TW202243098A - substrate holding device - Google Patents

Abstract

Provided is a substrate holding device with which the deflection of a substrate to be held, caused by the substrate's own weight, can be remedied. Specifically, this substrate holding device for holding a substrate is characterized by comprising: a substrate support part that supports the substrate from a bottom surface side; a substrate pressing part that presses the substrate from a top surface side; and a movement part that relatively moves the substrate support part and the substrate pressing part in a thickness direction of the substrate. The substrate holding device is also characterized in that the substrate pressing part presses the substrate downward from the top surface side at a position offset more toward the outside than an area at which the substrate is supported by the substrate support part.

Description

Substrate holding device

The invention relates to a substrate holding device for holding a substrate. Specifically, it relates to a substrate holding device that clamps from the front side and the back side of the substrate and holds it in a specific posture.

For example, after a semiconductor device is laminated to form a plurality of semiconductor device circuits (that is, the repeated appearance pattern of the device wafer) on a semiconductor wafer, it is singulated into individual chip parts, and the chip parts are packaged as Electronic parts are shipped individually or incorporated into electrical products.

And, before singulating each wafer part, keep one semiconductor wafer and repeatedly perform film formation, exposure, development, etching, smoothing, etc., and compare and photograph the repetition of device wafers formed on the wafer in the middle. The inspection image and reference image of the appearance pattern are used to perform inspections related to the quality of each chip component (for example, Patent Document 1).

The wafers to be processed in the manufacturing steps are transferred from cassette holders, etc. to processing devices or inspection devices, etc. by automatic transfer devices called handlers, and processed/inspected substrates are transferred or uninspected substrates are delivered.

In general, a wafer to be processed/inspected is processed/inspected by being supported over its entire surface by a wafer holding table with a flat upper surface from the lower surface side, sucked and held, etc. (for example, Patent Document 2). [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2007-155610 [Patent Document 2] Japanese Patent Laid-Open No. 2006-269989

[Problem to be solved by the invention]

The wiring patterns etc. are formed on the upper and lower surfaces of the wafer to be processed/inspected. In order to prevent foreign matter from adhering or damage, it is necessary to avoid supporting the entire lower surface of the wafer with a flat wafer holding table. Therefore, there are many examples in which the number of support points is small, or only the outer peripheral portion of the substrate is supported, and the substrate is likely to bend due to its own weight. If the substrate is bent, there will be a difference in the operating distance of processing/inspection between the central portion and the outer peripheral portion, and it may be difficult to perform specific processing/inspection.

Therefore, the present invention has been accomplished in view of the above-mentioned problems, and It is an object to provide a holding device capable of improving the self-weight bending of a substrate to be held. [Technical means to solve the problem]

In order to solve the above-mentioned problems, an aspect of the present invention is characterized in that it is a substrate holding device for holding a substrate, and has: a substrate support portion that supports the substrate from the lower surface side; a substrate pressing portion that presses the substrate from the upper surface side; and a moving part that relatively moves the substrate supporting part and the substrate pressing part in the thickness direction of the substrate; and The substrate pressing part presses downward from the upper surface side of the substrate to a position more outward than the part where the substrate is supported by the substrate supporting part.

With such a structure, the moment acts like lifting the central part of the board bent by its own weight. [Effect of Invention]

Self-weight bending of substrates to be held can be improved.

Hereinafter, the form for carrying out this invention is demonstrated using drawing. In addition, in the following description, the three axes of the orthogonal coordinate system are set as X, Y, and Z, the horizontal direction is expressed as the X direction and the Y direction, and the direction perpendicular to the XY plane (that is, the direction of gravity) is expressed as Z direction. In addition, the direction opposite to the gravity in the Z direction is represented as upward, and the direction in which gravity acts is represented as downward.

FIG. 1 is a perspective view (partial sectional view) showing an example of a substrate W processed in a form embodying the present invention. In FIG. 1( a ) and ( b ), a silicon wafer with a substantially circular shape used for manufacturing semiconductor devices and the like is illustrated as one type of substrate W. FIG. 1( a ) illustrates a situation in which the substrate W is observed from obliquely above, and FIG. 1( b ) illustrates a situation in which the substrate W is observed obliquely upward. The substrate W has mutually parallel and flat surfaces (so-called front or rear surfaces), and the upper side is called upper surface Wa, and the lower side is called lower surface Wb. In addition, the substrate W is processed in a state where the upper surface Wa and the lower surface Wb are parallel to the horizontal direction (that is, the thickness direction is the vertical direction). In addition, the substrate W has an outer peripheral portion E (that is, an outer end portion, also referred to as a side surface) located on the outer side (a direction away from the center Wc) than the upper surface Wa and the lower surface Wb, and the outer peripheral portion E is chamfered (rounded). processing).

