TW202124148A - Laminating device and method for manufacturing laminated body capable of laminating sheet materials after warpages or deflections of the sheet materials are eliminated - Google Patents

Laminating device and method for manufacturing laminated body capable of laminating sheet materials after warpages or deflections of the sheet materials are eliminated Download PDF

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TW202124148A
TW202124148A TW109130439A TW109130439A TW202124148A TW 202124148 A TW202124148 A TW 202124148A TW 109130439 A TW109130439 A TW 109130439A TW 109130439 A TW109130439 A TW 109130439A TW 202124148 A TW202124148 A TW 202124148A
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sheet
holder
platform
sheets
charged particles
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TW109130439A
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TWI760840B (en
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牧野由
森本崇
澤田智世
森隆
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日商日機裝股份有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment

Abstract

The present invention is capable of laminating sheet materials after warpages or deflections of the sheet materials are eliminated. A transporting and holding device 60 for lamination is used to hold, by vacuum suction, sheet materials L1- L5 on which a metal layer 104 is laminated on an insulating film 106, and transport them to a lamination platform 80. An electrical charge carrier 70 for a holder irradiates the sheet materials L1-L5 held on the transporting and holding device 60 for lamination with charged particles. The voltage of the charged particles irradiated by the electrical charge carrier 60 for a holder is higher when the insulating film 106 of the sheet materials L1-L5 being transported is thinner.

Description

積層裝置及積層體之製造方法Laminated device and manufacturing method of laminated body

本發明係關於一種積層裝置及積層體之製造方法。The present invention relates to a laminated device and a method of manufacturing a laminated body.

作為安裝於通訊機器等之電路基板,例如專利文獻1、2所揭示,使用將絕緣性膜上形成有金屬層之片材積層而成之積層體。As a circuit board mounted on a communication device etc., as disclosed in Patent Documents 1 and 2, for example, a laminate formed by laminating sheets in which a metal layer is formed on an insulating film is used.

積層體之製造製程中,片材一層一層地藉由保持器搬送至積層平台。例如於搬送至保持器之前進行片材之位置對準,將位置對準後之片材於積層平台上積層。藉由進行位置對準,可抑制層間之位置偏移。進而,對積層體加熱並且進行使其自上下端壓縮之壓接,藉此將各層固定。 [先前技術文獻] [專利文獻]In the manufacturing process of the laminate, the sheets are transported layer by layer by the holder to the laminate platform. For example, the position of the sheet is aligned before being transported to the holder, and the aligned sheet is stacked on the stacking platform. By performing position alignment, the position shift between layers can be suppressed. Furthermore, the layered body is heated and pressure-bonded by compressing it from the upper and lower ends to fix each layer. [Prior Technical Literature] [Patent Literature]

[專利文獻1]國際公開第2017/150678號 [專利文獻2]日本專利特開2018-170521號公報[Patent Document 1] International Publication No. 2017/150678 [Patent Document 2] Japanese Patent Laid-Open No. 2018-170521

[發明所欲解決之課題][The problem to be solved by the invention]

然而,有如下情形,即,基於絕緣片材與金屬層之隨溫度變化之膨脹率及收縮率之差,於片材上產生翹曲或撓曲。若將具有產生翹曲或撓曲之片材之積層體壓接,則於壓接過程中片材之翹曲及撓曲得以消除,但於翹曲及撓曲之消除過程中,有片材之位置偏移之虞。However, there are cases in which warpage or deflection occurs on the sheet based on the difference between the temperature-dependent expansion rate and the shrinkage rate of the insulating sheet and the metal layer. If a laminate with a sheet that produces warpage or deflection is crimped, the warpage and deflection of the sheet can be eliminated during the crimping process, but in the process of eliminating the warpage and deflection, there is a sheet The risk of position shift.

因此,本發明之目的在於提供一種能夠於消除片材之翹曲或撓曲之後進行該片材之積層之積層裝置及積層體之製造方法。 [解決課題之技術手段]Therefore, the object of the present invention is to provide a layering device and a method of manufacturing a layered body capable of laminating the sheet after eliminating the warpage or deflection of the sheet. [Technical means to solve the problem]

本發明係關於一種積層裝置,其使於絕緣膜上積層有金屬層之片材積層複數層。該積層裝置具備積層平台、搬送保持器、及保持器用帶電器。於積層平台上積層片材。搬送保持器藉由真空吸附而保持片材且將其搬送至積層平台。保持器用帶電器朝保持於搬送保持器之片材照射荷電粒子。保持器用帶電器照射搬送中之片材之絕緣膜越薄則電壓越高之荷電粒子。The present invention relates to a laminate device in which a plurality of layers of a sheet material having a metal layer laminated on an insulating film are laminated. The stacking device includes a stacking platform, a transport holder, and a charger for the holder. Laminate sheets on a laminating platform. The transport holder holds the sheet by vacuum suction and transports it to the stacking platform. The charger for the holder irradiates charged particles to the sheet held by the transport holder. The holder charging device irradiates the charged particles whose voltage is higher as the insulating film of the sheet being conveyed is thinner.

根據上述構成,藉由對搬送中之片材照射荷電粒子而將該片材靜電吸附於搬送保持器,於該過程中翹曲及撓曲得以消除。此處,片材之絕緣膜越薄則該膜之面彈性模數越降低,由與金屬層之膨脹率差及收縮率差所導致之翹曲量及撓曲量越增加。因此,本發明中,照射搬送中之片材之絕緣膜越薄則電壓越高之荷電粒子。如此,藉由根據絕緣膜之厚度調節荷電粒子之電壓,能以較高之準確度消除片材之翹曲及撓曲。According to the above-mentioned structure, by irradiating the sheet material being conveyed with charged particles, the sheet material is electrostatically attracted to the conveying holder, and the warpage and deflection are eliminated in the process. Here, the thinner the insulating film of the sheet, the lower the surface elastic modulus of the film, and the greater the amount of warpage and deflection caused by the difference in expansion rate and shrinkage rate with the metal layer. Therefore, in the present invention, the thinner the insulating film of the sheet being conveyed, the higher the voltage of the charged particles. In this way, by adjusting the voltage of the charged particles according to the thickness of the insulating film, the warpage and deflection of the sheet can be eliminated with higher accuracy.

又,上述構成中,亦可設置平台用帶電器,該平台用帶電器朝積層於積層平台上之複數層片材中最上層之片材之露出面照射荷電粒子。該情形時,保持器用帶電器及平台用帶電器照射彼此等電壓之荷電粒子。In addition, in the above-mentioned configuration, a charger for a platform may be provided that irradiates charged particles on the exposed surface of the uppermost sheet among the plurality of sheets stacked on the stacking platform. In this case, the charger for the holder and the charger for the platform irradiate charged particles of equal voltage to each other.

根據上述構成,對真空吸附於搬送保持器之片材照射荷電粒子,並且對積層於積層平台上之複數層片材中最上層之片材之露出面亦照射荷電粒子。藉由使兩者之荷電粒子之電壓相等,而使片材吸附於搬送保持器之靜電吸附力、與使被搬送之片材吸附於積層平台上之最上層之片材之靜電吸附力一致。藉此,例如能夠於不會因靜電吸附而阻礙由吹送正壓空氣使片材自搬送保持器脫離之範圍內之最大電壓下,消除片材之翹曲及撓曲。According to the above configuration, the sheet material vacuum-adsorbed on the transport holder is irradiated with charged particles, and the exposed surface of the uppermost sheet of the plurality of layers of sheets laminated on the stacking platform is also irradiated with the charged particles. By making the voltages of the charged particles of the two equal, the electrostatic adsorption force of the sheet to be adsorbed to the transport holder is consistent with the electrostatic adsorption force of the sheet to be transported to the uppermost sheet on the stacking platform. Thereby, for example, it is possible to eliminate the warpage and deflection of the sheet under the maximum voltage within the range that does not hinder the separation of the sheet from the conveying holder by blowing the positive pressure air due to electrostatic adsorption.

又,本發明係關於一種積層裝置,其使於絕緣膜上積層有金屬層之片材積層複數層。該積層裝置具備積層平台、搬送保持器、保持器用帶電器、及攝像器。於積層平台上積層片材。搬送保持器藉由真空吸附而保持片材且將其搬送至積層平台。保持器用帶電器朝保持於搬送保持器之片材照射荷電粒子。攝像器拍攝保持於搬送保持器之片材之表面形狀。保持器用帶電器對基於由攝像器拍攝之片材之表面形狀而特定出的與搬送保持器之保持面分離之片材之隆起部分,照射電壓相較密接於保持面之片材之密接部分高的荷電粒子。In addition, the present invention relates to a layering device in which a plurality of layers of sheets in which metal layers are layered on an insulating film are layered. This layering device includes a layering platform, a transport holder, a charger for the holder, and a camera. Laminate sheets on a laminating platform. The transport holder holds the sheet by vacuum suction and transports it to the stacking platform. The charger for the holder irradiates charged particles to the sheet held by the transport holder. The camera photographs the surface shape of the sheet held by the transport holder. The charger for the holder irradiates the raised portion of the sheet separated from the holding surface of the conveying holder, which is specified based on the surface shape of the sheet captured by the camera, with a higher voltage than the close contact portion of the sheet closely attached to the holding surface Of charged particles.

根據上述構成,對片材之隆起部分照射相對高電壓之荷電粒子,對其周圍之密接部分相對地抑制靜電吸附力。藉此,一方面避免片材上產生過度之靜電吸附力,一方面能夠消除翹曲及撓曲。According to the above-mentioned configuration, relatively high-voltage charged particles are irradiated to the raised portion of the sheet, and the electrostatic attraction force is relatively suppressed in the close contact portion around it. In this way, on the one hand, excessive electrostatic adsorption force on the sheet is avoided, and on the other hand, warpage and deflection can be eliminated.

又,上述構成中,對片材之隆起部分照射之荷電粒子設定為,該片材之絕緣膜越薄則電壓越高。Furthermore, in the above configuration, the charged particles irradiated to the raised portion of the sheet material are set such that the thinner the insulating film of the sheet material, the higher the voltage.

如上所述,絕緣膜越薄,則片材之翹曲量及撓曲量越增加。藉由設定為絕緣膜越薄則荷電粒子之電壓越高,而能夠以較高之準確度消除翹曲及撓曲。As described above, the thinner the insulating film, the greater the amount of warpage and deflection of the sheet. By setting that the thinner the insulating film, the higher the voltage of the charged particles, which can eliminate warpage and deflection with higher accuracy.

又,上述構成中,保持器用帶電器於相較保持於搬送保持器之片材之露出面小之區域,規定該露出面上之荷電粒子之照射點。該情形時,保持器用帶電器僅限於照射點之至少一部分與保持於搬送保持器之片材之隆起部分重疊時照射荷電粒子。Furthermore, in the above-mentioned configuration, the charger for the holder defines the irradiation point of the charged particles on the exposed surface in an area smaller than the exposed surface of the sheet held by the transport holder. In this case, the charger for the holder is limited to irradiating charged particles when at least a part of the irradiation point overlaps with the raised portion of the sheet held by the transport holder.

根據上述構成,僅限於照射點之至少一部分與隆起部分重疊時照射荷電粒子,於除此以外之片材區域未照射荷電粒子。因此,避免片材上產生過度之靜電吸附力,且於積層平台上,能夠容易地使片材自保持器脫離。According to the above configuration, the charged particles are irradiated only when at least a part of the irradiation spot overlaps the ridge portion, and the charged particles are not irradiated on the other sheet regions. Therefore, excessive electrostatic adsorption force on the sheet is avoided, and the sheet can be easily detached from the holder on the stacking platform.

又,上述構成中,可設置對準平台,該對準平台供保持於搬送保持器之前之片材載置,並且將所載置之片材對位。又,可設置加壓構件,該加壓構件進而載置於對準平台上所載置之片材上,對該片材之整面進行加壓。該情形時,對準平台之片材載置區域之至少一部分由透光性構件構成。又,可設置對準相機,該對準相機通過透光性構件而拍攝載置於對準平台之片材。對準相機拍攝藉由加壓構件而壓抵於對準平台之片材。Furthermore, in the above configuration, an alignment platform may be provided for placing the sheet held in front of the transport holder and aligning the placed sheet. In addition, a pressing member may be provided, and the pressing member is further placed on the sheet placed on the alignment platform to press the entire surface of the sheet. In this case, at least a part of the sheet placement area of the alignment platform is composed of a light-transmitting member. In addition, an alignment camera may be provided, and the alignment camera uses a light-transmitting member to photograph the sheet placed on the alignment platform. Aim the camera to shoot the sheet pressed against the alignment platform by the pressing member.

根據上述構成,即便為具有翹曲或撓曲之片材,亦可藉由利用加壓構件將該片材壓抵於對準平台而消除該翹曲或撓曲。藉由拍攝此時之片材能夠進行精度較高之對準。According to the above-mentioned structure, even if it is a sheet material which has a warpage or a flexure, the warpage or flexure can be eliminated by pressing the sheet material against the alignment platform by a pressing member. High-precision alignment can be performed by shooting the sheet at this time.

又,本發明係關於一種積層體之製造方法,其製造包含複數層於絕緣膜上積層有金屬層之片材而構成之積層體。該製造方法具備積層步驟及壓接步驟。於積層步驟中,藉由真空吸附將片材保持於搬送保持器且搬送至積層平台,於該積層平台將片材依序積層。於壓接步驟中,對在積層平台積層之片材之積層體進行壓接而將各層固定。於積層步驟中,對保持於搬送保持器之搬送中之片材照射該片材之絕緣膜越薄則電壓越高之荷電粒子。In addition, the present invention relates to a method for manufacturing a laminated body, which manufactures a laminated body composed of a sheet including a plurality of layers and a metal layer laminated on an insulating film. This manufacturing method includes a stacking step and a crimping step. In the layering step, the sheets are held in the transport holder by vacuum suction and transported to the layering platform, and the sheets are sequentially layered on the layering platform. In the crimping step, the laminated body of the sheets laminated on the lamination platform is crimped to fix each layer. In the layering step, the sheet material held in the conveying holder is irradiated with charged particles whose voltage is higher as the insulating film of the sheet material is thinner.

又,於上述構成中,亦可於積層步驟中,朝保持於搬送保持器之搬送中之片材、及於積層平台上積層之複數層片材中最上層之片材之露出面,照射彼此相等電壓之荷電粒子。In addition, in the above-mentioned structure, in the lamination step, the exposed surface of the uppermost sheet of the sheets held in the conveying holder and the plurality of sheets laminated on the lamination platform may be irradiated to each other during the lamination step. Charged particles of equal voltage.

