JP2012069765A - Manufacturing method of laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated ceramic electronic component which suppresses the lamination deviation of laminated ceramic green sheets by simple means.SOLUTION: A manufacturing method of a laminated ceramic electronic component 1, comprises a step for preparing a plurality of ceramic green sheets 18 formed on a supporting body 19, a step for laminating the plurality of the ceramic green sheets 18, a step for obtaining a laminated body 12 by heating and pressurizing the laminated ceramic green sheets 18, and a step for obtaining a laminated ceramic electronic component 1 from the laminated body 12. In the step for obtaining the laminated body 12, one surface 18d of the ceramic green sheet 18b on the laminated side is negatively charged, and a lower surface 18c of the ceramic green sheet 18a on a laminating side is positively charged. Charged surfaces 18c and 18d of the ceramic green sheets 18a and 18b which are charged with different polarity are laminated while contacting each other and temporarily fixed.

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component.

  As a method of manufacturing a multilayer ceramic capacitor, a ceramic green sheet formed on a support film is temporarily pressed while being laminated, and the ceramic green sheet that has been laminated and temporarily pressed is finally crimped to obtain a laminated body. A ceramic capacitor is manufactured (for example, refer to Patent Document 1). As described above, by temporarily pressing the ceramic green sheets while being laminated, the laminated ceramic green sheets are prevented from causing misalignment before the final pressure bonding.

Japanese Patent Laid-Open No. 6-31417

  However, in the manufacturing method described in Patent Document 1, in order to temporarily press-bond, the laminating apparatus must be provided with a heat-bonding function (such as a heater or a press), which may complicate the manufacturing apparatus and the manufacturing process. was there. Moreover, in a multilayer ceramic electronic component such as a multilayer ceramic capacitor, the ceramic green sheets are manufactured from 10 layers, and in many cases, 1000 layers or more are stacked. Therefore, the respective ceramic green sheets are stacked. If temporary pressure bonding is performed every time, there is a problem that the manufacturing time takes more than necessary.

  An object of this invention is to provide the manufacturing method of the laminated ceramic electronic component which can suppress the lamination | stacking shift | offset | difference of the laminated | stacked ceramic green sheet with a simple means.

  In order to solve the above problems, a method for manufacturing a multilayer ceramic electronic component according to the present invention includes a step of preparing a plurality of ceramic green sheets each formed on a support, and a step of stacking a plurality of ceramic green sheets. And a step of heating and pressurizing the laminated ceramic green sheets to obtain a laminated body, and a step of obtaining a laminated ceramic electronic component from the laminated body. Then, in the laminating step, the first charging step of charging one surface of the ceramic green sheet on the laminated side to one polarity, and the surface opposite to the support of the ceramic green sheet on the laminated side to the other polarity A second charging step, and a temporary fixing step of temporarily fixing by laminating the charged surfaces of the ceramic green sheets charged to different polarities in the first and second charging steps so that they are in contact with each other. It is out.

  In the method for manufacturing a multilayer ceramic electronic component according to the present invention, the first and second charging steps and the temporary fixing step are included in the stacking step. In this case, both ceramic green sheets are charged to different polarities by using a charging process that can be performed relatively easily as compared with the temporary press-bonding process by hot pressing, and the charged ceramic green sheets are temporarily fixed by electrostatic force. Yes. For this reason, the lamination | stacking shift | offset | difference of the laminated | stacked ceramic green sheet can be suppressed by a simple means, without using a large-scale means like a hot press. In addition, since both the ceramic green sheets are charged and temporarily fixed, the fixing of both is performed reliably.

  In the method for manufacturing a laminated ceramic electronic component described above, in the first charging step, one surface of the laminated ceramic green sheet is charged to one polarity by peeling the support from the laminated ceramic green sheet. It is preferable. In this case, when the support such as PET film is peeled off from the ceramic green sheet, the ceramic green sheet is charged by positively using the phenomenon of charging (peeling charging). It can be simplified. In this case, the polarity to be peeled and charged can be easily controlled by selecting the physical properties of the support and the ceramic green sheet.

