TW202239587A - 薄型化封裝接著結構 - Google Patents
薄型化封裝接著結構 Download PDFInfo
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- TW202239587A TW202239587A TW110107799A TW110107799A TW202239587A TW 202239587 A TW202239587 A TW 202239587A TW 110107799 A TW110107799 A TW 110107799A TW 110107799 A TW110107799 A TW 110107799A TW 202239587 A TW202239587 A TW 202239587A
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- Buffer Packaging (AREA)
Abstract
本發明乃是一種薄型化封裝接著結構，其包含：一第一薄片部，該第一薄片部具有兩面，其中一面為局部或全部與接著部相鄰接合；一接著部，該接著部位於第一薄片部與第二薄片部之間，其接著部為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑，且該接著部之厚度範圍為0.5~100微米；及一第二薄片部，該第二薄片部具有兩面，其中一面為局部或全部與接著部相鄰接合；其特徵是該第一薄片部、接著部及一第二薄片部組合成薄型化封裝接著結構，該薄型化封裝接著結構厚度小於等於200微米。
Description
本發明涉及用於電子元件之均熱及散熱之薄片結構。
目前薄型化均熱板被視為5G高傳輸晶片之最佳散熱方案。傳統薄型化均熱板是利用內部兩相蒸發和冷凝之現象，來將其晶片之熱量被動傳遞到整個均熱板平面上。傳統薄型化均熱板為了可以廣泛使用在5G電子設備上，仍待解決製造成本和量產性之問題。目前薄型化均熱板之接合技術，包含擴散接合、雷射焊接和共晶接合，但這些接合技術對於超薄均熱板造成製造工藝複雜化、低生產效率和高製造成本之限制性。
先前技術針對一種無注入管的可攜式電子裝置用薄膜均熱板及其製造方法研究，如中華民國專利號TW108140361所揭露，其結構包括：下部板，上表面形成有複數凸起部，在一側的上表面形成有以預定間隔隔開並凸出的複數第一凸起，且形成有從外側邊緣以預定間隔朝內側向上沿著邊緣形狀凸出形成的第一接合體；及上部板，凸出形成有接合於下部板的上側的第二接合體，且以對應於第一凸起的方式凸出形成有第二凸起，用於向內部注入工作流體的注入口形成在第二凸起的內側，當下部板彎曲並接觸於注入口時，以密封注入口的方式向下側方向凸出形成有段差；其中，藉由真空注入體，使以緊貼結合於上部板的注入口的方式實現接合狀態的上部板與下部板之間形成的內部空間處於真空狀態，並且將工作流體注入到內部空間。
先前技術針對一種智慧型手機一體型均熱板研究，如中華民國專利號TW108140413所揭露，一種如下的智慧型手機一體型均熱板，其能夠與智慧型手機框架一體地製成而不會改變厚度，在智慧型手機框架形成安裝部，而將均熱板對應安裝在上述安裝部，為了輕易實現相互之間的緊固，在安裝部和均熱板的外緣形成短凸緣，且在短凸緣進一步形成孔和凸起，從而增加緊固力，並且智慧型手機一體型均熱板還可以適用於在智慧型手機框架一體地結合均熱板的結構及智慧型手機本身形成有均熱板的結構。
先前技術針對散熱裝置研究，如中華民國專利公告號TW108147553所揭露，該散熱裝置係對被搭載於狹窄化的空間之高發熱量的發熱體亦可發揮優異的冷卻特性。散熱裝置係包括：複數支熱管，係與發熱體以熱性連接；及散熱部，係與複數支該熱管以熱性連接；該散熱裝置係：複數支該熱管中至少與該發熱體以熱性連接的蒸發部具有複數支該熱管之對熱輸送方向正交之方向的截面形狀是扁平的扁平部，並將該扁平部中厚度方向的面配置成與該發熱體相對向。