又,本發明係關於一種積層體之製造方法,其製造包含複數層於絕緣膜上積層有金屬層之片材而構成之積層體。該製造方法具備積層步驟及壓接步驟。於積層步驟中,藉由真空吸附將片材保持於搬送保持器且搬送至積層平台,於該積層平台將片材依序積層。於壓接步驟中,對在積層平台積層之片材之積層體進行壓接而將各層固定。於積層步驟中,對基於保持於搬送保持器之片材之表面形狀而特定出的與搬送保持器之保持面分離之片材之隆起部分,照射電壓相較密接於保持面之片材之密接部分高的荷電粒子。In addition, the present invention relates to a method for manufacturing a laminated body, which manufactures a laminated body composed of a sheet including a plurality of layers and a metal layer laminated on an insulating film. This manufacturing method includes a stacking step and a crimping step. In the layering step, the sheets are held in the transport holder by vacuum suction and transported to the layering platform, and the sheets are sequentially layered on the layering platform. In the crimping step, the laminated body of the sheets laminated on the lamination platform is crimped to fix each layer. In the layering step, the swelling part of the sheet separated from the holding surface of the transport holder, which is specified based on the surface shape of the sheet held on the transport holder, is applied to the close contact of the sheet that is closer to the holding surface than the holding surface. Part of the highly charged particles.

又,上述構成中,片材之絕緣膜越薄,對該片材之隆起部分照射之荷電粒子之電壓越高。 [發明之效果]Furthermore, in the above configuration, the thinner the insulating film of the sheet, the higher the voltage of the charged particles irradiated to the raised portion of the sheet. [Effects of Invention]

根據本發明,能夠於消除片材之翹曲或撓曲之後進行該片材之積層。According to the present invention, the lamination of the sheet can be performed after the warpage or deflection of the sheet is eliminated.

<積層體> 圖1中例示有由本實施形態之積層裝置製作之積層體100B。積層體100B係自最下層之片材L5積層至最上層之片材L1而成之最終積層體,與下述例如圖5所例示之積層中途之積層體100A於說明上有所區別。進而,為方便起見,積層中途之積層體100A亦包含僅將最下層之片材L5載置於積層平台80(參照圖4)之狀態。<Laminated body> FIG. 1 illustrates a laminate 100B produced by the laminate apparatus of this embodiment. The laminated body 100B is the final laminated body formed by laminating the sheet L5 of the lowest layer to the sheet L1 of the uppermost layer. Furthermore, for convenience, the layered body 100A in the middle of the layering also includes a state where only the sheet L5 of the lowermost layer is placed on the layering platform 80 (refer to FIG. 4).

又,於圖1〜圖21所示之實施形態中,最終積層體100B係由以片材L1〜L5構成之5層積層體而構成,但由本實施形態之積層裝置製成之積層體並不限定於該例。例如,本實施形態之積層裝置能夠將12層或20層等5層以外之複數層片材積層。In addition, in the embodiment shown in FIGS. 1 to 21, the final laminate 100B is composed of a 5-layer laminate composed of sheets L1 to L5, but the laminate made by the laminate device of this embodiment is not Limited to this example. For example, the laminating device of this embodiment can laminate multiple sheets of sheets other than 5 layers, such as 12 layers or 20 layers.

最終積層體100B亦可為例如安裝於通訊機器之電路基板。根據圖1之例,最終積層體100B係將複數層片材L1〜L5積層而形成。片材L1〜L5分別由例如於絕緣膜106上積層有金屬層104之複數層片材構成。絕緣膜106例如由熱塑性液晶聚合物構成。又,金屬層104例如由銅構成。The final laminate 100B may also be, for example, a circuit board mounted on a communication device. According to the example of FIG. 1, the final laminate 100B is formed by laminating a plurality of sheets L1 to L5. The sheets L1 to L5 are each composed of a plurality of sheets in which a metal layer 104 is laminated on an insulating film 106, for example. The insulating film 106 is made of, for example, a thermoplastic liquid crystal polymer. In addition, the metal layer 104 is made of copper, for example.

最下層之片材L5及最上層之片材L1以金屬層104露出之方式配置。例如最下層之片材L5相對於其他片材L1〜L4反轉配置。最上層之片材L1及最下層之片材L5之金屬層104可為例如於絕緣膜106之一面形成有金屬膜之所謂固體膜。The lowermost sheet L5 and the uppermost sheet L1 are arranged in such a way that the metal layer 104 is exposed. For example, the sheet L5 of the lowermost layer is arranged in reverse with respect to the other sheets L1 to L4. The metal layer 104 of the uppermost sheet L1 and the lowermost sheet L5 may be, for example, a so-called solid film in which a metal film is formed on one surface of the insulating film 106.

最上層之片材L1及最下層之片材L5之金屬層104於壓接製程中與壓接器90之經加熱之壓製面抵接。熔點較絕緣膜106相對高之金屬層104與經加熱之壓製面抵接,藉此可抑制最終積層體100B之與壓製面之抵接面熔融。The metal layer 104 of the uppermost sheet L1 and the lowermost sheet L5 abuts against the heated pressing surface of the crimping device 90 during the pressing process. The metal layer 104, which has a relatively higher melting point than the insulating film 106, is in contact with the heated pressing surface, thereby suppressing the melting of the contact surface of the final laminate 100B with the pressing surface.

又,於作為中間層之片材L2〜L4之金屬層104,形成有針對每一片材不同之配線圖案。就該點而言,片材L2〜L4亦被稱為附圖案之絕緣膜。又,片材L2〜L4之金屬層104藉由貫通於絕緣膜106之厚度方向之通孔102而連接。In addition, the metal layer 104 of the sheets L2 to L4 as the intermediate layer is formed with a different wiring pattern for each sheet. In this regard, the sheets L2 to L4 are also referred to as patterned insulating films. In addition, the metal layers 104 of the sheets L2 to L4 are connected by through holes 102 penetrating through the thickness direction of the insulating film 106.

又,各層之片材L1〜L5之絕緣膜106有時形成為厚度與其他層之片材不同。例如,越靠積層體上層,片材越厚。或者,越靠積層體上層,片材越薄。In addition, the insulating film 106 of the sheets L1 to L5 of each layer may be formed to have a thickness different from that of the sheets of other layers. For example, the closer to the upper layer of the laminate, the thicker the sheet. Alternatively, the closer to the upper layer of the laminate, the thinner the sheet.

又,如圖2、圖3之上段所例示,片材L1〜L5有時會產生翹曲或撓曲。例如基於絕緣膜106與金屬層104之膨脹率或收縮率之差,片材L1〜L5產生翹曲或撓曲。In addition, as illustrated in the upper stage of FIGS. 2 and 3, the sheets L1 to L5 may warp or bend. For example, based on the difference between the expansion rate or contraction rate of the insulating film 106 and the metal layer 104, the sheets L1 to L5 warp or flex.

如圖2、圖3之下段所例示,於壓接製程中,可消除該翹曲或撓曲,其結果,產生有翹曲或撓曲之層與其下層產生位置偏移。如下所述,本實施形態之積層裝置具備能夠於積層前消除各片材L1〜L5之翹曲或撓曲之構成。As shown in the lower part of Fig. 2 and Fig. 3, in the crimping process, the warpage or deflection can be eliminated, and as a result, the warped or deflection layer has a positional deviation from the lower layer. As described below, the laminating device of this embodiment has a structure capable of eliminating warpage or deflection of each sheet L1 to L5 before laminating.

再者,圖1中,作為片材之例,示出於絕緣膜106上形成有金屬層104之所謂貼合片材,但由本實施形態之積層裝置積層之片材並不限於該形態。例如,僅絕緣膜之類的僅一片電絕緣性膜亦可成為積層對象之片材。又,積層對象之片材亦可為將兩片電絕緣性膜貼合而成之貼合片材,或為於一片電絕緣性膜之兩面形成有金屬層之貼合片材。又,積層對象之片材亦可為將金屬層以一組電絕緣性片材夾持之貼合片材。進而,積層對象之片材亦可為於一面或兩面貼附PET膜或黏著片材之片材。In addition, in FIG. 1, as an example of the sheet, a so-called laminated sheet in which the metal layer 104 is formed on the insulating film 106 is shown, but the sheet laminated by the laminating apparatus of this embodiment is not limited to this form. For example, only one electrically insulating film such as an insulating film may be a sheet to be laminated. In addition, the sheet to be laminated may be a laminated sheet formed by bonding two electrically insulating films, or a laminated sheet having metal layers formed on both sides of one electrically insulating film. In addition, the sheet to be laminated may be a laminated sheet in which a metal layer is sandwiched by a set of electrically insulating sheets. Furthermore, the sheet to be laminated may also be a sheet with a PET film or an adhesive sheet attached to one or both sides.

<積層裝置之整體構成> 圖4、圖5中例示本實施形態之積層裝置10。以下,作為用以說明積層裝置10之佈局等之方向軸,適當使用X軸、Y軸及Z軸。X軸係沿積層用搬送保持器60之移動方向之軸。Y軸係與X軸於水平面上正交之軸。Z軸係與X軸及Y軸正交之鉛直軸,且與片材L1〜L5之積層方向相同。<Integral structure of laminated device> Fig. 4 and Fig. 5 illustrate the stacking apparatus 10 of this embodiment. Hereinafter, as the direction axis for explaining the layout of the layering device 10, etc., the X axis, the Y axis, and the Z axis are appropriately used. The X-axis is an axis along the moving direction of the transfer holder 60 for lamination. The Y axis is the axis orthogonal to the X axis on the horizontal plane. The Z axis is a vertical axis orthogonal to the X axis and the Y axis, and is the same as the stacking direction of the sheets L1 to L5.

又,對積層裝置10之各機構之配置進行說明時,片材保管庫30L1〜30L5側成為上游側,沿X軸之積層平台80側成為下游側。In the description of the arrangement of the various mechanisms of the layering apparatus 10, the sheet storage 30L1 to 30L5 side becomes the upstream side, and the layering platform 80 side along the X axis becomes the downstream side.

積層裝置10具備控制器20、片材保管庫30L1〜30L5、保管庫用搬送保持器40、對準平台50、積層用搬送保持器60、積層平台80、及壓接器90。進而,作為荷電粒子之照射機構,積層裝置10具備平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74。The stacking apparatus 10 includes a controller 20, sheet storage warehouses 30L1 to 30L5, a storage transport holder 40, an alignment platform 50, a stacking transport holder 60, a stacking platform 80, and a crimper 90. Furthermore, as a mechanism for irradiating charged particles, the layered device 10 includes a charger 68 for a platform, a charger 70 for a holder, a static remover 72 for a platform, and a static remover 74 for a holder.

於片材保管庫30L1〜30L5中,分別收容有片材L1〜L5。再者,圖4中,將片材L1〜L5作為所謂單片式片材而圖示,又,將片材保管庫30L1〜30L5作為收容單片式片材之匣盒而圖示,但本實施形態之積層裝置10並不限於該形態。例如亦可對片材L1〜L5分別形成連續形成有數片量之片材之片材卷,並且設置切割該片材卷之切刀。該情形時,片材保管庫30L1〜30L5構成為分別保持對應於片材L1〜L5之片材卷之捲筒保持器。The sheet materials L1 to L5 are respectively stored in the sheet material storage warehouses 30L1 to 30L5. Furthermore, in FIG. 4, the sheets L1 to L5 are shown as so-called single-piece sheets, and the sheet storage warehouses 30L1 to 30L5 are shown as cassettes for storing the single-piece sheets, but this The layering apparatus 10 of the embodiment is not limited to this form. For example, it is also possible to form a sheet roll in which several sheets are continuously formed on the sheets L1 to L5, and provide a cutter for cutting the sheet roll. In this case, the sheet storage warehouses 30L1 to 30L5 are configured as roll holders that respectively hold the sheet rolls corresponding to the sheets L1 to L5.

保管庫用搬送保持器40係於片材保管庫30L1〜30L5與對準平台50之間往復移動之搬送裝置。保管庫用搬送保持器40設置於相較積層用搬送保持器60更靠上游側,故亦被稱為「前段保持器」。The transport holder 40 for the storage is a transport device that reciprocates between the sheet storage 30L1-30L5 and the alignment platform 50. The transport holder 40 for storage is provided on the upstream side of the transport holder 60 for lamination, so it is also called a "front stage holder".

片材保管庫30L1〜30L5散佈於X軸方向及Y軸方向,故保管庫用搬送保持器40能夠於X軸方向及Y軸方向上移動。保管庫用搬送保持器40例如能夠沿未圖示之X軸平台及Y軸平台移動。The sheet storages 30L1 to 30L5 are scattered in the X-axis direction and the Y-axis direction, so the storage transport holder 40 can move in the X-axis direction and the Y-axis direction. The transport holder 40 for storage is movable along the X-axis stage and Y-axis stage which are not shown in figure, for example.

如圖5所例示,保管庫用搬送保持器40具備升降機構42。於升降機構42之下端設置有吸附板44。升降機構42使吸附板44於Z軸方向(鉛直方向)上移動。升降機構42例如構成為包含齒條、小齒輪機構、步進馬達或伺服馬達作為Z軸方向之移動機構。As illustrated in FIG. 5, the transport holder 40 for storage is provided with an elevating mechanism 42. A suction plate 44 is provided at the lower end of the lifting mechanism 42. The elevating mechanism 42 moves the suction plate 44 in the Z-axis direction (vertical direction). The elevating mechanism 42 is configured to include, for example, a rack and pinion mechanism, a stepping motor, or a servo motor as a moving mechanism in the Z-axis direction.

吸附板44例如於鋁板等金屬板上形成數個空氣孔。空氣孔之下端露出,上端連接於空氣配管46。對空氣配管46供給負壓(Vac)及正壓(Prs)之空氣。於片材L1〜L5吸附時將空氣配管46抽真空。於片材L1〜L5脫離時自空氣配管46輸送加壓空氣。於吸附板44之與片材L1〜L5之抵接面,亦可設置軟質之多孔質片材。The suction plate 44 has several air holes formed in a metal plate such as an aluminum plate, for example. The lower end of the air hole is exposed, and the upper end is connected to the air pipe 46. The air piping 46 is supplied with negative pressure (Vac) and positive pressure (Prs) air. When the sheets L1 to L5 are adsorbed, the air pipe 46 is evacuated. When the sheets L1 to L5 are detached, pressurized air is sent from the air pipe 46. A soft porous sheet can also be provided on the abutting surface of the adsorption plate 44 with the sheets L1 to L5.