  In the method for manufacturing a multilayer ceramic electronic component described above, in the second charging step, the laminate-side ceramic green sheet is irradiated with ions of the other polarity by a charging device to the multilayer-side ceramic green sheet, thereby supporting the multilayer-side ceramic green sheet. It is preferable to charge the opposite surface to the other polarity. In this case, since the charging is performed using a simple means such as a charging device, the method of manufacturing the multilayer ceramic electronic component can be further simplified.

  In the manufacturing method of the multilayer ceramic electronic component described above, the charge amount for charging the ceramic green sheet on the laminated side in the first charging step is the charge amount for charging the ceramic green sheet on the laminated side in the second charging step. It is preferable to make it larger. In this case, since the polarity imparted by peeling charging or the like can be controlled to be constant, the work of confirming whether the polarity of the laminated ceramic green sheets has changed can be omitted. As a result, it is possible to further reduce the manufacturing time of the multilayer ceramic electronic component.

  In the method for manufacturing a multilayer ceramic electronic component described above, a plurality of ceramic green sheets may be prepared so that the plurality of ceramic green sheets do not substantially contain an antistatic agent. In this case, characteristic deterioration of the final product that may occur when an antistatic agent is mixed can be prevented. Moreover, in the case where peeling charging is performed in the first charging step, peeling charging can be easily performed.

  In the method for manufacturing a multilayer ceramic electronic component described above, it is preferable that the second charging step is performed when the ceramic green sheet is conveyed. In this case, one of the charging processes is performed during the conveyance of the ceramic green sheet, and the manufacturing time of the multilayer ceramic electronic component can be further shortened.

  In the method for manufacturing a multilayer ceramic electronic component described above, in the step of laminating, the first and second charging steps and the temporary fixing step may be repeated a plurality of times. In this case, even if the multilayer ceramic electronic component is a thin-layer multilayer product, the manufacturing time can be shortened.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the multilayer ceramic electronic component which suppressed the lamination | stacking shift | offset | difference of the laminated | stacked ceramic green sheet with a simple means can be provided.

It is a perspective view which shows an example of the multilayer ceramic electronic component manufactured by the manufacturing method which concerns on this embodiment. It is sectional drawing of the multilayer ceramic electronic component shown in FIG. It is a flowchart which shows the manufacturing process of the multilayer ceramic electronic component which concerns on this embodiment. It is a schematic sectional drawing which shows the lamination process in the manufacturing process of the multilayer ceramic electronic component which concerns on this embodiment. It is a figure which shows the relationship between the charging amount by peeling charging, and the number of lamination | stacking. It is a figure which shows the lamination process in a comparative example, (a) is a schematic sectional drawing, (b) is a top view.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted. For convenience of explanation, the shape of each part may be exaggerated in each drawing, and the dimensional ratio on the drawing may not always match between the drawings.

  First, with reference to FIG.1 and FIG.2, the structure of the laminated ceramic electronic component 1 manufactured by the manufacturing method which concerns on this embodiment is demonstrated. In the present embodiment, the multilayer ceramic electronic component 1 will be described below by taking a multilayer capacitor as an example. However, the present invention is not limited to this, and other multilayer ceramic electronic components may be used. The multilayer ceramic electronic component 1 includes a component body 2, a terminal electrode 4, and an internal electrode 6.

As shown in FIG. 2, the component body 2 is formed by laminating a plurality of dielectric layers 8, and has a substantially rectangular parallelepiped shape. The dielectric layer 8 is formed of a dielectric material having electrostrictive characteristics such as a BaTiO ₃ system, a (Ti, Zr) O ₃ system, and a (Ba, Ca) TiO ₃ system. The terminal electrodes 4 are respectively formed so as to cover the end surface 2a in the longitudinal direction of the component element body 2, and are arranged so as to face each other. The terminal electrode 4 is multi-layered. For example, Cu, Ni, Ag—Pd or the like is used for the inner layer in contact with the component element body 2, and plating such as Ni—Sn is used for the outer layer. It has been subjected.