本發明乃是一種薄型化封裝接著結構，其包含：一第一薄片部，該第一薄片部具有兩面，其中一面為局部或全部與接著部相鄰接合；一接著部，該接著部位於第一薄片部與第二薄片部之間，其接著部為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑，且該接著部之厚度範圍為0.5~100微米；及一第二薄片部，該第二薄片部具有兩面，其中一面為局部或全部與接著部相鄰接合；其特徵是該第一薄片部、接著部及一第二薄片部組合成薄型化封裝接著結構，該薄型化封裝接著結構厚度小於等於200微米。其中，該第一薄片部為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。該接著部接合第一薄片部及第二薄片部之90度剝離強度≧4 N/cm。該接著部接合第一薄片部及第二薄片部之180度剝離強度≧2 N/cm。其中，該第二薄片部為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。至少一第一薄片部和第二薄片部內有一容置空間。該容置空間為填滿至少一凝膠、蠟、熱熔材料和導熱材料，該導熱材料為內含至少一氧化鋁、氮化鋁、氮化硼、碳化矽、碳黑粉、石墨粉、石墨烯粉、奈米碳管、奈米鑽石粉和陶瓷粉。該容置空間提供電子晶片元件容置，提供該電子晶片件包覆。更進一步，該薄型化封裝接著結構之至少一第一薄片部及第二薄片部之外側面覆蓋有至少一第一功能層，該第一功能層之厚度小於200微米，並相鄰之其第一功能層之下表面貼合於第一薄片部之上表面，該第一功能層，為陶瓷材料、石墨烯材料或接著劑，其接著劑為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑；及至少一第二功能層，該第二功能層之厚度小於200微米，並相鄰之其第二功能層之下表面貼合於第一功能層之上表面，該第二功能層，為陶瓷材料、石墨烯材料、接著劑、聚醯亞胺、聚醯胺、聚酯、聚丙烯、聚氨脂、銅、鋁、膠合材料或金屬導電材料，其接著劑為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑。更進一步，該薄型化封裝接著結構之至少一第一薄片部及第二薄片部之外側面覆蓋有一散熱塗層，該散熱塗層為至少一石墨烯、石墨片和陶瓷。本發明具更進一步薄型化封裝接著結構之規格，該薄型化封裝接著結構厚度小於等於200微米，其薄化結構有別於過去習知技藝具差異化，提供電子設備更微小的空間限制內之散熱解決方案，其新穎、進步及實用效益無誤。有關本創作所採用之技術、手段及其功效，茲舉一較佳實施例並配合圖式詳細說明於後，相信本創作上述之目的、構造及特徵，當可由之得一深入而具體的瞭解。
以下係藉由特定的具體實施例說明本創作之實施方式，熟習此技藝之人士可由本說明書所揭示之內容輕易地了解本創作之其他優點與功效。本創作亦可藉由其他不同的具體實施例加以施行或應用，本說明書中的各項細節亦可基於不同觀點與應用，在不悖離本創作之精神下進行各種修飾與變更。
首先敬請閱第1圖係顯示本創作薄型化封裝接著結構剖面圖，說明本發明乃是一種薄型化封裝接著結構，其包含：一第一薄片部101，該第一薄片部101具有兩面，其中一面為局部或全部與接著部201相鄰接合；一接著部201，該接著部201位於第一薄片部101與第二薄片部301之間，其接著部201為至少一環氧樹脂(epoxy resin)、矽樹脂(silicone resin)、聚酯(polyester)、聚氨酯(polyurethane)、奈米矽(nano silicate)及奈米鈦(nano titanium)之接著劑，且該接著部201之厚度範圍為0.5~100微米；及一第二薄片部301，該第二薄片部301具有兩面，其中一面為局部或全部與接著部201相鄰接合；其環氧樹脂為結構上具有環氧基之樹脂，如雙酚A型環氧樹脂是最常用的環氧樹脂，通過固化反應，環氧樹脂可以形成三維交聯高分子網絡結構。其矽樹脂是具有高度交聯結構的熱固性聚矽氧烷高分子，該聚矽氧烷高分子是由有機氯矽烷經由水解縮合及重排，製成室溫下穩定的活性矽氧烷預聚物，再進一步加熱即可縮和交聯成較硬或彈性較小的固體矽樹脂。其矽樹脂有很好的電絕緣性質，耐溫及防水的效果。其聚酯是在其主鏈上含有酯基(COO)官能團的高分子，如聚對苯二甲酸乙二酯。其聚氨酯是指主鏈中含有氨基甲酸酯官能基高分子。其奈米矽及奈米鈦則是上述高分子其混合物，其可以增加黏著強度。其特徵是該第一薄片部101、接著部201及一第二薄片部301組合成薄型化封裝接著結構，該薄型化封裝接著結構厚度小於等於200微米。薄型化均熱板(Vapor Chamber，VC)應用，其至少一第一薄片部101和第二薄片部301內有一容置空間401，該容置空間401為填滿至少一凝膠(gel)、蠟(wax)、熱熔材料(hot-melt material)和導熱材料，該導熱材料為內含至少一氧化鋁、氮化鋁、氮化硼、碳化矽、碳黑粉、石墨粉、石墨烯粉、奈米碳管、奈米鑽石粉和陶瓷粉，其填滿該材料可提供均熱與散熱之功能，有別於傳統薄型化均熱板導入未填滿之散熱液體，本創作沒有液體之注入，可解決傳統薄型化均熱板之液體散逸之缺陷。