TW202222932A - 無色多層聚醯亞胺薄膜、積層體、可撓性電子裝置之製造方法 - Google Patents
無色多層聚醯亞胺薄膜、積層體、可撓性電子裝置之製造方法 Download PDFInfo
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- TW202222932A TW202222932A TW110140900A TW110140900A TW202222932A TW 202222932 A TW202222932 A TW 202222932A TW 110140900 A TW110140900 A TW 110140900A TW 110140900 A TW110140900 A TW 110140900A TW 202222932 A TW202222932 A TW 202222932A
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Classifications
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- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J7/04—Coating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
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- Ceramic Engineering (AREA)
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- Application Of Or Painting With Fluid Materials (AREA)
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| TWI896923B (zh) * | 2023-01-04 | 2025-09-11 | 亞洲電材股份有限公司 | 複合膜及其製造方法 |
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| CN120380054A (zh) * | 2022-12-23 | 2025-07-25 | 东洋纺株式会社 | 聚酰亚胺膜、层叠体、柔性电子器件及柔性电子器件的制造方法 |
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| JPH0655491B2 (ja) * | 1987-05-29 | 1994-07-27 | 宇部興産株式会社 | 芳香族ポリイミドフィルムの製造方法 |
| JP3011293B2 (ja) * | 1991-07-23 | 2000-02-21 | 宇部興産株式会社 | 記録媒体用ベースフィルム及びその製法 |
| JPH08230124A (ja) * | 1995-02-23 | 1996-09-10 | Toray Ind Inc | 積層フィルムロール |
| EP0902048B1 (en) * | 1997-09-11 | 2005-11-23 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible polyimide film and process of preparation |
| JP2008044230A (ja) * | 2006-08-16 | 2008-02-28 | Toyobo Co Ltd | 多層ポリイミドフィルム及びその製造方法 |
| JPWO2009019968A1 (ja) * | 2007-08-03 | 2010-10-28 | 株式会社カネカ | 多層ポリイミドフィルム、積層板および金属張積層板 |
| TWI385198B (zh) * | 2008-08-11 | 2013-02-11 | Ind Tech Res Inst | 雙面金屬箔層積層板及其製法 |
| JP2010076438A (ja) * | 2008-08-27 | 2010-04-08 | Toyobo Co Ltd | 易滑性多層ポリイミドフィルム |
| JP5402254B2 (ja) * | 2009-02-13 | 2014-01-29 | 東洋紡株式会社 | 多層ポリイミドフィルム |
| JP6274109B2 (ja) * | 2012-09-27 | 2018-02-07 | 三菱瓦斯化学株式会社 | ポリイミド樹脂組成物 |
| TWI503228B (zh) * | 2013-12-05 | 2015-10-11 | Taimide Technology Inc | 低介電常數之多層聚醯亞胺膜、其疊合體及其製備方法 |
| JP6450009B2 (ja) * | 2014-12-10 | 2019-01-09 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | 多層フィルム |
| JP6780272B2 (ja) * | 2016-03-23 | 2020-11-04 | 東洋紡株式会社 | 高分子複合フィルム |
| KR20180089860A (ko) * | 2017-02-01 | 2018-08-09 | 스미또모 가가꾸 가부시키가이샤 | 폴리이미드 필름 |
| JP6973476B2 (ja) * | 2017-04-06 | 2021-12-01 | 大日本印刷株式会社 | ポリイミドフィルム、積層体、及びディスプレイ用表面材 |
-
2021
- 2021-11-01 JP JP2022524706A patent/JPWO2022102450A1/ja not_active Withdrawn
- 2021-11-01 WO PCT/JP2021/040229 patent/WO2022102450A1/ja not_active Ceased
- 2021-11-03 TW TW110140900A patent/TW202222932A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI896923B (zh) * | 2023-01-04 | 2025-09-11 | 亞洲電材股份有限公司 | 複合膜及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022102450A1 (ja) | 2022-05-19 |
| JPWO2022102450A1 (https=) | 2022-05-19 |
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