  The internal electrodes 6 are alternately stacked in the component element body 2 with at least one dielectric layer 8 interposed therebetween. The internal electrode 6 is composed of a main electrode portion 6a that forms a capacitance portion facing the other internal electrodes 6 adjacent in the stacking direction, and a lead electrode portion 6b that pulls the main electrode portion 6a toward the terminal electrode 4. Composed. One of the alternately stacked internal electrodes 6 is connected to one of the terminal electrodes 4, and the other of the internal electrodes 6 is connected to the other of the terminal electrodes 4. The thickness of the dielectric layer 8 is, for example, about 2 to 3 μm.

  Then, the manufacturing method of the multilayer ceramic electronic component 1 which has the structure mentioned above is demonstrated.

  FIG. 3 is a flowchart showing a manufacturing process of the multilayer ceramic electronic component 1. In manufacturing the multilayer ceramic electronic component 1, first, the conductive paste P1 for forming the internal electrode pattern 16 (see FIG. 4) to be the internal electrode 6 and the ceramic green sheet 18 to be the dielectric layer 8 (FIG. 4). The ceramic paste P2 for forming a reference) is prepared (step S01). The conductive paste P1 is a paste-like composition obtained by mixing a binder resin, a solvent, or the like with a metal powder such as Ni, Ag, or Pd.

The ceramic paste P2 is a paste obtained by mixing and kneading an organic vehicle or the like with the raw material of the dielectric material constituting the dielectric layer 8. Examples of the dielectric material include oxides, carbonates, nitrates and hydroxides of metal atoms contained in complex oxides such as BaTiO ₃ , (Ti, Zr) O ₃ , and (Ba, Ca) TiO ₃ , for example. And combinations of organometallic compounds. In the present embodiment, the ceramic paste P2 includes an antistatic agent, but may be substantially free of an antistatic material.

  Subsequently, when the preparations of both the conductive paste P1 and the ceramic paste P2 are completed, a long support 19 made of PET or the like is prepared (step S02), and the ceramic paste P2 is placed on the support 19. The ceramic green sheet 18 that is the precursor of the dielectric layer 8 is formed on the support 19 (step S03).

  Subsequently, a conductive paste P1 is applied to a predetermined position of the ceramic green sheet 18 by, for example, screen printing, and a large number of internal electrode patterns 16 corresponding to the internal electrodes 6 are formed on the ceramic green sheet 18. Thereafter, as shown in FIG. 4A, cutting is performed so that there are 16 internal electrode patterns 16 on one ceramic green sheet 18a (4 rows and 4 columns, only one of which is shown in the figure). A plurality of substantially rectangular ceramic green sheets 18a are formed by cutting at a predetermined position by the blade 21.

  Subsequently, the ceramic green sheet 18a (laminated ceramic green sheet) cut by the cutting blade 21 is laminated so that the internal electrode 6 and the dielectric layer 8 are arranged as shown in FIG. Then, the support 19 side is held and moved to the laminating device 24 (see FIG. 4C). By the way, in the present embodiment, as shown in FIG. 4B, the ceramic green sheet 18a receives positive ions irradiated from an ionizer 23 which is an example of a charging device in the middle of the conveyance. A lower surface 18c of the sheet 18a opposite to the support 19 is positively charged (second charging step). Depending on the physical properties of the ceramic green sheet 18a, the ions irradiated from the ionizer 23 may be negative ions.

  Subsequently, as shown in FIG. 4C, the ceramic green sheet 18a moved to the stacking position is stacked in the stacking direction with respect to the uppermost layer of the stacked ceramic green sheets 18b (the stacked ceramic green sheets). It arrange | positions in the position which opposes. As will be described later, the ceramic green sheet 18b positioned at the uppermost layer on the stacking side is minus by peeling the support 19 from the ceramic green sheet 18a after the stacking-side ceramic green sheet 18a is stacked. (The first charging step).

