JP2022144135A - Substrate holding device - Google Patents

Abstract

To provide a holding device for improving the self-weight deflection of a substrate to be held.SOLUTION: A substrate holding device 1 for holding a substrate includes a substrate-supporting portion 2 that supports the substrate from the underside, a substrate pressing portion 4 that presses the substrate from the upper side, and a moving portion 5 that moves the substrate-supporting portion and the substrate pressing portion relative to each other in the direction of the thicknesses of the substrate. The substrate pressing portion presses down a portion offset outward from the part where the substrate is supported by the substrate supporting portion from the top side of the substrate.SELECTED DRAWING: Figure 2

Description

The present invention relates to a substrate holding device that holds a substrate. More specifically, the present invention relates to a substrate holding device that clamps a substrate from the front side and the back side and holds the substrate in a predetermined posture.

For example, a semiconductor device is formed by layering a large number of semiconductor device circuits (i.e., repeated appearance patterns of device chips) on a single semiconductor wafer, and then singulated into individual chip parts. Components are packaged and shipped as individual electronic components or incorporated into electrical products.

Before individual chip components are separated into individual chips, a single semiconductor wafer is held and film formation, exposure/development, etching, smoothing, etc. are repeatedly performed. An inspection image obtained by picking up a repetitive appearance pattern of a device chip and a reference image are compared to inspect the quality of each chip component (for example, Patent Document 1).

Wafers to be processed in the manufacturing process are transported from a cassette carrier or the like to a processing device or an inspection device by an automatic transport device called a handler.

In general, a wafer to be processed or inspected is supported entirely from the bottom side by a wafer holding table with a flat top surface, and is held by suction or the like, and processed or inspected (see, for example, Patent Document 2).

JP 2007-155610 A JP 2006-269989 A

Films such as wiring patterns are formed on the upper and lower surfaces of the wafer to be processed and inspected, and in order to prevent the adhesion of foreign matter and the occurrence of scratches, the entire lower surface of the wafer can be supported by a flat wafer holder. be avoided. Therefore, in many cases, the number of supporting points is small, or only the peripheral portion of the substrate is supported, and the substrate tends to bend due to its own weight. When the substrate is warped, there is a difference in working distance for processing/inspection between the central portion and the outer peripheral portion, which sometimes makes it difficult to perform predetermined processing/inspection.

Therefore, the present invention has been made in view of the above problems,
It is an object of the present invention to provide a holding device capable of improving self-weight deflection of a substrate to be held.

In order to solve the above problems, one aspect of the present invention includes:
A substrate holding device for holding a substrate,
a substrate supporting portion that supports the substrate from the lower surface side;
a substrate holding portion that holds the substrate from the upper surface side;
a moving part for relatively moving the substrate supporting part and the substrate holding part in the thickness direction of the substrate;
The substrate holding portion is characterized in that it presses downward from the upper surface side of the substrate at a position offset outward from the portion where the substrate is supported by the substrate supporting portion.

Due to such a structure, a moment acts to lift the central portion of the substrate that is bent by its own weight.

The self-weight deflection of the substrate to be held can be improved.

1 is a perspective view showing an example of a substrate handled in a mode embodying the present invention; FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the whole structure of an example in the form which embodies this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows the principal part of an example in the form which embodies this invention. It is sectional drawing which shows the principal part of the modification in the form which embodies this invention. It is sectional drawing which shows the principal part of another modification in the form which embodies this invention. It is sectional drawing which shows the principal part of another modification in the form which embodies this invention.

EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated, using a figure. In the following description, the three axes of the orthogonal coordinate system are X, Y, and Z, the horizontal directions are expressed as the X direction and the Y direction, and the direction perpendicular to the XY plane (that is, the direction of gravity) is expressed as the Z direction. do. In the Z direction, the direction against gravity is expressed as up, and the direction in which gravity acts is expressed as down.

