TW202124148A - Laminating device and method for manufacturing laminated body capable of laminating sheet materials after warpages or deflections of the sheet materials are eliminated - Google Patents
Laminating device and method for manufacturing laminated body capable of laminating sheet materials after warpages or deflections of the sheet materials are eliminated Download PDFInfo
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- TW202124148A TW202124148A TW109130439A TW109130439A TW202124148A TW 202124148 A TW202124148 A TW 202124148A TW 109130439 A TW109130439 A TW 109130439A TW 109130439 A TW109130439 A TW 109130439A TW 202124148 A TW202124148 A TW 202124148A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Abstract
Description
本發明係關於一種積層裝置及積層體之製造方法。The present invention relates to a laminated device and a method of manufacturing a laminated body.
作為安裝於通訊機器等之電路基板,例如專利文獻1、2所揭示,使用將絕緣性膜上形成有金屬層之片材積層而成之積層體。As a circuit board mounted on a communication device etc., as disclosed in
積層體之製造製程中,片材一層一層地藉由保持器搬送至積層平台。例如於搬送至保持器之前進行片材之位置對準,將位置對準後之片材於積層平台上積層。藉由進行位置對準,可抑制層間之位置偏移。進而,對積層體加熱並且進行使其自上下端壓縮之壓接,藉此將各層固定。 [先前技術文獻] [專利文獻]In the manufacturing process of the laminate, the sheets are transported layer by layer by the holder to the laminate platform. For example, the position of the sheet is aligned before being transported to the holder, and the aligned sheet is stacked on the stacking platform. By performing position alignment, the position shift between layers can be suppressed. Furthermore, the layered body is heated and pressure-bonded by compressing it from the upper and lower ends to fix each layer. [Prior Technical Literature] [Patent Literature]
[專利文獻1]國際公開第2017/150678號 [專利文獻2]日本專利特開2018-170521號公報[Patent Document 1] International Publication No. 2017/150678 [Patent Document 2] Japanese Patent Laid-Open No. 2018-170521
[發明所欲解決之課題][The problem to be solved by the invention]
然而,有如下情形,即,基於絕緣片材與金屬層之隨溫度變化之膨脹率及收縮率之差,於片材上產生翹曲或撓曲。若將具有產生翹曲或撓曲之片材之積層體壓接,則於壓接過程中片材之翹曲及撓曲得以消除,但於翹曲及撓曲之消除過程中,有片材之位置偏移之虞。However, there are cases in which warpage or deflection occurs on the sheet based on the difference between the temperature-dependent expansion rate and the shrinkage rate of the insulating sheet and the metal layer. If a laminate with a sheet that produces warpage or deflection is crimped, the warpage and deflection of the sheet can be eliminated during the crimping process, but in the process of eliminating the warpage and deflection, there is a sheet The risk of position shift.
因此,本發明之目的在於提供一種能夠於消除片材之翹曲或撓曲之後進行該片材之積層之積層裝置及積層體之製造方法。 [解決課題之技術手段]Therefore, the object of the present invention is to provide a layering device and a method of manufacturing a layered body capable of laminating the sheet after eliminating the warpage or deflection of the sheet. [Technical means to solve the problem]
本發明係關於一種積層裝置,其使於絕緣膜上積層有金屬層之片材積層複數層。該積層裝置具備積層平台、搬送保持器、及保持器用帶電器。於積層平台上積層片材。搬送保持器藉由真空吸附而保持片材且將其搬送至積層平台。保持器用帶電器朝保持於搬送保持器之片材照射荷電粒子。保持器用帶電器照射搬送中之片材之絕緣膜越薄則電壓越高之荷電粒子。The present invention relates to a laminate device in which a plurality of layers of a sheet material having a metal layer laminated on an insulating film are laminated. The stacking device includes a stacking platform, a transport holder, and a charger for the holder. Laminate sheets on a laminating platform. The transport holder holds the sheet by vacuum suction and transports it to the stacking platform. The charger for the holder irradiates charged particles to the sheet held by the transport holder. The holder charging device irradiates the charged particles whose voltage is higher as the insulating film of the sheet being conveyed is thinner.
根據上述構成,藉由對搬送中之片材照射荷電粒子而將該片材靜電吸附於搬送保持器,於該過程中翹曲及撓曲得以消除。此處,片材之絕緣膜越薄則該膜之面彈性模數越降低,由與金屬層之膨脹率差及收縮率差所導致之翹曲量及撓曲量越增加。因此,本發明中,照射搬送中之片材之絕緣膜越薄則電壓越高之荷電粒子。如此,藉由根據絕緣膜之厚度調節荷電粒子之電壓,能以較高之準確度消除片材之翹曲及撓曲。According to the above-mentioned structure, by irradiating the sheet material being conveyed with charged particles, the sheet material is electrostatically attracted to the conveying holder, and the warpage and deflection are eliminated in the process. Here, the thinner the insulating film of the sheet, the lower the surface elastic modulus of the film, and the greater the amount of warpage and deflection caused by the difference in expansion rate and shrinkage rate with the metal layer. Therefore, in the present invention, the thinner the insulating film of the sheet being conveyed, the higher the voltage of the charged particles. In this way, by adjusting the voltage of the charged particles according to the thickness of the insulating film, the warpage and deflection of the sheet can be eliminated with higher accuracy.
又,上述構成中,亦可設置平台用帶電器,該平台用帶電器朝積層於積層平台上之複數層片材中最上層之片材之露出面照射荷電粒子。該情形時,保持器用帶電器及平台用帶電器照射彼此等電壓之荷電粒子。In addition, in the above-mentioned configuration, a charger for a platform may be provided that irradiates charged particles on the exposed surface of the uppermost sheet among the plurality of sheets stacked on the stacking platform. In this case, the charger for the holder and the charger for the platform irradiate charged particles of equal voltage to each other.
根據上述構成,對真空吸附於搬送保持器之片材照射荷電粒子,並且對積層於積層平台上之複數層片材中最上層之片材之露出面亦照射荷電粒子。藉由使兩者之荷電粒子之電壓相等,而使片材吸附於搬送保持器之靜電吸附力、與使被搬送之片材吸附於積層平台上之最上層之片材之靜電吸附力一致。藉此,例如能夠於不會因靜電吸附而阻礙由吹送正壓空氣使片材自搬送保持器脫離之範圍內之最大電壓下,消除片材之翹曲及撓曲。According to the above configuration, the sheet material vacuum-adsorbed on the transport holder is irradiated with charged particles, and the exposed surface of the uppermost sheet of the plurality of layers of sheets laminated on the stacking platform is also irradiated with the charged particles. By making the voltages of the charged particles of the two equal, the electrostatic adsorption force of the sheet to be adsorbed to the transport holder is consistent with the electrostatic adsorption force of the sheet to be transported to the uppermost sheet on the stacking platform. Thereby, for example, it is possible to eliminate the warpage and deflection of the sheet under the maximum voltage within the range that does not hinder the separation of the sheet from the conveying holder by blowing the positive pressure air due to electrostatic adsorption.
又,本發明係關於一種積層裝置,其使於絕緣膜上積層有金屬層之片材積層複數層。該積層裝置具備積層平台、搬送保持器、保持器用帶電器、及攝像器。於積層平台上積層片材。搬送保持器藉由真空吸附而保持片材且將其搬送至積層平台。保持器用帶電器朝保持於搬送保持器之片材照射荷電粒子。攝像器拍攝保持於搬送保持器之片材之表面形狀。保持器用帶電器對基於由攝像器拍攝之片材之表面形狀而特定出的與搬送保持器之保持面分離之片材之隆起部分,照射電壓相較密接於保持面之片材之密接部分高的荷電粒子。In addition, the present invention relates to a layering device in which a plurality of layers of sheets in which metal layers are layered on an insulating film are layered. This layering device includes a layering platform, a transport holder, a charger for the holder, and a camera. Laminate sheets on a laminating platform. The transport holder holds the sheet by vacuum suction and transports it to the stacking platform. The charger for the holder irradiates charged particles to the sheet held by the transport holder. The camera photographs the surface shape of the sheet held by the transport holder. The charger for the holder irradiates the raised portion of the sheet separated from the holding surface of the conveying holder, which is specified based on the surface shape of the sheet captured by the camera, with a higher voltage than the close contact portion of the sheet closely attached to the holding surface Of charged particles.
