的腔室；所述腔室内设有加热件，所述加热件与所述第一真空吸附孔相对应，所述加热件能够向靠拢或者远离所述第一真空吸附孔的方向移动；在所述第一片材上层叠第二片材之后，所述片材键合方法还包括：使所述加热件移动至与所述第一片材接触，使所述加热件发热；在所述压合面与所述支撑端面对所述第一片材和所述第二片材加压的同时，所述加热件对所述第一片材和所述第二片材加热。加热件可以对键合片材进行加热，使得片材顺利完成键合。
在一些实施例中，所述腔室内还设有导热件，所述导热件与所述加热件固定连接，所述导热件上设有与所述第一真空吸附孔相对应的第二真空吸附孔；所述加热件和所述导热件能够同时向靠拢或者远离所述第一真空吸附孔的方向移动；所述使所述加热件移动至与所述第一片材接触包括：使所述加热件和所述导热件同时向靠拢所述第一真空吸附孔的方向移动，直至所述导热件与所述第一片材接触，且所述第二真空吸附孔吸附所述第一片材。导热件可将加热件发出的热量传递至片材，第二真空吸附孔加强片材的稳固性。由此，既能顺利为片材键合提供热量，又能增加片材稳定性，从而确保对位精准性。
在一些实施例中，所述片材键合对位系统还包括：转运机构，所述转运机构包括抓取端面，所述抓取端面上设有第三真空吸附孔；在所述支撑端面上放置第一片材包括：所述抓取端面利用所述第三真空吸附孔住抓取所述第一片材，所述转运机构将所述抓取端面抓取的所述第一片材放置在所述支撑端面上；在所述第一片材上层叠第二片材包括：所述抓取端面利用所述第三真空吸附孔抓取所述第二片材，所述转运机构将所述抓取端面抓取的所述第二片材层叠在所述第一片材上。转运机构可以自动需键合片材转运至支撑端面上，实现了自动化操作，量产可行性较高。
在一些实施例中，所述片材键合对位系统还包括：图像获取设备；所述抓取端面利用所述第三真空吸附孔住抓取所述第一片材之后，所述转运机构将所述抓取端面抓取的所述第一片材放置在所述支撑端面上之前，所述片材键合方法还包括：所述图像获取设备获取第一图像，所述第一图像为所述第三真空吸附孔吸附所述第一片材至所述抓取端面的图像；识别所述第一图像中所述第一片材的第一坐标，将所述第一坐标与基准坐标比较，基于比较结果确认第一位置补偿系数，根据所述第一位置补偿系数校正所述转运机构将放置所述第一片材至所述支撑端面上的位置。
在一些实施例中，所述抓取端面利用所述第三真空吸附孔抓取所述第二片材之后，所述转运机构将所述抓取端面抓取的所述第二片材层叠在所述第一片材上之前，所述片材键合方法还包括：所述图像获取设备获取第二图像，所述第二图像为所述第三真空吸附孔吸附所述第二片材至所述抓取端面的图像；识别所述第二图像中所述第二片材的第二坐标，将所述第二坐标与基准坐标比较，基于比较结果确认第二位置补偿系数，根据所述第二位置补偿系数校正所述转运机构将放置所述第二片材至所述支撑端面上的位置。利用图像获取设备对需键合的两个片材的位置进行校正，提升对位精度。
本申请实施例提供的片材键合对位系统，在支撑平台上设置第一真空吸附孔，该第一真空吸附孔可以吸附放置在支撑端面上的需键合片材，也即第一真空吸附孔可以将需键合片材固定住，那么在层叠另一片材至被吸附的片材上时，被吸附的片材不会发生移位，两个片材的对位精度得以保障。
图1是本申请一种实施例提供的片材键合对位系统的结构示意图。
图2是本申请实施例提供的片材键合对位系统的支撑平台的结构示意图。
图3是本申请实施例提供的加热件和导热件设置结构示意图。
图4是本申请另一实施例提供的片材键合对位系统的结构示意图。
图5是本申请实施例提供的片材键合方法的流程示意图。
附图标记说明：100-对位机构，110-支撑平台，111-支撑端面，112-第一真空吸附孔，120-压合头，121-压合面，130-加热件，140-升降器，150-基座，160-导热件，161-第二真空吸附孔，200-转运机构，210-抓取端面，220-第三真空吸附孔，300-图像获取设备，400-上料台，500-下料台。