FIG. 1 is a perspective view (partial cross-sectional view) showing an example of a substrate W that is handled in a mode embodying the present invention. FIGS. 1(a) and 1(b) exemplify, as one type of substrate W, a silicon wafer having a substantially circular outer shape, which is used for manufacturing semiconductor devices and the like. FIG. 1A shows the substrate W viewed obliquely downward, and FIG. 1B shows the substrate W obliquely viewed upward. The substrate W has flat surfaces (so-called front surface and back surface) that are parallel to each other. The substrate W is handled in a state in which the upper surface Wa and the lower surface Wb are parallel to the horizontal direction (that is, the thickness direction is the vertical direction). In addition, the substrate W has an outer peripheral portion E (that is, an outer end portion, also referred to as a side surface) positioned outside (in a direction away from the center Wc) of the upper surface Wa and the lower surface Wb, and the outer peripheral portion E is chamfered. Processing (round processing) is applied.

On the upper surface Wa and the lower surface Wb of the substrate W, the area where the circuit pattern is formed and the area where the functional film is formed (approximately inside the outer edge and part of its periphery) are contaminated with dirt, foreign matter, and the like. In order to avoid adhesion, scratches, dents, etc., it is designated as a contact-prohibited area, and direct contact and air blowing are not permitted. On the other hand, a contact permissible region R that permits contact during handling is set over the entire outer periphery of the substrate W in the outer peripheral portion E (the outer edge and its vicinity) outside the contact prohibited region.

An upper surface side contact portion Ra is set on the upper surface Wa side of the substrate W in the contact allowable region R. As shown in FIG. On the other hand, on the lower surface Wb side of the substrate W, an outer peripheral contact portion Rb and a temporary substrate placement contact portion Rc are set. The outer peripheral contact portion Rb is set on the lower surface Wb side of the substrate W. As shown in FIG. The substrate temporary placement abutting portions Rc are set at positions different from the outer peripheral abutting portions Rb on the lower surface Wb side of the substrate W, and are distributed to a plurality of locations.

The allowable contact region R, upper surface side contact portion Ra, outer peripheral contact portion Rb, and substrate temporary placement contact portion Rc are not directly indicated on the substrate W, and the rules for handling the substrate W, It is set in regulations, etc. (also called concepts).

FIG. 2 is a perspective view showing an example overall configuration in a mode embodying the present invention. 2(a) and 2(b) show respective parts constituting the substrate holding device 1 according to the present invention and an example of arrangement thereof. FIG. 2(a) shows the posture when receiving (or discharging) the substrate W, and FIG. 2(b) shows how the substrate W is held in a predetermined posture. ing.

The substrate holding device 1 holds a substrate W. As shown in FIG.
Specifically, the substrate holding apparatus 1 receives a substrate W conveyed by an operator or a handler (not shown) in a horizontal state, holds the substrate W from the front side and the back side, and holds the substrate W in a predetermined posture. It is configured to hold. More specifically, the substrate holding device 1 includes a substrate supporting portion 2, a temporary placement supporting portion 3, a substrate holding portion 4, a moving portion 5, and the like.

The substrate supporting portion 2 supports the substrate W from the lower surface Wb side.
Specifically, the substrate supporting portion 2 is also called an outer peripheral supporting portion, and supports the substrate W by bringing it into contact with the outer peripheral contact portion Rb set on the lower surface Wb side of the substrate in the contact allowable region R. It is configured to More specifically, the substrate support section 2 is composed of arcuately curved wall-shaped members 21 to 23 attached to the apparatus base 1f, and their upper end surfaces 21a to 23a are flat horizontal surfaces. be. Further, the substrate support portion 2 has a shape (in this example, a substantially cylindrical shape) that follows the outer shape of the substrate W, and the portion where the temporary placement support portion 3 moves up and down is designed to avoid interference with each other. A notch (also called a gap or an opening) is provided.