In the upper surface Wa or the lower surface Wb of the substrate W, the area where the circuit pattern is formed or the area where the functional film formation is performed (approximately the inner part of the outer edge and a part of its periphery) is to avoid adhesion of dirt or foreign matter, etc. , or if damage or dent occurs, it is set as a contact taboo area, and direct contact or blowing is not allowed. On the other hand, in the outer peripheral portion E (outer edge and its vicinity) outside the contact forbidden area, a contact-allowed area R that allows contact during processing is set over the entire outer circumference of the substrate W.

Further, on the upper surface Wa side of the substrate W in the contact-allowed region R, an upper-surface-side contact portion Ra is set. On the other hand, on the side of the lower surface Wb of the substrate W, an outer peripheral contact portion Rb and a temporary substrate contact portion Rc are set. The outer peripheral contact portion Rb is set on the lower surface Wb side of the substrate W. As shown in FIG. The substrate temporary abutting portion Rc is divided into a plurality of portions and set on the lower surface Wb side of the substrate W at a position different from the outer peripheral abutting portion Rb.

In addition, the contact-allowed region R, upper-surface-side contact portion Ra, peripheral contact portion Rb, and substrate temporary contact portion Rc are not directly shown on the substrate W, but in the processing rules and regulations of the substrate W (also called the concept).

Fig. 2 is a perspective view showing an overall configuration of an example of an embodiment of the present invention. In Fig. 2 (a), (b), each part constituting the substrate holding device 1 of the present invention and its arrangement example are shown. In addition, FIG. 2( a ) shows the posture when the substrate W is received (or discharged), and FIG. 2( b ) shows the state of holding the substrate W in a specific posture.

The substrate holding device 1 holds a substrate W. As shown in FIG. Specifically, the substrate holding device 1 has a configuration that receives a substrate W conveyed by an operator or a handler (not shown) in a horizontal state, clamps the substrate W from the front side and the back side, and holds it in a specific posture. . More specifically, the substrate holding device 1 includes a substrate support unit 2 , a temporary support unit 3 , a substrate pressing unit 4 , a moving unit 5 , and the like.

The substrate support unit 2 supports the substrate W from the lower surface Wb side. Specifically, the substrate supporting portion 2 is also referred to as an outer peripheral supporting portion, and is configured to support the substrate W by contacting the outer peripheral contact portion Rb set on the lower surface Wb side of the substrate in the contact-allowed region R. More specifically, the substrate supporting portion 2 is composed of arc-shaped curved wall members 21-23 attached to the device base 1f, and their upper end surfaces 21a-23a are flat horizontal planes. Furthermore, the substrate supporting part 2 is shaped as following the outer shape of the substrate W (in this example, it is approximately cylindrical), and a gap is provided to avoid mutual interference with the part of the temporary supporting part 3 that performs lifting motion ( Also known as gap, opening).

The temporary support unit 3 temporarily supports the lower surface side of the substrate W, and supports a site different from the site supported by the substrate support unit 2 described later. Specifically, the temporary support portion 3 has the following configuration: it is in contact with a plurality of parts divided into substrates in the contact-allowed region R and is set on the lower surface Wb side of the substrate W on the substrate temporary support part different from the peripheral contact part Rb. The contact portion Rc receives and supports the substrate W. Specifically, the temporary support part 3 is arrange|positioned at several places (specifically, three places are illustrated) so that the outer peripheral part E of the board|substrate W may be surrounded. More specifically, the temporary support portion 3 has a shape in which ends 31a to 33a of rod-shaped support members 31 to 33 also called support pins or support claws protrude toward the center Wc side of the substrate W. And, the outer ends of these supporting members 31 to 33 (ie, opposite to the ends 31a to 33a ) are attached to movable parts 51 to 54 of the moving part 5 described later directly or through connecting metal fittings 50 and the like.

