JPWO2022158460A1 - - Google Patents

Info

Publication number
JPWO2022158460A1
JPWO2022158460A1 JP2022576697A JP2022576697A JPWO2022158460A1 JP WO2022158460 A1 JPWO2022158460 A1 JP WO2022158460A1 JP 2022576697 A JP2022576697 A JP 2022576697A JP 2022576697 A JP2022576697 A JP 2022576697A JP WO2022158460 A1 JPWO2022158460 A1 JP WO2022158460A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022576697A
Other versions
JPWO2022158460A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022158460A1 publication Critical patent/JPWO2022158460A1/ja
Publication of JPWO2022158460A5 publication Critical patent/JPWO2022158460A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022576697A 2021-01-19 2022-01-18 Pending JPWO2022158460A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006771 2021-01-19
PCT/JP2022/001679 WO2022158460A1 (ja) 2021-01-19 2022-01-18 はんだ接合用樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2022158460A1 true JPWO2022158460A1 (ja) 2022-07-28
JPWO2022158460A5 JPWO2022158460A5 (ja) 2023-06-16

Family

ID=82549405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576697A Pending JPWO2022158460A1 (ja) 2021-01-19 2022-01-18

Country Status (3)

Country Link
JP (1) JPWO2022158460A1 (ja)
TW (1) TW202245959A (ja)
WO (1) WO2022158460A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104494A (ja) * 1988-10-07 1990-04-17 Hitachi Chem Co Ltd プリント配線板の半田フラックス前駆体
JP2003103398A (ja) * 2001-09-26 2003-04-08 Sumitomo Bakelite Co Ltd 硬化性フラックスおよび硬化性フラックスシート
JP2010144150A (ja) * 2008-12-22 2010-07-01 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物
JP2013091093A (ja) * 2011-10-27 2013-05-16 Internatl Business Mach Corp <Ibm> アンダーフィルとの間で化学的に硬化物を形成する無洗浄フラックス
WO2013125685A1 (ja) * 2012-02-24 2013-08-29 日立化成株式会社 半導体装置及びその製造方法
JP2013216830A (ja) * 2012-04-11 2013-10-24 Panasonic Corp 熱硬化性樹脂組成物および半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104494A (ja) * 1988-10-07 1990-04-17 Hitachi Chem Co Ltd プリント配線板の半田フラックス前駆体
JP2003103398A (ja) * 2001-09-26 2003-04-08 Sumitomo Bakelite Co Ltd 硬化性フラックスおよび硬化性フラックスシート
JP2010144150A (ja) * 2008-12-22 2010-07-01 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物
JP2013091093A (ja) * 2011-10-27 2013-05-16 Internatl Business Mach Corp <Ibm> アンダーフィルとの間で化学的に硬化物を形成する無洗浄フラックス
WO2013125685A1 (ja) * 2012-02-24 2013-08-29 日立化成株式会社 半導体装置及びその製造方法
JP2013216830A (ja) * 2012-04-11 2013-10-24 Panasonic Corp 熱硬化性樹脂組成物および半導体装置

Also Published As

Publication number Publication date
WO2022158460A1 (ja) 2022-07-28
TW202245959A (zh) 2022-12-01

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