JP2009064920A - Method of manufacturing laminated electronic parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated electronic parts capable of suppressing the occurrence of a modification of a sheet laminate in carrying out a preliminary positioning of the sheet laminate. <P>SOLUTION: According to the method of manufacturing these laminated electronic parts, the sheet laminate 23 is contacted with positioning portions 3, 4 while floating the sheet laminate 23 from an installation surface 9 and sliding the sheet laminate 23, by spraying an air to the sheet laminate 23 installed on the installation surface 9. Accordingly, in positioning any frictional force is hardly generated between the sheet laminate 23 and the installation surface 9. Moreover, each process is performed to the sheet laminate 23 of a simple substance. Accordingly, any frictional force isn't generated between the sheet laminates 23, 23 differing from the case where the positioning is performed in such a fashion that the sheet laminates 23 are piled up. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer electronic component.

  In the manufacturing process of multilayer electronic components, a sheet laminate is formed in which a plurality of green sheets having a predetermined electrode pattern according to the function of the electronic component are laminated and pressed in a predetermined order to form a sheet laminate A process, a cutting process of cutting the formed sheet laminate to a predetermined dimension, and the like are included. In the sheet laminate forming process and the cutting process, when the green sheet is conveyed to the press device and when the sheet laminate is conveyed to the cutting device, preliminary alignment of these sheet members is performed.

As a technique for aligning a sheet body, for example, there is an alignment apparatus described in Patent Document 1. In this conventional alignment apparatus, after stacking the sheet body on the mounting table having the stopper, the end of the sheet body is aligned with the surface of the stopper by vibrating the mounting table inclined toward the stopper. Yes.
JP 2007-8697 A

  However, in the conventional alignment apparatus described above, vibration is applied to the mounting table in a state where the sheet bodies are stacked. Therefore, an excessive load is easily applied to the sheet body due to the influence of friction between the sheet bodies, and the sheet body may be deformed. Such a problem becomes more prominent as the thickness of the sheet body becomes smaller.

  The present invention has been made to solve the above-described problems, and provides a method for manufacturing a multilayer electronic component capable of suppressing the occurrence of deformation of a sheet body when performing preliminary alignment of the sheet body. The purpose is to do.

  In order to solve the above-described problems, a method for manufacturing a multilayer electronic component according to the present invention provides a positioning device having a positioning portion provided on a mounting surface and an air blowing hole extending toward the mounting surface. Positioning the end of the sheet body by blowing air from the air blowing hole toward the sheet body placed on the placement surface, the process, the step of placing a single sheet body on the placement surface of the positioning device And a step of conveying the sheet body in contact with the positioning unit to the next process apparatus.

  In this method of manufacturing a multilayer electronic component, air is blown toward the sheet body placed on the placement surface, and the sheet body is slid while being lifted from the placement surface and brought into contact with the positioning portion. Therefore, at the time of positioning, almost no frictional force is generated between the sheet body and the placement surface. Moreover, each process is performed with respect to a single sheet body. Therefore, unlike the case where the sheet bodies are positioned in a stacked state, no frictional force is generated between the sheet bodies. In this way, by suppressing the generation of the frictional force in the sheet body, it is possible to suitably suppress the occurrence of deformation of the sheet body when performing preliminary alignment of the sheet body.

  Moreover, it is preferable that the air blowing hole inclines toward the positioning part side. In this case, since air blows out toward the positioning unit, the sheet body can be easily slid to the positioning unit.

  Moreover, it is preferable to further include a step of inclining the placement surface by the tilting means so that the positioning unit side is at a low position after placing the sheet body on the placement surface. In this case, the sheet body can be slid with a smaller air flow rate by utilizing the weight of the sheet body.

  Moreover, it is preferable that the mounting surface is inclined so that the positioning portion side is at a low position. Also in this case, the sheet body can be slid with a smaller air flow rate by utilizing the weight of the sheet body.