  Then, after the ceramic green sheets 18a and 18b are arranged to face each other, the holding mechanism 22 is lowered to the laminating device 24 side so that the charged surfaces of the ceramic green sheets 18a and 18b charged with different polarities are in contact with each other. The ceramic green sheet 18a is laminated on the ceramic green sheet 18b (see FIG. 4D). Since both ceramic green sheets 18a and 18b are charged with substantially different polarities from each other, they are attracted to each other by Coulomb force, whereby both are temporarily fixed.

  Subsequently, when the laminated ceramic green sheet 18a is laminated on the laminated ceramic green sheet 18b, as shown in FIG. 4 (e), the support 19 of the ceramic green sheet 18a is removed by a peeling device ( The peeling surface 18d of the ceramic green sheet 18a is negatively charged by so-called peeling charging. The laminated ceramic green sheet 18a becomes the above-described laminated ceramic green sheet 18b after being laminated and peeled and charged.

  Thereafter, the charging process and the temporary fixing process shown in FIGS. 4B to 4E are repeated until a predetermined number of layers (for example, 10 layers) is reached. Here, the electric power due to the peeling charging of the ceramic green sheet 18b on the laminated side is approximately −200V or less, and the absolute value thereof is more than several tens of volts which is the electric power due to the ionizer of the ceramic green sheet 18a on the laminated side. Is getting bigger. Further, as shown in FIG. 5, the electric power due to the peeling charging of the ceramic green sheet 18b on the laminated side is substantially constant at −200 V or less even when the number of laminations is increased. Thus, the polarity of the laminated ceramic green sheet 18b is not changed.

  Subsequently, when a predetermined number of ceramic green sheets 18b are stacked, the process proceeds to FIG. 4F, and the stacked ceramic green sheets 18b are pressed in the stacking direction while being heated. Thereby, the laminated body 12 is formed (step S05).

  Subsequently, when the multilayer body 12 is formed, the multilayer body 12 is cut at a predetermined location corresponding to the extraction electrode portion 6b to form a plurality (16 pieces) of the component body 2 (step S06). In FIG. 4, for ease of explanation, the position of the internal electrode pattern 16 is slightly shifted with respect to the internal electrode 6 of FIG. 2, but actually, the internal electrode pattern 16 of FIG. Corresponds to the internal electrode 6.

Subsequently, when cutting is completed, the component body 2 is fired (step S07). Firing is performed by heating the component body 2 to, for example, about 1100 to 1300 ° C. in a reducing atmosphere. Prior to the firing process, the component body 2 may be subjected to a binder removal process. The binder removal process is performed by placing the component body 2 in a reducing atmosphere such as in air or a mixed gas of N ₂ and H ₂ and heating to about 200 to 600 ° C. Further, after firing the component body 2, the obtained fired product may be annealed at 800 to 1100 ° C. for about 2 to 10 hours as necessary.

  Subsequently, the conductive paste P3 is applied and baked so as to cover the end face 2a of the component element body 2, and then the terminal electrode 4 is formed by plating (step S08). As the conductive paste P3, for example, a metal powder mainly containing Cu mixed with glass frit and an organic vehicle can be used. The metal powder may contain Ni, Ag—Pd or Ag as a main component. For the plating, metal plating such as Ni, Sn, Ni—Sn alloy, Sn—Ag alloy, Sn—Bi alloy is used. Further, the metal plating may be a multi-layer structure in which two or more layers of Ni and Sn are formed, for example. Thus, the multilayer ceramic electronic component 1 shown in FIGS. 1 and 2 is obtained.

  As described above, in the method of manufacturing the multilayer ceramic electronic component 1 according to this embodiment, in the step of forming the multilayer body 12, the charging process and the temporary fixing process are performed as described above. In this way, the ceramic green sheets 18a and 18b are charged to different polarities by using a charging process (peeling charging and charging by an ionizer) that can be performed relatively easily as compared with the thermocompression bonding process using a hot press. Both the ceramic green sheets 18a and 18b are temporarily fixed by electrostatic force.

