TW202225229A - 樹脂組成物、硬化物、半導體密封材料、及半導體裝置 - Google Patents
樹脂組成物、硬化物、半導體密封材料、及半導體裝置 Download PDFInfo
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- TW202225229A TW202225229A TW110141096A TW110141096A TW202225229A TW 202225229 A TW202225229 A TW 202225229A TW 110141096 A TW110141096 A TW 110141096A TW 110141096 A TW110141096 A TW 110141096A TW 202225229 A TW202225229 A TW 202225229A
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- Prior art keywords
- resin
- resin composition
- phenol
- aforementioned
- preferable
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 title abstract description 13
- 238000005538 encapsulation Methods 0.000 title abstract 4
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- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 29
- 239000005011 phenolic resin Substances 0.000 claims abstract description 29
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 229960005323 phenoxyethanol Drugs 0.000 description 1
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- 150000003512 tertiary amines Chemical class 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical class CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
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- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 1
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- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
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- 239000013585 weight reducing agent Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020190382 | 2020-11-16 | ||
| JP2020-190382 | 2020-11-16 |
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| TW202225229A true TW202225229A (zh) | 2022-07-01 |
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| TW110141096A TW202225229A (zh) | 2020-11-16 | 2021-11-04 | 樹脂組成物、硬化物、半導體密封材料、及半導體裝置 |
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| JP (1) | JP7205673B2 (enrdf_load_stackoverflow) |
| TW (1) | TW202225229A (enrdf_load_stackoverflow) |
| WO (1) | WO2022102489A1 (enrdf_load_stackoverflow) |
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| JPH07196767A (ja) * | 1993-12-28 | 1995-08-01 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物およびその硬化物 |
| JP3962935B2 (ja) * | 1998-01-19 | 2007-08-22 | 大日本インキ化学工業株式会社 | エポキシ樹脂組成物 |
| US7569260B2 (en) * | 2003-08-21 | 2009-08-04 | Asahi Kasei Chemicals Corporation | Photosensitive composition and cured products thereof |
| JP2010222390A (ja) * | 2009-03-19 | 2010-10-07 | Lintec Corp | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
| US20140228483A1 (en) * | 2013-02-13 | 2014-08-14 | Momentive Specialty Chemicals Inc. | Compositions useful for preparing composites and composites produced therewith |
| WO2015152037A1 (ja) * | 2014-03-31 | 2015-10-08 | 明和化成株式会社 | フェノール樹脂、該フェノール樹脂を含むエポキシ樹脂組成物、該エポキシ樹脂組成物の硬化物、及び該硬化物を有する半導体装置 |
| TWI731986B (zh) * | 2016-06-29 | 2021-07-01 | 日商迪愛生股份有限公司 | 苯酚酚醛清漆樹脂、硬化性樹脂組成物及其硬化物 |
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- 2021-11-04 WO PCT/JP2021/040509 patent/WO2022102489A1/ja active Application Filing
- 2021-11-04 TW TW110141096A patent/TW202225229A/zh unknown
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| JP7205673B2 (ja) | 2023-01-17 |
| WO2022102489A1 (ja) | 2022-05-19 |
| JPWO2022102489A1 (enrdf_load_stackoverflow) | 2022-05-19 |
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