其凝膠是一種固體的、類似果凍的材料，凝膠是一種充分稀釋的交聯系統，在穩定狀態下沒有流動性。以重量計算，凝膠的主要成分是液體，但由於液體中的三維交聯網絡，凝膠在很多方面有著與固體相近的特性。其蠟是有長烷鏈的有機化合物，蠟是脂肪酸以及長鏈的醇所形成的酯類，或者長鏈碳氫化合物。其熱熔材料相變材料(PCM,Phase Change Material)是指隨溫度變化而改變形態並能提供潛熱的物質，該材料由固態變為液態或由液態變為固態的過程稱為相變過程。另外，電子封裝應用方面，該容置空間401亦可提供電子晶片元件容置，提供該電子晶片件包覆。其中，該第一薄片部101為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺(polyimide)或塑膠。該接著部201接合第一薄片部101及第二薄片部301之90度剝離強度≧4 N/cm。該接著部201接合第一薄片部101及第二薄片部301之180度剝離強度≧2 N/cm。其中，該第二薄片部301為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。其聚醯亞胺依據官能基團分為脂肪族、半芳香族和芳香族聚醯亞胺，又根據熱性質，可分為熱塑性和熱固性聚醯亞胺。聚醯亞胺是一種含有醯亞胺基的有機高分子材料，其製備方式主要是由雙胺類及雙酣類反應聚合成聚醯胺酸高分子，之後經過高溫環化(Imidization)形成聚醯亞胺高分子。
第2圖係顯示本創作薄型化封裝接著結構另一實施例剖面圖。說明本發明乃是一種薄型化封裝接著結構，其包含：一第一薄片部101，該第一薄片部101具有兩面，其中一面為局部或全部與接著部201相鄰接合；一接著部201，該接著部201位於第一薄片部101與第二薄片部301之間，其接著部201為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑，且該接著部201之厚度範圍為0.5~100微米；及一第二薄片部301，該第二薄片部301具有兩面，其中一面為局部或全部與接著部201相鄰接合；其特徵是該第一薄片部101、接著部201及一第二薄片部301組合成薄型化封裝接著結構，該薄型化封裝接著結構厚度小於等於200微米。其中，該第一薄片部101為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。該接著部201接合第一薄片部101及第二薄片部301之90度剝離強度≧4 N/cm。該接著部201接合第一薄片部101及第二薄片部301之180度剝離強度≧2 N/cm。其中，該第二薄片部301為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。
為使審查委員更進一步了解本創作實際應用情境，舉例結合散熱導電軟板之應用領域，如第3圖係顯示本創作薄型化封裝接著結構貼合第一功能層501及第二功能層502之剖面圖，舉例如第1圖之薄型化封裝接著結構，更進一步，該薄型化封裝接著結構之至少一第一薄片部101及第二薄片部301之外側面覆蓋有至少一第一功能層501，該第一功能層501之厚度小於200微米，並相鄰之其第一功能層501之下表面貼合於第一薄片部101之上表面，該第一功能層501，為陶瓷材料、石墨烯材料或接著劑，其接著劑為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑；及至少一第二功能層502，該第二功能層502之厚度小於200微米，並相鄰之其第二功能層502之下表面貼合於第一功能層501之上表面，該第二功能層502，為陶瓷材料、石墨烯材料、接著劑、聚醯亞胺、聚醯胺(polyamide)、聚酯、聚丙烯(polypropylene)、聚氨脂、銅、鋁、膠合材料或金屬導電材料，其接著劑為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑。第3圖中說明第一薄片部101外側面覆蓋有一層第一功能層501及依序疊合三層第二功能層502，達到單面導熱作用之效果。其聚醯胺是由含有羧基和氨基的單體通過醯胺鍵聚合成的高分子。其聚丙烯的重複單元由三個碳原子組成，其中兩個碳原子在主鏈上，一個碳原子以支鏈的形式存在之高分子材料。