根據上述構成,對片材之隆起部分照射相對高電壓之荷電粒子,對其周圍之密接部分相對地抑制靜電吸附力。藉此,一方面避免片材上產生過度之靜電吸附力,一方面能夠消除翹曲及撓曲。According to the above-mentioned configuration, relatively high-voltage charged particles are irradiated to the raised portion of the sheet, and the electrostatic attraction force is relatively suppressed in the close contact portion around it. In this way, on the one hand, excessive electrostatic adsorption force on the sheet is avoided, and on the other hand, warpage and deflection can be eliminated.
又,上述構成中,對片材之隆起部分照射之荷電粒子設定為,該片材之絕緣膜越薄則電壓越高。Furthermore, in the above configuration, the charged particles irradiated to the raised portion of the sheet material are set such that the thinner the insulating film of the sheet material, the higher the voltage.
如上所述,絕緣膜越薄,則片材之翹曲量及撓曲量越增加。藉由設定為絕緣膜越薄則荷電粒子之電壓越高,而能夠以較高之準確度消除翹曲及撓曲。As described above, the thinner the insulating film, the greater the amount of warpage and deflection of the sheet. By setting that the thinner the insulating film, the higher the voltage of the charged particles, which can eliminate warpage and deflection with higher accuracy.
又,上述構成中,保持器用帶電器於相較保持於搬送保持器之片材之露出面小之區域,規定該露出面上之荷電粒子之照射點。該情形時,保持器用帶電器僅限於照射點之至少一部分與保持於搬送保持器之片材之隆起部分重疊時照射荷電粒子。Furthermore, in the above-mentioned configuration, the charger for the holder defines the irradiation point of the charged particles on the exposed surface in an area smaller than the exposed surface of the sheet held by the transport holder. In this case, the charger for the holder is limited to irradiating charged particles when at least a part of the irradiation point overlaps with the raised portion of the sheet held by the transport holder.
根據上述構成,僅限於照射點之至少一部分與隆起部分重疊時照射荷電粒子,於除此以外之片材區域未照射荷電粒子。因此,避免片材上產生過度之靜電吸附力,且於積層平台上,能夠容易地使片材自保持器脫離。According to the above configuration, the charged particles are irradiated only when at least a part of the irradiation spot overlaps the ridge portion, and the charged particles are not irradiated on the other sheet regions. Therefore, excessive electrostatic adsorption force on the sheet is avoided, and the sheet can be easily detached from the holder on the stacking platform.
又,上述構成中,可設置對準平台,該對準平台供保持於搬送保持器之前之片材載置,並且將所載置之片材對位。又,可設置加壓構件,該加壓構件進而載置於對準平台上所載置之片材上,對該片材之整面進行加壓。該情形時,對準平台之片材載置區域之至少一部分由透光性構件構成。又,可設置對準相機,該對準相機通過透光性構件而拍攝載置於對準平台之片材。對準相機拍攝藉由加壓構件而壓抵於對準平台之片材。Furthermore, in the above configuration, an alignment platform may be provided for placing the sheet held in front of the transport holder and aligning the placed sheet. In addition, a pressing member may be provided, and the pressing member is further placed on the sheet placed on the alignment platform to press the entire surface of the sheet. In this case, at least a part of the sheet placement area of the alignment platform is composed of a light-transmitting member. In addition, an alignment camera may be provided, and the alignment camera uses a light-transmitting member to photograph the sheet placed on the alignment platform. Aim the camera to shoot the sheet pressed against the alignment platform by the pressing member.
根據上述構成,即便為具有翹曲或撓曲之片材,亦可藉由利用加壓構件將該片材壓抵於對準平台而消除該翹曲或撓曲。藉由拍攝此時之片材能夠進行精度較高之對準。According to the above-mentioned structure, even if it is a sheet material which has a warpage or a flexure, the warpage or flexure can be eliminated by pressing the sheet material against the alignment platform by a pressing member. High-precision alignment can be performed by shooting the sheet at this time.
又,本發明係關於一種積層體之製造方法,其製造包含複數層於絕緣膜上積層有金屬層之片材而構成之積層體。該製造方法具備積層步驟及壓接步驟。於積層步驟中,藉由真空吸附將片材保持於搬送保持器且搬送至積層平台,於該積層平台將片材依序積層。於壓接步驟中,對在積層平台積層之片材之積層體進行壓接而將各層固定。於積層步驟中,對保持於搬送保持器之搬送中之片材照射該片材之絕緣膜越薄則電壓越高之荷電粒子。In addition, the present invention relates to a method for manufacturing a laminated body, which manufactures a laminated body composed of a sheet including a plurality of layers and a metal layer laminated on an insulating film. This manufacturing method includes a stacking step and a crimping step. In the layering step, the sheets are held in the transport holder by vacuum suction and transported to the layering platform, and the sheets are sequentially layered on the layering platform. In the crimping step, the laminated body of the sheets laminated on the lamination platform is crimped to fix each layer. In the layering step, the sheet material held in the conveying holder is irradiated with charged particles whose voltage is higher as the insulating film of the sheet material is thinner.
又,於上述構成中,亦可於積層步驟中,朝保持於搬送保持器之搬送中之片材、及於積層平台上積層之複數層片材中最上層之片材之露出面,照射彼此相等電壓之荷電粒子。In addition, in the above-mentioned structure, in the lamination step, the exposed surface of the uppermost sheet of the sheets held in the conveying holder and the plurality of sheets laminated on the lamination platform may be irradiated to each other during the lamination step. Charged particles of equal voltage.
又,本發明係關於一種積層體之製造方法,其製造包含複數層於絕緣膜上積層有金屬層之片材而構成之積層體。該製造方法具備積層步驟及壓接步驟。於積層步驟中,藉由真空吸附將片材保持於搬送保持器且搬送至積層平台,於該積層平台將片材依序積層。於壓接步驟中,對在積層平台積層之片材之積層體進行壓接而將各層固定。於積層步驟中,對基於保持於搬送保持器之片材之表面形狀而特定出的與搬送保持器之保持面分離之片材之隆起部分,照射電壓相較密接於保持面之片材之密接部分高的荷電粒子。In addition, the present invention relates to a method for manufacturing a laminated body, which manufactures a laminated body composed of a sheet including a plurality of layers and a metal layer laminated on an insulating film. This manufacturing method includes a stacking step and a crimping step. In the layering step, the sheets are held in the transport holder by vacuum suction and transported to the layering platform, and the sheets are sequentially layered on the layering platform. In the crimping step, the laminated body of the sheets laminated on the lamination platform is crimped to fix each layer. In the layering step, the swelling part of the sheet separated from the holding surface of the transport holder, which is specified based on the surface shape of the sheet held on the transport holder, is applied to the close contact of the sheet that is closer to the holding surface than the holding surface. Part of the highly charged particles.
又,上述構成中,片材之絕緣膜越薄,對該片材之隆起部分照射之荷電粒子之電壓越高。 [發明之效果]Furthermore, in the above configuration, the thinner the insulating film of the sheet, the higher the voltage of the charged particles irradiated to the raised portion of the sheet. [Effects of Invention]
根據本發明,能夠於消除片材之翹曲或撓曲之後進行該片材之積層。According to the present invention, the lamination of the sheet can be performed after the warpage or deflection of the sheet is eliminated.