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳实施方式。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本申请的公开内容理解的更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本申请。
请参考图1至图2，图1是本申请一种实施例提供的片材键合对位系统的结构示意图，图2是本申请实施例提供的片材键合对位系统的支撑平台的结构示意图。其中，本申请实施例提供一种片材键合对位系统，包括：对位机构100；对位机构100包括支撑平台110和压合头120。
支撑平台110设有支撑端面111、贯穿支撑端面111的第一真空吸附孔112；压合头120设有压合面121；压合面121面对支撑端面111，压合面121与支撑端面111之间的距离可调。其中，第一真空吸附孔112用于吸附需键合片材，压合头120用于对第一真空吸附孔112吸附的片材进行压合。
参阅图5，以需键合片材为第一片材和第二片材为例，以下详述具体步骤：
步骤S100：在支撑端面111上放置第一片材，第一片材与第一真空吸附孔112相对应；第一真空吸附孔112预吸附第一片材。
步骤S110：在第一片材上层叠第二片材。
步骤S120：使得压合面121与支撑端面111之间的距离缩短，对第一片材和第二片材加压。
上述第一片材可以为LED晶圆，第二片材可以为显示背板，显示背板层叠于LED晶圆上，在经过加热和加压之后，可以将LED晶圆键合于显示背板上，也即LED晶圆和显示背板键合完成。
在另一种示例中，微型电子机械系统（micro-electro-mechanical system，MEMS）的加工工艺中，通常会采用硅片键合技术，硅片与蓝宝石片键合就是常见的硅片键合技术之一。因此上述第一片材可以为硅片，第二片材为蓝宝石。
在又一种示例中，集成电路的加工工艺中，通常会采用硅片和硅片键合的技术。因此上述第一片材可以为硅片，第二片材也可以为硅片。
其他示例中，也可以为玻璃-玻璃键合，硅片-硅片键合，金属-金属键合，或者是硅片-玻璃键合，硅片-金属键合等等。金属可以为金（Au）。也即，本申请实施例提供的片材键合对位系统可以应用于任何键合制程中，本申请中不做局限。
从上可见，本申请实施例提供的片材键合对位系统，通过在支撑平台110上设置第一真空吸附孔112，该第一真空吸附孔112可以预吸附放置在支撑端面111上的需键合片材，也即第一真空吸附孔112可以将需键合片材固定住，那么在层叠另一片材至被吸附的片材上时，被吸附的片材不会发生移位，因此对位精度得以保障。
若第一片材为LED芯片，第二片材为显示背板。则本申请实施例提供的片材键合对位系统，在支撑平台110上设置第一真空吸附孔112，该第一真空吸附孔112可以预吸附放置在支撑端面111上的LED芯片，也即第一真空吸附孔112可以将LED芯片固定住，那么在层叠显示背板至LED芯片上时，LED芯片不会发生移位，因此LED芯片和显示背板的对位精度得以保障。
示例性的，支撑平台110设有多个第一真空吸附孔112，腔室内设有与多个第一真空吸附孔112一一对应的多个加热件130。此处多个意指两个以上，因巨量转移数量非常庞大，因此相应的设置多个第一真空吸附孔112，每个第一真空吸附孔112对应吸附一个第一片材，可以进行批量加工，从而增加效率。可以理解的是，支撑平台110内的腔室与所有第一真空吸附孔112连通，该腔室相对密封，因此，仅需要真空源与该腔室连接，即可为所有的第一真空吸附孔112提供吸附力。
示例性的，多个第一真空吸附孔112均匀分布于支撑端面111上。具体的，以支撑端面111为圆形为例，多个第一真空吸附孔112可以分布成两圈、三圈等等，以支撑端面111的面积和第一真空吸附孔112的大小具体设置。以设置三圈第一真空吸附孔112为例，其中每一圈第一真空吸附孔112均等角度分布。并且，中间一圈第一真空吸附孔112到外圈第一真空吸附孔112的距离，与到内圈第一真空吸附孔112的距离相等。
以支撑端面111呈正方形为例，则多个第一真空吸附孔112可以呈矩阵排列，例如100个第一真空吸附孔112，排列成10行10列，任意相邻两个第一真空吸附孔112之间的距离均相等。