  The placement surface includes a first area located on the positioning portion side and a second area located on the opposite side of the positioning portion, and the inclination of the placement surface in the first area is the second area. It is preferable that it is gentler than the inclination of the mounting surface in the region. If it carries out like this, the speed of the sheet | seat body when approaching a positioning part can be decelerated compared with initial speed. Thereby, when the edge part of a sheet | seat body is contact | abutted to a positioning part, the load concerning a sheet | seat body can be reduced.

  Moreover, it is preferable that the mounting surface in the first region is horizontal. In this case, the speed of the sheet body when approaching the positioning unit can be more reliably decelerated than the initial speed.

  The mounting surface includes a first region located on the positioning portion side and a second region located on the opposite side of the positioning portion, and the air blowing hole located in the first region is a second region. It is preferable to incline toward the region. If it carries out like this, the speed of the sheet | seat body when approaching a positioning part can be decelerated compared with initial speed. Thereby, when the edge part of a sheet | seat body is contact | abutted to a positioning part, the load concerning a sheet | seat body can be reduced.

  According to the method for manufacturing a multilayer electronic component according to the present invention, it is possible to suppress the deformation of the sheet body when performing preliminary alignment of the sheet body.

  Hereinafter, a preferred embodiment of a method for manufacturing a multilayer electronic component according to the present invention will be described in detail with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic diagram showing a positioning device used in a first embodiment of a method for manufacturing a multilayer electronic component according to the present invention. FIG. 2 is a plan view of the positioning device shown in FIG.

  As shown in FIGS. 1 and 2, the positioning device 1 includes a mounting table 2, positioning units 3 and 4, a tilting device 5, a transfer arm 6, an air supply / discharge device 7, and a control unit 8. I have. In the manufacturing process of the multilayer electronic component, the positioning device 1 is, for example, when transporting a single green sheet coated with internal electrode paste to a press device, or when transporting a sheet laminate formed by pressing to a cutting device. It is an apparatus for performing preliminary alignment of a sheet body.

  The mounting table 2 has, for example, a rectangular plate shape, and the upper surface of the mounting table 2 is a mounting surface 9 on which a sheet body is mounted. The mounting table 2 is provided with air blowing holes 11 having a circular cross section, for example, in a 7 × 7 matrix. The axis of each air blowing hole 11 is inclined with respect to the mounting surface 9 toward the corner 12 where the positioning portions 3 and 4 intersect. Thereby, the air which passes each air blowing hole 11 blows off toward the corner | angular part 12 side.

  The positioning parts 3 and 4 have a long rectangular parallelepiped shape, and as shown in FIG. 2, along the one edge part 9a of the mounting surface 9 and the other edge part 9b orthogonal to the one edge part 9a. Are arranged respectively. Side surfaces 3 a and 4 a inside the positioning portions 3 and 4 are surfaces perpendicular to the placement surface 9. These side surfaces 3a and 4a function as a positioning reference for the sheet body by contacting the end portions of the sheet body.

  As the tilting device 5, for example, a stepping motor is used. The tilting device 5 adjusts the tilt angle θ of the mounting table 2 with respect to the horizontal plane so that the corner 12 side of the mounting table 2 is at a low position under the control of the control unit 8. The inclination angle θ is set, for example, between 0 ° and 30 ° in consideration of the relationship with the air flow rate supplied from the air supply / discharge device 7.

  The transport arm 6 has a suction plate 13 corresponding to the size of the sheet body, and is disposed above the mounting table 2. In the suction plate 13, for example, a plurality of through holes 14 having a circular cross section are provided in a state perpendicular to the lower surface 13 a of the suction plate 13. The transport arm 6 is controlled by the control unit 8 to transport the sheet body from the apparatus in the previous process to the mounting surface 9 of the positioning apparatus 1 and from the mounting surface 9 of the positioning apparatus 1 to the apparatus in the next process. Carry the body.

  The air supply / discharge device 7 includes a nozzle 15 connected to the air blowing hole 11 of the mounting table 2 and a nozzle 16 connected to the through hole 14 of the transport arm 6. The air supply / discharge device 7 supplies and discharges air to and from the air blowing holes 11 and the through holes 14 through the nozzles 15 and 16 under the control of the control unit 8.