<積層體>
圖1中例示有由本實施形態之積層裝置製作之積層體100B。積層體100B係自最下層之片材L5積層至最上層之片材L1而成之最終積層體,與下述例如圖5所例示之積層中途之積層體100A於說明上有所區別。進而,為方便起見,積層中途之積層體100A亦包含僅將最下層之片材L5載置於積層平台80(參照圖4)之狀態。<Laminated body>
FIG. 1 illustrates a laminate 100B produced by the laminate apparatus of this embodiment. The
又,於圖1〜圖21所示之實施形態中,最終積層體100B係由以片材L1〜L5構成之5層積層體而構成,但由本實施形態之積層裝置製成之積層體並不限定於該例。例如,本實施形態之積層裝置能夠將12層或20層等5層以外之複數層片材積層。In addition, in the embodiment shown in FIGS. 1 to 21, the
最終積層體100B亦可為例如安裝於通訊機器之電路基板。根據圖1之例,最終積層體100B係將複數層片材L1〜L5積層而形成。片材L1〜L5分別由例如於絕緣膜106上積層有金屬層104之複數層片材構成。絕緣膜106例如由熱塑性液晶聚合物構成。又,金屬層104例如由銅構成。The
最下層之片材L5及最上層之片材L1以金屬層104露出之方式配置。例如最下層之片材L5相對於其他片材L1〜L4反轉配置。最上層之片材L1及最下層之片材L5之金屬層104可為例如於絕緣膜106之一面形成有金屬膜之所謂固體膜。The lowermost sheet L5 and the uppermost sheet L1 are arranged in such a way that the
最上層之片材L1及最下層之片材L5之金屬層104於壓接製程中與壓接器90之經加熱之壓製面抵接。熔點較絕緣膜106相對高之金屬層104與經加熱之壓製面抵接,藉此可抑制最終積層體100B之與壓製面之抵接面熔融。The
又,於作為中間層之片材L2〜L4之金屬層104,形成有針對每一片材不同之配線圖案。就該點而言,片材L2〜L4亦被稱為附圖案之絕緣膜。又,片材L2〜L4之金屬層104藉由貫通於絕緣膜106之厚度方向之通孔102而連接。In addition, the
又,各層之片材L1〜L5之絕緣膜106有時形成為厚度與其他層之片材不同。例如,越靠積層體上層,片材越厚。或者,越靠積層體上層,片材越薄。In addition, the insulating
又,如圖2、圖3之上段所例示,片材L1〜L5有時會產生翹曲或撓曲。例如基於絕緣膜106與金屬層104之膨脹率或收縮率之差,片材L1〜L5產生翹曲或撓曲。In addition, as illustrated in the upper stage of FIGS. 2 and 3, the sheets L1 to L5 may warp or bend. For example, based on the difference between the expansion rate or contraction rate of the insulating
如圖2、圖3之下段所例示,於壓接製程中,可消除該翹曲或撓曲,其結果,產生有翹曲或撓曲之層與其下層產生位置偏移。如下所述,本實施形態之積層裝置具備能夠於積層前消除各片材L1〜L5之翹曲或撓曲之構成。As shown in the lower part of Fig. 2 and Fig. 3, in the crimping process, the warpage or deflection can be eliminated, and as a result, the warped or deflection layer has a positional deviation from the lower layer. As described below, the laminating device of this embodiment has a structure capable of eliminating warpage or deflection of each sheet L1 to L5 before laminating.
再者,圖1中,作為片材之例,示出於絕緣膜106上形成有金屬層104之所謂貼合片材,但由本實施形態之積層裝置積層之片材並不限於該形態。例如,僅絕緣膜之類的僅一片電絕緣性膜亦可成為積層對象之片材。又,積層對象之片材亦可為將兩片電絕緣性膜貼合而成之貼合片材,或為於一片電絕緣性膜之兩面形成有金屬層之貼合片材。又,積層對象之片材亦可為將金屬層以一組電絕緣性片材夾持之貼合片材。進而,積層對象之片材亦可為於一面或兩面貼附PET膜或黏著片材之片材。In addition, in FIG. 1, as an example of the sheet, a so-called laminated sheet in which the
<積層裝置之整體構成>
圖4、圖5中例示本實施形態之積層裝置10。以下,作為用以說明積層裝置10之佈局等之方向軸,適當使用X軸、Y軸及Z軸。X軸係沿積層用搬送保持器60之移動方向之軸。Y軸係與X軸於水平面上正交之軸。Z軸係與X軸及Y軸正交之鉛直軸,且與片材L1〜L5之積層方向相同。<Integral structure of laminated device>
Fig. 4 and Fig. 5 illustrate the stacking
又,對積層裝置10之各機構之配置進行說明時,片材保管庫30L1〜30L5側成為上游側,沿X軸之積層平台80側成為下游側。In the description of the arrangement of the various mechanisms of the
積層裝置10具備控制器20、片材保管庫30L1〜30L5、保管庫用搬送保持器40、對準平台50、積層用搬送保持器60、積層平台80、及壓接器90。進而,作為荷電粒子之照射機構,積層裝置10具備平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74。The stacking
於片材保管庫30L1〜30L5中,分別收容有片材L1〜L5。再者,圖4中,將片材L1〜L5作為所謂單片式片材而圖示,又,將片材保管庫30L1〜30L5作為收容單片式片材之匣盒而圖示,但本實施形態之積層裝置10並不限於該形態。例如亦可對片材L1〜L5分別形成連續形成有數片量之片材之片材卷,並且設置切割該片材卷之切刀。該情形時,片材保管庫30L1〜30L5構成為分別保持對應於片材L1〜L5之片材卷之捲筒保持器。The sheet materials L1 to L5 are respectively stored in the sheet material storage warehouses 30L1 to 30L5. Furthermore, in FIG. 4, the sheets L1 to L5 are shown as so-called single-piece sheets, and the sheet storage warehouses 30L1 to 30L5 are shown as cassettes for storing the single-piece sheets, but this The
保管庫用搬送保持器40係於片材保管庫30L1〜30L5與對準平台50之間往復移動之搬送裝置。保管庫用搬送保持器40設置於相較積層用搬送保持器60更靠上游側,故亦被稱為「前段保持器」。The
片材保管庫30L1〜30L5散佈於X軸方向及Y軸方向,故保管庫用搬送保持器40能夠於X軸方向及Y軸方向上移動。保管庫用搬送保持器40例如能夠沿未圖示之X軸平台及Y軸平台移動。The sheet storages 30L1 to 30L5 are scattered in the X-axis direction and the Y-axis direction, so the
如圖5所例示,保管庫用搬送保持器40具備升降機構42。於升降機構42之下端設置有吸附板44。升降機構42使吸附板44於Z軸方向(鉛直方向)上移動。升降機構42例如構成為包含齒條、小齒輪機構、步進馬達或伺服馬達作為Z軸方向之移動機構。As illustrated in FIG. 5, the
吸附板44例如於鋁板等金屬板上形成數個空氣孔。空氣孔之下端露出,上端連接於空氣配管46。對空氣配管46供給負壓(Vac)及正壓(Prs)之空氣。於片材L1〜L5吸附時將空氣配管46抽真空。於片材L1〜L5脫離時自空氣配管46輸送加壓空氣。於吸附板44之與片材L1〜L5之抵接面,亦可設置軟質之多孔質片材。The
如圖4所例示,對準平台50進行自保管庫用搬送保持器40搬送之片材L1〜L5之對位。對準平台50具備移動機構52、作為載置台之平台板53、及對準相機56。As shown in FIG. 4, the
移動機構52使平台板53能夠沿X軸及Y軸移動,且使平台板53能夠以Z軸為旋轉軸而旋轉。平台板53具備作為透光性構件之透光板54。透光板54設置於供片材L1〜L5載置之片材載置區域之至少一部分。例如圖4所例示,平台板53之至少相當於片材L1〜L5之四角之部位由透光板54構成。或者,代替圖4所例示之形態,亦可包含相當於片材L1〜L5之四角之部位在內,於平台板53設置一片透光板54。The moving
對準相機56於平台板53下設置複數個。例如於能夠拍攝片材L1〜L5之四角、或對角線上之兩個角之位置,配置對準相機56。對準相機56能夠通過透光板54(透光性構件)而拍攝載置於平台板53上之片材L1〜L5。所載置之片材L1〜L5之對準製程將於以下敍述。A plurality of
如圖4所例示,積層用搬送保持器60藉由真空吸附保持由對準平台50對位後之片材L1〜L5,且將其等搬送至積層平台80。例如將對準平台50及積層平台80配置於X軸上之情形時,積層用搬送保持器60能夠僅沿X軸移動。As shown in FIG. 4, the
如圖5所例示,積層用搬送保持器60具備與保管庫用搬送保持器40大致相同之構造。即,積層用搬送保持器60具備升降機構62、設置於升降機構62下端之吸附板64、及連接於吸附板64之空氣配管66。As illustrated in FIG. 5, the transport holder for
升降機構62使吸附板64沿Z軸方向(鉛直方向)移動。升降機構62例如構成為包含齒條、小齒輪機構、及步進馬達或伺服馬達作為Z軸方向之移動機構。The