以支撑端面111呈长方形为例，则多个第一真空吸附孔112可以呈矩阵排列，例如80个第一真空吸附孔112，排列成8行10列，任意相邻两个第一真空吸附孔112之间的距离均相等。
由此，可以在有限的面积上设置尽可能多的第一真空吸附孔112，从而一次性可以吸附固定较多数量的需键合片材，可以提升键合效率。
在一些实施例中，支撑平台110还设有与第一真空吸附孔112连通的腔室，腔室内设有加热件130，加热件130与第一真空吸附孔112相对应，加热件130能够向靠拢或者远离第一真空吸附孔112的方向移动；该加热件130可以对需要键合的片材进行加热。
加热件130可以对键合片材进行加热，使得片材顺利完成键合；另外，将加热件130设于腔室内，合理利用率了支撑平台110的空间，提升了空间利用率，缩小了整个设备的体积。在进行键合时，利用第一真空吸附孔112将LED芯片预吸附，也可以防止加热件130向上移动时触碰第一片材，导致第一片材移位，增加LED芯片的位置精确性。
设置加热件130之后，具体键合步骤如下：继续以第一片材和第二片材为例，其中，在支撑端面111上放置第一片材后，第一真空吸附孔112吸附第一片材；在被吸附的第一片材上层叠第二片材，且加热件130向靠拢第一真空吸附孔112的方向移动至与第一片材接触之后，加热件130发热，且压合面121与支撑端面111之间的距离缩短，以使压合面121对第二片材施压。
更详细的步骤如下：
S10：在支撑端面111上放置第一片材，第一片材与第一真空吸附孔112相对应；第一真空吸附孔112预吸附第一片材。
S11：在第一片材上层叠第二片材。
S12：加热件130移动至与第一片材接触。
S13：加热件130开始发热，并使得压合面121与支撑端面111之间的距离缩短，对第一片材和第二片材加热加压。可以理解的是，加热件130移动至与第一片材接触，且开始发热之后，还可以控制加热件130继续向上移动至略微伸出第一真空吸附孔112，以使得加热件130可以起到支撑和压合第一片材和第二片材的作用。当然，加热件130也可以向上移动至较多部分伸出第一真空吸附孔112，以起到带动第一片材向上移动的作用，使得第一片材可以快速靠近压合面121。
该实施例提供的片材键合对位系统，在支撑平台110上设置第一真空吸附孔112，该第一真空吸附孔112可以预吸附放置在支撑端面111上的LED芯片，也即第一真空吸附孔112可以将LED芯片固定住，那么在层叠显示背板至LED芯片上时，LED芯片不会发生移位，因此LED芯片和显示背板的对位精度得以保障。另外利用第一真空吸附孔112将LED芯片预吸附，也可以防止加热件130向上移动时触碰第一片材，导致第一片材移位，增加LED芯片的位置精确性。
以图1中的方向为参考，加热件130可移至与第一片材接触，从而对需要键合的第一片材和第二片材进行加热，压合头120可移至与第二片材接触，压合头120继续向着靠拢支撑端面111移动时，压合头120和加热件130相互配合对第一片材和第二片材施压，同时加热件130对第一片材和第二片材加热。由此，使得第一片材和第二片材键合完成。
从上可见，该实施例提供的片材键合对位系统，通过在支撑平台110上设置第一真空吸附孔112，增加需要键合的两片材的对位精度。通过控制压合头120和加热件130自动移动，对需键合片材进行加热加压，从而快速完成键合制程，提升了键合效率。
在一些实施例中，加热件130设有加热端面，加热端面面对第一真空吸附孔112，且与支撑端面111平行；加热端面用于与第一片材接触。通过设置加热端面，使得加热件130可以与片材面面接触，从而增加接触面积，使得加热件130的热量更好的传递至片材，提升键合可靠性。更具体的，通过设置加热端面，使得加热件130可以与第一片材面面接触，从而增加接触面积，使得加热件130的热量更好的传递至第一片材，以及经过第二片材传递至第二片材，从而使得第一片材和第二片材受热均匀，提升键合可靠性。
