JPWO2022158460A1 - - Google Patents
Info
- Publication number
- JPWO2022158460A1 JPWO2022158460A1 JP2022576697A JP2022576697A JPWO2022158460A1 JP WO2022158460 A1 JPWO2022158460 A1 JP WO2022158460A1 JP 2022576697 A JP2022576697 A JP 2022576697A JP 2022576697 A JP2022576697 A JP 2022576697A JP WO2022158460 A1 JPWO2022158460 A1 JP WO2022158460A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021006771 | 2021-01-19 | ||
| PCT/JP2022/001679 WO2022158460A1 (ja) | 2021-01-19 | 2022-01-18 | はんだ接合用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022158460A1 true JPWO2022158460A1 (https=) | 2022-07-28 |
| JPWO2022158460A5 JPWO2022158460A5 (https=) | 2023-06-16 |
Family
ID=82549405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022576697A Pending JPWO2022158460A1 (https=) | 2021-01-19 | 2022-01-18 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022158460A1 (https=) |
| TW (1) | TW202245959A (https=) |
| WO (1) | WO2022158460A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02104494A (ja) * | 1988-10-07 | 1990-04-17 | Hitachi Chem Co Ltd | プリント配線板の半田フラックス前駆体 |
| JP2003103398A (ja) * | 2001-09-26 | 2003-04-08 | Sumitomo Bakelite Co Ltd | 硬化性フラックスおよび硬化性フラックスシート |
| JP2010144150A (ja) * | 2008-12-22 | 2010-07-01 | Panasonic Electric Works Co Ltd | 熱硬化性樹脂組成物 |
| JP2013091093A (ja) * | 2011-10-27 | 2013-05-16 | Internatl Business Mach Corp <Ibm> | アンダーフィルとの間で化学的に硬化物を形成する無洗浄フラックス |
| WO2013125685A1 (ja) * | 2012-02-24 | 2013-08-29 | 日立化成株式会社 | 半導体装置及びその製造方法 |
| JP2013216830A (ja) * | 2012-04-11 | 2013-10-24 | Panasonic Corp | 熱硬化性樹脂組成物および半導体装置 |
-
2022
- 2022-01-18 WO PCT/JP2022/001679 patent/WO2022158460A1/ja not_active Ceased
- 2022-01-18 JP JP2022576697A patent/JPWO2022158460A1/ja active Pending
- 2022-01-19 TW TW111102165A patent/TW202245959A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02104494A (ja) * | 1988-10-07 | 1990-04-17 | Hitachi Chem Co Ltd | プリント配線板の半田フラックス前駆体 |
| JP2003103398A (ja) * | 2001-09-26 | 2003-04-08 | Sumitomo Bakelite Co Ltd | 硬化性フラックスおよび硬化性フラックスシート |
| JP2010144150A (ja) * | 2008-12-22 | 2010-07-01 | Panasonic Electric Works Co Ltd | 熱硬化性樹脂組成物 |
| JP2013091093A (ja) * | 2011-10-27 | 2013-05-16 | Internatl Business Mach Corp <Ibm> | アンダーフィルとの間で化学的に硬化物を形成する無洗浄フラックス |
| WO2013125685A1 (ja) * | 2012-02-24 | 2013-08-29 | 日立化成株式会社 | 半導体装置及びその製造方法 |
| JP2013216830A (ja) * | 2012-04-11 | 2013-10-24 | Panasonic Corp | 熱硬化性樹脂組成物および半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202245959A (zh) | 2022-12-01 |
| WO2022158460A1 (ja) | 2022-07-28 |
Similar Documents
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