吸附板64例如於鋁板等金屬板上形成複數個空氣孔。空氣孔之下端露出,上端連接於空氣配管66。空氣配管66被供給負壓(Vac)及正壓(Prs)之空氣。於片材L1〜L5吸附時自空氣配管66饋入空氣。於片材L1〜L5脫離時自空氣配管66輸送加壓空氣。於吸附板64之與片材L1〜L5之抵接面,亦可設置軟質之多孔質片材。The
如圖4所例示,於積層平台80上積層片材L1〜L5。於形成最終積層體100B(參照圖1)之積層平台80之載置面,可形成用以保持最下層之片材L5之吸附孔(未圖示)。如圖5所例示,該吸附孔連接於空氣配管82。藉由自空氣配管82饋入負壓,將最下層之片材L5保持於積層平台80。又,亦可代替真空吸附,而於積層平台80之載置面貼附黏著片材。As shown in FIG. 4, the sheets L1 to L5 are laminated on the
如圖4所例示,於積層裝置10,設置有對積層用搬送保持器60、由該保持器搬送之片材L1〜L5、及於積層平台積層之積層中途之積層體100A照射荷電粒子之帶電器及除電器。As shown in FIG. 4, the
具體而言,積層裝置10具備平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74。該等帶電器及除電器例如由電離器構成。Specifically, the
平台用帶電器68朝積層平台80之載置面照射荷電粒子。又,如圖5所例示,平台用帶電器68朝積層於積層平台80上之複數個片材L3〜L5中最上層之片材L3之露出面照射荷電粒子。例如,平台用帶電器68能夠與積層平台80相對移動。具體而言,如圖4所例示,平台用帶電器68安裝於積層用搬送保持器60之下游端(偏靠積層平台80之位置),且能夠與積層用搬送保持器60一起於X軸上移動。The
例如,平台用帶電器68於圖5所例示之相較最上層之片材L3之露出面小的區域,規定該露出面上之荷電粒子之照射點。例如圖5所示,相較積層平台80及片材L3〜L5之X軸方向長度短之區域成為平台用帶電器68之最上層之片材L3之露出面上的照射點。再者,照射點之Y軸方向長度可為積層平台80及片材L3〜L5之Y軸方向長度以上。藉由積層平台80與平台用帶電器68沿X軸方向相對移動,而能夠遍及積層平台80之載置面及積層中途之積層體100A之最上表面之整面照射荷電粒子。For example, the
保持器用帶電器70及保持器用除電器74能夠與積層用搬送保持器60沿X軸方向、亦即積層用搬送保持器60之移動方向相對移動。例如,保持器用帶電器70及保持器用除電器74配置成,設置於對準平台50及積層平台80之間,且其上供積層用搬送保持器60通過。The
例如,保持器用帶電器70及保持器用除電器74朝上方(Z軸正向)照射荷電粒子。如上所述,積層用搬送保持器60將片材L1〜L5真空吸附於其下端。因此,若於積層用搬送保持器60在保持器用帶電器70及保持器用除電器74上移動時照射荷電粒子,則荷電粒子入射至被搬送之片材L1〜L5之露出面。For example, the
保持器用帶電器70及保持器用除電器74於相較保持於積層用搬送保持器60之片材L1〜L5之露出面小之區域,規定該露出面上之荷電粒子之照射點。例如,相較片材L1〜L5之X軸方向長度短之區域成為保持器用帶電器70及保持器用除電器74之於片材L1〜L5之露出面上之照射點。再者,照射點之Y軸方向長度可為片材L1〜L5之Y軸方向長度以上。藉由積層用搬送保持器60與保持器用帶電器70及保持器用除電器74沿X軸方向相對移動,而能夠遍及被搬送至積層用搬送保持器60之片材L1〜L5之露出面之整面照射荷電粒子。The
平台用除電器72例如可相對於積層平台80固定。例如,平台用除電器72能夠遍及積層平台80之載置面之整面而照射荷電粒子。亦即,平台用除電器72設定為,與平台用帶電器68、保持器用帶電器70、及保持器用除電器74相比,積層平台80上之荷電粒子之照射點變寬。The
平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74與荷電粒子之照射對象即片材L1〜L5之分開距離可為10 mm以上且120 mm以下。進而,該分開距離亦可維持為50 mm。關於該點,亦可於平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74設置調整Z軸方向之位置之Z升降機構。The distance between the
又,平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74均能夠照射具有-50 kV<V<-5 kV、5kv<V<50 kV之範圍之電壓值V的荷電粒子。In addition, the
例如以下所述,保持器用帶電器70為了消除被搬送至積層用搬送保持器60之片材L1〜L5之翹曲、撓曲而照射荷電粒子。此處,藉由照射低於-5 kV之電壓值、或超過5 kV之電壓值之荷電粒子而可良好地消除片材L1〜L5之翹曲、撓曲。又,藉由將電壓值設為高於-50 kV之電壓值、或未達50 kV之電壓值,而能夠抑制片材L1〜L5之絕緣破壞等之破損。For example, as described below, the
圖6所例示之控制器20控制積層裝置10之各機器。控制器20例如由電腦構成。即,控制器20具備輸入輸出控制器21、CPU22、ROM23、RAM24、及硬碟驅動器(HDD)25,該等連接於內部匯流排28。進而,控制器20具備滑鼠或鍵盤等輸入部26、及顯示器等顯示部27,且該等連接於內部匯流排28。The
於控制器20之記憶部即ROM23中,記憶用以執行圖8所例示之電壓設定流程及圖9〜圖18所例示之積層製程之程式。又,該程式當然由通訊手段提供,且亦能夠儲存於CD-ROM或USB記憶體等電腦可讀取之記錄媒體中而執行。In the memory portion of the
記憶於ROM23、或由通訊手段或記錄媒體提供之程式藉由構成控制器20之電腦之CPU22執行。藉由執行該程式而於控制器20中設置如圖7之功能塊。The program stored in the
即,控制器20具備保管庫用搬送保持器控制部110、對準平台控制部112、積層用搬送保持器控制部114、片材資訊記憶部116、帶電器控制部118、除電器控制部120、及壓接器控制部122。That is, the
如圖7所例示,保管庫用搬送保持器控制部110控制保管庫用搬送保持器40之動作。例如,保管庫用搬送保持器控制部110自圖4所例示之片材保管庫30L1〜30L5中設定片材未保持之保管庫用搬送保持器40之移動目的地。As illustrated in FIG. 7, the storage transport
例如,保管庫用搬送保持器控制部110具備片材計數器111。於片材計數器111中,記憶有指定作為保管庫用搬送保持器40之移動目的地之片材保管庫30L1〜30L5之順序。For example, the transport
例如,保管庫用搬送保持器控制部110按片材保管庫30L5、片材保管庫30L4、片材保管庫30L3、片材保管庫30L2、片材保管庫30L1之順序指定保管庫用搬送保持器40之移動目的地。
於指定片材保管庫30L1之後,保管庫用搬送保持器控制部110將保管庫用搬送保持器40之移動目的地恢復為片材保管庫30L5。For example, the storage transport
又,例如,於片材計數器111中,作為初始設定,設定片材保管庫30L5作為積層裝置10啟動時之、亦即最初之保管庫用搬送保持器40之移動目的地。或者,由機器管理者等將積層裝置10啟動時之保管庫用搬送保持器40之移動目的地設定為任意之片材保管庫30L1〜30L5。In addition, for example, in the
又,保管庫用搬送保持器控制部110將保持有片材L1〜L5之保管庫用搬送保持器40之搬送目的地自片材保管庫30L1〜30L5設定為對準平台50。In addition, the storage transport
此外,保管庫用搬送保持器控制部110控制吸附板44之下降及上升動作。例如,當保管庫用搬送保持器40到達指定為移動目的地之片材保管庫30L1〜30L5上時,保管庫用搬送保持器控制部110使保管庫用搬送保持器40之吸附板44下降。例如,保管庫用搬送保持器40使升降機構42驅動而使吸附板44下降至抵接於片材保管庫30L1〜30L5之最上層之片材L1〜L5為止。又,當吸附板44吸附片材L1〜L5時,保管庫用搬送保持器控制部110使升降機構42驅動而使吸附板44上升。In addition, the storage transport
又,當保管庫用搬送保持器40到達指定為片材L1〜L5之搬送目的地之對準平台50之平台板53上時,保管庫用搬送保持器控制部110使升降機構42驅動而使吸附板44下降至抵接於平台板53為止。又,當片材L1〜L5自吸附板44脫離時,保管庫用搬送保持器控制部110使升降機構42驅動而使吸附板44上升。In addition, when the
關於上述片材L1〜L5之吸附及脫離,保管庫用搬送保持器控制部110控制圖5所例示之空氣配管46之內壓。例如,使片材L1〜L5自片材保管庫30L1〜30L5吸附至保管庫用搬送保持器40時,保管庫用搬送保持器控制部110使空氣配管46為負壓狀態。例如,保管庫用搬送保持器控制部110對設置於自空氣配管46分支且與負壓源(未圖示)連接之分支配管之閥(未圖示)輸出打開指令。Regarding the adsorption and detachment of the aforementioned sheets L1 to L5, the storage transport
又,自保管庫用搬送保持器40將搬送中之片材L1〜L5交遞至對準平台50之平台板53時,保管庫用搬送保持器控制部110對設置於自空氣配管46分支且與負壓源連接之分支配管之閥輸出關閉指令。其後,保管庫用搬送保持器控制部110對設置於自空氣配管46分支且與正壓源(未圖示)連接之分支配管之閥(未圖示)輸出打開指令。In addition, when the
如圖5、7所例示,對準平台控制部112基於自對準相機56取得之載置於平台板53上之片材之圖像,產生對移動機構52之驅動指令。對準平台控制部112例如將對準相機56之拍攝圖像與預先記憶之參照圖像加以比較,求出片材自參照圖像中設定之目標位置、角度之位置偏移及角度偏移。進而,對準平台控制部112對移動機構52輸出用以消除所求出之偏移之驅動指令。As shown in FIGS. 5 and 7, the alignment