参考图3，结合图1和图2，图3是本申请实施例提供的加热件和导热件设置结构示意图。在一些实施例中，腔室内还设有导热件160，导热件160与加热件130固定连接，导热件160上设有与第一真空吸附孔112相对应的第二真空吸附孔161；加热件130和导热件160能够同时向靠拢或者远离第一真空吸附孔112的方向移动。第二真空吸附孔161用于吸附需键合片材，导热件160用于将加热件130的热量传递至需键合片材上。
具体的，在被吸附的第一片材上层叠第二片材后，加热件130和导热件160同时向靠拢第一真空吸附孔112的方向移动，直至导热件160与第一片材接触，且第二真空吸附孔161吸附第一片材；然后加热件130发热。
该导热件160可以由导热金属制成，导热件160和加热件130固定，加热件130可以上下移动，因此导热件160可以跟随加热件130同时上下移动，加热件130需要对第一片材和第二片材加热以进行键合时，加热件130和导热件160同时向上移动，直至导热件160与第一片材接触，且第二真空吸附孔161吸附第一片材。此时，导热件160可将加热件130发出的热量传递至第一片材，第二真空吸附孔161加强第一片材的稳固性。由此，既能顺利为第一片材和第二片材键合提供热量，又能增加第一片材稳定性，从而确保对位精准性。
具体的，导热件160可以位于加热件130与第一真空吸附孔112之间，导热件160背离加热件130，也即面对第一真空吸附孔112的一侧设置第二真空吸附孔161。该第二真空吸附孔161与加热件130上的相对密封的空腔连通，然后利用一个真空源与该空腔连接，即可为第二真空吸附孔161提供吸附力。
在一些实施例中，参考图4，图4是本申请另一实施例提供的片材键合对位系统的结构示意图。片材键合对位系统还包括转运机构200，转运机构200包括抓取端面210，抓取端面210上设有第三真空吸附孔220；第三真空吸附孔220用于吸附需键合片材至抓取端面210上，转运机构200用于将吸附的片材放置在支撑端面111上。
继续以第一片材和第二片材为例，第三真空吸附孔220先吸附第一片材至抓取端面210上，然后转运机构200将吸附的第一片材放在支撑端面111上，第一片材与第一真空吸附孔112相对应。接着，第三真空吸附孔220再吸附第二片材至抓取端面210上，转运机构200再将吸附的第二片材层叠在第一片材上。
该转运机构200具体可以为六轴机器人，六轴机器人的机械臂可以在六个维度活动。具体的，六轴机器人具有六个轴，每个轴都是一个电机配备减速机来传动，各个轴的运动方式和方向都不同，每个轴均模拟人手的各个关节的动作。由此可以更加精确抓取第一片材和第二片材，以及更加精确的将第一片材与第一真空吸附孔112对应，以及将第二片材与第一片材对应层叠。
转运机构200可以自动将第一片材转运至支撑端面111上，以及可以自动将第二片材转运至层叠在第一片材上，实现了自动化操作，量产可行性较高。
当然，本领域技术人员可以理解的是，可以设置抓取端面210和支撑端面111的形状相同，且设置第三真空吸附孔220在支撑端面111的分布情况与第一真空吸附孔112在抓取端面210上的分布情况相同，由此当抓取端面210抓取第一片材后，将抓取端面210与支撑端面111对齐，也即抓取端面210的投影和支撑端面111重合时，第一真空吸附孔112的吸附力消除，第一片材被放置在支撑端面111上，此时第一片材正好与第三真空吸附孔220对应。第一真空吸附孔112和第三真空吸附孔220的分布情况包括形状、尺寸和间隔等等。第二片材以同样的方式层叠在第一片材上。从上可见，通过设置抓取端面210和支撑端面111的形状相同，且设置第三真空吸附孔220在支撑端面111的分布情况与第一真空吸附孔112在抓取端面210上的分布情况相同，可以增加第一片材和第二片材的对位精度。
当然，在另一些实施例中，也可以设置抓取端面210和支撑端面111的形状不相同。
需要理解的是，在转移机构需要将第一片材放置在支撑端面111上或者将第二片材层叠在第一片材上时，压合头120和支撑平台110之间需要有足够的距离，防止压合头120干扰转移机构。也即需要将压合头120和支撑平台110之间的距离调整的较远。
设置转运机构200的片材对位键合系统中，键合具体步骤如下：
详细步骤如下：
S20：抓取端面210利用第三真空吸附孔220抓取第一片材。