  For example, triggered by a predetermined operation by an operator, the control unit 8 adjusts the tilt angle θ of the mounting table 2 by the tilting device 5, moves the transfer arm 6, and supplies / discharges air by the air supply / discharge device 7. This is the part that controls the operation. Details of the control will be described later.

  Subsequently, a manufacturing process of the multilayer electronic component using the positioning device 1 having the above-described configuration will be described.

  3 to 6 are schematic views showing manufacturing steps of the multilayer electronic component using the positioning device 1. For convenience of explanation, the present embodiment exemplifies a case where the sheet stack 23 is conveyed from the baking device 21 to the cutting device 22. The sheet laminate 23 is obtained by laminating and pressing a green sheet in which an electrode paste corresponding to an internal electrode is applied in a predetermined pattern in a predetermined order and firing the green sheet.

  First, suction of air from the through hole 14 of the suction plate 13 in the transport arm 6 is started with a predetermined operation by the operator. Along with this, the transfer arm 6 moves to the baking apparatus 21 which is the apparatus of the previous process. Thereby, among the plurality of sheet laminates 23 stacked in the baking apparatus 21, the uppermost sheet laminate 23 is adsorbed to the lower surface 13 a of the adsorption plate 13.

  After the sheet stack 23 is adsorbed to the suction plate 13, as shown in FIG. 3, the transport arm 6 moves above the positioning device 1, and air is sucked from the through holes 14 of the suction plate 13 in the transport arm 6. Is stopped. Thereby, the sheet laminate 23 is peeled off from the suction plate 13, and the sheet laminate 23 is placed on the placement surface 9 of the positioning device 1. Note that the placement position of the sheet laminate 23 on the placement surface 9 is such that the distance between the end of the sheet laminate 23 and the side surfaces 3a and 4a inside the positioning portions 3 and 4 is about several millimeters apart. It is preferable that

  Next, as shown in FIG. 4, the tilting angle 5 of the mounting table 2 with respect to the horizontal plane is adjusted by the tilting device 5 so that the corner 12 side of the mounting table 2 is at a low position. The inclination angle θ is set to 30 °, for example. At this time, the transport arm 6 is held in the position when the sheet stack 23 is placed on the placement surface 9 of the positioning device 1.

  After the inclination angle θ of the mounting surface 9 is adjusted, as shown in FIG. 5, air blowing from the air blowing holes 11 of the mounting table 2 is started, and the sheet stack 23 is slightly moved from the mounting surface 9. Lifted up. Then, the sheet laminate 23 slides on the placement surface 9 toward the corner portion 12 due to its own weight, and the end of the sheet laminate 23 abuts against the side surfaces 3a and 4a inside the positioning portions 3 and 4, respectively. Stop at the point.

  Further, in synchronization with the blowing of air from the air blowing hole 11, the blowing of air from the through hole 14 of the suction plate 13 in the transport arm 6 is performed. The flow rate of air blown from the through holes 14 of the suction plate 13 is set to be smaller than the flow rate of air blown from the air blow holes 11 of the mounting table 2.

  After the slide of the sheet laminate 23 is stopped, the tilting device 5 is actuated again, and the tilt angle θ of the mounting table 2 with respect to the horizontal plane is returned to the initial state (horizontal state) as shown in FIG. Then, suction of air from the through hole 14 of the suction plate 13 in the transport arm 6 is started, and the sheet stack 23 in contact with the positioning portions 3 and 4 is sucked to the suction plate 13.

  After the sheet stack 23 is adsorbed to the suction plate 13, the transport arm 6 moves above the cutting device 22, and the suction of air from the through hole 14 of the suction plate 13 in the transport arm 6 is stopped. As a result, the sheet laminate 23 is peeled off from the suction plate 13, and the sheet laminate 23 is placed on the cutting device 22. Thereafter, the operation of the positioning device 1 is completed by repeating the above-described operation for all the sheet laminates 23 stacked in the firing device 21.