如圖4所例示,對準平台50進行自保管庫用搬送保持器40搬送之片材L1〜L5之對位。對準平台50具備移動機構52、作為載置台之平台板53、及對準相機56。As shown in FIG. 4, the alignment platform 50 performs position alignment of the sheets L1 to L5 conveyed from the conveyance holder 40 for storage. The alignment platform 50 includes a moving mechanism 52, a platform plate 53 as a mounting table, and an alignment camera 56.

移動機構52使平台板53能夠沿X軸及Y軸移動,且使平台板53能夠以Z軸為旋轉軸而旋轉。平台板53具備作為透光性構件之透光板54。透光板54設置於供片材L1〜L5載置之片材載置區域之至少一部分。例如圖4所例示,平台板53之至少相當於片材L1〜L5之四角之部位由透光板54構成。或者,代替圖4所例示之形態,亦可包含相當於片材L1〜L5之四角之部位在內,於平台板53設置一片透光板54。The moving mechanism 52 enables the platform plate 53 to move along the X axis and the Y axis, and enables the platform plate 53 to rotate about the Z axis as a rotation axis. The platform board 53 includes a light-transmitting plate 54 as a light-transmitting member. The light-transmitting plate 54 is provided in at least a part of the sheet placement area where the sheets L1 to L5 are placed. For example, as illustrated in FIG. 4, at least parts of the platform plate 53 corresponding to the four corners of the sheets L1 to L5 are constituted by a light-transmitting plate 54. Alternatively, instead of the form illustrated in FIG. 4, a light-transmitting plate 54 may be provided on the platform plate 53 including the parts corresponding to the four corners of the sheets L1 to L5.

對準相機56於平台板53下設置複數個。例如於能夠拍攝片材L1〜L5之四角、或對角線上之兩個角之位置,配置對準相機56。對準相機56能夠通過透光板54(透光性構件)而拍攝載置於平台板53上之片材L1〜L5。所載置之片材L1〜L5之對準製程將於以下敍述。A plurality of cameras 56 are arranged under the platform board 53. For example, the alignment camera 56 is arranged at a position where the four corners of the sheets L1 to L5 can be photographed, or two corners on the diagonal line. The alignment camera 56 can photograph the sheets L1 to L5 placed on the platform plate 53 through the light-transmitting plate 54 (light-transmitting member). The alignment process of the placed sheets L1 to L5 will be described below.

如圖4所例示,積層用搬送保持器60藉由真空吸附保持由對準平台50對位後之片材L1〜L5,且將其等搬送至積層平台80。例如將對準平台50及積層平台80配置於X軸上之情形時,積層用搬送保持器60能夠僅沿X軸移動。As shown in FIG. 4, the lamination transport holder 60 holds the sheets L1 to L5 aligned by the alignment platform 50 by vacuum suction, and transports them to the lamination platform 80. For example, when the alignment platform 50 and the build-up platform 80 are arranged on the X-axis, the build-up transport holder 60 can move only along the X-axis.

如圖5所例示,積層用搬送保持器60具備與保管庫用搬送保持器40大致相同之構造。即,積層用搬送保持器60具備升降機構62、設置於升降機構62下端之吸附板64、及連接於吸附板64之空氣配管66。As illustrated in FIG. 5, the transport holder for lamination 60 has a structure substantially the same as that of the transport holder 40 for storage. That is, the transport holder 60 for lamination includes an elevating mechanism 62, a suction plate 64 provided at the lower end of the elevating mechanism 62, and an air pipe 66 connected to the suction plate 64.

升降機構62使吸附板64沿Z軸方向(鉛直方向)移動。升降機構62例如構成為包含齒條、小齒輪機構、及步進馬達或伺服馬達作為Z軸方向之移動機構。The lifting mechanism 62 moves the suction plate 64 in the Z-axis direction (vertical direction). The elevating mechanism 62 is configured to include, for example, a rack and pinion mechanism, and a stepping motor or a servo motor as a moving mechanism in the Z-axis direction.

吸附板64例如於鋁板等金屬板上形成複數個空氣孔。空氣孔之下端露出,上端連接於空氣配管66。空氣配管66被供給負壓(Vac)及正壓(Prs)之空氣。於片材L1〜L5吸附時自空氣配管66饋入空氣。於片材L1〜L5脫離時自空氣配管66輸送加壓空氣。於吸附板64之與片材L1〜L5之抵接面,亦可設置軟質之多孔質片材。The suction plate 64 has a plurality of air holes formed in a metal plate such as an aluminum plate, for example. The lower end of the air hole is exposed, and the upper end is connected to the air pipe 66. The air pipe 66 is supplied with negative pressure (Vac) and positive pressure (Prs) air. When the sheets L1 to L5 are adsorbed, air is fed from the air pipe 66. When the sheets L1 to L5 are detached, pressurized air is sent from the air pipe 66. A soft porous sheet can also be provided on the abutting surface of the adsorption plate 64 with the sheets L1 to L5.

如圖4所例示,於積層平台80上積層片材L1〜L5。於形成最終積層體100B(參照圖1)之積層平台80之載置面,可形成用以保持最下層之片材L5之吸附孔(未圖示)。如圖5所例示,該吸附孔連接於空氣配管82。藉由自空氣配管82饋入負壓,將最下層之片材L5保持於積層平台80。又,亦可代替真空吸附,而於積層平台80之載置面貼附黏著片材。As shown in FIG. 4, the sheets L1 to L5 are laminated on the laminated platform 80. On the placement surface of the laminated platform 80 forming the final laminated body 100B (refer to FIG. 1), suction holes (not shown) for holding the lowermost sheet L5 can be formed. As shown in FIG. 5, the suction hole is connected to an air pipe 82. By feeding negative pressure from the air pipe 82, the sheet L5 of the lowermost layer is held on the stacking platform 80. In addition, instead of vacuum suction, an adhesive sheet may be attached to the placement surface of the build-up platform 80.

如圖4所例示,於積層裝置10,設置有對積層用搬送保持器60、由該保持器搬送之片材L1〜L5、及於積層平台積層之積層中途之積層體100A照射荷電粒子之帶電器及除電器。As shown in FIG. 4, the laminating device 10 is provided with a transport holder 60 for laminating, the sheets L1 to L5 transported by the holder, and a belt for irradiating charged particles to the laminate 100A in the middle of the laminating of the laminating platform. Electrical appliances and in addition to electrical appliances.

具體而言,積層裝置10具備平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74。該等帶電器及除電器例如由電離器構成。Specifically, the layered device 10 includes a charger 68 for a platform, a charger 70 for a holder, a static remover 72 for a platform, and a static remover 74 for a holder. These chargers and eliminators are composed of ionizers, for example.

平台用帶電器68朝積層平台80之載置面照射荷電粒子。又,如圖5所例示,平台用帶電器68朝積層於積層平台80上之複數個片材L3〜L5中最上層之片材L3之露出面照射荷電粒子。例如,平台用帶電器68能夠與積層平台80相對移動。具體而言,如圖4所例示,平台用帶電器68安裝於積層用搬送保持器60之下游端(偏靠積層平台80之位置),且能夠與積層用搬送保持器60一起於X軸上移動。The charger 68 for the platform irradiates charged particles to the mounting surface of the laminated platform 80. Furthermore, as shown in FIG. 5, the stage charger 68 irradiates charged particles on the exposed surface of the uppermost sheet L3 among the plurality of sheets L3 to L5 stacked on the stacking platform 80. For example, the charger 68 for the platform can move relative to the build-up platform 80. Specifically, as shown in FIG. 4, the charger 68 for the stage is installed at the downstream end of the transfer holder for build-up 60 (a position biased against the build-up platform 80), and can be mounted on the X axis together with the transfer holder for build-up 60 move.

例如,平台用帶電器68於圖5所例示之相較最上層之片材L3之露出面小的區域,規定該露出面上之荷電粒子之照射點。例如圖5所示,相較積層平台80及片材L3〜L5之X軸方向長度短之區域成為平台用帶電器68之最上層之片材L3之露出面上的照射點。再者,照射點之Y軸方向長度可為積層平台80及片材L3〜L5之Y軸方向長度以上。藉由積層平台80與平台用帶電器68沿X軸方向相對移動,而能夠遍及積層平台80之載置面及積層中途之積層體100A之最上表面之整面照射荷電粒子。For example, the charger 68 for a platform is illustrated in FIG. 5 in a region smaller than the exposed surface of the uppermost sheet L3, and defines the irradiation point of the charged particles on the exposed surface. For example, as shown in FIG. 5, a region having a shorter length in the X-axis direction than the laminated platform 80 and the sheets L3 to L5 becomes the irradiation spot on the exposed surface of the uppermost sheet L3 of the platform charger 68. Furthermore, the length of the irradiation point in the Y-axis direction may be greater than the length of the layered platform 80 and the sheet materials L3 to L5 in the Y-axis direction. By the relative movement of the layered platform 80 and the platform charger 68 in the X-axis direction, the charged particles can be irradiated over the placement surface of the layered platform 80 and the entire upper surface of the layered body 100A in the middle of the layering.

保持器用帶電器70及保持器用除電器74能夠與積層用搬送保持器60沿X軸方向、亦即積層用搬送保持器60之移動方向相對移動。例如,保持器用帶電器70及保持器用除電器74配置成,設置於對準平台50及積層平台80之間,且其上供積層用搬送保持器60通過。The holder charger 70 and the holder static remover 74 can move relative to the stacking transport holder 60 in the X-axis direction, that is, in the moving direction of the stacking transport holder 60. For example, the holder charger 70 and the holder static remover 74 are arranged so as to be provided between the alignment platform 50 and the build-up platform 80, and the transfer holder 60 for the build-up can pass therethrough.

例如,保持器用帶電器70及保持器用除電器74朝上方(Z軸正向)照射荷電粒子。如上所述,積層用搬送保持器60將片材L1〜L5真空吸附於其下端。因此,若於積層用搬送保持器60在保持器用帶電器70及保持器用除電器74上移動時照射荷電粒子,則荷電粒子入射至被搬送之片材L1〜L5之露出面。For example, the holder charging device 70 and the holder removing device 74 irradiate the charged particles upward (the Z-axis positive direction). As described above, the transport holder 60 for lamination vacuum sucks the sheets L1 to L5 to the lower end thereof. Therefore, if the charged particles are irradiated when the carrier holder 60 for stacking is moved on the charger 70 for holder and the static remover 74 for holder, the charged particles enter the exposed surfaces of the conveyed sheets L1 to L5.

保持器用帶電器70及保持器用除電器74於相較保持於積層用搬送保持器60之片材L1〜L5之露出面小之區域,規定該露出面上之荷電粒子之照射點。例如,相較片材L1〜L5之X軸方向長度短之區域成為保持器用帶電器70及保持器用除電器74之於片材L1〜L5之露出面上之照射點。再者,照射點之Y軸方向長度可為片材L1〜L5之Y軸方向長度以上。藉由積層用搬送保持器60與保持器用帶電器70及保持器用除電器74沿X軸方向相對移動,而能夠遍及被搬送至積層用搬送保持器60之片材L1〜L5之露出面之整面照射荷電粒子。The holder charging device 70 and the holder removing device 74 define the irradiation point of the charged particles on the exposed surface in an area smaller than the exposed surface of the sheets L1 to L5 held in the laminated transport holder 60. For example, a region having a shorter length in the X-axis direction compared to the sheets L1 to L5 becomes the irradiation spot on the exposed surfaces of the sheets L1 to L5 of the holder charging device 70 and the holder removing device 74. Furthermore, the length of the irradiation spot in the Y-axis direction may be longer than the length of the sheets L1 to L5 in the Y-axis direction. By relatively moving in the X-axis direction of the carrier holder 60 for the lamination, the charger 70 for the holder, and the eliminator 74 for the holder, it is possible to cover the entire exposed surface of the sheets L1 to L5 that are conveyed to the carrier holder 60 for the lamination. The surface is irradiated with charged particles.

平台用除電器72例如可相對於積層平台80固定。例如,平台用除電器72能夠遍及積層平台80之載置面之整面而照射荷電粒子。亦即,平台用除電器72設定為,與平台用帶電器68、保持器用帶電器70、及保持器用除電器74相比,積層平台80上之荷電粒子之照射點變寬。The neutralizer 72 for the platform may be fixed to the build-up platform 80, for example. For example, the static remover 72 for the platform can irradiate the charged particles over the entire surface of the placement surface of the laminated platform 80. That is, the platform-use static remover 72 is set so that the irradiation spot of the charged particles on the laminated platform 80 becomes wider compared with the platform-use charger 68, the holder-use charger 70, and the holder-use static remover 74.

平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74與荷電粒子之照射對象即片材L1〜L5之分開距離可為10 mm以上且120 mm以下。進而,該分開距離亦可維持為50 mm。關於該點,亦可於平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74設置調整Z軸方向之位置之Z升降機構。The distance between the charger 68 for the platform, the charger 70 for the holder, the static remover 72 for the platform, and the static remover 74 for the holder, and the sheets L1 to L5, which are the objects to be irradiated by the charged particles, may be 10 mm or more and 120 mm or less. Furthermore, the separation distance can also be maintained at 50 mm. Regarding this point, a Z lifting mechanism for adjusting the position of the Z-axis direction may be provided in the platform charger 68, the holder charger 70, the platform static remover 72, and the holder static remover 74.

又,平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74均能夠照射具有-50 kV<V<-5 kV、5kv<V<50 kV之範圍之電壓值V的荷電粒子。In addition, the charger 68 for the platform, the charger 70 for the holder, the static remover 72 for the platform, and the static remover 74 for the holder can all be irradiated with voltages in the range of -50 kV<V<-5 kV, 5kv<V<50 kV Charged particles of value V.

例如以下所述,保持器用帶電器70為了消除被搬送至積層用搬送保持器60之片材L1〜L5之翹曲、撓曲而照射荷電粒子。此處,藉由照射低於-5 kV之電壓值、或超過5 kV之電壓值之荷電粒子而可良好地消除片材L1〜L5之翹曲、撓曲。又,藉由將電壓值設為高於-50 kV之電壓值、或未達50 kV之電壓值,而能夠抑制片材L1〜L5之絕緣破壞等之破損。For example, as described below, the charger 70 for a holder irradiates charged particles in order to eliminate warpage and deflection of the sheets L1 to L5 that are transported to the transport holder 60 for lamination. Here, by irradiating charged particles with a voltage value of less than -5 kV or a voltage value of more than 5 kV, the warpage and deflection of the sheets L1 to L5 can be eliminated well. In addition, by setting the voltage value to a voltage value higher than -50 kV or a voltage value less than 50 kV, it is possible to suppress damage such as insulation breakdown of the sheets L1 to L5.

