TW202245959A - 焊料接合用樹脂組成物 - Google Patents

焊料接合用樹脂組成物 Download PDF

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Publication number
TW202245959A
TW202245959A TW111102165A TW111102165A TW202245959A TW 202245959 A TW202245959 A TW 202245959A TW 111102165 A TW111102165 A TW 111102165A TW 111102165 A TW111102165 A TW 111102165A TW 202245959 A TW202245959 A TW 202245959A
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TW
Taiwan
Prior art keywords
solder
resin composition
solder bonding
substrate
resin
Prior art date
Application number
TW111102165A
Other languages
English (en)
Chinese (zh)
Inventor
渡辺桂司
宮内一浩
吉松修平
平岡崇志
Original Assignee
日商長瀬化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商長瀬化成股份有限公司 filed Critical 日商長瀬化成股份有限公司
Publication of TW202245959A publication Critical patent/TW202245959A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111102165A 2021-01-19 2022-01-19 焊料接合用樹脂組成物 TW202245959A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006771 2021-01-19
JP2021-006771 2021-01-19

Publications (1)

Publication Number Publication Date
TW202245959A true TW202245959A (zh) 2022-12-01

Family

ID=82549405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111102165A TW202245959A (zh) 2021-01-19 2022-01-19 焊料接合用樹脂組成物

Country Status (3)

Country Link
JP (1) JPWO2022158460A1 (https=)
TW (1) TW202245959A (https=)
WO (1) WO2022158460A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104494A (ja) * 1988-10-07 1990-04-17 Hitachi Chem Co Ltd プリント配線板の半田フラックス前駆体
JP2003103398A (ja) * 2001-09-26 2003-04-08 Sumitomo Bakelite Co Ltd 硬化性フラックスおよび硬化性フラックスシート
JP5144489B2 (ja) * 2008-12-22 2013-02-13 パナソニック株式会社 熱硬化性樹脂組成物
JP2013091093A (ja) * 2011-10-27 2013-05-16 Internatl Business Mach Corp <Ibm> アンダーフィルとの間で化学的に硬化物を形成する無洗浄フラックス
US20150014842A1 (en) * 2012-02-24 2015-01-15 Hitachi Chemical Company, Ltd. Semiconductor device and production method therefor
JP5571730B2 (ja) * 2012-04-11 2014-08-13 パナソニック株式会社 熱硬化性樹脂組成物および半導体装置

Also Published As

Publication number Publication date
WO2022158460A1 (ja) 2022-07-28
JPWO2022158460A1 (https=) 2022-07-28

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