The substrate pressing part 4 is for pressing the substrate W from the upper surface Wa side. Furthermore, the substrate pressing portion 4 is for pressing downward from the upper surface side of the substrate W at a position that is more outward than the portion where the substrate W is supported by the substrate supporting portion 2 . Specifically, the substrate holding part 4 has the following configuration: it is arranged at a spaced position above the substrate supporting part 2 so as to cover at least a part of the upper end surfaces 21a to 23b of the substrate supporting part 2, and is located above the contact-allowed region R. The upper surface side abutment portion Ra on the surface Wa side abuts on the substrate W and presses the substrate W downward. More specifically, the substrate pressing portion 4 has a shape in which ends 41 a to 43 a of the plate-shaped members 41 to 43 protrude toward the center Wc of the substrate W. As shown in FIG. In addition, these plate-like members 41-43 have a shape in which the portion (also referred to as the lower surface side or the contact surface) that contacts the substrate W is not parallel to the upper surface of the substrate W, but is inclined inward (in the figure). is wedge-shaped). Furthermore, the substrate pressing portion 4 is arranged above the temporary support portion 3 at a predetermined interval, and the plate members 41 to 43 are attached to the movable portions 51 to 54 of the moving portion 5 described later directly or through the connecting metal fitting 50 and the like.

The moving part 5 is for relatively moving the substrate pressing part 4 and the substrate supporting part 2 in the thickness direction of the substrate W. As shown in FIG. Specifically, the moving part 5 is for integrally moving the temporary support part 3 and the substrate pressing part 4 in the thickness direction of the substrate W relative to the substrate supporting part 2 . More specifically, the moving part 5 is constituted by an air cylinder or an electric actuator including movable parts 51 to 54 and main parts 56 to 59, and is arranged in a plurality of places so as to surround the substrate supporting part 2 (specifically, 4 place).

The movable part 51 is for integrally moving the supporting member 31 of the temporary supporting part 3 and the plate-shaped member 41 of the substrate pressing part 4 in the vertical direction (ie, lifts up and down). Similarly, the movable part 52 is for making the supporting member 32 of the temporary supporting part 3 and the plate-like member 42 of the substrate pressing part 4 move integrally in the up and down direction (that is, lifting action), and the movable part 53 is for making the temporarily supporting part 3 The supporting member 33 and the plate-shaped member 43 of the substrate pressing part 4 move integrally in the up and down direction (that is, lift up and down). Specifically, the movable parts 51 to 53 are composed of rod-shaped members having a predetermined length in the vertical direction, and the supporting member 31 of the temporary support part 3 and the plate-shaped member 41 of the substrate pressing part 4 are attached to the movable part 51 . Moreover, the support member 32 of the temporary support part 3 and the plate-shaped member 42 of the board|substrate pressing part 4 are attached to the movable parts 52 and 53 via the connection metal fitting 50. As shown in FIG. Moreover, the support member 33 of the temporary support part 3 and the plate-shaped member 43 of the board|substrate pressing part 4 are attached to the movable part 54. As shown in FIG.

The main body parts 56 to 59 are for moving the movable parts 51 to 54 in the up and down direction (that is, for lifting and lowering operations). Specifically, the main bodies 56 to 59 are attached to the device base 1f, and are configured to be driven by connecting air pipes (that is, lifting motion) if they are air cylinders, or driven by electric signals if they are electric actuators ( That is, lifting operation), and moves to the ascending end side and descending end side and stops.

FIG. 3 is a schematic diagram showing the main parts of an example of an embodiment of the present invention, and the state of the substrate is shifted from temporary placement to holding (clamping), and the substrate W, the temporary support part 3, and the substrate support The positional relationship between the part 2 and the substrate pressing part 4 is displayed together. Fig. 3(a) shows the state when the moving part 5 is in the upper-stage state (that is, the movable parts 51-54 move to the position of the rising end side), and Fig. 3(c) shows that the moving part 5 is in the lower-stage state (That is, the state when the movable parts 51 to 54 have moved to the position on the lower end side) is a state in which they are moving (falling) among them in FIG. 3( b ).