圖6所例示之控制器20控制積層裝置10之各機器。控制器20例如由電腦構成。即,控制器20具備輸入輸出控制器21、CPU22、ROM23、RAM24、及硬碟驅動器(HDD)25,該等連接於內部匯流排28。進而,控制器20具備滑鼠或鍵盤等輸入部26、及顯示器等顯示部27,且該等連接於內部匯流排28。The controller 20 illustrated in FIG. 6 controls each device of the layering apparatus 10. The controller 20 is constituted by, for example, a computer. That is, the controller 20 includes an input/output controller 21, a CPU 22, a ROM 23, a RAM 24, and a hard disk drive (HDD) 25, and these are connected to the internal bus 28. Furthermore, the controller 20 includes an input unit 26 such as a mouse or a keyboard, and a display unit 27 such as a display, and these are connected to the internal bus 28.

於控制器20之記憶部即ROM23中,記憶用以執行圖8所例示之電壓設定流程及圖9〜圖18所例示之積層製程之程式。又,該程式當然由通訊手段提供,且亦能夠儲存於CD-ROM或USB記憶體等電腦可讀取之記錄媒體中而執行。In the memory portion of the controller 20, that is, the ROM 23, a program for executing the voltage setting process illustrated in FIG. 8 and the build-up process illustrated in FIGS. 9 to 18 is stored. Moreover, the program is of course provided by communication means, and can also be stored in a computer-readable recording medium such as CD-ROM or USB memory for execution.

記憶於ROM23、或由通訊手段或記錄媒體提供之程式藉由構成控制器20之電腦之CPU22執行。藉由執行該程式而於控制器20中設置如圖7之功能塊。The program stored in the ROM 23 or provided by the communication means or recording medium is executed by the CPU 22 of the computer constituting the controller 20. By executing the program, the controller 20 is provided with functional blocks as shown in FIG. 7.

即,控制器20具備保管庫用搬送保持器控制部110、對準平台控制部112、積層用搬送保持器控制部114、片材資訊記憶部116、帶電器控制部118、除電器控制部120、及壓接器控制部122。That is, the controller 20 includes a storage transport holder control unit 110, an alignment platform control unit 112, a stacking transport holder control unit 114, a sheet information storage unit 116, a charger control unit 118, and a static eliminator control unit 120 , And the crimper control unit 122.

如圖7所例示,保管庫用搬送保持器控制部110控制保管庫用搬送保持器40之動作。例如,保管庫用搬送保持器控制部110自圖4所例示之片材保管庫30L1〜30L5中設定片材未保持之保管庫用搬送保持器40之移動目的地。As illustrated in FIG. 7, the storage transport holder control unit 110 controls the operation of the storage transport holder 40. For example, the storage transport holder control unit 110 sets the movement destination of the storage transport holder 40 for which the sheet is not held from the sheet storages 30L1 to 30L5 illustrated in FIG. 4.

例如,保管庫用搬送保持器控制部110具備片材計數器111。於片材計數器111中,記憶有指定作為保管庫用搬送保持器40之移動目的地之片材保管庫30L1〜30L5之順序。For example, the transport holder control unit 110 for storage includes a sheet counter 111. In the sheet counter 111, the order of designating the sheet storage warehouses 30L1 to 30L5 as the movement destination of the transport holder 40 for the storage warehouse is memorized.

例如,保管庫用搬送保持器控制部110按片材保管庫30L5、片材保管庫30L4、片材保管庫30L3、片材保管庫30L2、片材保管庫30L1之順序指定保管庫用搬送保持器40之移動目的地。 於指定片材保管庫30L1之後,保管庫用搬送保持器控制部110將保管庫用搬送保持器40之移動目的地恢復為片材保管庫30L5。For example, the storage transport holder control unit 110 specifies the storage transport holders in the order of sheet storage 30L5, sheet storage 30L4, sheet storage 30L3, sheet storage 30L2, and sheet storage 30L1. The mobile destination of 40. After designating the sheet storage 30L1, the storage transport holder control unit 110 restores the movement destination of the storage transport holder 40 to the sheet storage 30L5.

又,例如,於片材計數器111中,作為初始設定,設定片材保管庫30L5作為積層裝置10啟動時之、亦即最初之保管庫用搬送保持器40之移動目的地。或者,由機器管理者等將積層裝置10啟動時之保管庫用搬送保持器40之移動目的地設定為任意之片材保管庫30L1〜30L5。In addition, for example, in the sheet counter 111, as an initial setting, the sheet storage 30L5 is set as the movement destination of the first storage transport holder 40 when the stacking apparatus 10 is activated. Alternatively, the machine manager or the like may set the movement destination of the storage transport holder 40 when the stacking apparatus 10 is activated to any of the sheet storages 30L1 to 30L5.

又,保管庫用搬送保持器控制部110將保持有片材L1〜L5之保管庫用搬送保持器40之搬送目的地自片材保管庫30L1〜30L5設定為對準平台50。In addition, the storage transport holder control unit 110 sets the transport destination of the storage transport holder 40 holding the sheets L1 to L5 from the sheet storages 30L1 to 30L5 as the alignment platform 50.

此外,保管庫用搬送保持器控制部110控制吸附板44之下降及上升動作。例如,當保管庫用搬送保持器40到達指定為移動目的地之片材保管庫30L1〜30L5上時,保管庫用搬送保持器控制部110使保管庫用搬送保持器40之吸附板44下降。例如,保管庫用搬送保持器40使升降機構42驅動而使吸附板44下降至抵接於片材保管庫30L1〜30L5之最上層之片材L1〜L5為止。又,當吸附板44吸附片材L1〜L5時,保管庫用搬送保持器控制部110使升降機構42驅動而使吸附板44上升。In addition, the storage transport holder control unit 110 controls the descending and ascending operations of the suction plate 44. For example, when the storage transport holder 40 reaches the sheet storages 30L1 to 30L5 designated as the movement destination, the storage transport holder control unit 110 lowers the suction plate 44 of the storage transport holder 40. For example, the storage transport holder 40 drives the elevating mechanism 42 to lower the suction plate 44 until it abuts on the uppermost sheet L1 to L5 of the sheet storage 30L1 to 30L5. In addition, when the suction plate 44 suctions the sheets L1 to L5, the storage transport holder control unit 110 drives the elevating mechanism 42 to raise the suction plate 44.

又,當保管庫用搬送保持器40到達指定為片材L1〜L5之搬送目的地之對準平台50之平台板53上時,保管庫用搬送保持器控制部110使升降機構42驅動而使吸附板44下降至抵接於平台板53為止。又,當片材L1〜L5自吸附板44脫離時,保管庫用搬送保持器控制部110使升降機構42驅動而使吸附板44上升。In addition, when the storage transport holder 40 reaches the platform plate 53 of the alignment platform 50 designated as the transport destination of the sheets L1 to L5, the storage transport holder control unit 110 drives the elevating mechanism 42 to make The suction plate 44 descends until it abuts on the platform plate 53. In addition, when the sheets L1 to L5 are separated from the suction plate 44, the storage transport holder control unit 110 drives the elevating mechanism 42 to raise the suction plate 44.

關於上述片材L1〜L5之吸附及脫離,保管庫用搬送保持器控制部110控制圖5所例示之空氣配管46之內壓。例如,使片材L1〜L5自片材保管庫30L1〜30L5吸附至保管庫用搬送保持器40時,保管庫用搬送保持器控制部110使空氣配管46為負壓狀態。例如,保管庫用搬送保持器控制部110對設置於自空氣配管46分支且與負壓源(未圖示)連接之分支配管之閥(未圖示)輸出打開指令。Regarding the adsorption and detachment of the aforementioned sheets L1 to L5, the storage transport holder control unit 110 controls the internal pressure of the air pipe 46 illustrated in FIG. 5. For example, when the sheets L1 to L5 are sucked from the sheet storages 30L1 to 30L5 to the storage transport holder 40, the storage transport holder control unit 110 causes the air pipe 46 to be in a negative pressure state. For example, the transport holder control unit 110 for storage outputs an opening command to a valve (not shown) provided in a branch pipe branched from the air pipe 46 and connected to a negative pressure source (not shown).

又,自保管庫用搬送保持器40將搬送中之片材L1〜L5交遞至對準平台50之平台板53時,保管庫用搬送保持器控制部110對設置於自空氣配管46分支且與負壓源連接之分支配管之閥輸出關閉指令。其後,保管庫用搬送保持器控制部110對設置於自空氣配管46分支且與正壓源(未圖示)連接之分支配管之閥(未圖示)輸出打開指令。In addition, when the transport holder 40 for the storage transfers the sheets L1 to L5 that are being transported to the platform plate 53 of the alignment platform 50, the transport holder control unit 110 for the storage pair is installed in the air piping 46 branching and The valve of the branch piping connected to the negative pressure source outputs a closing command. After that, the storage transport holder control unit 110 outputs an opening command to a valve (not shown) provided in a branch pipe branched from the air pipe 46 and connected to a positive pressure source (not shown).

如圖5、7所例示,對準平台控制部112基於自對準相機56取得之載置於平台板53上之片材之圖像,產生對移動機構52之驅動指令。對準平台控制部112例如將對準相機56之拍攝圖像與預先記憶之參照圖像加以比較,求出片材自參照圖像中設定之目標位置、角度之位置偏移及角度偏移。進而,對準平台控制部112對移動機構52輸出用以消除所求出之偏移之驅動指令。As shown in FIGS. 5 and 7, the alignment platform control unit 112 generates a drive command to the moving mechanism 52 based on the image of the sheet placed on the platform plate 53 obtained by the self-aligning camera 56. The alignment platform control unit 112, for example, compares the captured image of the alignment camera 56 with the reference image stored in advance, and obtains the target position, angle, and angle offset of the sheet material from the reference image. Furthermore, the alignment platform control unit 112 outputs to the moving mechanism 52 a drive command for eliminating the obtained offset.

積層用搬送保持器控制部114控制積層用搬送保持器60之動作。例如,積層用搬送保持器控制部114使積層用搬送保持器60於對準平台50與積層平台80之間往復移動。The stacking transport holder control unit 114 controls the operation of the stacking transport holder 60. For example, the transfer holder for build-up control unit 114 reciprocates the transfer holder for build-up 60 between the alignment platform 50 and the build-up platform 80.

此外,積層用搬送保持器控制部114控制吸附板64之下降及上升動作。例如,當積層用搬送保持器60到達圖5所例示被指定為移動目的地之對準平台50之平台板53上時,積層用搬送保持器控制部114使吸附板64下降。例如,積層用搬送保持器控制部114使升降機構62驅動,從而使吸附板64下降至抵接於平台板53為止。又,當吸附板64吸附片材L1〜L5時,積層用搬送保持器控制部114使升降機構62驅動而使吸附板64上升。In addition, the stacking carrier holder control unit 114 controls the descending and ascending operations of the suction plate 64. For example, when the lamination carrier 60 reaches the platform plate 53 of the alignment platform 50 designated as the movement destination illustrated in FIG. 5, the lamination carrier controller 114 lowers the suction plate 64. For example, the stacking transport holder control unit 114 drives the elevating mechanism 62 to lower the suction plate 64 until it abuts on the platform plate 53. In addition, when the suction plate 64 suctions the sheets L1 to L5, the lamination transport holder control unit 114 drives the elevating mechanism 62 to raise the suction plate 64.

又,當積層用搬送保持器60到達被指定為片材L1〜L5之搬送目的地之積層平台80上時,積層用搬送保持器控制部114使積層用搬送保持器60之吸附板64下降。例如,積層用搬送保持器控制部114使升降機構62驅動,從而使吸附板64下降至抵接於積層平台80為止。又,當片材L1〜L5自吸附板64脫離時,積層用搬送保持器控制部114使升降機構62驅動而使吸附板64上升。In addition, when the lamination transport holder 60 reaches the lamination platform 80 designated as the transport destination of the sheets L1 to L5, the lamination transport holder control unit 114 lowers the suction plate 64 of the lamination transport holder 60. For example, the stacking transport holder control unit 114 drives the elevating mechanism 62 to lower the suction plate 64 until it abuts the stacking platform 80. In addition, when the sheets L1 to L5 are separated from the suction plate 64, the lamination transport holder control unit 114 drives the elevating mechanism 62 to raise the suction plate 64.

關於上述片材L1〜L5之吸附及脫離,積層用搬送保持器控制部114控制圖5所例示之空氣配管66之內壓。例如,使積層用搬送保持器60自平台板53吸附片材L1〜L5時,積層用搬送保持器控制部114對設置於自空氣配管66分支且與負壓源(未圖示)連接之分支配管之閥(未圖示)輸出打開指令。Regarding the adsorption and detachment of the above-mentioned sheets L1 to L5, the lamination transport holder control unit 114 controls the internal pressure of the air pipe 66 illustrated in FIG. 5. For example, when the lamination transport holder 60 sucks the sheets L1 to L5 from the platform plate 53, the lamination transport holder control unit 114 is provided on a branch that is branched from the air pipe 66 and connected to a negative pressure source (not shown) The piping valve (not shown) outputs an open command.

又,自積層用搬送保持器60將搬送中之片材L1〜L5交遞至積層平台80時,積層用搬送保持器控制部114對自空氣配管66分支且與負壓源(未圖示)連接之分支配管對閥輸出關閉指令。其後,積層用搬送保持器控制部114對設置於自空氣配管66分支且與正壓源(未圖示)連接之分支配管上之閥(未圖示)輸出打開指令。In addition, when the transport holder 60 for laminating transfers the sheets L1 to L5 that are being transported to the laminating platform 80, the transport holder controller 114 for laminating is branched from the air pipe 66 and connected to a negative pressure source (not shown) The connected branch piping outputs a closing command to the valve. After that, the lamination carrier holder control unit 114 outputs an opening command to a valve (not shown) provided on a branch pipe branched from the air pipe 66 and connected to a positive pressure source (not shown).

帶電器控制部118進行平台用帶電器68及保持器用帶電器70之荷電粒子之照射控制。照射控制包含照射時點之控制、及荷電粒子之電壓控制。如下所述,電壓控制與除電器控制部120之電壓控制一起執行。The charger control unit 118 performs irradiation control of the charged particles of the charger 68 for the platform and the charger 70 for the holder. Irradiation control includes the control of the time of irradiation and the voltage control of the charged particles. As described below, the voltage control is executed together with the voltage control of the eliminator control unit 120.