  As described above, in this method for manufacturing a multilayer electronic component, air is blown toward the sheet laminate 23 placed on the placement surface 9 to slide the sheet laminate 23 while floating from the placement surface 9. To be brought into contact with the positioning portions 3 and 4. Therefore, almost no frictional force is generated between the sheet laminate 23 and the placement surface 9 during positioning. Moreover, each process is performed with respect to the single sheet | seat laminated body 23. FIG. Therefore, unlike the case where the sheet laminate 23 is positioned in a stacked state, the friction force between the sheet laminates 23 and 23 is not generated. Thus, by suppressing the generation of the frictional force in the sheet laminate 23, the occurrence of deformation of the sheet laminate 23 during the preliminary alignment can be suitably suppressed.

  Moreover, in the positioning apparatus 1, the air blowing hole provided in the mounting base 2 inclines toward the corner | angular part 12 side where the positioning parts 3 and 4 cross | intersect. For this reason, the air which passes each air blowing hole 11 will blow off toward the corner | angular part 12, and the sheet | seat laminated body 23 can be slid easily.

  Further, in the positioning device 1, after the sheet laminate is placed on the placement surface 9, the placement surface 9 is inclined by the inclination device 5 so that the corner portion 12 side of the positioning portions 3 and 4 is at a low position. I am letting. Thereby, the sheet | seat laminated body 23 can be slid with a smaller air flow rate using the dead weight of the sheet | seat laminated body 23. FIG. Note that the inclination angle θ by the inclination device 5 is set to 30 ° or less. For this reason, it can prevent that the sheet laminated body 23 slides at an excessive speed, and when the sheet laminated body 23 abuts against the positioning portions 3, 4, the load applied to the sheet laminated body 23 can be suitably suppressed.

  Further, in synchronization with the blowing of air from the air blowing hole 11, the blowing of air from the through hole 14 of the suction plate 13 in the transport arm 6 is performed. In this way, by blowing air from the upper and lower sides of the sheet laminate 23, it is possible to limit the amount of lifting of the sheet laminate 23 from the placement surface 9 and to stabilize the posture of the sheet laminate 23 during the slide. it can. Since the flow rate of air blown from the through holes 14 of the suction plate 13 is smaller than the flow rate of air blown from the air blow holes 11 of the mounting table 2, the pressure applied to the sheet laminate 23 does not become a problem.

[Second Embodiment]
Subsequently, a second embodiment of the present invention will be described.

  FIG. 7 is a schematic view showing a positioning device used in the second embodiment of the method for manufacturing a multilayer electronic component according to the present invention. As shown in FIG. 7, the positioning device 31 used in the second embodiment is such that the placement surface 32 of the placement surface 9 with respect to the horizontal plane is inclined using the tilting device 5 in that the placement surface 32 has an inclination with respect to the horizontal plane in advance. This is different from the first embodiment in which the inclination angle θ is adjusted.

  That is, in the positioning device 31, the mounting table 33 has a trapezoidal cross section, and the upper surface of the mounting table 33 that functions as the mounting surface 32 is positioned so that the corner 12 side of the mounting table 33 is at a low position. For example, it is inclined with respect to the bottom surface of 33 within a range of 30 ° or less. Further, the axis of each air blowing hole 34 provided in the mounting table 33 is inclined to the corner portion 12 side with respect to the mounting surface 32.

  Also with such a positioning device 31, the air is blown toward the sheet laminate 23 placed on the placement surface 32, and the sheet laminate 23 is slid while floating from the placement surface 32, so that the positioning units 3, 4. It can be made to contact. Therefore, as in the first embodiment, the generation of frictional force in the sheet laminate 23 is suppressed, and the occurrence of deformation of the sheet laminate 23 during the preliminary alignment can be suitably suppressed. Further, since the tilting device 5 can be omitted, the device configuration can be simplified and the manufacturing process can be simplified.

[Third Embodiment]
Subsequently, a third embodiment of the present invention will be described.