The temporary placement support portion 3 temporarily supports the lower surface side of the substrate W, and supports a portion different from the portion supported by the substrate support portion 2 described later.
Specifically, the temporary placement support part 3 is provided in the contact permissible area R at a plurality of locations of the substrate W and set on the lower surface Wb side of the substrate W, and the substrate temporary placement contact portion is different from the outer peripheral contact portion Rb. It is configured to receive and support the substrate W by bringing it into contact with the portion Rc.
Specifically, the temporary placement support portions 3 are arranged at a plurality of locations (specifically, three locations are exemplified) so as to surround the outer peripheral portion E of the substrate W. As shown in FIG.
More specifically, the temporary placement support portion 3 has a shape in which one ends 31a to 33a of rod-shaped support members 31 to 33, which are also called support pins or support claws, extend toward the center Wc of the substrate W. . One end of each of the support members 31 to 33 on the outside (that is, the side opposite to the ends 31a to 33a) is attached to the movable portions 51 to 54 of the moving portion 5, which will be described later, either directly or via a connecting fitting 50 or the like. ing.

The substrate pressing part 4 presses the substrate W from the upper surface Wa side. Further, the substrate holding portion 4 holds down the substrate W from the upper surface thereof at a position offset outward from the portion where the substrate W is supported by the substrate supporting portion 2 .
Specifically, the substrate holding portion 4 is arranged above the substrate supporting portion 2 at a position spaced apart so as to cover at least a part of the upper end surfaces 21a to 23b of the substrate supporting portion 2. Among them, the substrate W is brought into contact with the upper surface side contact portion Ra on the upper surface Wa side to press the substrate W downward.
More specifically, the substrate pressing portion 4 has a shape in which one ends 41a to 43a of the plate members 41 to 43 extend toward the center Wc of the substrate W. As shown in FIG. The plate-like members 41 to 43 have a portion (also referred to as a lower surface side or a contact surface) that contacts the substrate W, and are not parallel to the upper surface of the substrate W, but have a shape that is inclined inward (in the figure, , wedge-shaped).
The substrate holding portion 4 is arranged above the temporary placement support portion 3 with a predetermined space therebetween, and the plate-like members 41 to 43 are connected directly or via the connecting metal fittings 50 or the like to the moving portion 5, which will be described later. It is attached to the movable parts 51-54.

The moving part 5 moves the substrate pressing part 4 and the substrate supporting part 2 in the thickness direction of the substrate W relative to each other.
Specifically, the moving section 5 moves the temporary placement support section 3 and the substrate holding section 4 together in the thickness direction of the substrate W with respect to the substrate support section 2 .
More specifically, the moving part 5 is composed of an air cylinder or an electric actuator having movable parts 51 to 54 and body parts 56 to 59, and is provided at a plurality of locations (specifically, (4 locations are shown as an example).

The movable portion 51 vertically moves the support member 31 of the temporary placement support portion 3 and the plate-like member 41 of the substrate holding portion 4 integrally (that is, moves up and down).
Similarly, the movable portion 52 connects the support member 32 of the temporary placement support portion 3 and the plate-like member 42 of the substrate pressing portion 4 , and the movable portion 53 connects the support member 33 of the temporary placement support portion 3 and the substrate pressing portion 4 . The plate-like member 43 is vertically moved integrally (that is, moved up and down).
Specifically, the movable parts 51 to 53 are composed of rod-shaped members having a predetermined length in the vertical direction. A plate member 41 is attached. Further, the support member 32 of the temporary placement support portion 3 and the plate-like member 42 of the substrate holding portion 4 are attached to the movable portions 52 and 53 via the connecting metal fittings 50 .
Further, the support member 33 of the temporary placement support section 3 and the plate member 43 of the substrate holding section 4 are attached to the movable section 54 .

The body portions 56 to 59 move the movable portions 51 to 54 in the vertical direction (that is, move up and down). Specifically, the main bodies 56 to 59 are attached to the device base 1f, and if they are air cylinders, they are driven by being connected to air pipes (that is, they are moved up and down), and if they are electric actuators, they are driven by electric signals. (That is, it moves up and down), moves to the rising end side and the falling end side, and stops.

FIG. 3 is a schematic diagram showing a main part of an example of a mode embodying the present invention. , the substrate supporting portion 2, and the substrate holding portion 4, respectively.
3(a) shows the moving part 5 in the upper state (that is, the positions where the movable parts 51 to 54 have moved to the rising end side), and FIG. 3(c) shows the moving part 5 in the lower state ( That is, when the movable parts 51 to 54 are in the lower end position), FIG.