  For this reason, according to this manufacturing method, the lamination | stacking shift | offset | difference of the laminated | stacked ceramic green sheets 18a and 18b can be suppressed by a simple means, without using a big means like a hot press. In addition, since both the ceramic green sheets 18a and 18b are charged with different polarities and temporarily fixed, the both can be reliably fixed.

  Moreover, in the manufacturing method of the multilayer ceramic electronic component 1 described above, by peeling the support 19 from the ceramic green sheet 18b on the laminated side, one surface of the ceramic green sheet 18b on the laminated side is set to one polarity (minus). It is charged. In this way, the ceramic green sheet 18b is charged by actively utilizing the phenomenon (peeling charging) that the ceramic green sheet 18b is charged when the support 19 such as a PET film is peeled from the ceramic green sheet 18b. The manufacturing method 1 can be simplified.

  Moreover, in the manufacturing method of the multilayer ceramic electronic component 1 described above, by irradiating the laminate-side ceramic green sheet 18a with positive ions by the ionizer 23, the opposite side to the support 19 of the laminate-side ceramic green sheet 18a. The lower surface 18c is charged to the other polarity (plus). Thus, since the charging is performed using a simple means such as the ionizer 23, the method for manufacturing the multilayer ceramic electronic component 1 can be further simplified.

  In the method for manufacturing the multilayer ceramic electronic component 1 described above, the charge amount charged on the laminated ceramic green sheet 18b is larger than the charge amount charged on the laminated ceramic green sheet 18a. For this reason, even if the number of stacked layers increases, it can be controlled so that the polarity imparted by peeling electrification etc. is constant, so the work of confirming whether the polarity of the laminated ceramic green sheets 18b has changed or not. Can be omitted. As a result, the manufacturing time of the multilayer ceramic electronic component 1 can be further shortened.

  Further, in the method for manufacturing the multilayer ceramic electronic component 1 described above, when the ceramic green sheet 18a is conveyed, the ionizer 23 performs a charging process on the ceramic green sheet 18a on the multilayer side. In this way, one of the charging processes is performed during the conveyance of the ceramic green sheet 18a, and the manufacturing time of the multilayer ceramic electronic component 1 can be further shortened.

  Moreover, in the manufacturing method of the multilayer ceramic electronic component 1 described above, in the step of forming the multilayer body 12, the charging process and the temporary fixing process shown in FIGS. 4B to 4E are repeated a plurality of times. Since the charging process and the temporary fixing process according to this embodiment can be performed in a short time, even if the multilayer ceramic electronic component 1 is a thin-layer multilayer product, the manufacturing time can be shortened.

  Here, the difference in shape between the ceramic green sheets 18a laminated by the manufacturing method according to the present embodiment and the ceramic green sheets 38a laminated by temporarily fixing a part by hot pressing will be briefly described.

  First, a method for temporarily fixing with a hot press will be briefly described. As shown in FIG. 6 (a), in the temporary fixing method by hot pressing, after the laminated ceramic green sheets 38a are laminated on the laminated ceramic green sheets 38b on the laminating apparatus 34, Hot pressing is performed by a crimping device 32 provided with a thermocompression bonding portion 31. By this hot pressing, as shown in FIG. 6B, the four corners 31a of the ceramic green sheets 38a and 38b are temporarily fixed.

  By the way, in the temporary fixing method by this hot press, since the four corners 31a are further heat-welded and temporarily fixed, portions other than the temporary fixing point 31a are extended. For this reason, the planar shape of the ceramic green sheet 38a becomes an irregular shape, and the thickness may vary greatly depending on the location. As a result, in the laminate temporarily fixed by hot pressing, there is a possibility that a part (for example, the vicinity of the temporary fixing point 31a) becomes a defective product.

