TW202243098A - 基板保持裝置 - Google Patents

基板保持裝置 Download PDF

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Publication number
TW202243098A
TW202243098A TW111106326A TW111106326A TW202243098A TW 202243098 A TW202243098 A TW 202243098A TW 111106326 A TW111106326 A TW 111106326A TW 111106326 A TW111106326 A TW 111106326A TW 202243098 A TW202243098 A TW 202243098A
Authority
TW
Taiwan
Prior art keywords
substrate
holding device
supporting
temporary
pressing
Prior art date
Application number
TW111106326A
Other languages
English (en)
Chinese (zh)
Inventor
山下元気
Original Assignee
日商東麗工程股份有限公司
日商東實先進股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗工程股份有限公司, 日商東實先進股份有限公司 filed Critical 日商東麗工程股份有限公司
Publication of TW202243098A publication Critical patent/TW202243098A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW111106326A 2021-03-18 2022-02-22 基板保持裝置 TW202243098A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021045014A JP2022144135A (ja) 2021-03-18 2021-03-18 基板保持装置
JP2021-045014 2021-03-18

Publications (1)

Publication Number Publication Date
TW202243098A true TW202243098A (zh) 2022-11-01

Family

ID=83319970

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111106326A TW202243098A (zh) 2021-03-18 2022-02-22 基板保持裝置

Country Status (3)

Country Link
JP (1) JP2022144135A (ja)
TW (1) TW202243098A (ja)
WO (1) WO2022196017A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI843362B (zh) 2022-11-30 2024-05-21 大陸商西安奕斯偉材料科技股份有限公司 矽晶片夾持裝置及矽晶片清洗設備

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982785A (ja) * 1995-09-18 1997-03-28 Nec Corp 半導体ウェハ温度制御装置
KR102365819B1 (ko) * 2015-07-17 2022-02-21 삼성전자주식회사 웨이퍼 클램핑 장치
JP2019044249A (ja) * 2017-09-06 2019-03-22 キヤノン株式会社 アライメント装置、および、成膜装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI843362B (zh) 2022-11-30 2024-05-21 大陸商西安奕斯偉材料科技股份有限公司 矽晶片夾持裝置及矽晶片清洗設備

Also Published As

Publication number Publication date
WO2022196017A1 (ja) 2022-09-22
JP2022144135A (ja) 2022-10-03

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