First, when the moving part 5 is in the upper-stage state, the part of the temporary support part 3 that is in contact with the temporary substrate contact part Rc of the substrate W is arranged in a position that is in contact with the outer periphery of the substrate W in the substrate support part 2 The part where Rb touches is higher. Furthermore, the substrate pressing part 4 is disposed above the temporary support part 3 with a gap required for placing or replacing the substrate W (see FIG. 3( a ) and FIG. 2( a )). In addition, as shown in FIG. 2(a), the substrate W moves in the direction shown by the arrow M1 during receiving/ejecting, but at this time, the outer edge of the substrate W passes through the trajectory shown by the chain line W ". Therefore In order to avoid interference when the substrate W passes, the support members 31, 33 of the temporary support part 3 and the plate-shaped members 41, 43 of the substrate pressing part 4 are respectively arranged in a substantially U-shape with large overhangs.

Thereafter, when the transfer of the substrate W is completed, the moving part 5 is lowered toward the lowering end side. In addition, during the descent of the moving part 5 to the lowering end side, the outer peripheral abutting part Rb on the lower surface Wb side of the substrate W contacts the upper end surfaces 21a to 23a of the substrate supporting part 2 (refer to FIG. 3(b)). . At this time, due to the bending of the substrate W due to its own weight, the inner edge portions of the upper end surfaces 21a to 23a of the substrate supporting portion 2 are in contact with the lower surface Wb side of the substrate W, and the outer side of the inner edge portion is separated from the substrate W. (The so-called suspended state).

By further lowering the moving part 5 , the supporting members 31 to 33 of the temporary supporting part 3 are separated from the substrate temporary abutting part Rc set on the lower surface Wb side of the substrate W, and the supporting members 31 to 33 of the temporary supporting part 3 It moves below the upper end surfaces 21 a to 23 a of the substrate support part 2 .

The moving part 5 is further lowered to the lower end side, and the ends 41a to 43a of the plate members 41 to 43 of the substrate pressing part 4 abut against the upper surface side abutment part Ra set on the upper surface Wa side of the substrate W, and the moving part 5. The decline stops. This position is the lower-order state of the moving part 5 (refer to FIG. 3( c ), FIG. 2( b )). At this time, the substrate W is clamped (that is, held) by the substrate pressing part 4 and the substrate supporting part 2 from the front Wa side and the back Wb side. Further, the substrate pressing portion 4 is arranged to press downward from the upper surface Wa side of the substrate W at a position that is more outward than the portion where the substrate W is supported by the substrate supporting portion 2 . Therefore, when the substrate W is placed on the substrate supporting part 2, the substrate W is clamped by the substrate supporting part 2 and the substrate pressing part 4 of the present invention, and it is in a state of being separated from the upper end surfaces 21a to 23a by bending due to its own weight. The outer side of the substrate W is pressed against the upper end surfaces 21a to 23a, generating a moment as if the central portion of the substrate W is lifted upward.

With such a configuration, according to the substrate holding device 1 of the present invention, a moment such as lifting the central part of the substrate W is generated, and the self-weight bending of the substrate W can be improved.

[variation example] In addition, in the above, as shown in FIGS. 2 and 3 , the ends 31a to 33a of the support members 31 to 33 of the temporary support portion 3 that are in contact with the temporary substrate contact portion Rc of the substrate W, or the ends 31a to 33a of the upper surface, have been exemplified. Ends 41a to 43a of the plate-like members 41 to 43 of the substrate holding portion 4 abutted on the side abutting portion Ra are configured to protrude horizontally toward the center Wc of the substrate W, respectively. On the other hand, an example in which the upper end surfaces 21a to 23a of the wall members 21 to 23 of the substrate supporting portion 2 that contact the outer peripheral contact portion Rb of the substrate W are formed of horizontal surfaces has been shown. When the contact-allowed region R includes a horizontal plane on the upper surface Wa side or the lower surface Wb side of the substrate W, the present invention can be embodied by the above configuration.

However, the shape and arrangement of the substrate support part 2, the temporary support part 3, the substrate pressing part 4, and the moving part 5 are not limited to this configuration, and various modifications can be adopted after embodying the present invention.

[About provisional support department 3] In addition, in the above, the structure provided with the temporary support part 3 was illustrated as the specific example of the board|substrate holding|maintenance apparatus 1. As shown in FIG. If it is a structure provided with the temporary support part 3 of such a structure, since it does not need to place the board|substrate W directly on the board|substrate support part 2, since it can be conveyed by a handler etc., it is preferable. However, on the basis of embodying the present invention, the temporary support portion 3 is not an essential structure, and may be omitted.

[About reception guide part 6] On the basis of embodying the present invention, the substrate holding device 1 may be configured to include the receiving guide portion 6 in addition to the above-mentioned provisional support portion 3 .