S21：转运机构200在支撑端面111上放置第一片材，第一片材与第一真空吸附孔112相对应；第一真空吸附孔112吸附第一片材。
S22：抓取端面210利用第三真空吸附孔220抓取第二片材。
S23：转运机构200在第一片材上层叠第二片材。
S24：加热件130移动至与第一片材接触。
S25：加热件130开始发热，使得压合面121与支撑端面111之间的距离缩短，对第一片材和第二片材加热加压。
在一些实施例中，参考图3，片材键合对位系统还包括图像获取设备300，图像获取设备300用于获取第三真空吸附孔220吸附需键合片材的图像，图像被用于校正转运机构200放置需键合片材至支撑端面111上的位置。
本领域技术人员需要理解的，转运机构200和图像获取设备300等均需要控制系统进行控制，以下详述：在转运机构200将吸附的第一片材放置在支撑端面111上之前，图像获取设备300获取第三真空吸附孔220吸附第一片材至抓取端面210的第一图像，然后将第一图像发送至控制系统；控制系统接收到第一图像后，识别第一图像中第一片材的第一坐标，将第一坐标与基准坐标比较，基于比较结果确认第一位置补正系数，第一位置补正系数用于校正转运机构200放置第一片材至支撑端面111上的位置。
在转运机构200将吸附的第二片材层叠在第一片材上之前，图像获取设备300还获取第三真空吸附孔220吸附第二片材至抓取端面210的第二图像，然后将第二图像发送至控制系统；控制系统接收到第二图像后，识别第二图像中第二片材的第二坐标，将第二坐标与基准坐标比较，基于比较结果确认第二位置补正系数，第二位置补正系数用于校正转运机构200将第二片材层叠在第一片材上的位置。
上述图像获取设备300可以为照相机、摄像机、带有摄像头的手机和带有摄像头的平板电脑等等设备。本申请中不做限制。上述的摄像机可以为电荷耦合器件（charge coupled device，CCD）摄像机。
设置图像获取设备300，在转运机构200将第一片材放置在支撑端面上之前，转运机构200先经过图像获取设备300处，以使图像获取设备300对转运机构200的抓取端面210拍照，从而获取到吸附有第一片材的抓取端面210的图像，图像发送至控制系统后，控制系统可以识别第一片材相对于抓取端面210的坐标，接着将该坐标和基准坐标比较，若有偏差，则需要调整转运机构200放置第一片材至支撑端面111上的位置。具体的，可以基于比较结果计算出第一位置补正系数，利用该第一位置补正系数控制转运机构200转运第一片材至支撑端面111时的位置。第二片材采用同样的方式进行位置补正，不再赘述。由此，可以增加对位精度。
以参考坐标系为X-Y坐标系为例，那么识别出的第一片材的坐标为1.1X-1Y，然而基准坐标为1X-1Y，也即，第一片材的坐标误差为0.1X。那么，第一位置补正系数则可以为-0.1X。更具体的，0.1X为第一片材向右偏差的数值，那么则第一位置补正系数即为向左0.1X。由此，可以完成位置补正，增加对位精度。
由上可见，设置图像获取设备300，可以对第一片材和第二片材的位置进行校正，提升对位精度。
设置转运机构200和图像获取设备300的片材对位键合系统中，键合具体步骤如下：
详细步骤如下：
S30：抓取端面210利用第三真空吸附孔220抓取第一片材。
S31：转运机构200的机械臂移动，以使抓取端面210正对图像获取设备300的镜头，图像获取设备300获取吸附有第一片材的抓取端面210的图像，然后将图像发送至控制系统。
S32：控制系统接收到图像后，识别第一片材的坐标，将识别的坐标和基准坐标比较，根据比较结果计算出第一位置补正系数。
S33：控制系统基于第一位置补正系数，控制转运机构200在支撑端面111上放置第一片材，第一片材与第一真空吸附孔112相对应；第一真空吸附孔112吸附第一片材。
S34：抓取端面210利用第三真空吸附孔220抓取第二片材。
S35：转运机构200的机械臂移动，以使抓取端面210正对图像获取设备300的镜头，图像获取设备300获取吸附有第二片材的抓取端面210的图像，然后将图像发送至控制系统。
S36：控制系统接收到图像后，识别第二片材的坐标，将识别的坐标和基准坐标比较，根据比较结果计算出第二位置补正系数。