積層用搬送保持器控制部114控制積層用搬送保持器60之動作。例如,積層用搬送保持器控制部114使積層用搬送保持器60於對準平台50與積層平台80之間往復移動。The stacking transport
此外,積層用搬送保持器控制部114控制吸附板64之下降及上升動作。例如,當積層用搬送保持器60到達圖5所例示被指定為移動目的地之對準平台50之平台板53上時,積層用搬送保持器控制部114使吸附板64下降。例如,積層用搬送保持器控制部114使升降機構62驅動,從而使吸附板64下降至抵接於平台板53為止。又,當吸附板64吸附片材L1〜L5時,積層用搬送保持器控制部114使升降機構62驅動而使吸附板64上升。In addition, the stacking carrier
又,當積層用搬送保持器60到達被指定為片材L1〜L5之搬送目的地之積層平台80上時,積層用搬送保持器控制部114使積層用搬送保持器60之吸附板64下降。例如,積層用搬送保持器控制部114使升降機構62驅動,從而使吸附板64下降至抵接於積層平台80為止。又,當片材L1〜L5自吸附板64脫離時,積層用搬送保持器控制部114使升降機構62驅動而使吸附板64上升。In addition, when the
關於上述片材L1〜L5之吸附及脫離,積層用搬送保持器控制部114控制圖5所例示之空氣配管66之內壓。例如,使積層用搬送保持器60自平台板53吸附片材L1〜L5時,積層用搬送保持器控制部114對設置於自空氣配管66分支且與負壓源(未圖示)連接之分支配管之閥(未圖示)輸出打開指令。Regarding the adsorption and detachment of the above-mentioned sheets L1 to L5, the lamination transport
又,自積層用搬送保持器60將搬送中之片材L1〜L5交遞至積層平台80時,積層用搬送保持器控制部114對自空氣配管66分支且與負壓源(未圖示)連接之分支配管對閥輸出關閉指令。其後,積層用搬送保持器控制部114對設置於自空氣配管66分支且與正壓源(未圖示)連接之分支配管上之閥(未圖示)輸出打開指令。In addition, when the
帶電器控制部118進行平台用帶電器68及保持器用帶電器70之荷電粒子之照射控制。照射控制包含照射時點之控制、及荷電粒子之電壓控制。如下所述,電壓控制與除電器控制部120之電壓控制一起執行。The
如圖7所例示,自積層用搬送保持器控制部114對帶電器控制部118發送積層用搬送保持器60之座標資訊。帶電器控制部118基於該座標資訊,設定平台用帶電器68及保持器用帶電器70之荷電粒子之照射時點。再者,帶電器控制部118亦可以如下方式控制平台用帶電器68及保持器用帶電器70,即,確認由未圖示之相機等拍攝之積層用搬送保持器60之實際位置,於積層用搬送保持器60到達規定之位置之時點照射荷電粒子。As shown in FIG. 7, the self-stacking transport
除電器控制部120進行平台用除電器72及保持器用除電器74之荷電粒子之照射控制。照射控制包含照射時點之控制、及荷電粒子之電壓控制。The static
如圖7所例示,自積層用搬送保持器控制部114對除電器控制部120發送積層用搬送保持器60之座標資訊。除電器控制部120基於該座標資訊,設定平台用除電器72及保持器用除電器74之荷電粒子之照射時點。再者,除電器控制部120亦可以如下方式控制保持器用除電器74,即,確認由未圖示之相機等拍攝之積層用搬送保持器60之實際位置,於積層用搬送保持器60到達規定之位置之時點照射荷電粒子。As shown in FIG. 7, the self-stacking transport
<電壓設定流程>
圖8中,例示帶電器控制部118及除電器控制部120對平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74之各者之電壓設定流程。<Voltage setting procedure>
In FIG. 8, the voltage setting flow of the
例如,圖8之電壓設定流程針對收容於片材保管庫30L1〜30L5之片材L1〜L5之每一批次而執行。所謂批次係指例如將片材L1〜L5按單片切斷前之片材卷之單位,簡言之,其表示可將各片材L1〜L5之絕緣膜106之厚度視為固定之單位。For example, the voltage setting process in FIG. 8 is executed for each batch of sheets L1 to L5 stored in the sheet storage warehouses 30L1 to 30L5. The so-called batch refers to, for example, the unit of the sheet roll before the sheet material L1~L5 is cut into a single sheet. In short, it means that the thickness of the insulating
例如,於新一批次之各第一片片材L1〜L5積層時,執行圖8之電壓設定流程。於第二片以後,將針對每一片材L1〜L5設定之電壓V0〜V4記憶於帶電器控制部118及除電器控制部120。進而,基於自片材計數器111發送之要搬送至積層用搬送保持器60之片材L1〜L5而設定電壓V0〜V4。For example, when the first sheets L1 to L5 of a new batch are laminated, the voltage setting process of FIG. 8 is executed. After the second sheet, the voltages V0 to V4 set for each sheet L1 to L5 are stored in the
如圖7、圖8所例示,帶電器控制部118特定出要搬送至積層用搬送保持器60之片材,換言之,特定出接下來要積層於積層中途之積層體100A之片材(取得片材編號)(S10)。As shown in Figs. 7 and 8, the
帶電器控制部118參照片材資訊記憶部116,取得搬送對象片材之片材厚度資訊(S12)。繼而,帶電器控制部118求出基於片材厚度資訊之電壓值V0(S14)。電壓值V0係指為了消除積層用搬送保持器60中片材L1〜L5之翹曲或撓曲所需之電壓值,例如由事先之實驗或模擬等求出。The
此處,定性而言,根據片材L1〜L5之絕緣膜106之厚度而設定電壓值。更具體而言,絕緣膜106越薄,設定越高之電壓。此處,所謂高電壓包含正高電壓及負高電壓,簡言之,其係指電壓值之絕對值較高之電壓。Here, qualitatively, the voltage value is set according to the thickness of the insulating
絕緣膜106越薄,則絕緣膜106之面彈性模數(換言之,緊繃程度)越降低,由與金屬層104之膨脹率差及收縮率差所導致之翹曲量及撓曲量越增加。因此,本實施形態之電壓設定流程中,搬送中之片材L1〜L5之絕緣膜106越薄,照射之荷電粒子設定為越高之電壓。The thinner the insulating
進而,帶電器控制部118將保持器用帶電器70照射之荷電粒子之電壓值V1設定為電壓值V0(S16)。進而,除電器控制部120將保持器用除電器74照射之荷電粒子之電壓值V3設定為絕對值與V0(=V1)相等且極性相反之電壓值(S18)。再者,即便將帶電電壓V0與除電電壓V3設為相同極性,亦可藉由分極而獲得除電效果,故亦可代替V3=-V0而設為V3=V0。又,並不限定於使帶電電壓與除電電壓之絕對值相等,可根據除電裝置及除電方法而適當設定除電電壓。Furthermore, the
又,帶電器控制部118將平台用帶電器68照射之荷電粒子之電壓值V2設定為電壓值V0(S20)。進而,除電器控制部120將平台用除電器72照射之荷電粒子之電壓值V4設定為絕對值與V0(=V2)相等且極性相反之電壓值(S22)。再者,即便使帶電電壓V0與除電電壓V4為相同極性,亦可藉由分極而獲得除電效果,故亦可代替V4=-V0而設為V4=V0。又,並不限定於使帶電電壓與除電電壓之絕對值相等,可根據除電裝置及除電方法而適當設定除電電壓。In addition, the
根據上述電壓設定流程,藉由對真空吸附於積層用搬送保持器60之片材L1〜L5照射荷電粒子,片材L1〜L5之翹曲部分或撓曲部分(隆起部分)藉由靜電吸附被吸附於積層用搬送保持器60。此處,搬送中之片材L1〜L5之絕緣膜106越薄,亦即如上所述翹曲量及撓曲量越多,則照射電壓越高之荷電粒子,藉此使靜電吸附力增加,從而消除翹曲及撓曲。According to the above-mentioned voltage setting process, by irradiating the charged particles on the sheets L1~L5 vacuum-adsorbed on the
進而,積層平台80中,將與上述靜電吸附等電壓之荷電粒子照射至積層中途之積層體100A之最上表面。亦即,使片材L1〜L5吸附於積層用搬送保持器60之靜電吸附力、與使片材L1〜L5吸附於積層中途之積層體100A之靜電吸附力相等。藉此,自積層用搬送保持器60噴射正壓空氣使片材L1〜L5脫離並將其交遞至積層平台80時,可抑制對積層用搬送保持器60賦予之用於消除翹曲及撓曲之靜電吸附力阻礙上述脫離。換言之,能夠於不會因靜電吸附而阻礙片材L1〜L5自積層用搬送保持器60脫離之範圍內之最大電壓下,消除片材L1〜L5之翹曲及撓曲。Furthermore, in the build-up
如圖7所例示,壓接器控制部122控制壓接器90,對最終積層體100B進行壓接。於積層平台80上積層至最上層之片材L1而成之最終積層體100B藉由搬送保持器91搬送至壓接器90。As illustrated in FIG. 7, the
壓接器90中,最終積層體100B一面被加熱一面自上下方向、換言之自積層方向被壓縮。該壓接製程藉由壓接器控制部122控制。壓接製程之結果如圖1下段所示,最終積層體100B之各層得以固定,且作為電路基板安裝於通訊機器等。In the
<積層製程>
圖9〜圖18中例示本實施形態之積層裝置10之積層製程。圖7所例示之保管庫用搬送保持器控制部110之片材計數器111中,設定片材保管庫30L5作為積層裝置10啟動時之、亦即最初之保管庫用搬送保持器40之移動目的地。因此,如圖9所例示,將保管庫用搬送保持器40之移動目的地指定為片材保管庫30L5。<Layer Process>
