TW202233514A - 微機電系統裝置之製造 - Google Patents

微機電系統裝置之製造 Download PDF

Info

Publication number
TW202233514A
TW202233514A TW110146424A TW110146424A TW202233514A TW 202233514 A TW202233514 A TW 202233514A TW 110146424 A TW110146424 A TW 110146424A TW 110146424 A TW110146424 A TW 110146424A TW 202233514 A TW202233514 A TW 202233514A
Authority
TW
Taiwan
Prior art keywords
carrier
components
grooves
mems device
bonding
Prior art date
Application number
TW110146424A
Other languages
English (en)
Chinese (zh)
Inventor
太寧 章
西恩 安德魯斯
Original Assignee
美商歐柏西迪恩感應器公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商歐柏西迪恩感應器公司 filed Critical 美商歐柏西迪恩感應器公司
Publication of TW202233514A publication Critical patent/TW202233514A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0207—Bolometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
TW110146424A 2020-12-10 2021-12-10 微機電系統裝置之製造 TW202233514A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063123932P 2020-12-10 2020-12-10
US63/123,932 2020-12-10

Publications (1)

Publication Number Publication Date
TW202233514A true TW202233514A (zh) 2022-09-01

Family

ID=79259446

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110146424A TW202233514A (zh) 2020-12-10 2021-12-10 微機電系統裝置之製造

Country Status (7)

Country Link
US (2) US20240043264A1 (https=)
EP (1) EP4240691A1 (https=)
JP (1) JP2024501450A (https=)
KR (1) KR20230113392A (https=)
CN (1) CN116761772A (https=)
TW (1) TW202233514A (https=)
WO (1) WO2022125815A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024501450A (ja) * 2020-12-10 2024-01-12 オブシディアン センサーズ インコーポレイテッド Ｍｅｍｓデバイス製造
DE102023206603A1 (de) * 2023-07-12 2025-01-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Verarbeiten eines Halbleiter-Wafers und Montageschablone

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
US6912078B2 (en) * 2001-03-16 2005-06-28 Corning Incorporated Electrostatically actuated micro-electro-mechanical devices and method of manufacture
JP2008218811A (ja) * 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
JP2010165731A (ja) * 2009-01-13 2010-07-29 Torex Semiconductor Ltd 機能素子パッケージ
JP2011228352A (ja) * 2010-04-15 2011-11-10 Daishinku Corp リッドおよびベースおよび電子部品用パッケージ
JP5768975B2 (ja) * 2011-12-15 2015-08-26 オムロン株式会社 接合部の構造及びその接合方法並びに電子部品
DE112015000731T5 (de) * 2014-04-22 2017-02-02 Robert Bosch Gmbh Mems-Mikrofonbaugruppe
US9771258B2 (en) * 2015-06-24 2017-09-26 Raytheon Company Wafer level MEMS package including dual seal ring
JP2024501450A (ja) * 2020-12-10 2024-01-12 オブシディアン センサーズ インコーポレイテッド Ｍｅｍｓデバイス製造

Also Published As

Publication number Publication date
EP4240691A1 (en) 2023-09-13
JP2024501450A (ja) 2024-01-12
KR20230113392A (ko) 2023-07-28
US20260008669A1 (en) 2026-01-08
WO2022125815A1 (en) 2022-06-16
US20240043264A1 (en) 2024-02-08
CN116761772A (zh) 2023-09-15

Similar Documents

Publication Publication Date Title
US6448109B1 (en) Wafer level method of capping multiple MEMS elements
US20260008669A1 (en) Mems device manufacturing
JP5419923B2 (ja) センサー素子
CN100359653C (zh) 用于连结基片的处理和复合元件
CN101675498B (zh) 用于微镜器件的倒装芯片封装的方法和系统
US6573156B1 (en) Low defect method for die singulation and for structural support for handling thin film devices
US7422962B2 (en) Method of singulating electronic devices
US7485956B2 (en) Microelectronic package optionally having differing cover and device thermal expansivities
TW201630171A (zh) 晶圓級封裝式半導體裝置及其製造方法
CN110745773A (zh) 用于气密密封的薄膜结构
JP4620939B2 (ja) 複合素子の製造方法
WO2019195334A1 (en) Hermetically sealed optically transparent wafer-level packages and methods for making the same
WO2018004690A1 (en) Piezoelectric package-integrated pressure sensing devices
JP2011018907A (ja) 視認用窓を有するハンドリングウェハー
WO2009038686A2 (en) Hermetic wafer level cavity package
JP2018041084A (ja) 傾斜した光学窓を有するマイクロメカニカルデバイスの製造方法、及び、対応するマイクロメカニカルデバイス
US7510947B2 (en) Method for wafer level packaging and fabricating cap structures
US7598125B2 (en) Method for wafer level packaging and fabricating cap structures
TW201436140A (zh) 晶片封裝體及其形成方法
TW201503279A (zh) 用於處理基材之方法與托架
CN109824011A (zh) 一种共晶键合的结构和方法
US7361284B2 (en) Method for wafer-level package
CN101807528A (zh) 图像传感器封装中的玻璃安装技术
Farrens et al. Wafer level packaging: Balancing device requirements and materials properties
US11815699B2 (en) Method for producing lens elements and packaged radiation-sensitive devices on wafer level