KR20230113392A - 멤스 디바이스 제조 - Google Patents

멤스 디바이스 제조 Download PDF

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Publication number
KR20230113392A
KR20230113392A KR1020237022842A KR20237022842A KR20230113392A KR 20230113392 A KR20230113392 A KR 20230113392A KR 1020237022842 A KR1020237022842 A KR 1020237022842A KR 20237022842 A KR20237022842 A KR 20237022842A KR 20230113392 A KR20230113392 A KR 20230113392A
Authority
KR
South Korea
Prior art keywords
groove
grooves
implementations
cavity
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237022842A
Other languages
English (en)
Korean (ko)
Inventor
탈리스 창
션 앤드류스
Original Assignee
옵시디안 센서스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 옵시디안 센서스 인코포레이티드 filed Critical 옵시디안 센서스 인코포레이티드
Publication of KR20230113392A publication Critical patent/KR20230113392A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0207—Bolometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
KR1020237022842A 2020-12-10 2021-12-09 멤스 디바이스 제조 Pending KR20230113392A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063123932P 2020-12-10 2020-12-10
US63/123,932 2020-12-10
PCT/US2021/062674 WO2022125815A1 (en) 2020-12-10 2021-12-09 Mems device manufacturing

Publications (1)

Publication Number Publication Date
KR20230113392A true KR20230113392A (ko) 2023-07-28

Family

ID=79259446

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237022842A Pending KR20230113392A (ko) 2020-12-10 2021-12-09 멤스 디바이스 제조

Country Status (7)

Country Link
US (2) US20240043264A1 (https=)
EP (1) EP4240691A1 (https=)
JP (1) JP2024501450A (https=)
KR (1) KR20230113392A (https=)
CN (1) CN116761772A (https=)
TW (1) TW202233514A (https=)
WO (1) WO2022125815A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024501450A (ja) * 2020-12-10 2024-01-12 オブシディアン センサーズ インコーポレイテッド Ｍｅｍｓデバイス製造
DE102023206603A1 (de) * 2023-07-12 2025-01-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Verarbeiten eines Halbleiter-Wafers und Montageschablone

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
US6912078B2 (en) * 2001-03-16 2005-06-28 Corning Incorporated Electrostatically actuated micro-electro-mechanical devices and method of manufacture
JP2008218811A (ja) * 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
JP2010165731A (ja) * 2009-01-13 2010-07-29 Torex Semiconductor Ltd 機能素子パッケージ
JP2011228352A (ja) * 2010-04-15 2011-11-10 Daishinku Corp リッドおよびベースおよび電子部品用パッケージ
JP5768975B2 (ja) * 2011-12-15 2015-08-26 オムロン株式会社 接合部の構造及びその接合方法並びに電子部品
DE112015000731T5 (de) * 2014-04-22 2017-02-02 Robert Bosch Gmbh Mems-Mikrofonbaugruppe
US9771258B2 (en) * 2015-06-24 2017-09-26 Raytheon Company Wafer level MEMS package including dual seal ring
JP2024501450A (ja) * 2020-12-10 2024-01-12 オブシディアン センサーズ インコーポレイテッド Ｍｅｍｓデバイス製造

Also Published As

Publication number Publication date
EP4240691A1 (en) 2023-09-13
JP2024501450A (ja) 2024-01-12
US20260008669A1 (en) 2026-01-08
WO2022125815A1 (en) 2022-06-16
US20240043264A1 (en) 2024-02-08
CN116761772A (zh) 2023-09-15
TW202233514A (zh) 2022-09-01

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20230705

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20241112

Comment text: Request for Examination of Application