9 to 18 illustrate the lamination process of the
如圖9、圖10所例示,保管庫用搬送保持器40(前段保持器)自片材保管庫30L5真空吸附片材L5,且將其移動至對準平台50。As illustrated in FIGS. 9 and 10, the storage transport holder 40 (front stage holder) vacuum sucks the sheet L5 from the sheet storage 30L5 and moves it to the
如圖10所例示,當保管庫用搬送保持器40到達對準平台50上時,藉由升降機構42使吸附板44及吸附於該吸附板44之片材L5下降。當片材L5抵接於對準平台50之平台板53上時,升降機構42之下降驅動停止。例如,藉由扭矩感測器使升降機構42之下降驅動停止。As shown in FIG. 10, when the
此時,如圖10所例示,藉由保管庫用搬送保持器40(前段保持器)將片材L5壓抵於對準平台50之平台板53。即便於片材L5形成有翹曲或撓曲之情形時,亦可藉由保管庫用搬送保持器40之壓抵而暫時消除該翹曲或撓曲。於該狀態(展開狀態)時,對準相機56通過透光板54(參照圖1)而拍攝平台板53上之片材L5。At this time, as illustrated in FIG. 10, the sheet L5 is pressed against the
如圖7所例示,對準平台控制部112基於自對準相機56取得之片材L5之圖像,產生對移動機構52之驅動指令。對準平台控制部112例如將對準相機56之拍攝圖像、與預先記憶之參照圖像加以比較,求出片材L5自參照圖像中設定之目標位置、角度之位置偏移及角度偏移。進而,對準平台控制部112對移動機構52輸出用以消除所求出之偏移之驅動指令。As shown in FIG. 7, the alignment
如圖11所例示,保管庫用搬送保持器40之吸附板44與平台板53分離之後,隨著移動機構52之驅動而將片材L5對位。對位後之片材L5如圖12所例示,由積層用搬送保持器60真空吸附。As shown in FIG. 11, after the
真空吸附有片材L5之積層用搬送保持器60根據積層用搬送保持器控制部114(參照圖7)之驅動指令,朝積層平台80沿X軸方向移動。於該移動過程中,如圖13所例示,自保持器用帶電器70對真空吸附於積層用搬送保持器60之片材L5之露出面照射離子粒子等荷電粒子。The
又,此時,圖7所例示之保管庫用搬送保持器控制部110根據記憶於片材計數器111中之順序,將保管庫用搬送保持器40之移動目的地指定為片材保管庫30L4。對應於此,如圖13所例示,保管庫用搬送保持器40移動至片材保管庫30L4,吸附(真空吸附)第二層片材L4。At this time, the storage transport
例如圖7所示,自積層用搬送保持器控制部114向帶電器控制部118發送積層用搬送保持器60之當前座標。帶電器控制部118接收該當前座標,控制保持器用帶電器70,於搬送至積層用搬送保持器60之片材L5通過保持器用帶電器70上之全過程持續地自保持器用帶電器70向上方照射照射荷電粒子。藉此,遍及片材L5之露出面之整面入射荷電粒子。For example, as shown in FIG. 7, the self-laminating transport
如圖14所例示,照射該荷電粒子係為了消除片材L5之翹曲或撓曲。藉由荷電粒子之照射,於片材L5上除產生真空之吸附力外,還產生靜電引力(庫侖力)之吸附力。藉由此種靜電吸附,片材L5之自吸附板64之保持面分離(剝離)之隆起部分12被吸附板64牽引。如下述電壓設定製程中所說明,自保持器用帶電器70照射之荷電粒子可帶有正電荷,亦可帶有負電荷。As shown in FIG. 14, the charged particles are irradiated in order to eliminate the warpage or deflection of the sheet material L5. By the irradiation of the charged particles, in addition to the vacuum suction force, the electrostatic attraction force (Coulomb force) is also generated on the sheet L5. With this electrostatic adsorption, the raised
再者,如上所述,照射至吸附於積層用搬送保持器60之片材之荷電粒子之電壓設定為該片材越薄則越高之電壓。此處,所謂高電壓包含正高電壓及負高電壓,簡言之,其係指電壓值之絕對值較高之電壓。Furthermore, as described above, the voltage of the charged particles irradiated to the sheet material adsorbed on the
圖1所例示之絕緣膜106越薄,則絕緣膜106之面彈性模數(換言之,緊繃程度)越降低,由與金屬層104之膨脹率差及收縮率差所導致之翹曲量及撓曲量越增加。因此,本實施形態之積層製程中,搬送中之片材L1〜L5之絕緣膜106越薄,照射之荷電粒子設定為越高之電壓。The thinner the insulating
如圖15所例示,保管庫用搬送保持器40將第二層片材L4搬送至對準平台50。又,安裝於積層用搬送保持器60之平台用帶電器68朝向積層平台80之片材載置面照射荷電粒子。例如,自積層平台80之X軸上游端至下游端,自平台用帶電器68照射荷電粒子。As illustrated in FIG. 15, the
再者,圖15中,積層平台80上未載置片材L1〜L5,但於積層平台80上積層有該等片材L1〜L5時,自平台用帶電器68對該積層中途之積層體100A之最上表面照射荷電粒子。換言之,自平台用帶電器68對積層於積層平台80上之複數個片材中最上層之片材之露出面照射荷電粒子。再者,積層平台80之尺寸大於片材L1〜L5之尺寸,故對未載置片材L1〜L5之部分(即,積層平台80之露出之部分)亦照射荷電粒子。Furthermore, in FIG. 15, the sheets L1 to L5 are not placed on the
此時,如上述電壓設定流程中所說明,將自平台用帶電器68照射之荷電粒子、與自保持器用帶電器70照射之荷電粒子設定為等電壓(V1=V2)。藉由照射荷電粒子,而於積層平台80之載置面、積層中途之積層體100A(參照圖5)之最上表面產生靜電引力。At this time, as explained in the above-mentioned voltage setting process, the charged particles irradiated by the
當積層用搬送保持器60到達積層平台80上時,如圖16所例示,藉由升降機構62之下降驅動使吸附板64及吸附於其下端之片材L5下降。當片材L5與積層平台80之載置面或積層中途之積層體100A之最上表面抵接時,自空氣配管66噴出用於脫離之正壓空氣。When the
此時,於積層用搬送保持器60與片材L5之間靜電引力發揮作用。另一方面,於積層平台80與片材L5之間亦靜電引力發揮作用。如上所述,將自平台用帶電器68照射之荷電粒子、與自保持器用帶電器70照射之荷電粒子設定為等電壓(V1=V2)。因此,於積層用搬送保持器60與片材L5之間發揮作用之靜電引力、及於積層平台80與片材L5之間發揮作用之靜電引力理論上相等。其結果,能夠於不會因靜電吸附而阻礙利用正壓空氣使片材L1〜L5自積層用搬送保持器60脫離之範圍內之最大電壓下,消除片材L1〜L5之翹曲及撓曲。At this time, electrostatic attractive force acts between the
如圖17所例示,積層用搬送保持器60自積層平台80離開且朝向對準平台50時,自平台用除電器72朝積層平台80之載置面照射荷電粒子。該荷電粒子之電壓值例如藉由除電器控制部120(參照圖7)而設定為與自平台用帶電器68照射之荷電粒子為相反極性、且電壓值之絕對值相等之值。As shown in FIG. 17, when the
積層中途之積層體100A(為方便起見,亦包含僅片材L5之狀態)中,對平台用帶電器68照射荷電粒子,但若反覆進行該照射使電荷累積,則有於積層體100A內產生絕緣破壞等損傷之虞。因此,藉由平台用除電器72對積層中途之積層體100A除電。In the
進而,如圖18所例示,於積層用搬送保持器60之移動中,自保持器用除電器74朝吸附板64照射荷電粒子。該荷電粒子之電壓值例如藉由除電器控制部120(參照圖7)而設定為與自保持器用帶電器70照射之荷電粒子為相反極性、且電壓值之絕對值相等之值。藉由照射此種荷電粒子而對吸附板64除電。Furthermore, as illustrated in FIG. 18, during the movement of the
如圖18所例示,於對準平台50上載置已對位之第二層片材L4。積層用搬送保持器60真空吸附片材L4,且反覆執行圖12〜圖18之過程,直至積層最上層之片材L1為止。As shown in FIG. 18, the aligned second layer sheet L4 is placed on the
於積層平台80上積層至最上層之片材L1而成之最終積層體100B藉由搬送保持器91搬送至壓接器90。壓接器90中,將最終積層體100B一面加熱一面自上下方向、換言之自積層方向壓縮。該壓接製程之結果,如圖1下段所示,最終積層體100B之各層得以固定,且作為電路基板安裝於通訊機器等。The final
<積層裝置之另一例>
上述實施形態中,遍及搬送至積層用搬送保持器60之片材L1〜L5之露出面之整面照射荷電粒子,但本實施形態之積層裝置10並不限於此種形態。由於照射荷電粒子之目的在於消除片材L1〜L5之隆起部分12(參照圖14),故亦可對該隆起部分12集中照射荷電粒子。<Another example of multilayer device>
In the above-mentioned embodiment, the charged particles are irradiated over the entire exposed surface of the sheets L1 to L5 conveyed to the conveying