First, when the moving part 5 is in the upper stage state, the part of the temporary placement support part 3 that contacts the substrate temporary placement contact part Rc of the substrate W contacts the peripheral contact part Rb of the substrate W of the substrate support part 2 . placed above the site. Further, the substrate holding portion 4 is arranged above the temporary placement support portion 3 with a clearance necessary for placing and replacing the substrate W (see FIGS. 3A and 2A). .
As shown in FIG. 2(a), the substrate W moves in the direction indicated by the arrow M1 when it is received/discharged. Therefore, the support members 31 and 33 of the temporary placement support section 3 and the plate-like members 41 and 43 of the substrate holding section 4 have a substantially U-shaped overhang so as not to interfere with each other when the substrate W passes. are placed respectively.

After that, when the transfer of the substrate W is completed, the moving part 5 is lowered toward the lower end side. Then, while the moving part 5 is descending to the lower end side, the outer peripheral contact part Rb set on the lower surface Wb side of the substrate W comes into contact with the upper end surfaces 21a to 23a of the substrate supporting part 2 (FIG. 3(b)). reference). At this time, due to the deflection of the substrate W by its own weight, the inner ridges of the upper end surfaces 21a to 23a of the substrate supporting portion 2 are in contact with the lower surface Wb side of the substrate W, while the outer side of the inner ridges is separated from the substrate W (so-called , floating state).

As the moving part 5 is further lowered, the support members 31 to 33 of the temporary placement support part 3 are separated from the substrate temporary placement abutting portion Rc set on the lower surface Wb side of the substrate W, and the support members of the temporary placement support part 3 are separated. 31 to 33 move below the upper end surfaces 21a to 23a of the substrate supporting portion 2. As shown in FIG.

Further, the moving part 5 descends toward the lower end side, and one ends 41a to 43a of the plate-like members 41 to 43 of the substrate pressing part 4 come into contact with the upper surface side contact portion Ra set on the upper surface Wa side of the substrate W. contact, and the descent of the moving part 5 stops. This position is the lower stage state of the moving part 5 (see FIGS. 3(c) and 2(b)). At this time, the substrate W is clamped (that is, held) by the substrate pressing portion 4 and the substrate supporting portion 2 from the front surface Wa side and the rear surface Wb side. The substrate holding portion 4 is arranged to hold down the substrate W from the upper surface Wa side of the substrate W at a position offset outward from the portion where the substrate W is supported by the substrate supporting portion 2 . Therefore, when the substrate W is placed on the substrate supporting portion 2, the outer side of the substrate W, which has been separated from the upper end surfaces 21a to 23a due to the deflection of its own weight, is replaced by the substrate supporting portion 2 and the substrate pressing portion 4 according to the present invention. By holding the substrate W between the substrates W, the substrate W is pressed toward the upper end surfaces 21a to 23a, and a moment is generated to lift the central portion of the substrate W upward.

With such a configuration, according to the substrate holding device 1 of the present invention, a moment is generated to lift the central portion of the substrate W upward, thereby improving deflection of the substrate W under its own weight. .

[Modification]
In the above description, as shown in FIGS. 2 and 3, one end 31a to 33a of the support members 31 to 33 of the temporary placement support portion 3 to be brought into contact with the substrate temporary placement contact portion Rc of the substrate W, and the upper surface side contact portion The one ends 41a to 43a of the plate-like members 41 to 43 of the substrate pressing portion 4 that are brought into contact with Ra extend horizontally toward the center Wc of the substrate W, respectively. On the other hand, an example in which the upper end surfaces 21a to 23a of the substrate supporting portion 2, which contact the outer peripheral contact portion Rb of the substrate W, is configured as a horizontal surface is shown. When the contact permissible region R includes a horizontal surface on the upper surface Wa side or the lower surface Wb side of the substrate W, the present invention can be embodied by the above configuration.