如圖7所例示,自積層用搬送保持器控制部114對帶電器控制部118發送積層用搬送保持器60之座標資訊。帶電器控制部118基於該座標資訊,設定平台用帶電器68及保持器用帶電器70之荷電粒子之照射時點。再者,帶電器控制部118亦可以如下方式控制平台用帶電器68及保持器用帶電器70,即,確認由未圖示之相機等拍攝之積層用搬送保持器60之實際位置,於積層用搬送保持器60到達規定之位置之時點照射荷電粒子。As shown in FIG. 7, the self-stacking transport holder control unit 114 transmits the coordinate information of the laminating transport holder 60 to the charger control unit 118. Based on the coordinate information, the charger control unit 118 sets the irradiation time point of the charged particles of the charger 68 for the platform and the charger 70 for the holder. Furthermore, the charger control unit 118 may also control the charger 68 for the platform and the charger 70 for the holder in the following way, that is, confirm the actual position of the transport holder 60 for the lamination taken by a camera not shown in the figure, and use it for the lamination. When the transport holder 60 reaches a predetermined position, the charged particles are irradiated.

除電器控制部120進行平台用除電器72及保持器用除電器74之荷電粒子之照射控制。照射控制包含照射時點之控制、及荷電粒子之電壓控制。The static eliminator control unit 120 performs irradiation control of the charged particles of the static eliminator 72 for the platform and the static eliminator 74 for the holder. Irradiation control includes the control of the time of irradiation and the voltage control of the charged particles.

如圖7所例示,自積層用搬送保持器控制部114對除電器控制部120發送積層用搬送保持器60之座標資訊。除電器控制部120基於該座標資訊,設定平台用除電器72及保持器用除電器74之荷電粒子之照射時點。再者,除電器控制部120亦可以如下方式控制保持器用除電器74,即,確認由未圖示之相機等拍攝之積層用搬送保持器60之實際位置,於積層用搬送保持器60到達規定之位置之時點照射荷電粒子。As shown in FIG. 7, the self-stacking transport holder control unit 114 transmits the coordinate information of the laminating transport holder 60 to the static eliminator control unit 120. Based on the coordinate information, the static eliminator control unit 120 sets the irradiation time point of the charged particles of the static eliminator 72 for the platform and the static eliminator 74 for the holder. Furthermore, the static remover control unit 120 may also control the static remover 74 for the holder by confirming the actual position of the stacking transport holder 60 photographed by a camera not shown in the figure, and reaching the specified position at the stacking transport holder 60 Irradiate charged particles at the point in time.

<電壓設定流程> 圖8中,例示帶電器控制部118及除電器控制部120對平台用帶電器68、保持器用帶電器70、平台用除電器72、及保持器用除電器74之各者之電壓設定流程。<Voltage setting procedure> In FIG. 8, the voltage setting flow of the charger control unit 118 and the neutralizer control unit 120 for each of the platform charger 68, the holder charger 70, the platform static remover 72, and the holder static remover 74 is exemplified.

例如,圖8之電壓設定流程針對收容於片材保管庫30L1〜30L5之片材L1〜L5之每一批次而執行。所謂批次係指例如將片材L1〜L5按單片切斷前之片材卷之單位,簡言之,其表示可將各片材L1〜L5之絕緣膜106之厚度視為固定之單位。For example, the voltage setting process in FIG. 8 is executed for each batch of sheets L1 to L5 stored in the sheet storage warehouses 30L1 to 30L5. The so-called batch refers to, for example, the unit of the sheet roll before the sheet material L1~L5 is cut into a single sheet. In short, it means that the thickness of the insulating film 106 of each sheet material L1~L5 can be regarded as a fixed unit .

例如,於新一批次之各第一片片材L1〜L5積層時,執行圖8之電壓設定流程。於第二片以後,將針對每一片材L1〜L5設定之電壓V0〜V4記憶於帶電器控制部118及除電器控制部120。進而,基於自片材計數器111發送之要搬送至積層用搬送保持器60之片材L1〜L5而設定電壓V0〜V4。For example, when the first sheets L1 to L5 of a new batch are laminated, the voltage setting process of FIG. 8 is executed. After the second sheet, the voltages V0 to V4 set for each sheet L1 to L5 are stored in the charger control section 118 and the static eliminator control section 120. Furthermore, the voltages V0 to V4 are set based on the sheets L1 to L5 sent from the sheet counter 111 to be transported to the stacking transport holder 60.

如圖7、圖8所例示,帶電器控制部118特定出要搬送至積層用搬送保持器60之片材,換言之,特定出接下來要積層於積層中途之積層體100A之片材(取得片材編號)(S10)。As shown in Figs. 7 and 8, the charger control unit 118 specifies the sheet to be transported to the transport holder 60 for the lamination, in other words, specifies the sheet of the laminate 100A to be laminated in the middle of the lamination (acquisition sheet Material number) (S10).

帶電器控制部118參照片材資訊記憶部116,取得搬送對象片材之片材厚度資訊(S12)。繼而,帶電器控制部118求出基於片材厚度資訊之電壓值V0(S14)。電壓值V0係指為了消除積層用搬送保持器60中片材L1〜L5之翹曲或撓曲所需之電壓值,例如由事先之實驗或模擬等求出。The charger control unit 118 refers to the photo material information storage unit 116 to obtain sheet thickness information of the conveyed target sheet (S12). Then, the charger control unit 118 obtains the voltage value V0 based on the sheet thickness information (S14). The voltage value V0 refers to the voltage value required to eliminate the warpage or deflection of the sheets L1 to L5 in the laminated transport holder 60, and is determined by, for example, prior experiments or simulations.

此處,定性而言,根據片材L1〜L5之絕緣膜106之厚度而設定電壓值。更具體而言,絕緣膜106越薄,設定越高之電壓。此處,所謂高電壓包含正高電壓及負高電壓,簡言之,其係指電壓值之絕對值較高之電壓。Here, qualitatively, the voltage value is set according to the thickness of the insulating film 106 of the sheets L1 to L5. More specifically, the thinner the insulating film 106 is, the higher the voltage is set. Here, the so-called high voltage includes a positive high voltage and a negative high voltage. In short, it refers to a voltage with a higher absolute value of the voltage value.

絕緣膜106越薄,則絕緣膜106之面彈性模數(換言之,緊繃程度)越降低,由與金屬層104之膨脹率差及收縮率差所導致之翹曲量及撓曲量越增加。因此,本實施形態之電壓設定流程中,搬送中之片材L1〜L5之絕緣膜106越薄,照射之荷電粒子設定為越高之電壓。The thinner the insulating film 106, the lower the surface elastic modulus (in other words, the degree of tightness) of the insulating film 106, and the greater the amount of warpage and deflection caused by the difference in expansion and contraction from the metal layer 104 . Therefore, in the voltage setting process of the present embodiment, the thinner the insulating film 106 of the sheets L1 to L5 being conveyed, the higher the voltage of the charged particles to be irradiated is set.

進而,帶電器控制部118將保持器用帶電器70照射之荷電粒子之電壓值V1設定為電壓值V0(S16)。進而,除電器控制部120將保持器用除電器74照射之荷電粒子之電壓值V3設定為絕對值與V0(=V1)相等且極性相反之電壓值(S18)。再者,即便將帶電電壓V0與除電電壓V3設為相同極性,亦可藉由分極而獲得除電效果,故亦可代替V3=-V0而設為V3=V0。又,並不限定於使帶電電壓與除電電壓之絕對值相等,可根據除電裝置及除電方法而適當設定除電電壓。Furthermore, the charger control unit 118 sets the voltage value V1 of the charged particles irradiated by the holder charger 70 to the voltage value V0 (S16). Furthermore, the static eliminator control unit 120 sets the voltage value V3 of the charged particles irradiated by the holder static eliminator 74 to a voltage value whose absolute value is equal to V0 (=V1) and opposite in polarity (S18). Furthermore, even if the charged voltage V0 and the neutralization voltage V3 are set to the same polarity, the neutralization effect can be obtained by polarization, so instead of V3=-V0, V3=V0 may be set. Moreover, it is not limited to making the absolute value of the electrification voltage and the neutralization voltage equal, and the neutralization voltage can be appropriately set according to the neutralization device and the neutralization method.

又,帶電器控制部118將平台用帶電器68照射之荷電粒子之電壓值V2設定為電壓值V0(S20)。進而,除電器控制部120將平台用除電器72照射之荷電粒子之電壓值V4設定為絕對值與V0(=V2)相等且極性相反之電壓值(S22)。再者,即便使帶電電壓V0與除電電壓V4為相同極性,亦可藉由分極而獲得除電效果,故亦可代替V4=-V0而設為V4=V0。又,並不限定於使帶電電壓與除電電壓之絕對值相等,可根據除電裝置及除電方法而適當設定除電電壓。In addition, the charger control unit 118 sets the voltage value V2 of the charged particles irradiated by the stage charger 68 to the voltage value V0 (S20). Furthermore, the neutralizer control unit 120 sets the voltage value V4 of the charged particles irradiated by the platform neutralizer 72 to a voltage value whose absolute value is equal to V0 (=V2) and opposite in polarity (S22). Furthermore, even if the charged voltage V0 and the neutralization voltage V4 have the same polarity, the neutralization effect can be obtained by polarization, so instead of V4=-V0, V4=V0 can be set. Moreover, it is not limited to making the absolute value of the electrification voltage and the neutralization voltage equal, and the neutralization voltage can be appropriately set according to the neutralization device and the neutralization method.

根據上述電壓設定流程,藉由對真空吸附於積層用搬送保持器60之片材L1〜L5照射荷電粒子,片材L1〜L5之翹曲部分或撓曲部分(隆起部分)藉由靜電吸附被吸附於積層用搬送保持器60。此處,搬送中之片材L1〜L5之絕緣膜106越薄,亦即如上所述翹曲量及撓曲量越多,則照射電壓越高之荷電粒子,藉此使靜電吸附力增加,從而消除翹曲及撓曲。According to the above-mentioned voltage setting process, by irradiating the charged particles on the sheets L1~L5 vacuum-adsorbed on the carrier holder 60 for lamination, the warped parts or the flexed parts (protruding parts) of the sheets L1~L5 are absorbed by electrostatic adsorption. It is adsorbed on the conveying holder 60 for lamination. Here, the thinner the insulating film 106 of the sheets L1 to L5 that are being conveyed, that is, the greater the amount of warpage and the amount of deflection as described above, the higher the voltage of the charged particles is irradiated, thereby increasing the electrostatic adsorption force. Thereby eliminating warpage and deflection.

進而,積層平台80中,將與上述靜電吸附等電壓之荷電粒子照射至積層中途之積層體100A之最上表面。亦即,使片材L1〜L5吸附於積層用搬送保持器60之靜電吸附力、與使片材L1〜L5吸附於積層中途之積層體100A之靜電吸附力相等。藉此,自積層用搬送保持器60噴射正壓空氣使片材L1〜L5脫離並將其交遞至積層平台80時,可抑制對積層用搬送保持器60賦予之用於消除翹曲及撓曲之靜電吸附力阻礙上述脫離。換言之,能夠於不會因靜電吸附而阻礙片材L1〜L5自積層用搬送保持器60脫離之範圍內之最大電壓下,消除片材L1〜L5之翹曲及撓曲。Furthermore, in the build-up platform 80, charged particles having a voltage equal to the electrostatic adsorption described above are irradiated to the uppermost surface of the layered body 100A in the middle of the build-up. That is, the electrostatic adsorption force of the sheet materials L1 to L5 to the laminated transport holder 60 is equal to the electrostatic adsorption force of the sheet materials L1 to L5 to the laminated body 100A in the middle of the laminated layer. Thereby, when the positive pressure air is ejected from the transport holder for lamination 60 to detach the sheets L1 to L5 and delivered to the lamination platform 80, it is possible to suppress the application of the transport holder for lamination 60 to eliminate warpage and deflection. The electrostatic adsorption force of the song hinders the above-mentioned detachment. In other words, it is possible to eliminate the warpage and deflection of the sheets L1 to L5 under the maximum voltage within a range that does not prevent the sheets L1 to L5 from being separated from the laminated transport holder 60 due to electrostatic adsorption.

如圖7所例示,壓接器控制部122控制壓接器90,對最終積層體100B進行壓接。於積層平台80上積層至最上層之片材L1而成之最終積層體100B藉由搬送保持器91搬送至壓接器90。As illustrated in FIG. 7, the crimper control unit 122 controls the crimper 90 to crimp the final laminated body 100B. The final laminated body 100B, which is the sheet L1 laminated to the uppermost layer on the laminated platform 80, is transported to the crimper 90 by the transport holder 91.

壓接器90中,最終積層體100B一面被加熱一面自上下方向、換言之自積層方向被壓縮。該壓接製程藉由壓接器控制部122控制。壓接製程之結果如圖1下段所示,最終積層體100B之各層得以固定,且作為電路基板安裝於通訊機器等。In the crimper 90, the final laminated body 100B is heated while being compressed from the vertical direction, in other words, the self-laminating direction. The crimping process is controlled by the crimping device control unit 122. The result of the crimping process is shown in the lower part of FIG.

<積層製程> 圖9〜圖18中例示本實施形態之積層裝置10之積層製程。圖7所例示之保管庫用搬送保持器控制部110之片材計數器111中,設定片材保管庫30L5作為積層裝置10啟動時之、亦即最初之保管庫用搬送保持器40之移動目的地。因此,如圖9所例示,將保管庫用搬送保持器40之移動目的地指定為片材保管庫30L5。<Layer Process> 9 to 18 illustrate the lamination process of the lamination apparatus 10 of this embodiment. In the sheet counter 111 of the storage transport holder control unit 110 illustrated in FIG. 7, the sheet storage 30L5 is set as the movement destination of the first storage transport holder 40 when the stacking device 10 is activated. . Therefore, as illustrated in FIG. 9, the moving destination of the transport holder 40 for storage is designated as the sheet storage 30L5.

如圖9、圖10所例示,保管庫用搬送保持器40(前段保持器)自片材保管庫30L5真空吸附片材L5,且將其移動至對準平台50。As illustrated in FIGS. 9 and 10, the storage transport holder 40 (front stage holder) vacuum sucks the sheet L5 from the sheet storage 30L5 and moves it to the alignment platform 50.

如圖10所例示,當保管庫用搬送保持器40到達對準平台50上時,藉由升降機構42使吸附板44及吸附於該吸附板44之片材L5下降。當片材L5抵接於對準平台50之平台板53上時,升降機構42之下降驅動停止。例如,藉由扭矩感測器使升降機構42之下降驅動停止。As shown in FIG. 10, when the transport holder 40 for the storage warehouse arrives on the alignment platform 50, the suction plate 44 and the sheet L5 sucked to the suction plate 44 are lowered by the lifting mechanism 42. When the sheet L5 abuts on the platform plate 53 of the alignment platform 50, the lowering driving of the lifting mechanism 42 stops. For example, the lowering driving of the lifting mechanism 42 is stopped by the torque sensor.