Fig. 4 is a schematic diagram showing a main part of a modified example of an embodiment of the present invention. In FIGS. 4( a ) to ( c ), specific examples of the arrangement and shape of the receiving guide portion 6 are shown.

The receiving guide part 6 guides the substrate W to a specific temporary position while abutting against a part of the outer edge of the substrate W when the substrate W is placed on the temporary support part 3 . Specifically, the receiving and guiding portion 6 is formed with a side (outside) of the temporary support portion 3 that is not vertical or horizontal, but a mortar-like inclined or curved surface. More specifically, the receiving guide portion 6 has the following configuration: it is formed as it goes toward the outside of the temporary support portion 3 (the side away from the center Wc of the substrate), and is formed above the ends 31a-33a of the support members 31-33. Above the surface (that is, the contact portion with the substrate W), the tapered shape expands outward.

Therefore, when the substrate W is delivered by an operator or a handler, even if the outline position of the substrate W is slightly shifted in the horizontal direction, it is guided by a plurality of receiving guides 6 disposed so as to surround the substrate W. The substrate W is moved downward. Therefore, since the substrate W corrects the positional deviation as it descends, and is positioned (also referred to as centering) at a specific position and abuts against the temporary support part 3, the positional deviation at the time of transfer to the substrate support part 2 is reduced, so better.

[about mobile part 5] In the above, the structure in which the moving part 5 integrally moves the substrate holding part 4 and the temporary supporting part 3 (including the receiving guide part 6 ) relative to the substrate supporting part 2 in the thickness direction of the substrate W has been exemplified.

If this structure is adopted, the movable parts 51 to 54 of the moving part 5 are made to perform one stroke action (in this example, move downward), and the state where the substrate W is supported by the supporting part 3 can be temporarily placed freely, and then moved to the state where the substrate W is supported by the substrate. The support portion 2 and the substrate pressing portion 4 sandwich the substrate W. Therefore, it is preferable because the time required for state transition is only short. However, the moving part 5 is not limited to such a structure, The temporary support part 3 and the board|substrate pressing part 4 may be made into the structure which moves individually.

In addition, in the above, as a specific arrangement example of the moving part 5, the example in which it arrange|positions in four places so that the board|substrate support part 2 may be surrounded was shown. However, on the basis of actualizing the present invention, the moving part 5 is not limited to such an arrangement, and a suitably changed configuration can be adopted.

[About board support part 2] The board|substrate support part 2 is not limited to the structure whose upper end surface 21a-23a is a flat horizontal plane as mentioned above, Various modification examples can be employ|adopted. For example, the substrate supporting portion 2 may be configured such that the portion in contact with the lower surface side of the substrate W is an inclined surface whose outer side is lower than the inner side.

Fig. 5 is a cross-sectional view of an essential part showing another modification example of an embodiment of the present invention. FIG. 5( a ) shows a state in which the moving part 5 is in the upper-stage state (that is, the movable parts 51 to 54 have moved to positions on the ascending end side). On the other hand, FIG. 5( b ) shows a state in which the moving part 5 is in a lower-step state (that is, the movable parts 51 to 54 have moved to positions on the lower end side).

According to this structure, the substrate W is clamped by the substrate supporting part 2 and the substrate pressing part 4 of the present invention, so that when the outer peripheral part W of the substrate W is pressed against the upper end surfaces 21a to 23a, the central part of the substrate W is pressed. The moment is like lifting upwards, but since the upper end surfaces 21a-23a of the substrate supporting part 2 are in the shape of an inverted mortar, a stronger moment is generated than in the case of a horizontal surface. Therefore, the self-weight bending of the substrate W can be further improved.

[About board pressing part 4] In addition, in the above, as a specific example of the substrate pressing portion 4 , the shape (wedge shape) in which the part abutting the substrate W is inclined inward with respect to the upper surface of the substrate W has been shown. However, the substrate pressing portion 4 is not limited to this shape, and the lower surface of the plate-shaped member having the same thickness may be arranged to be inclined inwardly with respect to the upper surface of the substrate W. In this way, it is preferable to arrange the lower surface side of the substrate pressing part 4 inclined inwardly with respect to the upper surface of the substrate W so that the moving part 5 can abut against the outermost side of the substrate W when the moving part 5 is placed in a lower-step state.