However, in embodying the present invention, the shape and arrangement of the substrate supporting portion 2, the temporary placement supporting portion 3, the substrate holding portion 4, and the moving portion 5 are not limited to such a configuration, and various modifications are adopted. can.

[Regarding the temporary placement support part 3]
In the above description, as a specific example of the substrate holding device 1, a configuration including the temporary placement support portion 3 is illustrated. A configuration including the temporary placement supporter 3 having such a configuration is preferable because the substrate W does not need to be directly placed on the substrate supporter 2 and can be transported by a handler or the like.
However, in embodying the present invention, the temporary placement support portion 3 is not an essential component, and may be omitted.

[Regarding the receiving guide part 6]
In embodying the present invention, the substrate holding device 1 may be configured to include the receiving guide portion 6 in the configuration including the temporary placement support portion 3 described above.

FIG. 4 is a schematic diagram showing a main part of a modification in the form embodying the present invention.
4A to 4C show specific examples of the arrangement and shape of the receiving guide portion 6. FIG.

The receiving guide portion 6 guides the substrate W to a predetermined temporary placement position while contacting a portion of the outer edge of the substrate W when the substrate W is placed on the temporary placement support portion 3 .
Specifically, the side (outer side) of the temporary placement support portion 3 of the receiving guide portion 6 is formed of a surface that is not vertical or horizontal, but inclined or curved like a mortar.
More specifically, the reception guide portion 6 is located outside the temporary placement support portion 3 (away from the center Wc of the substrate), and is located on the upper surfaces of the ends 31a to 33a of the support members 31 to 33 (that is, the substrate W and the substrate W). It has a tapered configuration that spreads outward as it goes higher than the contact portion of the .

Therefore, when the substrate W is transferred by an operator, a handler, or the like, even if the external position of the substrate W is slightly deviated in the horizontal direction, the substrate W is guided by a plurality of receiving guide portions 6 arranged so as to surround the substrate W. The substrate W moves downward. Therefore, as the substrate W descends, the positional deviation is corrected, and the substrate W is positioned (also called centering) at a predetermined position and comes into contact with the temporary placement supporter 3 . Therefore, it is preferable.

[Regarding the moving part 5]
In the above description, the moving section 5 integrally moves the substrate holding section 4 and the temporary placement support section 3 (including the receiving guide section 6 as necessary) with respect to the substrate support section 2 in the thickness direction of the substrate W. The structure to move is illustrated.

With such a configuration, the movable portions 51 to 54 of the moving portion 5 are stroked once (moved downward in this example) to move the substrate W from the state supported by the temporary placement support portion 3 to the substrate. W can be shifted to a state in which it is sandwiched between the substrate supporting portion 2 and the substrate pressing portion 4 . Therefore, the time required for state transition is short, which is preferable. However, the moving part 5 is not limited to such a configuration, and may be configured to move the temporary placement support part 3 and the substrate holding part 4 individually.

Further, in the above description, as a specific arrangement example of the moving part 5, an example in which the moving part 5 is arranged at four locations so as to surround the substrate supporting part 2 is shown. However, in embodying the present invention, the moving part 5 is not limited to such an arrangement, and may employ an appropriately modified configuration.

[Regarding the substrate support part 2]
The substrate supporting portion 2 is not limited to the configuration in which the upper end surfaces 21a to 23a are flat horizontal surfaces as described above, and various modifications can be adopted.
For example, the substrate supporting portion 2 may have a structure in which the part that contacts the lower surface side of the substrate W has an inclined surface that is lower on the outside than on the inside.

FIG. 5 is a cross-sectional view showing a main part of another modification in the form embodying the present invention. FIG. 5(a) shows a state in which the moving portion 5 is in the upper stage state (that is, a position where the movable portions 51 to 54 have moved to the upper end side). On the other hand, FIG. 5(b) shows the state when the moving portion 5 is in the lower state (that is, the position where the movable portions 51 to 54 have moved to the lower end side).