例如圖19所例示,於積層裝置10中,於對準平台50與保持器用除電器74之間設置相機130。相機130將其上方作為拍攝區域,能夠拍攝被搬送至積層用搬送保持器60且通過相機130上方之片材L1〜L5之表面形狀。再者,積層用搬送保持器60在位於相機130之上方時,為了拍攝亦可暫時停止移動。For example, as illustrated in FIG. 19, in the
又,亦可代替設置相機130,由對準相機56拍攝於對準平台50對位後之片材L1〜L5之表面形狀。In addition, the
此種情形時,例如作為控制器20之功能塊,對圖7所例示之帶電器控制部118發送由相機130或對準相機56獲得之片材L1〜L5之拍攝圖像。In this case, for example, as a functional block of the
將由相機130或對準相機56取得之片材L1〜L5之拍攝圖像發送至帶電器控制部118(參照圖7)。帶電器控制部118基於所拍攝之片材L1〜L5之表面形狀,設定自保持器用帶電器70對保持於積層用搬送保持器60之片材L1〜L5之荷電粒子之照射時點及電壓。The photographed images of the sheets L1 to L5 obtained by the
具體而言,帶電器控制部118以對與積層用搬送保持器60之保持面分離之片材L1〜L5之隆起部分12(參照圖14)照射電壓相較密接於該保持面之片材之密接部分高之荷電粒子的方式,控制保持器用帶電器70。Specifically, the
例如,保持器用帶電器70僅限於搬送之片材L1〜L5之露出面上的荷電粒子之照射點之至少一部分與保持於積層用搬送保持器60之片材L1〜L5之隆起部分12重疊時照射荷電粒子。該照射時點可根據自積層用搬送保持器控制部114發送之積層用搬送保持器60之座標、與所拍攝之片材L1〜L5之表面形狀而求出。再者,對片材L1〜L5之除隆起部分12以外之密接部分停止荷電粒子之照射。For example, the
圖20中,例示圖8之另一例之電壓設定流程。以下,關於圖20中與圖8之符號重複之步驟,因其行程內容無變更,故適當省略說明。FIG. 20 illustrates the voltage setting process of another example in FIG. 8. Hereinafter, regarding the steps in FIG. 20 that are repeated with the symbols in FIG. 8, since there is no change in the content of the itinerary, the description is appropriately omitted.
圖20之步驟S14中,基於片材厚度資訊求出電壓值V0。具體而言,如上所述,圖1所例示之片材L1〜L5之絕緣膜106越薄,則設定越高之電壓。In step S14 of FIG. 20, the voltage value V0 is obtained based on the sheet thickness information. Specifically, as described above, the thinner the insulating
其次,圖7所例示之帶電器控制部118解析片材L1〜L5之表面形狀,判定該片材之至少一部分是否自積層用搬送保持器60之吸附板64隆起,換言之是否有隆起部分12(S30)。再者,於利用對準相機56之拍攝圖像進行之圖像解析中,基於平台板53上之片材L1〜L5之表面形狀而判定有無隆起部分12。此處,為了於圖像解析中強調隆起部分12,亦可於相機130或對準相機56中設置閃光儀機構。Next, the
若藉由圖像解析而判定片材L1〜L5上無隆起部分12,則原本就無需由荷電粒子進行隆起部分12之消除,故帶電器控制部118將保持器用帶電器70之設定電壓值V1設定為0[V](S32)。If it is determined by image analysis that there is no raised
另一方面,於步驟S30中,若特定出片材L1〜L5之隆起部分12(S36),則帶電器控制部118將保持器用帶電器70及保持器用除電器74之荷電粒子之照射區間僅設定為隆起部分12(S38)。自積層用搬送保持器控制部114向帶電器控制部118發送積層用搬送保持器60之座標,故與該座標之變化同步控制荷電粒子之照射及停止。On the other hand, in step S30, if the raised
進而,將保持器用帶電器70照射之荷電粒子之電壓值V1設定為電壓值V0(S16)。又,將保持器用除電器74照射之荷電粒子之電壓值V3設定為絕對值與V0(=V1)相等且極性相反之電壓值(S18)。Furthermore, the voltage value V1 of the charged particles irradiated by the
此處,於步驟S32中將保持器用帶電器70之設定電壓值V1設定為0[V]之情形時,亦可將保持器用除電器74之電壓V3設定為電壓值V0(S18),對積層用搬送保持器60進行除電。Here, when the set voltage value V1 of the
例如圖16所例示,自積層用搬送保持器60將片材交遞至積層平台80時,有電荷自帶電之積層中途之積層體100A(圖16中片材L5)向積層用搬送保持器60移動從而導致積層用搬送保持器60帶電之虞。因此,無論是否藉由保持器用帶電器70照射荷電粒子,於將片材交遞至積層平台80之後,均對積層用搬送保持器60進行除電。For example, as shown in FIG. 16, when the self-laminating
根據以上說明之實施形態之積層裝置10,對片材L1〜L5之隆起部分12照射相對高電壓之荷電粒子,對其周圍之密接部分,包含0[V]之情形在內相對地抑制靜電吸附力。藉此,可避免片材L1〜L5上產生過度之靜電吸附力,於積層平台80,能夠使片材L1〜L5容易地自積層用搬送保持器60脫離。According to the
<對準平台之另一例>
上述實施形態中,如圖10所例示,藉由保管庫用搬送保持器40(前段保持器)將片材L5壓抵於對準平台50之平台板53。藉此消除片材L5之翹曲或撓曲,且於該狀態下利用對準相機56進行拍攝。<Another example of alignment platform>
In the above embodiment, as illustrated in FIG. 10, the sheet L5 is pressed against the
本實施形態之於對準平台50上消除翹曲及撓曲之手段並不限於上述手段。簡言之,只要設置加壓構件便可消除片材L1〜L5之翹曲及撓曲,該加壓構件進而載置於對準平台50之平台板53上所載置之片材L1〜L5上,對片材L1〜L5之整面進行加壓。The means for eliminating warpage and deflection on the
例如圖21所示,於對準平台50上,亦可設置加壓板55作為加壓構件。加壓板55例如可由丙烯酸系樹脂板構成。又,為了吸附加壓板55,於平台板53上亦可設置氣動夾頭51。For example, as shown in FIG. 21, on the
又,作為加壓構件,亦可使用PET膜等膜構件。該情形時,藉由於平台板53上之片材L1〜L5由膜構件覆蓋之狀態下,由氣動夾頭51進行抽真空而將片材L1〜L5密封於膜構件。此時,片材L1〜L5被膜構件加壓,片材L1〜L5之翹曲及撓曲得以消除。In addition, as the pressing member, a film member such as a PET film may also be used. In this case, since the sheets L1 to L5 on the
再者,加壓板55及膜構件能夠由氣動夾頭51保持,故亦可構成為面積較片材L1〜L5大。加壓板55或膜構件藉由管理積層裝置10之積層製程之機器管理者、或藉由未圖示之搬送機器人而與平台板53上之片材L1〜L5重疊。Furthermore, the
藉由加壓板55或膜構件而壓抵於對準平台50之平台板53之片材L1〜L5由對準相機56拍攝。基於該拍攝圖像而修正平台板53上之片材L1〜L5之位置偏移及角度偏移。The sheets L1 to L5 pressed against the
10:積層裝置 12:隆起部分 20:控制器 21:輸入輸出控制器 22:CPU 23:ROM 24:RAM 25:硬碟驅動器(HDD) 26:輸入部 27:顯示部 28:內部匯流排 30L1〜30L5:片材保管庫 40:保管庫用搬送保持器(前段保持器) 42:升降機構 44:吸附板 46:空氣配管 50:對準平台 51:氣動夾頭 52:移動機構 53:平台板 54:透光板 55:加壓板 56:對準相機 60:積層用搬送保持器 62:升降機構 64:吸附板 66:空氣配管 68:平台用帶電器 70:保持器用帶電器 72:平台用除電器 74:保持器用除電器 80:積層平台 82:空氣配管 90:壓接器 91:搬送保持器 100A:積層中途之積層體 100B:最終積層體 102:通孔 104:金屬層 106:絕緣膜 110:保管庫用搬送保持器控制部 111:片材計數器 112:對準平台控制部 114:積層用搬送保持器控制部 116:片材資訊記憶部 118:帶電器控制部 120:除電器控制部 122:壓接器控制部 130:相機(攝像器) L1~L5:片材10: Layered device 12: Uplift 20: Controller 21: Input and output controller 22: CPU 23: ROM 24: RAM 25: Hard Disk Drive (HDD) 26: Input section 27: Display 28: Internal bus 30L1~30L5: Sheet storage 40: Transport holder for storage warehouse (front holder) 42: Lifting mechanism 44: Adsorption board 46: Air piping 50: Align the platform 51: Pneumatic chuck 52: mobile agency 53: platform board 54: Translucent board 55: pressure