  FIG. 8 is a schematic view showing a positioning device used in the third embodiment of the method for manufacturing a multilayer electronic component according to the present invention. As shown in FIG. 8, the positioning device 41 used in the third embodiment is such that the inclination of the mounting surface 42 is stepwise with respect to the horizontal plane, and the inclination of the mounting surface 9 is relative to the horizontal plane. This is different from the uniform second embodiment.

  That is, in the positioning device 41, the mounting surface 42 of the mounting table 43 includes a first region 44 positioned on the corner 12 side where the positioning portions 3 and 4 intersect, and a second positioned on the opposite side of the corner 12. Area 45. The first region 44 of the mounting surface 42 is substantially parallel to the horizontal plane, and the second region 45 of the mounting surface 42 is such that the corner 12 side of the mounting table 43 is at a low position. Furthermore, it is in a state inclined with respect to the bottom surface of the mounting table 43 within a range of, for example, 30 ° or less.

  Further, in the positioning device 41, the axis of each air blowing hole 46 provided in the first region 44 is inclined to the second region 45 side with respect to the placement surface 42, and the second region The axis of each air blowing hole 47 provided in 45 is inclined to the first region 44 side with respect to the placement surface.

  Also with such a positioning device 41, the air is blown toward the sheet laminate 23 placed on the placement surface 42 to slide the sheet laminate 23 while floating from the placement surface 42, so that the positioning units 3, 4. It can be made to contact. Therefore, as in the first embodiment, the generation of frictional force in the sheet laminate 23 is suppressed, and the occurrence of deformation of the sheet laminate 23 during the preliminary alignment can be suitably suppressed. Further, since the tilting device 5 is not required, the device configuration can be simplified and the manufacturing process can be simplified.

  Further, in the positioning device 41, in the first region 44 existing on the corner 12 side, the mounting surface 42 is substantially parallel to the horizontal surface, and the air blown out from the air blowing hole 46 is on the second region 45 side. To flow toward. For this reason, the speed of the sheet laminate 23 when approaching the positioning portions 3 and 4 is sufficiently reduced as compared with the initial speed. Thereby, when making the edge part of the sheet laminated body 23 contact the positioning parts 3 and 4, the load concerning the sheet laminated body 23 can be reduced more reliably.

  The present invention is not limited to the above embodiment. For example, in the first embodiment to the second embodiment, it is not always necessary to incline the shafts of the air blowing holes 11 and 34 toward the corner 12 with respect to the mounting surfaces 9 and 32, and they are formed in the vertical direction. Also good. In the third embodiment, at least one of the axes of the air blowing holes 46 and 47 provided in the first region 44 and the second region 45 may be formed in the vertical direction. In the third embodiment, the first region 44 of the placement surface 42 does not necessarily have to be substantially parallel to the horizontal plane, and has a gentler inclination angle than the second region 45 of the placement surface 42. The corner portion 12 side of the mounting table 2 may be inclined so as to be in a low position.

  Moreover, you may provide the air flow rate adjustment mechanism which adjusts the air flow rate which blows off from an air blowing hole for every area | region of a mounting surface. FIG. 9 is a schematic view showing a positioning device provided with an air flow rate adjusting mechanism. The positioning device 51 shown in FIG. 9 is newly provided with a bottom plate 52 and an opening / closing lid 53. An upper surface side of the bottom plate 52 is open, and the bottom plate 52 is fixed to the bottom surface side of the mounting table 2, whereby an internal space S communicating with the air blowing holes 11 is formed inside the bottom plate 52. For example, the interior space S is divided into three equal parts by partition plates 55, 55 extending substantially parallel to the positioning portion 4.

  Further, the opening / closing lid 53 is a flat plate having the same size as the mounting table 2, and an opening 54 corresponding to the arrangement of the air blowing holes 11 is formed. The opening / closing lid 53 is slidably disposed inside the mounting table 2, and the air blowing hole 11 opens and closes when the opening 54 enters and retracts from the air blowing hole 11.

  Further, the nozzle 56 extending from the air supply / discharge device 7 branches in three directions in the vicinity of the opening / closing lid 53. Each branch portion of the nozzle 56 is connected to each internal space S of the bottom plate 52 partitioned by the partition plates 55 and 55. And the adjustment valve 57 is each provided in the base end side rather than the branch part in the nozzle 56, and each branch part.