With such a configuration, when the substrate W is held between the substrate supporting portion 2 and the substrate holding portion 4 according to the present invention, the outer peripheral portion W of the substrate W is pressed toward the upper end surfaces 21a to 23a. However, since the upper end faces 21a to 23a of the substrate supporting portion 2 are shaped like an inverted mortar, the moment is stronger than in the case of a horizontal surface. occur. Therefore, the self-weight deflection of the substrate W can be further improved.

[Regarding the board holding part 4]
In the above description, as a specific example of the substrate pressing portion 4, the part to be brought into contact with the substrate W has a shape (wedge shape) inclined inwardly with respect to the upper surface of the substrate W. As shown in FIG. However, the substrate holding portion 4 is not limited to such a shape, and the lower surface of the plate-shaped member having the same thickness may be arranged so as to be inclined inwardly with respect to the upper surface of the substrate W. In this manner, the lower surface side of the substrate holding portion 4 is arranged to be inclined inwardly with respect to the upper surface of the substrate W, and is brought into contact with the outermost portion of the substrate W when the moving portion 5 is placed in the lower state. preferred because it can

FIG. 6 is a schematic diagram showing a main part of still another modification in the form embodying the present invention. 6A to 6F respectively illustrate the shape, arrangement, positional relationship, etc., of the outer peripheral portion E of the substrate W, the substrate supporting portion 2, and the substrate pressing portion 4, to which the present invention is applicable. there is
In FIGS. 6A and 6B, the outer peripheral portion E of the substrate W to be held is chamfered, and the flat part of the substrate W on the lower surface Wb side (that is, the non-chamfered surface) is used to support the substrate. A state in which the entire upper end face or the inner edge of the portion 2 is supported is shown.
The substrate holding part 4 is shown holding down the chamfered portion of the outer peripheral portion of the substrate W on the side of the upper surface Wa. When the substrate W is sandwiched from above and below in such a positional relationship, a moment is generated that lifts the central portion of the substrate W upward, so that deflection of the substrate W under its own weight can be improved.
In FIGS. 6(c) and 6(d), the outer peripheral portion of the substrate W to be held has a substantially right-angled cross section, and the flat part of the lower surface Wb side of the substrate W (that is, the non-chamfered surface) is shown in FIG. , the substrate supporting portion 2 is supported by the entire upper end surface or the inner edge thereof.
The substrate holding part 4 is shown holding down the corners of the outer periphery of the substrate W on the side of the upper surface Wa. When the substrate W is sandwiched from above and below in such a positional relationship, a moment is generated that lifts the central portion of the substrate W upward, so that deflection of the substrate W under its own weight can be improved.

Furthermore, as shown in FIGS. 6A and 6C, if the positional relationship is such that the outer peripheral portion E of the substrate W overhangs the outer edge portion of the substrate supporting portion 2, the substrate supporting portion 2 and the substrate holding portion 4, the outer ridge portion of the substrate supporting portion 2 becomes a fulcrum supporting the substrate W from the lower surface Wb side, and the force indicated by the broken arrow acts. Then, the position offset to the outside can be pressed downward by the substrate pressing part 4 . Therefore, by sandwiching the substrate W between the substrate supporting portion 2 and the substrate holding portion 4, it is possible to generate a moment that lifts the central portion of the substrate W further upward compared to a state in which there is no overhang. By doing so, the self-weight deflection improvement effect can be further achieved.

In the above description, the substrate holding portion 4 is arranged above the substrate supporting portion 2 so as to cover at least a part of the upper end surfaces 21a to 23b of the substrate supporting portion 2 at a distance therefrom. With such a configuration, the substrate W can be held in a relatively wide range from the upper surface Wa side and the lower surface Wb side of the substrate W, which is preferable. However, in order to embody the present invention, it is not essential that the substrate holding portion 4 be disposed so as to cover at least part of the upper end surfaces 21a to 23b of the substrate supporting portion 2. FIG. For example, like the substrate temporary placement support section 3 described above, the substrate W is pressed downward from the upper surface Wa side with a width (circumferential direction) equal to or narrower than that of the notch of the substrate support section 2. Also good.