  On the other hand, in the temporary fixing method in the manufacturing method according to this embodiment described above, substantially the entire surface of the ceramic green sheets 18a and 18b is temporarily fixed by electrostatic force. For this reason, the planar shape of the ceramic green sheet 18a maintains a substantially rectangular shape. As a result, in the laminated body temporarily fixed according to the present embodiment, the possibility that a part thereof becomes defective due to elongation, uneven thickness, or the like is reduced, and manufacturing efficiency can be improved.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, in the above embodiment, the case where the ceramic green sheet 18 includes the antistatic agent has been described. However, the ceramic green sheet 18 may be prepared so that the ceramic green sheet 18 does not substantially include the antistatic agent. Good. In this case, characteristic deterioration of the final product that may occur when an antistatic agent is mixed can be prevented. Moreover, in the case of performing peeling charging, the peeling charging can be easily performed.

  In the above embodiment, the case where the number of stacked layers is about 10 has been described. However, the manufacturing method described in the present embodiment may be applied to a multi-layered structure in which the number of stacked layers is 1000 layers or more. . In particular, when the number of stacked layers is large, the temporary fixing method in the present embodiment is simpler and shorter processing than the temporary fixing method by the conventional hot press, so that the effect can be made remarkable.

  Moreover, in the said embodiment, although demonstrated taking the case of the multilayer capacitor as an example of the multilayer ceramic electronic component 1 manufactured with the manufacturing method which concerns on this embodiment, even if this manufacturing method is applied to multilayer ceramic electronic components other than a multilayer capacitor. Good. Further, in the above embodiment, the charging process is performed by the ionizer 23 which is a charging device during the conveyance of the ceramic green sheet 18a. However, the charging process may be performed by temporarily stopping the conveyance of the ceramic green sheet 18a. . In this case, the charging process can be performed more reliably. A charging device other than an ionizer may be used.

  Further, in the above-described embodiment, the case where the ceramic green sheet 18b is negatively charged by charge peeling has been described, but the ceramic green sheet 18b may be positively charged. In the peeling charging, the polarity for peeling charging can be easily controlled by selecting the physical properties of the support 19 and the ceramic green sheet 18b. In this case, the ceramic green sheet 18a is charged negatively.

  DESCRIPTION OF SYMBOLS 1 ... Multilayer ceramic electronic component, 2 ... Component body, 4 ... Terminal electrode, 6 ... Internal electrode, 8 ... Dielectric layer, 18 ... Ceramic green sheet, 19 ... Support body, 23 ... Ionizer.

Claims (7)

Preparing a plurality of ceramic green sheets each formed on a support;
Laminating the plurality of ceramic green sheets;
Heating and pressurizing the laminated ceramic green sheets to obtain a laminate;
Obtaining a multilayer ceramic electronic component from the laminate,
The laminating step includes a first charging step of charging one surface of the ceramic green sheet on the laminated side to one polarity, and a surface opposite to the support of the ceramic green sheet on the laminating side to the other polarity. And a temporary fixing step of performing temporary fixing by laminating the charged surfaces of the ceramic green sheets charged in different polarities in the first and second charging steps so as to contact each other. A method for producing a multilayer ceramic electronic component comprising:   The first charging step is characterized in that one surface of the laminated ceramic green sheet is charged to one polarity by peeling the support from the laminated ceramic green sheet. A method for producing a multilayer ceramic electronic component according to claim 1.   In the second charging step, by irradiating the laminated ceramic green sheet with ions of the other polarity by a charging device, the other surface of the laminated ceramic green sheet is opposite to the support. The method for producing a multilayer ceramic electronic component according to claim 1, wherein the multilayer ceramic electronic component is charged to a polarity of the following.   The charge amount for charging the ceramic green sheet on the laminated side in the first charging step is larger than the charge amount for charging the ceramic green sheet on the laminated side in the second charging step. The manufacturing method of the multilayer ceramic electronic component as described in any one of Claims 1-3.   5. The plurality of ceramic green sheets are prepared in the preparing step so that the plurality of ceramic green sheets do not substantially contain an antistatic agent. 6. Manufacturing method for multilayer ceramic electronic parts.   The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the second charging step is performed when the ceramic green sheet is conveyed.   The method for producing a multilayer ceramic electronic component according to claim 1, wherein in the step of laminating, the first and second charging steps and the temporary fixing step are repeated a plurality of times. .

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