S37：控制系统利用第二位置补正系数控制转运机构200在第一片材上层叠第二片材。
S38：控制系统控制加热件130移动至与第一片材接触。
S39：控制系统控制加热件130开始发热，以及控制压合面121与支撑端面111之间的距离缩短，对第一片材和第二片材加热加压。
压合面121和支撑端面111之间的距离可调，具体需要移动压合头120和支撑平台110来调整。在一些实施例中，对位机构100还包括升降器140；压合头120与升降器140连接，升降器140能够带动压合头120向靠拢或者远离支撑平台110的方向移动，以使压合面121与支撑端面111之间的距离可调。当压合面121需要与加热件130配合对第一片材和第二片材进行压合时，升降器140可以带动压合头120向靠拢支撑平台110的方向移动；当完成压合后，升降器140可以带动压合头120远离支撑平台110，以防止压合头120干扰转运机构200的工作。也即，通过升降器140带动压合头120移动，以使压合头120可以朝向或者远离支撑平台110，增加自动化程度，提升键合效率。
在另一些实施例中，参考图3，对位机构100还包括升降器140；支撑平台110与升降器140连接，升降器140能够带动支撑平台110向靠拢或者远离压合头120的方向移动，以使压合面121与支撑端面111之间的距离可调。当压合面121需要与加热件130配合对第一片材和第二片材进行压合时，升降器140可以带动支撑平台110向靠拢压合头120的方向移动；当完成压合后，升降器140可以带动支撑平台110远离压合头120，以防止压合头120干扰转运机构200的工作。也即，通过升降器140带动支撑平台110移动，以使支撑平台110可以朝向或者远离压合头120，增加自动化程度，提升键合效率。
在又一些实施例中，对位机构100还包括第一升降器和第二升降器；压合头120与第一升降器连接，第一升降器能够带动压合头120向靠拢或者远离支撑平台110的方向移动；支撑平台110与第二升降器连接，第二升降器能够带动支撑平台110向靠拢或者远离压合头120的方向移动；以使压合面121与支撑端面111之间的距离可调。当压合面121需要与加热件130配合对第一片材和第二片材进行压合时，第一升降器可以带动压合头120向靠拢支撑平台110的方向移动，第二升降器可以带动支撑平台110向靠拢压合头120的方向移动；当完成压合后，第一升降器可以带动压合头120远离支撑平台110，第二升降器可以带动支撑平台110远离压合头120。由此，在需要压合时，压合面121和支撑端面111之间的距离可以快速缩短；完成压合后，压合面121和支撑端面111之间的距离可以快速拉开，以防止压合头120干扰转运机构200，从而能够加快生产效率。
在一些实施例中，参考图3，片材键合对位系统还包括上料台400，上料台400用于放置需键合片材。具体的：上料台400用于在第一片材放置于支撑端面111上之前，支撑固定有第一片材的第一基材；上料台400还用于在第二片材层叠至第一片材上之前，支撑固定第二片材或者支撑固定有第二片材的第二基材。可以理解的是，在第二片材为显示背板时，可以不需要第二基材进行支撑，直接将显示背板固定于上料台400上即可。当第二片材为其他不便于直接固定在上料台400上的物料时，则需要设置第二基材进行支撑。
该上料台400上可以设置卡夹，在第一基材放置于上料台400时，卡夹可以将第一基材夹持，从而将第一基材固定住。该第一基材可以为承载LED芯片的转移基板。同样的道理，在第二基材放置于上料台400上时，卡夹可以将第二基材夹持，从而将第二基材固定住。通过设置上料台400，可以在第一片材和第二片材被转运机构200抓取之前暂时存储第一片材和第二片材，增加使用便利性，提升制备效率。
在一些实施例中，参考图3，片材键合对位系统还包括下料台500，下料台500用于支撑键合完成的片材，具体的，下料台500用于在第一片材和第二片材经过加热加压键合完成后，支撑键合完成的第一片材和第二片材。在第一片材和第二片材完成键合后，转运机构200可以利用抓取端面210和第三真空吸附孔220，将完成键合的成品转运至下料台500处暂存，从而增加操作便利性。
