CN116761772A - Mems器件制造 - Google Patents

Mems器件制造 Download PDF

Info

Publication number
CN116761772A
CN116761772A CN202180083684.4A CN202180083684A CN116761772A CN 116761772 A CN116761772 A CN 116761772A CN 202180083684 A CN202180083684 A CN 202180083684A CN 116761772 A CN116761772 A CN 116761772A
Authority
CN
China
Prior art keywords
mems device
grooves
carrier
cavity
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180083684.4A
Other languages
English (en)
Chinese (zh)
Inventor
T·常
S·安德鲁斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaojing Technology Co ltd
Original Assignee
Yaojing Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaojing Technology Co ltd filed Critical Yaojing Technology Co ltd
Publication of CN116761772A publication Critical patent/CN116761772A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0207—Bolometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
CN202180083684.4A 2020-12-10 2021-12-09 Mems器件制造 Pending CN116761772A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063123932P 2020-12-10 2020-12-10
US63/123,932 2020-12-10
PCT/US2021/062674 WO2022125815A1 (en) 2020-12-10 2021-12-09 Mems device manufacturing

Publications (1)

Publication Number Publication Date
CN116761772A true CN116761772A (zh) 2023-09-15

Family

ID=79259446

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180083684.4A Pending CN116761772A (zh) 2020-12-10 2021-12-09 Mems器件制造

Country Status (7)

Country Link
US (2) US20240043264A1 (https=)
EP (1) EP4240691A1 (https=)
JP (1) JP2024501450A (https=)
KR (1) KR20230113392A (https=)
CN (1) CN116761772A (https=)
TW (1) TW202233514A (https=)
WO (1) WO2022125815A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024501450A (ja) * 2020-12-10 2024-01-12 オブシディアン センサーズ インコーポレイテッド Ｍｅｍｓデバイス製造
DE102023206603A1 (de) * 2023-07-12 2025-01-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Verarbeiten eines Halbleiter-Wafers und Montageschablone

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
US6912078B2 (en) * 2001-03-16 2005-06-28 Corning Incorporated Electrostatically actuated micro-electro-mechanical devices and method of manufacture
JP2008218811A (ja) * 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
JP2010165731A (ja) * 2009-01-13 2010-07-29 Torex Semiconductor Ltd 機能素子パッケージ
JP2011228352A (ja) * 2010-04-15 2011-11-10 Daishinku Corp リッドおよびベースおよび電子部品用パッケージ
JP5768975B2 (ja) * 2011-12-15 2015-08-26 オムロン株式会社 接合部の構造及びその接合方法並びに電子部品
DE112015000731T5 (de) * 2014-04-22 2017-02-02 Robert Bosch Gmbh Mems-Mikrofonbaugruppe
US9771258B2 (en) * 2015-06-24 2017-09-26 Raytheon Company Wafer level MEMS package including dual seal ring
JP2024501450A (ja) * 2020-12-10 2024-01-12 オブシディアン センサーズ インコーポレイテッド Ｍｅｍｓデバイス製造

Also Published As

Publication number Publication date
EP4240691A1 (en) 2023-09-13
JP2024501450A (ja) 2024-01-12
KR20230113392A (ko) 2023-07-28
US20260008669A1 (en) 2026-01-08
WO2022125815A1 (en) 2022-06-16
US20240043264A1 (en) 2024-02-08
TW202233514A (zh) 2022-09-01

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