[Regarding the substrate support part 2]
The upper end surfaces 21a to 23a of the substrate supporting portion 2 are not limited to flat surfaces, and may be provided with grooves or rough surfaces. Alternatively, the upper end surfaces 21a to 23a of the substrate supporting portion 2 may be configured to include a suction holding portion that suctions the lower surface Wb side of the substrate W with a negative pressure. With such a configuration, even if the substrate holding portion cannot be arranged over the entire circumference of the substrate W, it is possible to add a moment generated from the lower surface side, so that the effect of improving the self-weight deflection of the substrate W can be enhanced. .

[Regarding the substrate W]
In the above description, a wafer having a substantially circular outer shape is exemplified as the substrate W to be held by the substrate holding device 1 according to the present invention. A wafer having a substantially circular outer shape has a strong tendency to have a large diameter and a thin plate, and tends to bend due to its own weight. In addition, wafers that are handled in the manufacturing process of semiconductor devices are subject to multiple layers of film formation in order to form electronic circuit patterns. was difficult. However, if such a wafer is held by the substrate holding apparatus 1 according to the present invention, it is possible to improve deflection of the wafer by its own weight and hold it in a predetermined posture, which is preferable.

However, the substrate W to be held by the substrate holding apparatus 1 according to the present invention is not limited to such a substantially circular thin plate wafer, and may be a thick plate, a rectangular glass substrate or a resin substrate. It may be a substrate or the like.

1 Substrate holding device 2 Substrate support portion 3 Temporary placement support portion 4 Substrate holding portion 5 Moving portion 6 Receiving guide portion 21 to 23 Wall-shaped members (upper end surfaces:
31-33 support member (one end: 31a-33a)
41 to 43 plate-like members (one end: 41a to 43a)
50 Connecting fittings 51 to 54 Movable part 56 to 59 Main body W Wafer W″ Outer edge through which the wafer passes when being transferred Wa Upper surface Wb Lower surface Wc Center E Peripheral part (peripheral part, side surface)
R contact allowable region Ra upper surface side contact portion (upper surface side of substrate, portion that contacts substrate pressing portion 4)
Rb Outer circumference contact portion (lower surface side of substrate, portion in contact with substrate support portion 2)
Rc Substrate temporary placement contact portion (bottom side of substrate, portion that contacts temporary placement support portion 3)
M1 Arrow (conveyance direction by handler, etc.)
M2 arrow (up/down direction)

Claims (5)

A substrate holding device for holding a substrate,
a substrate supporting portion that supports the substrate from the lower surface side;
a substrate pressing portion that presses the substrate from the upper surface side;
a moving part that relatively moves the substrate supporting part and the substrate holding part in the thickness direction of the substrate;
The substrate holding device according to claim 1, wherein the substrate holding portion presses downward from the upper surface side of the substrate at a position that is offset outward from a portion where the substrate is supported by the substrate supporting portion. a temporary placement support portion that temporarily supports a portion on the lower surface side of the substrate that is different from the portion supported by the substrate support portion;
a receiving guide portion that guides the substrate to a predetermined temporary placement position while contacting a portion of the outer edge of the substrate when the substrate is placed on the temporary placement support portion;
The moving section moves the temporary placement support section, the receiving guide section, and the substrate holding section integrally relative to the substrate support section in the thickness direction of the substrate, thereby moving the substrate to the temporary storage area. 2. The substrate holding device according to claim 1, wherein said substrate is shifted from a state of being supported by a placement support portion to a state of being sandwiched between said substrate support portion and said substrate holding portion. 3. The substrate holding device according to claim 1, wherein the portion of the substrate pressing portion that contacts the substrate is inclined inwardly with respect to the upper surface of the substrate. . 2. The substrate supporting portion has a predetermined width along the outer peripheral portion of the substrate, and the portion in contact with the lower surface side of the substrate is an inclined surface in which the outer side is lower than the inner side. 4. The substrate holding device according to any one of 1 to 3. 5. The substrate holding device according to claim 1, wherein said substrate supporting portion includes a suction holding portion for sucking the lower surface side of said substrate with a negative pressure.

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