在一些实施例中压合头120上设有压力传感器，压力传感器用于检测压合面121对第二片材施压的压力值。加热件130上设有温度传感器，温度传感器用于检测加热件130发热后的温度值。示例性的，压力传感器和温度传感器均与上述的控制系统电连接，检测到的压力值和温度值可以反馈至控制系统，控制系统检测到压力值处于基准压力范围时，可以控制压合头120和支撑平台110之间的距离停止变动，也即可以控制上述升降器140停止运行，或者是控制上述第一升降器和第二升降器停止运行。控制系统检测到加热件130温度处于基准温度范围内时，控制加热件130停止加热。由此，可以防止过热或者过压导致第一片材和第二片材损伤。
在一些实施例中，对位机构100还可以包括基座150，该基座150可以用于安装控制系统，承载支撑平台110、升降器140和压合头120等等。
应当理解的是，本申请的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本申请所附权利要求的保护范围。
Claims (18)
- 一种片材键合对位系统，其中，包括：对位机构；所述对位机构包括支撑平台和压合头；所述支撑平台设有支撑端面、以及设有贯穿所述支撑端面的第一真空吸附孔；所述压合头设有压合面；所述压合面面对所述支撑端面，所述压合面与所述支撑端面之间的距离可调；所述第一真空吸附孔用于吸附需键合片材，所述压合头用于对所述第一真空吸附孔吸附的片材进行压合。
- 根据权利要求1所述的片材键合对位系统，其中，所述支撑平台设有多个所述第一真空吸附孔。
- 根据权利要求2所述的片材键合对位系统，其中，多个所述第一真空吸附孔均匀分布于所述支撑平台上。
- 根据权利要求1所述的片材键合对位系统，其中，所述支撑平台还设有与所述第一真空吸附孔连通的腔室；所述腔室内设有加热件，所述加热件与所述第一真空吸附孔相对应，所述加热件能够向靠拢或者远离所述第一真空吸附孔的方向移动；所述加热件用于对需键合片材进行加热。
- 根据权利要求4所述的片材键合对位系统，其中，所述腔室内还设有导热件，所述导热件与所述加热件固定连接，所述导热件上设有与所述第一真空吸附孔相对应的第二真空吸附孔；所述加热件和所述导热件能够同时向靠拢或者远离所述第一真空吸附孔的方向移动；所述第二真空吸附孔用于吸附需键合片材，所述导热件用于将所述加热件的热量传递至需键合片材上。
- 根据权利要求4所述的片材键合对位系统，其中，所述加热件设有加热端面，所述加热端面面对所述第一真空吸附孔，且与所述支撑端面平行；所述加热端面用于与需键合片材接触。
- 根据权利要求1所述的片材键合对位系统，其中，所述片材键合对位系统还包括：转运机构，所述转运机构包括抓取端面，所述抓取端面上设有第三真空吸附孔；所述第三真空吸附孔用于吸附需键合片材至所述抓取端面上，所述转运机构用于将吸附的需键合片材转移至所述支撑端面上。
- 根据权利要求7所述的片材键合对位系统，其中，所述片材键合对位系统还包括：图像获取设备；所述图像获取设备用于获取所述第三真空吸附孔吸附需键合片材的图像，所述图像被用于校正所述转运机构放置需键合片材至所述支撑端面上的位置。
- 根据权利要求1所述的片材键合对位系统，其中，所述片材键合对位系统还包括：升降器；所述压合头与所述升降器连接，所述升降器能够带动所述压合头向靠拢或者远离所述支撑平台的方向移动，以使所述压合面与所述支撑端面之间的距离可调。
- 根据权利要求1所述的片材键合对位系统，其中，所述片材键合对位系统还包括：升降器；所述支撑平台与所述升降器连接，所述升降器能够带动所述支撑平台向靠拢或者远离所述压合头的方向移动，以使所述压合面与所述支撑端面之间的距离可调。
- 根据权利要求1所述的片材键合对位系统，其中，所述对位机构还包括：第一升降器和第二升降器；所述压合头与所述第一升降器连接，所述第一升降器能够带动所述压合头向靠拢或者远离所述支撑平台的方向移动；所述支撑平台与所述第二升降器连接，所述第二升降器能够带动所述支撑平台向靠拢或者远离所述压合头的方向移动；以使所述压合面与所述支撑端面之间的距离可调。