此時,如圖10所例示,藉由保管庫用搬送保持器40(前段保持器)將片材L5壓抵於對準平台50之平台板53。即便於片材L5形成有翹曲或撓曲之情形時,亦可藉由保管庫用搬送保持器40之壓抵而暫時消除該翹曲或撓曲。於該狀態(展開狀態)時,對準相機56通過透光板54(參照圖1)而拍攝平台板53上之片材L5。At this time, as illustrated in FIG. 10, the sheet L5 is pressed against the platform plate 53 of the alignment platform 50 by the transport holder 40 (front stage holder) for storage. Even when the sheet material L5 is warped or deflection, the warpage or deflection can be temporarily eliminated by the pressing of the transport holder 40 for storage. In this state (expanded state), the aiming camera 56 passes through the light-transmitting plate 54 (refer to FIG. 1) to photograph the sheet L5 on the platform plate 53.

如圖7所例示,對準平台控制部112基於自對準相機56取得之片材L5之圖像,產生對移動機構52之驅動指令。對準平台控制部112例如將對準相機56之拍攝圖像、與預先記憶之參照圖像加以比較,求出片材L5自參照圖像中設定之目標位置、角度之位置偏移及角度偏移。進而,對準平台控制部112對移動機構52輸出用以消除所求出之偏移之驅動指令。As shown in FIG. 7, the alignment platform control unit 112 generates a drive command to the moving mechanism 52 based on the image of the sheet L5 obtained from the alignment camera 56. The alignment platform control unit 112, for example, compares the captured image of the alignment camera 56 with the reference image stored in advance, and obtains the target position, angle position offset, and angle offset of the sheet L5 set from the reference image. shift. Furthermore, the alignment platform control unit 112 outputs to the moving mechanism 52 a drive command for eliminating the obtained offset.

如圖11所例示,保管庫用搬送保持器40之吸附板44與平台板53分離之後,隨著移動機構52之驅動而將片材L5對位。對位後之片材L5如圖12所例示,由積層用搬送保持器60真空吸附。As shown in FIG. 11, after the suction plate 44 of the transport holder 40 for storage is separated from the platform plate 53, the sheet L5 is aligned with the driving of the moving mechanism 52. The aligned sheet L5 is exemplified in FIG. 12 and is vacuum sucked by the lamination transport holder 60.

真空吸附有片材L5之積層用搬送保持器60根據積層用搬送保持器控制部114(參照圖7)之驅動指令,朝積層平台80沿X軸方向移動。於該移動過程中,如圖13所例示,自保持器用帶電器70對真空吸附於積層用搬送保持器60之片材L5之露出面照射離子粒子等荷電粒子。The transfer holder 60 for lamination with vacuum suction of the sheet L5 moves in the X-axis direction toward the stacking table 80 in accordance with a drive command of the transfer holder control unit 114 (see FIG. 7) for the lamination. During this movement, as illustrated in FIG. 13, the exposed surface of the sheet L5 vacuum-adsorbed by the carrier holder 60 for lamination is irradiated with charged particles such as ion particles from the charger 70 for a holder.

又,此時,圖7所例示之保管庫用搬送保持器控制部110根據記憶於片材計數器111中之順序,將保管庫用搬送保持器40之移動目的地指定為片材保管庫30L4。對應於此,如圖13所例示,保管庫用搬送保持器40移動至片材保管庫30L4,吸附(真空吸附)第二層片材L4。At this time, the storage transport holder control unit 110 illustrated in FIG. 7 designates the movement destination of the storage transport holder 40 as the sheet storage 30L4 based on the order stored in the sheet counter 111. In response to this, as illustrated in FIG. 13, the storage transport holder 40 moves to the sheet storage 30L4 and sucks (vacuum sucks) the second-layer sheet L4.

例如圖7所示,自積層用搬送保持器控制部114向帶電器控制部118發送積層用搬送保持器60之當前座標。帶電器控制部118接收該當前座標,控制保持器用帶電器70,於搬送至積層用搬送保持器60之片材L5通過保持器用帶電器70上之全過程持續地自保持器用帶電器70向上方照射照射荷電粒子。藉此,遍及片材L5之露出面之整面入射荷電粒子。For example, as shown in FIG. 7, the self-laminating transport holder control unit 114 transmits the current coordinates of the laminating transport holder 60 to the charger control unit 118. The charger control unit 118 receives the current coordinates and controls the charger 70 for the holder, and the entire process of the sheet L5 conveyed to the transport holder 60 for lamination passing on the charger 70 for the holder continues upward from the charger 70 for the holder Irradiation irradiates charged particles. Thereby, charged particles are incident on the entire surface of the exposed surface of the sheet L5.

如圖14所例示,照射該荷電粒子係為了消除片材L5之翹曲或撓曲。藉由荷電粒子之照射,於片材L5上除產生真空之吸附力外,還產生靜電引力(庫侖力)之吸附力。藉由此種靜電吸附,片材L5之自吸附板64之保持面分離(剝離)之隆起部分12被吸附板64牽引。如下述電壓設定製程中所說明,自保持器用帶電器70照射之荷電粒子可帶有正電荷,亦可帶有負電荷。As shown in FIG. 14, the charged particles are irradiated in order to eliminate the warpage or deflection of the sheet material L5. By the irradiation of the charged particles, in addition to the vacuum suction force, the electrostatic attraction force (Coulomb force) is also generated on the sheet L5. With this electrostatic adsorption, the raised portion 12 of the sheet L5 separated (peeled off) from the holding surface of the adsorption plate 64 is pulled by the adsorption plate 64. As explained in the voltage setting process described below, the charged particles irradiated by the charger 70 for the self-sustainer may be positively charged or negatively charged.

再者,如上所述,照射至吸附於積層用搬送保持器60之片材之荷電粒子之電壓設定為該片材越薄則越高之電壓。此處,所謂高電壓包含正高電壓及負高電壓,簡言之,其係指電壓值之絕對值較高之電壓。Furthermore, as described above, the voltage of the charged particles irradiated to the sheet material adsorbed on the carrier holder 60 for lamination is set to a higher voltage as the sheet material is thinner. Here, the so-called high voltage includes a positive high voltage and a negative high voltage. In short, it refers to a voltage with a higher absolute value of the voltage value.

圖1所例示之絕緣膜106越薄,則絕緣膜106之面彈性模數(換言之,緊繃程度)越降低,由與金屬層104之膨脹率差及收縮率差所導致之翹曲量及撓曲量越增加。因此,本實施形態之積層製程中,搬送中之片材L1〜L5之絕緣膜106越薄,照射之荷電粒子設定為越高之電壓。The thinner the insulating film 106 illustrated in FIG. 1 is, the more the surface elastic modulus (in other words, the degree of tightness) of the insulating film 106 decreases, and the amount of warpage caused by the difference in expansion and contraction with the metal layer 104 The amount of deflection increases. Therefore, in the lamination process of this embodiment, the thinner the insulating film 106 of the sheets L1 to L5 that are being conveyed, the higher the voltage of the charged particles to be irradiated is set.

如圖15所例示,保管庫用搬送保持器40將第二層片材L4搬送至對準平台50。又,安裝於積層用搬送保持器60之平台用帶電器68朝向積層平台80之片材載置面照射荷電粒子。例如,自積層平台80之X軸上游端至下游端,自平台用帶電器68照射荷電粒子。As illustrated in FIG. 15, the storage transport holder 40 transports the second layer sheet L4 to the alignment platform 50. In addition, the charger 68 for the platform attached to the transport holder 60 for the build-up is irradiated with the charged particles toward the sheet placement surface of the build-up platform 80. For example, from the upstream end to the downstream end of the X axis of the layered platform 80, the charged particles are irradiated from the platform charger 68.

再者,圖15中,積層平台80上未載置片材L1〜L5,但於積層平台80上積層有該等片材L1〜L5時,自平台用帶電器68對該積層中途之積層體100A之最上表面照射荷電粒子。換言之,自平台用帶電器68對積層於積層平台80上之複數個片材中最上層之片材之露出面照射荷電粒子。再者,積層平台80之尺寸大於片材L1〜L5之尺寸,故對未載置片材L1〜L5之部分(即,積層平台80之露出之部分)亦照射荷電粒子。Furthermore, in FIG. 15, the sheets L1 to L5 are not placed on the layering platform 80, but when the sheets L1 to L5 are layered on the layering platform 80, the charger 68 for the platform is used for the layered body in the middle of the layering. The top surface of 100A is irradiated with charged particles. In other words, the exposed surface of the uppermost sheet among the plurality of sheets stacked on the stacking platform 80 is irradiated with the charged particles from the charger 68 for the platform. Furthermore, the size of the layered platform 80 is larger than the size of the sheets L1 to L5, so the part where the sheets L1 to L5 are not placed (ie, the exposed part of the layered platform 80) is also irradiated with charged particles.

此時,如上述電壓設定流程中所說明,將自平台用帶電器68照射之荷電粒子、與自保持器用帶電器70照射之荷電粒子設定為等電壓(V1=V2)。藉由照射荷電粒子,而於積層平台80之載置面、積層中途之積層體100A(參照圖5)之最上表面產生靜電引力。At this time, as explained in the above-mentioned voltage setting process, the charged particles irradiated by the charger 68 for the self-sustainer and the charged particles irradiated by the charger 70 for the self-sustainer are set to equal voltages (V1=V2). By irradiating the charged particles, electrostatic attraction is generated on the placement surface of the layered platform 80 and the uppermost surface of the layered body 100A (refer to FIG. 5) in the middle of the layering.

當積層用搬送保持器60到達積層平台80上時,如圖16所例示,藉由升降機構62之下降驅動使吸附板64及吸附於其下端之片材L5下降。當片材L5與積層平台80之載置面或積層中途之積層體100A之最上表面抵接時,自空氣配管66噴出用於脫離之正壓空氣。When the lamination transport holder 60 arrives on the lamination platform 80, as shown in FIG. 16, the suction plate 64 and the sheet L5 adsorbed to the lower end thereof are lowered by the descending drive of the elevating mechanism 62. When the sheet material L5 comes into contact with the placement surface of the layering platform 80 or the uppermost surface of the layered body 100A in the middle of the layering, positive pressure air for detachment is ejected from the air pipe 66.

此時,於積層用搬送保持器60與片材L5之間靜電引力發揮作用。另一方面,於積層平台80與片材L5之間亦靜電引力發揮作用。如上所述,將自平台用帶電器68照射之荷電粒子、與自保持器用帶電器70照射之荷電粒子設定為等電壓(V1=V2)。因此,於積層用搬送保持器60與片材L5之間發揮作用之靜電引力、及於積層平台80與片材L5之間發揮作用之靜電引力理論上相等。其結果,能夠於不會因靜電吸附而阻礙利用正壓空氣使片材L1〜L5自積層用搬送保持器60脫離之範圍內之最大電壓下,消除片材L1〜L5之翹曲及撓曲。At this time, electrostatic attractive force acts between the transport holder 60 for lamination and the sheet L5. On the other hand, electrostatic attraction also acts between the laminated platform 80 and the sheet L5. As described above, the charged particles irradiated by the charger 68 for the self-sustainer and the charged particles irradiated by the charger 70 for the self-sustainer are set to equal voltages (V1=V2). Therefore, the electrostatic attractive force acting between the lamination conveyance holder 60 and the sheet L5 and the electrostatic attractive force acting between the lamination platform 80 and the sheet L5 are theoretically equal. As a result, it is possible to eliminate the warpage and deflection of the sheets L1 to L5 under the maximum voltage within the range where the positive pressure air is not hindered by electrostatic adsorption and the sheet materials L1 to L5 are detached from the laminated transport holder 60. .

如圖17所例示,積層用搬送保持器60自積層平台80離開且朝向對準平台50時,自平台用除電器72朝積層平台80之載置面照射荷電粒子。該荷電粒子之電壓值例如藉由除電器控制部120(參照圖7)而設定為與自平台用帶電器68照射之荷電粒子為相反極性、且電壓值之絕對值相等之值。As shown in FIG. 17, when the transfer holder 60 for the build-up is away from the build-up platform 80 and faces the alignment platform 50, the charge particles are irradiated from the separator 72 for the platform to the placement surface of the build-up platform 80. The voltage value of the charged particles is set by the static eliminator control unit 120 (see FIG. 7) to have the opposite polarity to the charged particles irradiated from the platform charger 68, and the absolute value of the voltage value is the same.

積層中途之積層體100A(為方便起見,亦包含僅片材L5之狀態)中,對平台用帶電器68照射荷電粒子,但若反覆進行該照射使電荷累積,則有於積層體100A內產生絕緣破壞等損傷之虞。因此,藉由平台用除電器72對積層中途之積層體100A除電。In the layered body 100A in the middle of the layering (for convenience, only the state of the sheet L5 is included), the platform charger 68 is irradiated with charged particles, but if the irradiation is repeated to accumulate the electric charge, it will be in the layered body 100A Risk of damage such as insulation breakdown. Therefore, the layered body 100A in the middle of the layering is neutralized by the platform neutralizer 72.

進而,如圖18所例示,於積層用搬送保持器60之移動中,自保持器用除電器74朝吸附板64照射荷電粒子。該荷電粒子之電壓值例如藉由除電器控制部120(參照圖7)而設定為與自保持器用帶電器70照射之荷電粒子為相反極性、且電壓值之絕對值相等之值。藉由照射此種荷電粒子而對吸附板64除電。Furthermore, as illustrated in FIG. 18, during the movement of the transport holder 60 for the build-up, the adsorption plate 64 is irradiated with the charged particles from the separator 74 for the holder. The voltage value of the charged particles is set by the static eliminator control unit 120 (refer to FIG. 7) to have the opposite polarity to the charged particles irradiated by the self-retainer charger 70, and the absolute value of the voltage value is the same. The adsorption plate 64 is de-charged by irradiating such charged particles.

如圖18所例示,於對準平台50上載置已對位之第二層片材L4。積層用搬送保持器60真空吸附片材L4,且反覆執行圖12〜圖18之過程,直至積層最上層之片材L1為止。As shown in FIG. 18, the aligned second layer sheet L4 is placed on the alignment platform 50. The conveying holder 60 for lamination vacuum sucks the sheet L4, and repeats the process of FIGS. 12 to 18 until the uppermost sheet L1 is laminated.