第4圖係顯示本創作薄型化封裝接著結構外層設置散熱塗層之剖面圖，舉例如第1圖之薄型化封裝接著結構，更進一步，該薄型化封裝接著結構之至少一第一薄片部101及第二薄片部301之外側面覆蓋有一散熱塗層601，該散熱塗層601為至少一石墨烯、石墨片和陶瓷。其薄型化封裝接著結構表面經噴塗、含浸或塗布方式，將至少一石墨烯、石墨片和陶瓷設置於薄型化封裝接著結構表面，提供輻射散熱與均熱之功能，更提升熱源散逸之作用。第4圖中說明第二薄片部301外側面覆蓋有一散熱塗層601，可節省散熱塗層601使用量，達到單面散熱作用之效果，增加第二薄片部301的散熱面積及輻射散熱特性。
綜觀上述實施例之結構與特徵，本發明乃是一種薄型化封裝接著結構，其包含：一第一薄片部101，該第一薄片部101具有兩面，其中一面為局部或全部與接著部201相鄰接合；一接著部201，該接著部201位於第一薄片部101與第二薄片部301之間，其接著部201為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑，且該接著部201之厚度範圍為0.5~100微米；及一第二薄片部301，該第二薄片部301具有兩面，其中一面為局部或全部與接著部201相鄰接合；其特徵是該第一薄片部101、接著部201及一第二薄片部301組合成薄型化封裝接著結構，該薄型化封裝接著結構厚度小於等於200微米。其中，該第一薄片部101為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。該接著部201接合第一薄片部101及第二薄片部301之90度剝離強度≧4 N/cm。該接著部201接合第一薄片部101及第二薄片部301之180度剝離強度≧2 N/cm。其中，該第二薄片部301為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。至少一第一薄片部101和第二薄片部301內有一容置空間401。該容置空間401為填滿至少一凝膠、蠟、熱熔材料和導熱材料，該導熱材料為內含至少一氧化鋁、氮化鋁、氮化硼、碳化矽、碳黑粉、石墨粉、石墨烯粉、奈米碳管、奈米鑽石粉和陶瓷粉。該容置空間401提供電子晶片元件容置，提供該電子晶片件包覆。其中，該電子晶片元件與接著部201接合，且該接著部201至少一接合第一薄片部101與第二薄片部301。更進一步，該薄型化封裝接著結構之至少一第一薄片部101及第二薄片部301之外側面覆蓋有至少一第一功能層501，該第一功能層501之厚度小於200微米，並相鄰之其第一功能層501之下表面貼合於第一薄片部101之上表面，該第一功能層501，為陶瓷材料、石墨烯材料或接著劑，其接著劑為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑；及至少一第二功能層502，該第二功能層502之厚度小於200微米，並相鄰之其第二功能層502之下表面貼合於第一功能層501之上表面，該第二功能層502，為陶瓷材料、石墨烯材料、接著劑、聚醯亞胺、聚醯胺、聚酯、聚丙烯、聚氨脂、銅、鋁、膠合材料或金屬導電材料，其接著劑為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑。更進一步，該薄型化封裝接著結構之至少一第一薄片部101及第二薄片部301之外側面覆蓋有一散熱塗層601，該散熱塗層601為至少一石墨烯、石墨片和陶瓷。本發明薄型化封裝接著結構特徵，其薄型化封裝接著結構厚度小於等於200微米，其薄化結構有別於過去習知技藝具差異化，提供電子設備更微小的空間限制內之散熱解決方案，有別於過去習知技藝具差異化，其新穎、進步及實用效益無誤。故可有效改進習知缺失，使用上有相當大之實用性。
綜觀上述，本創作實施例所揭露之具體構造，確實能提供電子元件封裝、薄型化散熱片及散熱導電軟板之應用領域，以其整體結構而言，既未曾見諸於同類產品中，申請前亦未見公開，誠已符合專利法之法定要件，爰依法提出發明專利申請。
惟以上所述者，僅為本創作之一較佳實施例而已，當不能以此限定本創作實施之範圍，即大凡依本創作申請專利範圍及創作說明書內容所作之等效變化與修飾，皆應仍屬本創作專利涵蓋之範圍內。
101:第一薄片部
201:接著部
301:第二薄片部
401:容置空間
501:第一功能層
502:第二功能層
601:散熱塗層
第1圖係顯示本創作薄型化封裝接著結構剖面圖。
第2圖係顯示本創作薄型化封裝接著結構另一實施例剖面圖。
第3圖係顯示本創作薄型化封裝接著結構貼合第一功能層及第二功能層之剖面圖。
第4圖係顯示本創作薄型化封裝接著結構外層設置散熱塗層之剖面圖。