plate 56: Point at the camera 60: Conveyor holder for stacking 62: Lifting mechanism 64: Adsorption board 66: Air piping 68: Platform with electrical appliances 70: With electrical appliances for retainers 72: In addition to electrical appliances for platforms 74: In addition to electrical appliances for retainers 80: Multilayer platform 82: Air piping 90: Crimper 91: Transport holder 100A: Stacked body in the middle of stacking 100B: Final laminate 102: Through hole 104: Metal layer 106: insulating film 110: Conveyor holder control unit for storage 111: sheet counter 112: Align the platform control department 114: Conveyor holder control unit for stacking 116: Sheet Information Memory Department 118: Charger control department 120: In addition to the electrical control unit 122: Crimper control unit 130: camera (video camera) L1~L5: Sheet
[圖1]係例示由本實施形態之積層裝置製造之積層體之圖。 [圖2]係例示包含具有翹曲之片材之積層體之圖。 [圖3]係例示包含具有撓曲之片材之積層體之圖。 [圖4]係例示本實施形態之積層裝置之構成之立體圖。 [圖5]係例示本實施形態之積層裝置之構成之X-Z側視圖。 [圖6]係例示控制器之硬體構成之圖。 [圖7]係例示控制器之功能塊之圖。 [圖8]係例示於片材之積層製程中執行之帶電及除電之電壓設定流程之圖。 [圖9]係說明使用有本實施形態之積層裝置之片材之積層製程(1/10)的圖。 [圖10]係說明使用有本實施形態之積層裝置之片材之積層製程(2/10)的圖。 [圖11]係說明使用有本實施形態之積層裝置之片材之積層製程(3/10)的圖。 [圖12]係說明使用有本實施形態之積層裝置之片材之積層製程(4/10)的圖。 [圖13]係說明使用有本實施形態之積層裝置之片材之積層製程(5/10)的圖。 [圖14]係說明使用有本實施形態之積層裝置之片材之積層製程(6/10)的圖。 [圖15]係說明使用有本實施形態之積層裝置之片材之積層製程(7/10)的圖。 [圖16]係說明使用有本實施形態之積層裝置之片材之積層製程(8/10)的圖。 [圖17]係說明使用有本實施形態之積層裝置之片材之積層製程(9/10)的圖。 [圖18]係說明使用有本實施形態之積層裝置之片材之積層製程(10/10)的圖。 [圖19]係例示本實施形態之另一例之積層裝置之構成之圖。 [圖20]係表示於片材之積層製程中執行之帶電及除電之電壓設定流程之另一例之圖。 [圖21]係表示對準平台之另一例之圖。[FIG. 1] A diagram illustrating a laminate manufactured by the laminate apparatus of this embodiment. [Fig. 2] A diagram illustrating a laminate including a sheet having warpage. [Fig. 3] A diagram illustrating a laminate including a sheet having a flexure. [FIG. 4] A perspective view illustrating the structure of the stacking device of this embodiment. [Fig. 5] An X-Z side view illustrating the structure of the stacking device of this embodiment. [Figure 6] A diagram illustrating the hardware configuration of the controller. [Figure 7] is a diagram illustrating the functional blocks of the controller. [Fig. 8] A diagram illustrating the voltage setting flow of charging and discharging performed in the lamination process of the sheet material. [Fig. 9] is a diagram illustrating the lamination process (1/10) of sheets using the lamination device of this embodiment. [Fig. 10] is a diagram illustrating the lamination process (2/10) of sheets using the lamination device of this embodiment. [Fig. 11] is a diagram illustrating the lamination process (3/10) of sheets using the lamination device of this embodiment. [Fig. 12] is a diagram illustrating the lamination process (4/10) of sheets using the lamination device of this embodiment. [Fig. 13] is a diagram illustrating the lamination process (5/10) of sheets using the lamination device of this embodiment. [Fig. 14] is a diagram illustrating the lamination process (6/10) of sheets using the lamination device of this embodiment. [Fig. 15] is a diagram illustrating the lamination process (7/10) of sheets using the lamination device of this embodiment. [Fig. 16] is a diagram illustrating the lamination process (8/10) of sheets using the lamination device of this embodiment. [Fig. 17] is a diagram illustrating the lamination process (9/10) of sheets using the lamination device of this embodiment. [Fig. 18] is a diagram illustrating the lamination process (10/10) of sheets using the lamination device of this embodiment. [FIG. 19] A diagram illustrating the structure of another example of a laminate device of this embodiment. [Fig. 20] is a diagram showing another example of the voltage setting process of charging and discharging performed in the laminate process of the sheet. [Fig. 21] A diagram showing another example of the alignment platform.
10:積層裝置10: Layered device
20:控制器20: Controller
30L1~30L5:片材保管庫30L1~30L5: Sheet storage
40:保管庫用搬送保持器(前段保持器)40: Transport holder for storage warehouse (front holder)
50:對準平台50: Align the platform
52:移動機構52: mobile agency
53:平台板53: platform board
54:透光板54: Translucent board
56:對準相機56: Point at the camera
60:積層用搬送保持器60: Conveyor holder for stacking
68:平台用帶電器68: Platform with electrical appliances
70:保持器用帶電器70: With electrical appliances for retainers
72:平台用除電器72: In addition to electrical appliances for platforms
74:保持器用除電器74: In addition to electrical appliances for retainers
80:積層平台80: Multilayer platform
90:壓接器90: Crimper
91:搬送保持器91: Transport holder
L1~L5:片材L1~L5: Sheet
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