Fig. 6 is a schematic diagram showing an essential part of yet another modification example of an embodiment of the present invention. 6( a ) to ( f ) respectively illustrate the shape, arrangement, and positional relationship of the outer peripheral portion E of the substrate W, the substrate supporting portion 2 , and the substrate pressing portion 4 to which the present invention can be applied. In Fig. 6 (a) (b), it is shown that the outer peripheral part E of the substrate W to be held is chamfered, and the entire upper end surface of the substrate support part 2 is supported to the flat part of the lower surface Wb side of the inner edge of the substrate W ( That is, the condition of the surface without chamfering). In addition, a state in which the substrate pressing portion 4 presses the chamfered portion of the outer peripheral portion on the upper surface Wa side of the substrate W downward is shown. If the substrate W is clamped up and down in such a positional relationship, a moment as if the center portion of the substrate W is lifted upward will be generated, so the self-weight bending of the substrate W can be improved. In Fig. 6(c)(d), it is shown that the outer peripheral portion of the substrate W to be held has a cross section at a substantially right angle, from the entire upper end surface of the substrate support portion 2 to the flat part on the lower surface Wb side of the inner edge support substrate W. (that is, the state of the surface that has not been chamfered). In addition, it is shown that the substrate pressing portion 4 presses the corner portion of the outer peripheral portion on the upper surface Wa side of the substrate W downward. If the substrate W is clamped up and down in such a positional relationship, a moment as if the center portion of the substrate W is lifted upward will be generated, so the self-weight bending of the substrate W can be improved.

Furthermore, as shown in FIG. 6(a)(c), if the positional relationship is such that the outer peripheral portion E of the substrate W overhangs outside the outer edge portion of the substrate supporting portion 2, then the substrate supporting portion 2 and the When the substrate holding part 4 clamps, the outer edge of the substrate supporting part 2 becomes a fulcrum for supporting the substrate W from the lower surface Wb side, and the force indicated by the arrow indicated by the dotted line acts. In addition, the substrate pressing portion 4 can be pressed downward at a position deviated to the outside thereof. Therefore, compared with the state where there is no overhang by sandwiching between the substrate supporting portion 2 and the substrate pressing portion 4 , a moment such as lifting the central portion of the substrate W can be further generated. In this way, the effect of further improving self-weight bending is exerted.

In addition, above, the configuration in which the substrate holding portion 4 is arranged at a spaced position above the substrate supporting portion 2 so as to cover at least a part of the upper end surfaces 21 a to 23 b of the substrate supporting portion 2 has been exemplified. Such a configuration is preferable since the substrate W can be clamped in a relatively wide range from the upper surface Wa side and the lower surface Wb side of the substrate W. However, when the present invention is realized, the arrangement such that the substrate holding portion 4 covers at least part of the upper end surfaces 21a to 23b of the substrate supporting portion 2 is not an essential configuration. For example, the substrate W may be pressed downward from the upper surface Wa side with the same or narrower width (circumferential direction) as the cutout of the substrate support portion 2 like the above-mentioned substrate temporary support portion 3 .

[About board support part 2] The upper end surfaces 21a to 23a of the substrate support portion 2 are not limited to flat surfaces, and may be formed with grooves or rough surfaces. Alternatively, the upper end surfaces 21a to 23a of the substrate support portion 2 may be configured to include a suction holding portion that performs negative pressure suction on the lower surface Wb side of the substrate W. With such a configuration, even when the substrate pressing portion cannot be arranged over the entire circumference of the substrate W, an additional moment from the lower surface side can be generated, thereby enhancing the effect of improving the bending of the substrate W due to its own weight.

[About board W] In addition, in the above, as the substrate W to be held in the substrate holding device 1 of the present invention, a wafer having a substantially circular shape has been exemplified. Wafers with a roughly circular shape have a strong tendency to become larger in diameter or thinner, and are prone to self-weight bending. Furthermore, the wafers processed in the manufacturing steps of semiconductor devices are sometimes subjected to multiple film formations to form electronic circuit patterns, which tend to bend under their own weight and are difficult to maintain in a specific posture. However, if such a wafer is held by the substrate holding device 1 of the present invention, since the bending of the wafer by its own weight can be improved and the wafer can be held in a specific posture, it is preferable.