於積層平台80上積層至最上層之片材L1而成之最終積層體100B藉由搬送保持器91搬送至壓接器90。壓接器90中,將最終積層體100B一面加熱一面自上下方向、換言之自積層方向壓縮。該壓接製程之結果,如圖1下段所示,最終積層體100B之各層得以固定,且作為電路基板安裝於通訊機器等。The final laminated body 100B, which is the sheet L1 laminated to the uppermost layer on the laminated platform 80, is transported to the crimper 90 by the transport holder 91. In the crimper 90, the final laminated body 100B is heated while being compressed from the vertical direction, in other words, the self-laminating direction. As a result of the crimping process, as shown in the lower part of FIG. 1, the layers of the laminate 100B are finally fixed and mounted as a circuit board in communication equipment or the like.

<積層裝置之另一例> 上述實施形態中,遍及搬送至積層用搬送保持器60之片材L1〜L5之露出面之整面照射荷電粒子,但本實施形態之積層裝置10並不限於此種形態。由於照射荷電粒子之目的在於消除片材L1〜L5之隆起部分12(參照圖14),故亦可對該隆起部分12集中照射荷電粒子。<Another example of multilayer device> In the above-mentioned embodiment, the charged particles are irradiated over the entire exposed surface of the sheets L1 to L5 conveyed to the conveying holder 60 for lamination, but the lamination apparatus 10 of this embodiment is not limited to this form. Since the purpose of irradiating the charged particles is to eliminate the raised portions 12 of the sheets L1 to L5 (refer to FIG. 14), the raised portions 12 can also be irradiated concentratedly.

例如圖19所例示,於積層裝置10中,於對準平台50與保持器用除電器74之間設置相機130。相機130將其上方作為拍攝區域,能夠拍攝被搬送至積層用搬送保持器60且通過相機130上方之片材L1〜L5之表面形狀。再者,積層用搬送保持器60在位於相機130之上方時,為了拍攝亦可暫時停止移動。For example, as illustrated in FIG. 19, in the layering apparatus 10, a camera 130 is provided between the alignment platform 50 and the holder static remover 74. The camera 130 uses its upper portion as an imaging area, and can image the surface shapes of the sheets L1 to L5 that are transported to the lamination transport holder 60 and pass above the camera 130. In addition, when the transport holder 60 for lamination is located above the camera 130, the movement may be temporarily stopped for shooting.

又,亦可代替設置相機130,由對準相機56拍攝於對準平台50對位後之片材L1〜L5之表面形狀。In addition, the camera 130 can be replaced by the alignment camera 56 to photograph the surface shapes of the sheets L1 to L5 after the alignment platform 50 is aligned.

此種情形時,例如作為控制器20之功能塊,對圖7所例示之帶電器控制部118發送由相機130或對準相機56獲得之片材L1〜L5之拍攝圖像。In this case, for example, as a functional block of the controller 20, the charger control unit 118 illustrated in FIG.

將由相機130或對準相機56取得之片材L1〜L5之拍攝圖像發送至帶電器控制部118(參照圖7)。帶電器控制部118基於所拍攝之片材L1〜L5之表面形狀,設定自保持器用帶電器70對保持於積層用搬送保持器60之片材L1〜L5之荷電粒子之照射時點及電壓。The photographed images of the sheets L1 to L5 obtained by the camera 130 or the aiming camera 56 are sent to the charger control unit 118 (refer to FIG. 7). The charger control unit 118 sets the irradiation time point and voltage of the charged particles from the holder charger 70 to the sheets L1 to L5 held by the laminated transport holder 60 based on the surface shapes of the photographed sheets L1 to L5.

具體而言,帶電器控制部118以對與積層用搬送保持器60之保持面分離之片材L1〜L5之隆起部分12(參照圖14)照射電壓相較密接於該保持面之片材之密接部分高之荷電粒子的方式,控制保持器用帶電器70。Specifically, the charger control unit 118 irradiates the raised portion 12 (refer to FIG. 14) of the sheets L1 to L5 separated from the holding surface of the lamination transport holder 60 with a voltage that is more closely connected to the sheet of the holding surface The method of closely contacting the high-charged particles is to control the charger 70 for the holder.

例如,保持器用帶電器70僅限於搬送之片材L1〜L5之露出面上的荷電粒子之照射點之至少一部分與保持於積層用搬送保持器60之片材L1〜L5之隆起部分12重疊時照射荷電粒子。該照射時點可根據自積層用搬送保持器控制部114發送之積層用搬送保持器60之座標、與所拍攝之片材L1〜L5之表面形狀而求出。再者,對片材L1〜L5之除隆起部分12以外之密接部分停止荷電粒子之照射。For example, the holder charger 70 is limited to the case where at least a part of the irradiation point of the charged particles on the exposed surface of the conveyed sheets L1 to L5 overlaps with the raised portion 12 of the sheets L1 to L5 held by the laminated conveying holder 60 Irradiate charged particles. The irradiation time point can be obtained from the coordinates of the laminated transport holder 60 sent from the laminated transport holder control unit 114 and the surface shape of the photographed sheets L1 to L5. Furthermore, the irradiation of the charged particles is stopped at the close contact part of the sheets L1 to L5 except the raised part 12.

圖20中,例示圖8之另一例之電壓設定流程。以下,關於圖20中與圖8之符號重複之步驟,因其行程內容無變更,故適當省略說明。FIG. 20 illustrates the voltage setting process of another example in FIG. 8. Hereinafter, regarding the steps in FIG. 20 that are repeated with the symbols in FIG. 8, since there is no change in the content of the itinerary, the description is appropriately omitted.

圖20之步驟S14中,基於片材厚度資訊求出電壓值V0。具體而言,如上所述,圖1所例示之片材L1〜L5之絕緣膜106越薄,則設定越高之電壓。In step S14 of FIG. 20, the voltage value V0 is obtained based on the sheet thickness information. Specifically, as described above, the thinner the insulating film 106 of the sheets L1 to L5 illustrated in FIG. 1, the higher the voltage is set.

其次,圖7所例示之帶電器控制部118解析片材L1〜L5之表面形狀,判定該片材之至少一部分是否自積層用搬送保持器60之吸附板64隆起,換言之是否有隆起部分12(S30)。再者,於利用對準相機56之拍攝圖像進行之圖像解析中,基於平台板53上之片材L1〜L5之表面形狀而判定有無隆起部分12。此處,為了於圖像解析中強調隆起部分12,亦可於相機130或對準相機56中設置閃光儀機構。Next, the charger control unit 118 illustrated in FIG. 7 analyzes the surface shapes of the sheets L1 to L5, and determines whether at least a part of the sheet is raised from the suction plate 64 of the laminated transport holder 60, in other words, whether there is a raised portion 12 ( S30). Furthermore, in the image analysis using the captured image of the alignment camera 56, the presence or absence of the raised portion 12 is determined based on the surface shape of the sheets L1 to L5 on the platen 53. Here, in order to emphasize the protruding part 12 in the image analysis, a flasher mechanism may also be provided in the camera 130 or the aiming camera 56.

若藉由圖像解析而判定片材L1〜L5上無隆起部分12,則原本就無需由荷電粒子進行隆起部分12之消除,故帶電器控制部118將保持器用帶電器70之設定電壓值V1設定為0[V](S32)。If it is determined by image analysis that there is no raised portion 12 on the sheets L1 to L5, there is no need to eliminate the raised portion 12 by the charged particles, so the charger control unit 118 sets the voltage value V1 of the holder charger 70 Set to 0[V] (S32).

另一方面,於步驟S30中,若特定出片材L1〜L5之隆起部分12(S36),則帶電器控制部118將保持器用帶電器70及保持器用除電器74之荷電粒子之照射區間僅設定為隆起部分12(S38)。自積層用搬送保持器控制部114向帶電器控制部118發送積層用搬送保持器60之座標,故與該座標之變化同步控制荷電粒子之照射及停止。On the other hand, in step S30, if the raised portion 12 of the sheets L1 to L5 is specified (S36), the charger control unit 118 will only irradiate the charged particles of the holder charger 70 and the holder separator 74 Set to the raised portion 12 (S38). The self-laminating transport holder control unit 114 sends the coordinates of the laminating transport holder 60 to the charger control unit 118, so that the irradiation and stopping of the charged particles are controlled in synchronization with the change of the coordinates.

進而,將保持器用帶電器70照射之荷電粒子之電壓值V1設定為電壓值V0(S16)。又,將保持器用除電器74照射之荷電粒子之電壓值V3設定為絕對值與V0(=V1)相等且極性相反之電壓值(S18)。Furthermore, the voltage value V1 of the charged particles irradiated by the holder charger 70 is set to the voltage value V0 (S16). In addition, the voltage value V3 of the charged particles irradiated by the eliminator 74 for the holder is set to a voltage value whose absolute value is equal to V0 (=V1) and opposite in polarity (S18).

此處,於步驟S32中將保持器用帶電器70之設定電壓值V1設定為0[V]之情形時,亦可將保持器用除電器74之電壓V3設定為電壓值V0(S18),對積層用搬送保持器60進行除電。Here, when the set voltage value V1 of the holder charger 70 is set to 0 [V] in step S32, the voltage V3 of the holder charger 74 can also be set to the voltage value V0 (S18). The conveyance holder 60 is used for neutralization.

例如圖16所例示,自積層用搬送保持器60將片材交遞至積層平台80時,有電荷自帶電之積層中途之積層體100A(圖16中片材L5)向積層用搬送保持器60移動從而導致積層用搬送保持器60帶電之虞。因此,無論是否藉由保持器用帶電器70照射荷電粒子,於將片材交遞至積層平台80之後,均對積層用搬送保持器60進行除電。For example, as shown in FIG. 16, when the self-laminating transport holder 60 delivers the sheet to the laminating platform 80, the laminated body 100A (sheet L5 in FIG. 16) in the middle of the laminating layer that is self-charged with electric charge is transferred to the laminating transport holder 60 The movement may cause the build-up transport holder 60 to become charged. Therefore, regardless of whether or not the charged particles are irradiated by the holder charger 70, after the sheet is delivered to the build-up platform 80, the build-up transport holder 60 is de-charged.

根據以上說明之實施形態之積層裝置10,對片材L1〜L5之隆起部分12照射相對高電壓之荷電粒子,對其周圍之密接部分,包含0[V]之情形在內相對地抑制靜電吸附力。藉此,可避免片材L1〜L5上產生過度之靜電吸附力,於積層平台80,能夠使片材L1〜L5容易地自積層用搬送保持器60脫離。According to the laminating device 10 of the embodiment described above, relatively high-voltage charged particles are irradiated to the raised portion 12 of the sheets L1 to L5, and the surrounding close contact portion, including the case of 0 [V], is relatively suppressed from electrostatic adsorption. force. Thereby, it is possible to avoid excessive electrostatic adsorption force on the sheets L1 to L5, and on the stacking platform 80, the sheets L1 to L5 can be easily detached from the transfer holder 60 for stacking.

<對準平台之另一例> 上述實施形態中,如圖10所例示,藉由保管庫用搬送保持器40(前段保持器)將片材L5壓抵於對準平台50之平台板53。藉此消除片材L5之翹曲或撓曲,且於該狀態下利用對準相機56進行拍攝。<Another example of alignment platform> In the above embodiment, as illustrated in FIG. 10, the sheet L5 is pressed against the platform plate 53 of the alignment platform 50 by the transport holder 40 (front stage holder) for storage. Thereby, the warpage or deflection of the sheet L5 is eliminated, and the aiming camera 56 is used for shooting in this state.

本實施形態之於對準平台50上消除翹曲及撓曲之手段並不限於上述手段。簡言之,只要設置加壓構件便可消除片材L1〜L5之翹曲及撓曲,該加壓構件進而載置於對準平台50之平台板53上所載置之片材L1〜L5上,對片材L1〜L5之整面進行加壓。The means for eliminating warpage and deflection on the alignment platform 50 in this embodiment is not limited to the above-mentioned means. In short, the warpage and deflection of the sheets L1 to L5 can be eliminated as long as the pressing member is provided, and the pressing member is then placed on the sheet L1 to L5 placed on the platform plate 53 of the alignment platform 50 Above, pressurize the entire surface of the sheets L1 to L5.

例如圖21所示,於對準平台50上,亦可設置加壓板55作為加壓構件。加壓板55例如可由丙烯酸系樹脂板構成。又,為了吸附加壓板55,於平台板53上亦可設置氣動夾頭51。For example, as shown in FIG. 21, on the alignment platform 50, a pressing plate 55 may also be provided as a pressing member. The pressure plate 55 may be composed of, for example, an acrylic resin plate. In addition, in order to adsorb the pressure plate 55, a pneumatic chuck 51 may also be provided on the platform plate 53.

又,作為加壓構件,亦可使用PET膜等膜構件。該情形時,藉由於平台板53上之片材L1〜L5由膜構件覆蓋之狀態下,由氣動夾頭51進行抽真空而將片材L1〜L5密封於膜構件。此時,片材L1〜L5被膜構件加壓,片材L1〜L5之翹曲及撓曲得以消除。In addition, as the pressing member, a film member such as a PET film may also be used. In this case, since the sheets L1 to L5 on the platform plate 53 are covered by the film member, the air chuck 51 is evacuated to seal the sheets L1 to L5 to the film member. At this time, the sheets L1 to L5 are pressurized by the film member, and the warpage and deflection of the sheets L1 to L5 are eliminated.

再者,加壓板55及膜構件能夠由氣動夾頭51保持,故亦可構成為面積較片材L1〜L5大。加壓板55或膜構件藉由管理積層裝置10之積層製程之機器管理者、或藉由未圖示之搬送機器人而與平台板53上之片材L1〜L5重疊。Furthermore, the pressure plate 55 and the film member can be held by the pneumatic chuck 51, so they can also be configured to have a larger area than the sheets L1 to L5. The pressure plate 55 or the film member is overlapped with the sheets L1 to L5 on the platform plate 53 by a machine manager who manages the lamination process of the lamination device 10, or by a transport robot not shown.

藉由加壓板55或膜構件而壓抵於對準平台50之平台板53之片材L1〜L5由對準相機56拍攝。基於該拍攝圖像而修正平台板53上之片材L1〜L5之位置偏移及角度偏移。The sheets L1 to L5 pressed against the platform plate 53 of the alignment platform 50 by the pressure plate 55 or the film member are photographed by the alignment camera 56. Based on the captured image, the positional deviation and the angular deviation of the sheets L1 to L5 on the platform plate 53 are corrected.