101:第一薄片部
201:接著部
301:第二薄片部
401:容置空間
Claims (10)
- 一種薄型化封裝接著結構，其包含： 一第一薄片部，該第一薄片部具有兩面，其中一面為局部或全部與接著部相鄰接合； 一接著部，該接著部位於第一薄片部與第二薄片部之間，其接著部為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑，且該接著部之厚度範圍為0.5~100微米；及 一第二薄片部，該第二薄片部具有兩面，其中一面為局部或全部與接著部相鄰接合； 其特徵是該第一薄片部、接著部及一第二薄片部組合成薄型化封裝接著結構，該薄型化封裝接著結構厚度小於等於200微米。
- 如請求項1所述之薄型化封裝接著結構，其中，該第一薄片部為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。
- 如請求項1所述之薄型化封裝接著結構，其中，該接著部為至少一矽、鈦、環氧樹脂及矽膠材料，該材料接合第一薄片部及第二薄片部之90度剝離強度≧4 N/cm。
- 如請求項1所述之薄型化封裝接著結構，其中，該接著部為至少一矽、鈦、環氧樹脂及矽膠材料，該材料接合第一薄片部及第二薄片部之180度剝離強度≧2 N/cm。
- 如請求項1所述之薄型化封裝接著結構，其中，其中，該第二薄片部為鋁、銅、鎳、金、銀、矽、陶瓷、環氧樹脂、聚醯亞胺或塑膠。
- 如請求項1所述之薄型化封裝接著結構，其中，至少一第一薄片部和第二薄片部內有一容置空間。
- 如請求項5所述之薄型化封裝接著結構，其中，該容置空間為填滿至少一凝膠、蠟、熱熔材料和導熱材料，該導熱材料為內含至少一氧化鋁、氮化鋁、氮化硼、碳化矽、碳黑粉、石墨粉、石墨烯粉、奈米碳管、奈米鑽石粉和陶瓷粉。
- 如請求項5所述之薄型化封裝接著結構，其中，該容置空間提供電子晶片元件容置，提供該電子晶片件包覆。
- 如請求項1所述之薄型化封裝接著結構，更進一步，該薄型化封裝接著結構之至少一第一薄片部及第二薄片部之外側面覆蓋有至少一第一功能層，該第一功能層之厚度小於200微米，並相鄰之其第一功能層之下表面貼合於第一薄片部之上表面，該第一功能層，為陶瓷材料、石墨烯材料或接著劑，其接著劑為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑；及至少一第二功能層，該第二功能層之厚度小於200微米，並相鄰之其第二功能層之下表面貼合於第一功能層之上表面，該第二功能層，為陶瓷材料、石墨烯材料、接著劑、聚醯亞胺、聚醯胺、聚酯、聚丙烯、聚氨脂、銅、鋁、膠合材料或金屬導電材料，其接著劑為至少一環氧樹脂、矽樹脂、聚酯、聚氨酯、奈米矽及奈米鈦之接著劑。
- 如請求項1所述之薄型化封裝接著結構，更進一步，該薄型化封裝接著結構至少一第一薄片部及第二薄片部之外側面覆蓋有一散熱塗層，該散熱塗層為至少一石墨烯、石墨片和陶瓷。
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| CN202110550641.4A CN115020356A (zh) | 2021-03-04 | 2021-05-17 | 薄型化封装接着结构 |
| JP2021090807A JP7223058B2 (ja) | 2021-03-04 | 2021-05-31 | 薄型化封止接着構造 |
| US17/353,085 US20220281203A1 (en) | 2021-03-04 | 2021-06-21 | Thin encapsulating attachment structure |
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Family Cites Families (25)
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| JP2007150013A (ja) * | 2005-11-29 | 2007-06-14 | Matsushita Electric Ind Co Ltd | シート状ヒートパイプおよび電子機器冷却構造体 |
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| US20100294461A1 (en) | 2009-05-22 | 2010-11-25 | General Electric Company | Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the same |