- 根据权利要求1所述的片材键合对位系统，其中，所述片材键合对位系统还包括：上料台和下料台，所述上料台用于支撑需键合片材；所述下料台用于支撑键合完成的片材。
- 一种片材键合方法，其中，所述片材键合对位方法使用片材键合对位系统实现，所述片材键合对位系统包括：对位机构；所述对位机构包括支撑平台和压合头；所述支撑平台设有支撑端面、以及设有贯穿所述支撑端面的第一真空吸附孔；所述压合头设有压合面；所述压合面面对所述支撑端面，所述压合面与所述支撑端面之间的距离可调；所述片材键合方法包括：在所述支撑端面上放置第一片材，使得所述第一片材与所述第一真空吸附孔相对应，所述第一真空吸附孔预吸附所述第一片材；在所述第一片材上层叠第二片材；调整所述压合面与所述支撑端面之间的距离，使得所述压合面和所述支撑端面之间的距离缩短，以使所述压合面和所述支撑端面对所述第一片材和所述第二片材加压。
- 根据权利要求13所述的片材键合方法，其中，所述支撑平台还设有与所述第一真空吸附孔连通的腔室；所述腔室内设有加热件，所述加热件与所述第一真空吸附孔相对应，所述加热件能够向靠拢或者远离所述第一真空吸附孔的方向移动；在所述第一片材上层叠第二片材之后，所述片材键合方法还包括：使所述加热件移动至与所述第一片材接触，使所述加热件发热；在所述压合面和所述支撑端面对所述第一片材和所述第二片材加压的同时，所述加热件对所述第一片材和所述第二片材加热。
- 根据权利要求14所述的片材键合方法，其中，所述腔室内还设有导热件，所述导热件与所述加热件固定连接，所述导热件上设有与所述第一真空吸附孔相对应的第二真空吸附孔；所述加热件和所述导热件能够同时向靠拢或者远离所述第一真空吸附孔的方向移动；使所述加热件移动至与所述第一片材接触，包括：使所述加热件和所述导热件同时向靠拢所述第一真空吸附孔的方向移动，直至所述导热件与所述第一片材接触，且所述第二真空吸附孔吸附所述第一片材。
- 根据权利要求13所述的片材键合方法，其中，所述片材键合对位系统还包括：转运机构，所述转运机构包括抓取端面，所述抓取端面上设有第三真空吸附孔；在所述支撑端面上放置第一片材包括：所述抓取端面利用所述第三真空吸附孔住抓取所述第一片材，所述转运机构将所述抓取端面抓取的所述第一片材放置在所述支撑端面上；在所述第一片材上层叠第二片材包括：所述抓取端面利用所述第三真空吸附孔抓取所述第二片材，所述转运机构将所述抓取端面抓取的所述第二片材层叠在所述第一片材上。
- 根据权利要求16所述的片材键合方法，其中，所述片材键合对位系统还包括：图像获取设备；所述抓取端面利用所述第三真空吸附孔抓取所述第一片材之后，所述转运机构将所述抓取端面抓取的所述第一片材放置在所述支撑端面上之前，所述片材键合方法还包括：所述图像获取设备获取第一图像，所述第一图像为所述第三真空吸附孔吸附所述第一片材至所述抓取端面的图像；识别所述第一图像中所述第一片材的第一坐标，将所述第一坐标与基准坐标比较，基于比较结果确认第一位置补偿系数，根据所述第一位置补偿系数校正所述转运机构将放置所述第一片材至所述支撑端面上的位置。
- 根据权利要求17所述的片材键合方法，其中，所述抓取端面利用所述第三真空吸附孔抓取所述第二片材之后，所述转运机构将所述抓取端面抓取的所述第二片材层叠在所述第一片材上之前，所述片材键合方法还包括：所述图像获取设备获取第二图像，所述第二图像为所述第三真空吸附孔吸附所述第二片材至所述抓取端面的图像；识别所述第二图像中所述第二片材的第二坐标，将所述第二坐标与基准坐标比较，基于比较结果确认第二位置补偿系数，根据所述第二位置补偿系数校正所述转运机构将放置所述第二片材至所述支撑端面上的位置。
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| CN116313838B (zh) * | 2023-03-07 | 2023-07-28 | 天津中科晶禾电子科技有限责任公司 | 三维封装方法及三维封装装置 |
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