10:積層裝置 12:隆起部分 20:控制器 21:輸入輸出控制器 22:CPU 23:ROM 24:RAM 25:硬碟驅動器(HDD) 26:輸入部 27:顯示部 28:內部匯流排 30L1〜30L5:片材保管庫 40:保管庫用搬送保持器(前段保持器) 42:升降機構 44:吸附板 46:空氣配管 50:對準平台 51:氣動夾頭 52:移動機構 53:平台板 54:透光板 55:加壓板 56:對準相機 60:積層用搬送保持器 62:升降機構 64:吸附板 66:空氣配管 68:平台用帶電器 70:保持器用帶電器 72:平台用除電器 74:保持器用除電器 80:積層平台 82:空氣配管 90:壓接器 91:搬送保持器 100A:積層中途之積層體 100B:最終積層體 102:通孔 104:金屬層 106:絕緣膜 110:保管庫用搬送保持器控制部 111:片材計數器 112:對準平台控制部 114:積層用搬送保持器控制部 116:片材資訊記憶部 118:帶電器控制部 120:除電器控制部 122:壓接器控制部 130:相機(攝像器) L1~L5:片材10: Layered device 12: Uplift 20: Controller 21: Input and output controller 22: CPU 23: ROM 24: RAM 25: Hard Disk Drive (HDD) 26: Input section 27: Display 28: Internal bus 30L1~30L5: Sheet storage 40: Transport holder for storage warehouse (front holder) 42: Lifting mechanism 44: Adsorption board 46: Air piping 50: Align the platform 51: Pneumatic chuck 52: mobile agency 53: platform board 54: Translucent board 55: pressure plate 56: Point at the camera 60: Conveyor holder for stacking 62: Lifting mechanism 64: Adsorption board 66: Air piping 68: Platform with electrical appliances 70: With electrical appliances for retainers 72: In addition to electrical appliances for platforms 74: In addition to electrical appliances for retainers 80: Multilayer platform 82: Air piping 90: Crimper 91: Transport holder 100A: Stacked body in the middle of stacking 100B: Final laminate 102: Through hole 104: Metal layer 106: insulating film 110: Conveyor holder control unit for storage 111: sheet counter 112: Align the platform control department 114: Conveyor holder control unit for stacking 116: Sheet Information Memory Department 118: Charger control department 120: In addition to the electrical control unit 122: Crimper control unit 130: camera (video camera) L1~L5: Sheet

[圖1]係例示由本實施形態之積層裝置製造之積層體之圖。 [圖2]係例示包含具有翹曲之片材之積層體之圖。 [圖3]係例示包含具有撓曲之片材之積層體之圖。 [圖4]係例示本實施形態之積層裝置之構成之立體圖。 [圖5]係例示本實施形態之積層裝置之構成之X-Z側視圖。 [圖6]係例示控制器之硬體構成之圖。 [圖7]係例示控制器之功能塊之圖。 [圖8]係例示於片材之積層製程中執行之帶電及除電之電壓設定流程之圖。 [圖9]係說明使用有本實施形態之積層裝置之片材之積層製程(1/10)的圖。 [圖10]係說明使用有本實施形態之積層裝置之片材之積層製程(2/10)的圖。 [圖11]係說明使用有本實施形態之積層裝置之片材之積層製程(3/10)的圖。 [圖12]係說明使用有本實施形態之積層裝置之片材之積層製程(4/10)的圖。 [圖13]係說明使用有本實施形態之積層裝置之片材之積層製程(5/10)的圖。 [圖14]係說明使用有本實施形態之積層裝置之片材之積層製程(6/10)的圖。 [圖15]係說明使用有本實施形態之積層裝置之片材之積層製程(7/10)的圖。 [圖16]係說明使用有本實施形態之積層裝置之片材之積層製程(8/10)的圖。 [圖17]係說明使用有本實施形態之積層裝置之片材之積層製程(9/10)的圖。 [圖18]係說明使用有本實施形態之積層裝置之片材之積層製程(10/10)的圖。 [圖19]係例示本實施形態之另一例之積層裝置之構成之圖。 [圖20]係表示於片材之積層製程中執行之帶電及除電之電壓設定流程之另一例之圖。 [圖21]係表示對準平台之另一例之圖。[FIG. 1] A diagram illustrating a laminate manufactured by the laminate apparatus of this embodiment. [Fig. 2] A diagram illustrating a laminate including a sheet having warpage. [Fig. 3] A diagram illustrating a laminate including a sheet having a flexure. [FIG. 4] A perspective view illustrating the structure of the stacking device of this embodiment. [Fig. 5] An X-Z side view illustrating the structure of the stacking device of this embodiment. [Figure 6] A diagram illustrating the hardware configuration of the controller. [Figure 7] is a diagram illustrating the functional blocks of the controller. [Fig. 8] A diagram illustrating the voltage setting flow of charging and discharging performed in the lamination process of the sheet material. [Fig. 9] is a diagram illustrating the lamination process (1/10) of sheets using the lamination device of this embodiment. [Fig. 10] is a diagram illustrating the lamination process (2/10) of sheets using the lamination device of this embodiment. [Fig. 11] is a diagram illustrating the lamination process (3/10) of sheets using the lamination device of this embodiment. [Fig. 12] is a diagram illustrating the lamination process (4/10) of sheets using the lamination device of this embodiment. [Fig. 13] is a diagram illustrating the lamination process (5/10) of sheets using the lamination device of this embodiment. [Fig. 14] is a diagram illustrating the lamination process (6/10) of sheets using the lamination device of this embodiment. [Fig. 15] is a diagram illustrating the lamination process (7/10) of sheets using the lamination device of this embodiment. [Fig. 16] is a diagram illustrating the lamination process (8/10) of sheets using the lamination device of this embodiment. [Fig. 17] is a diagram illustrating the lamination process (9/10) of sheets using the lamination device of this embodiment. [Fig. 18] is a diagram illustrating the lamination process (10/10) of sheets using the lamination device of this embodiment. [FIG. 19] A diagram illustrating the structure of another example of a laminate device of this embodiment. [Fig. 20] is a diagram showing another example of the voltage setting process of charging and discharging performed in the laminate process of the sheet. [Fig. 21] A diagram showing another example of the alignment platform.

10:積層裝置10: Layered device

20:控制器20: Controller

30L1~30L5:片材保管庫30L1~30L5: Sheet storage

40:保管庫用搬送保持器(前段保持器)40: Transport holder for storage warehouse (front holder)

50:對準平台50: Align the platform

52:移動機構52: mobile agency

53:平台板53: platform board

54:透光板54: Translucent board

56:對準相機56: Point at the camera

60:積層用搬送保持器60: Conveyor holder for stacking

68:平台用帶電器68: Platform with electrical appliances

70:保持器用帶電器70: With electrical appliances for retainers

72:平台用除電器72: In addition to electrical appliances for platforms

74:保持器用除電器74: In addition to electrical appliances for retainers

80:積層平台80: Multilayer platform

90:壓接器90: Crimper

91:搬送保持器91: Transport holder

L1~L5:片材L1~L5: Sheet

Claims (10)

一種積層裝置,其使於絕緣膜上積層有金屬層之片材積層複數層,且具備: 積層平台,其供上述片材積層; 搬送保持器,其藉由真空吸附而保持上述片材且將其搬送至上述積層平台;及 保持器用帶電器,其朝保持於上述搬送保持器之上述片材照射荷電粒子; 上述保持器用帶電器照射搬送中之上述片材之上述絕緣膜越薄則電壓越高之荷電粒子。A layering device that laminates a plurality of layers of sheets with metal layers laminated on an insulating film, and is provided with: Laminating platform for laminating the above-mentioned sheets; A transport holder that holds the above-mentioned sheet by vacuum suction and transports it to the above-mentioned stacking platform; and A charger for a holder, which irradiates charged particles onto the sheet held in the transport holder; The charger for the holder irradiates the charged particles whose voltage is higher as the insulating film of the sheet material being transported is thinner. 如請求項1之積層裝置,其具備平台用帶電器, 該平台用帶電器朝積層於上述積層平台上之複數層上述片材中最上層之上述片材之露出面照射荷電粒子, 上述保持器用帶電器及上述平台用帶電器照射彼此等電壓之荷電粒子。For example, the layered device of claim 1, which has a charger for the platform, The charger for the platform irradiates charged particles on the exposed surface of the uppermost layer among the plurality of layers of the above-mentioned sheets laminated on the above-mentioned layered platform, and The charger for the holder and the charger for the platform irradiate charged particles of equal voltage to each other. 一種積層裝置,其使於絕緣膜上積層有金屬層之片材積層複數層,且具備: 積層平台,其供上述片材積層; 搬送保持器,其藉由真空吸附而保持上述片材且將其搬送至上述積層平台; 保持器用帶電器,其朝保持於上述搬送保持器之上述片材照射荷電粒子;及 攝像器,其拍攝保持於上述搬送保持器之上述片材之表面形狀; 上述保持器用帶電器對基於由上述攝像器拍攝之上述片材之表面形狀而特定出的與上述搬送保持器之保持面分離之上述片材之隆起部分,照射電壓相較密接於上述保持面之上述片材之密接部分高的荷電粒子。A layering device that laminates a plurality of layers of sheets with metal layers laminated on an insulating film, and is provided with: Laminating platform for laminating the above-mentioned sheets; A transport holder, which holds the above-mentioned sheet by vacuum suction and transports it to the above-mentioned stacking platform; A charger for a holder, which irradiates charged particles on the sheet held in the transport holder; and A camera that photographs the surface shape of the sheet material held in the transport holder; The charger for the holder irradiates the raised portion of the sheet separated from the holding surface of the transport holder, which is specified based on the surface shape of the sheet photographed by the camera, with a relatively close contact with the holding surface. Highly charged particles in the close contact part of the above-mentioned sheet. 如請求項3之積層裝置,其中, 對上述片材之上述隆起部分照射之荷電粒子被設定為上述片材之絕緣膜越薄則電壓越高。Such as the layered device of claim 3, in which, The charged particles irradiated to the raised portion of the sheet material are set such that the thinner the insulating film of the sheet material, the higher the voltage. 如請求項3或4之積層裝置,其中, 上述保持器用帶電器於相較保持於上述搬送保持器之上述片材之露出面小之區域,規定上述露出面上之荷電粒子之照射點, 上述保持器用帶電器僅限於上述照射點之至少一部分與保持於上述搬送保持器之上述片材之上述隆起部分重疊時照射荷電粒子。Such as the layered device of claim 3 or 4, in which, The charger for the holder defines the irradiation point of the charged particles on the exposed surface in an area smaller than the exposed surface of the sheet held on the transport holder, The charger for the holder is limited to irradiating charged particles when at least a part of the irradiation point overlaps with the raised portion of the sheet held by the transport holder. 如請求項1之積層裝置,其具備: 對準平台,其供保持於上述搬送保持器之前之上述片材載置,並且將所載置之上述片材對位;及 加壓構件,其進而載置於上述對準平台上所載置之上述片材上,對該片材之整面進行加壓; 上述對準平台之片材載置區域之至少一部分由透光性構件構成, 該積層裝置設置有對準相機,該對準相機通過上述透光性構件而拍攝載置於上述對準平台之上述片材, 上述對準相機拍攝藉由上述加壓構件壓抵於上述對準平台之上述片材。Such as the layered device of claim 1, which has: An alignment platform for placing the above-mentioned sheet material held before the above-mentioned conveying holder, and aligning the placed above-mentioned sheet material; and A pressing member, which is further placed on the sheet placed on the alignment platform, and pressurizes the entire surface of the sheet; At least a part of the sheet placement area of the alignment platform is composed of a light-transmitting member, The layering device is provided with an alignment camera that photographs the sheet material placed on the alignment platform through the light-transmitting member, The alignment camera shoots the sheet material pressed against the alignment platform by the pressing member. 一種積層體之製造方法,其製造包含複數層於絕緣膜上積層有金屬層之片材而構成之積層體,且具備: 積層步驟,其係藉由真空吸附將上述片材保持於搬送保持器且搬送至積層平台,於上述積層平台使上述片材依序積層;及 壓接步驟,其係對在上述積層平台積層之上述片材之積層體進行壓接而將各層固定; 於上述積層步驟中,對保持於上述搬送保持器之搬送中之上述片材,照射上述片材之絕緣膜越薄則電壓越高之荷電粒子。A method for manufacturing a laminated body, which manufactures a laminated body composed of a plurality of sheets with a metal layer laminated on an insulating film, and comprising: A layering step, which is to hold the sheet material in a conveying holder by vacuum suction and convey it to a layering platform, and layer the sheets in sequence on the layering platform; and The crimping step is to crimp the laminated body of the above-mentioned sheets laminated on the above-mentioned laminated platform to fix each layer; In the laminating step, the sheet material held in the conveying holder is irradiated with charged particles whose voltage is higher as the insulating film of the sheet material is thinner. 如請求項7之積層體之製造方法,其中, 於上述積層步驟中,朝保持於上述搬送保持器之搬送中之上述片材、及積層於上述積層平台上之複數層上述片材中最上層之上述片材之露出面,照射彼此等電壓之荷電粒子。Such as the manufacturing method of the laminated body of claim 7, in which, In the above-mentioned layering step, the exposed surface of the uppermost layer of the above-mentioned sheet material among the plurality of layers of the above-mentioned sheets layered on the above-mentioned layering platform and the above-mentioned sheet material being held in the conveyance of the carrying holder is irradiated with equal voltages of each other. Charged particles. 一種積層體之製造方法,其製造包含複數層於絕緣膜上積層有金屬層之片材而構成之積層體,且具備: 積層步驟,其係藉由真空吸附將上述片材保持於搬送保持器且搬送至積層平台,於該積層平台使上述片材依序積層; 壓接步驟,其係對在上述積層平台積層之上述片材之積層體進行壓接而將各層固定; 於上述積層步驟中,對基於保持於上述搬送保持器之上述片材之表面形狀而特定出的與上述搬送保持器之保持面分離之上述片材之隆起部分,照射電壓相較密接於上述保持面之上述片材之密接部分高的荷電粒子。A method for manufacturing a laminated body, which manufactures a laminated body composed of a plurality of sheets with a metal layer laminated on an insulating film, and comprising: The layering step is to hold the above-mentioned sheet in a transport holder by vacuum suction and transport it to a layering platform, where the above-mentioned sheets are sequentially layered on the layering platform; The crimping step is to crimp the laminated body of the above-mentioned sheets laminated on the above-mentioned laminated platform to fix each layer; In the lamination step, the swelling part of the sheet separated from the holding surface of the transport holder, which is specified based on the surface shape of the sheet held by the transport holder, is irradiated with a voltage that is relatively close to the holder Highly charged particles in the close contact part of the above-mentioned sheet on the surface. 如請求項9之積層體之製造方法,其中, 上述片材之絕緣膜越薄,對上述片材之隆起部分照射之荷電粒子之電壓越高。Such as the manufacturing method of the laminated body of claim 9, in which: The thinner the insulating film of the sheet, the higher the voltage of the charged particles irradiated to the raised portion of the sheet.
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