JP2024501450A - Ｍｅｍｓデバイス製造 - Google Patents

Ｍｅｍｓデバイス製造 Download PDF

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Publication number
JP2024501450A
JP2024501450A JP2023535303A JP2023535303A JP2024501450A JP 2024501450 A JP2024501450 A JP 2024501450A JP 2023535303 A JP2023535303 A JP 2023535303A JP 2023535303 A JP2023535303 A JP 2023535303A JP 2024501450 A JP2024501450 A JP 2024501450A
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JP
Japan
Prior art keywords
groove
mems device
component
cavity
carrier
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Pending
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JP2023535303A
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English (en)
Japanese (ja)
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JP2024501450A5 (https=
Inventor
タリス チャン
ショーン アンドリュース
Original Assignee
オブシディアン センサーズ インコーポレイテッド
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Application filed by オブシディアン センサーズ インコーポレイテッド filed Critical オブシディアン センサーズ インコーポレイテッド
Publication of JP2024501450A publication Critical patent/JP2024501450A/ja
Publication of JP2024501450A5 publication Critical patent/JP2024501450A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0207—Bolometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
JP2023535303A 2020-12-10 2021-12-09 Ｍｅｍｓデバイス製造 Pending JP2024501450A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063123932P 2020-12-10 2020-12-10
US63/123,932 2020-12-10
PCT/US2021/062674 WO2022125815A1 (en) 2020-12-10 2021-12-09 Mems device manufacturing

Publications (2)

Publication Number Publication Date
JP2024501450A true JP2024501450A (ja) 2024-01-12
JP2024501450A5 JP2024501450A5 (https=) 2026-03-03

Family

ID=79259446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023535303A Pending JP2024501450A (ja) 2020-12-10 2021-12-09 Ｍｅｍｓデバイス製造

Country Status (7)

Country Link
US (2) US20240043264A1 (https=)
EP (1) EP4240691A1 (https=)
JP (1) JP2024501450A (https=)
KR (1) KR20230113392A (https=)
CN (1) CN116761772A (https=)
TW (1) TW202233514A (https=)
WO (1) WO2022125815A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024501450A (ja) * 2020-12-10 2024-01-12 オブシディアン センサーズ インコーポレイテッド Ｍｅｍｓデバイス製造
DE102023206603A1 (de) * 2023-07-12 2025-01-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Verarbeiten eines Halbleiter-Wafers und Montageschablone

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
JP2008218811A (ja) * 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
JP2010165731A (ja) * 2009-01-13 2010-07-29 Torex Semiconductor Ltd 機能素子パッケージ
JP2011228352A (ja) * 2010-04-15 2011-11-10 Daishinku Corp リッドおよびベースおよび電子部品用パッケージ
JP2013125912A (ja) * 2011-12-15 2013-06-24 Omron Corp 接合部の構造及びその接合方法並びに電子部品
JP2020059119A (ja) * 2015-06-24 2020-04-16 レイセオン カンパニー 二重のシールリングを含むウエハレベルｍｅｍｓパッケージ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6912078B2 (en) * 2001-03-16 2005-06-28 Corning Incorporated Electrostatically actuated micro-electro-mechanical devices and method of manufacture
DE112015000731T5 (de) * 2014-04-22 2017-02-02 Robert Bosch Gmbh Mems-Mikrofonbaugruppe
JP2024501450A (ja) * 2020-12-10 2024-01-12 オブシディアン センサーズ インコーポレイテッド Ｍｅｍｓデバイス製造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
JP2008218811A (ja) * 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
JP2010165731A (ja) * 2009-01-13 2010-07-29 Torex Semiconductor Ltd 機能素子パッケージ
JP2011228352A (ja) * 2010-04-15 2011-11-10 Daishinku Corp リッドおよびベースおよび電子部品用パッケージ
JP2013125912A (ja) * 2011-12-15 2013-06-24 Omron Corp 接合部の構造及びその接合方法並びに電子部品
JP2020059119A (ja) * 2015-06-24 2020-04-16 レイセオン カンパニー 二重のシールリングを含むウエハレベルｍｅｍｓパッケージ

Also Published As

Publication number Publication date
EP4240691A1 (en) 2023-09-13
KR20230113392A (ko) 2023-07-28
US20260008669A1 (en) 2026-01-08
WO2022125815A1 (en) 2022-06-16
US20240043264A1 (en) 2024-02-08
CN116761772A (zh) 2023-09-15
TW202233514A (zh) 2022-09-01

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