However, the substrate W to be held in the substrate holding device 1 of the present invention is not limited to such a substantially circular thin-plate wafer, and may be a thick plate, or may be a glass substrate or a resin substrate having a rectangular shape. .

1: Substrate holding device 1f: Device base 2: Substrate support part 3: Temporary support department 4: Substrate pressing part 5:Mobile Department 6: Receiving and guiding department 21～23: wall-shaped member (upper end surface: 21a～23a) 31～33: supporting member (one end: 31a～33a) 41～43: Plate member (one end: 41a～43a) 50: Connecting metal parts 51～54: Movable part 56～59: Body part E: Outer peripheral part (peripheral part, side surface) M1: Arrow (transfer direction of processor, etc.) M2: Arrow (lifting direction) R: contact allowed area Ra: Upper surface side abutting portion (the upper surface side of the substrate, the portion that abuts against the substrate pressing portion 4) Rb: Peripheral abutting portion (the lower surface side of the substrate, the portion abutting against the substrate supporting portion 2) Rc: Substrate temporary abutment part (the lower surface side of the substrate, the part that abuts against the temporary support part 3) W: Wafer Wa: upper surface Wb: lower surface Wc: center W": passing through the outer edge when transferring the wafer

Fig. 1(a), (b) is a perspective view showing an example of a substrate processed in a form embodying the present invention. Fig.2 (a), (b) is a perspective view which shows the whole structure of the example of the form which actualized this invention. 3( a ) to ( c ) are schematic diagrams showing essential parts of an example of an embodiment of the present invention. 4( a ) to ( c ) are cross-sectional views of essential parts showing variations of embodiments of the present invention. 5( a ), ( b ) are cross-sectional views showing essential parts of another modification example of an embodiment of the present invention. 6( a ) to ( d ) are cross-sectional views showing essential parts of yet another modification example of an embodiment of the present invention.

1: Substrate holding device

1f: Device base

2: Substrate support part

3: Temporary support department

4: Substrate pressing part

5:Mobile Department

21~23: wall member (upper end surface: 21a~23a)

31~33: Support member (one end: 31a~33a)

41~43: Plate member (one end: 41a~43a)

50: Connecting metal parts

51~54: Movable part

56~59: Main body

M1: Arrow (transfer direction of processor, etc.)

M2: Arrow (lifting direction)

W: Wafer

Wc: center

W": passing through the outer edge when transferring the wafer

Claims (7)

A substrate holding device, characterized in that it holds a substrate, and has: a substrate supporting part that supports the above-mentioned substrate from the lower surface side; a substrate pressing part that presses the above-mentioned substrate from the upper surface side; and a moving part for relatively moving the substrate supporting part and the substrate pressing part in the thickness direction of the substrate; and The substrate pressing portion presses downward from the upper surface side of the substrate to a position that is more outward than a portion where the substrate is supported by the substrate supporting portion. As the substrate holding device of claim 1, it has: a temporary support part that temporarily supports a part of the lower surface of the above-mentioned substrate that is different from the part supported by the above-mentioned substrate support part; and a receiving and guiding part that guides the substrate to a specific temporary position while abutting against a part of the outer edge of the substrate when the substrate is placed on the temporary support part; and The moving part allows the temporary supporting part to support the substrate by allowing the temporary supporting part, the receiving guide part, and the substrate pressing part to move relative to the substrate supporting part in the thickness direction of the substrate integrally. The state shifts to a state where the substrate is clamped by the substrate supporting portion and the substrate pressing portion. The substrate holding device as claimed in claim 1, wherein A portion of the substrate pressing portion that is in contact with the substrate is arranged to be inclined inwardly with respect to the upper surface of the substrate. The substrate holding device as claimed in claim 2, wherein A portion of the substrate pressing portion that is in contact with the substrate is arranged to be inclined inwardly with respect to the upper surface of the substrate. The substrate holding device according to any one of claims 1 to 4, wherein The above-mentioned substrate support portion has a specific width along the outer peripheral portion of the above-mentioned substrate, and the portion that contacts the lower surface side of the substrate is an inclined surface whose outer side is lower than the inner side. The substrate holding device according to any one of claims 1 to 4, wherein The substrate supporting part is provided with a suction holding part for performing negative pressure suction on the lower surface side of the substrate. Such as the substrate holding device of claim 5, wherein The substrate supporting part is provided with a suction holding part for performing negative pressure suction on the lower surface side of the substrate.

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