  According to such a configuration, for example, by adjusting the slide amount of the opening / closing lid 53 and adjusting the air flow rate of each branching portion of the nozzle 56 by each adjustment valve 57 under the control of the control unit 8, The flow rate of the air blown from 11 can be changed stepwise in the direction toward the positioning portions 3 and 4. Thereby, the speed of the sheet laminate 23 when approaching the positioning portions 3 and 4 can be adjusted more precisely, and the sheet lamination when the end portion of the sheet laminate 23 is brought into contact with the positioning portions 3 and 4 is achieved. The load on the body 23 can be further reliably reduced.

  FIG. 10 is a schematic view showing a modified example of the positioning device provided with the air flow rate adjusting mechanism. Like the positioning device 61 shown in FIG. 10, the air supply / discharge devices 7 are provided as many as the number of partitions in each internal space S of the bottom plate 52, and the nozzles 62 extending from the air supply / discharge devices 7 are connected to the partition plates 55, 55. It may be connected to each internal space S of the bottom board 52 partitioned by.

It is a schematic diagram which shows the positioning device used for 1st Embodiment of the manufacturing method of the multilayer electronic component which concerns on this invention. It is a top view of the positioning device shown in FIG. It is a schematic diagram which shows the manufacturing process of a multilayer electronic component using the positioning device shown in FIG. FIG. 4 is a schematic diagram illustrating a subsequent process of FIG. 3. FIG. 5 is a schematic diagram illustrating a subsequent process of FIG. 4. FIG. 6 is a schematic diagram illustrating a subsequent process of FIG. 5. It is a schematic diagram which shows the positioning apparatus used for 2nd Embodiment of the manufacturing method of the multilayer electronic component which concerns on this invention. It is a schematic diagram which shows the positioning device used for 3rd Embodiment of the manufacturing method of the multilayer electronic component which concerns on this invention. It is a schematic diagram which shows the positioning device which concerns on a modification. It is a schematic diagram which shows the positioning device which concerns on another modification.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, 31, 41, 51, 61 ... Positioning device, 5 ... Inclining device (tilting means), 9, 32, 42 ... Placement surface, 11, 34, 46, 47 ... Air blowing hole, 21 ... Baking device, 22 ... cutting device, 23 ... sheet laminated body (sheet body), 44 ... first region, 45 ... second region, θ ... inclination angle.

Claims (7)

A step of preparing a positioning device having a positioning portion provided on the mounting surface and an air blowing hole extending toward the mounting surface;
Placing a single sheet on the placement surface of the positioning device;
The step of bringing the end of the sheet member into contact with the positioning unit by blowing air from the air blowing hole toward the sheet member placed on the placement surface;
A method of manufacturing a multilayer electronic component including a step of transporting the sheet member brought into contact with the positioning portion to an apparatus of a next step.   The method for manufacturing a multilayer electronic component according to claim 1, wherein the air blowing hole is inclined toward the positioning portion side.   3. The multilayer electronic component according to claim 1, further comprising a step of inclining the placement surface by an inclining unit so that the positioning unit side is at a low position after the sheet body is placed on the placement surface. Manufacturing method.   The manufacturing method of the multilayer electronic component according to claim 1, wherein the placement surface is inclined so that the positioning portion side is at a low position. The placement surface includes a first area located on the positioning portion side and a second area located on the opposite side of the positioning portion,
2. The method for manufacturing a multilayer electronic component according to claim 1, wherein the inclination of the mounting surface in the first region is gentler than the inclination of the mounting surface in the second region.   6. The method for manufacturing a multilayer electronic component according to claim 5, wherein the mounting surface in the first region is horizontal. The placement surface includes a first area located on the positioning portion side and a second area located on the opposite side of the positioning portion,
2. The method for manufacturing a multilayer electronic component according to claim 1, wherein the air blowing hole located in the first region is inclined toward the second region.

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