| JP2016012619A (ja) * | 2014-06-27 | 2016-01-21 | 大日本印刷株式会社 | 放熱構造体及び放熱構造体を備える太陽電池モジュール |
| TWI529364B (zh) * | 2014-07-22 | 2016-04-11 | Ultra - thin temperature plate and its manufacturing method | |
| JP5788069B1 (ja) * | 2014-08-29 | 2015-09-30 | 古河電気工業株式会社 | 平面型ヒートパイプ |
| CN107407531B (zh) * | 2015-03-26 | 2020-05-08 | 株式会社村田制作所 | 片型热管 |
| CN107849429B (zh) * | 2015-08-19 | 2021-06-25 | 东洋纺株式会社 | 低介电粘合剂组合物 |
| DE102015219791A1 (de) | 2015-10-13 | 2017-04-13 | Siemens Aktiengesellschaft | Halbleitermodul, Stromrichter und Fahrzeug |
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| DE112018003831T5 (de) | 2017-07-28 | 2020-04-09 | Dana Canada Corporation | Ultradünne wärmetauscher für das wärmemanagement |
| US10561041B2 (en) | 2017-10-18 | 2020-02-11 | Pimems, Inc. | Titanium thermal module |
| TWI632843B (zh) * | 2017-12-01 | 2018-08-11 | 微星科技股份有限公司 | 人臉及身分辨識機 |
| US20190249940A1 (en) * | 2018-02-10 | 2019-08-15 | Shan-Teng QUE | Heat dissipation plate and manufacturing method thereof |
| WO2019230911A1 (ja) * | 2018-05-30 | 2019-12-05 | 大日本印刷株式会社 | ベーパーチャンバー、及び電子機器 |
| KR102128771B1 (ko) * | 2018-10-30 | 2020-07-02 | 조인셋 주식회사 | 베이퍼 챔버 |
| JP6606267B1 (ja) | 2018-12-28 | 2019-11-13 | 古河電気工業株式会社 | ヒートシンク |
| JP6831416B2 (ja) * | 2019-03-28 | 2021-02-17 | Ｄｏｗａエレクトロニクス株式会社 | 接合材及び接合方法 |
| KR102077002B1 (ko) | 2019-04-08 | 2020-02-13 | 주식회사 폴라앤코 | 스마트폰 일체형 증기챔버 |
| KR102147124B1 (ko) | 2019-04-16 | 2020-08-31 | 주식회사 폴라앤코 | 주입관이 없는 휴대 전자기기용 박막 증기챔버 및 이의 제조방법 |
| US11732974B2 (en) * | 2021-01-06 | 2023-08-22 | Asia Vital Components Co., Ltd. | Thin-type two-phase fluid device |
| TWM615078U (zh) * | 2021-03-04 | 2021-08-01 | 宸寰科技有限公司 | 薄型化封裝接著結構 |
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| DE102021116559A1 (de) | 2022-09-08 |
| US20220281203A1 (en) | 2022-09-08 |
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