KR102431286B1 - Laminating system and laminating method - Google Patents

Abstract

The present invention relates to a laminating system and a laminating method capable of laminating and planarizing a first film or a second film on an upper surface or a lower surface of a substrate, wherein the first film or the second film is aligned on the upper surface or lower surface of a substrate to each other a film alignment unit to be in contact; a film bonding unit for temporarily bonding the aligned first or second film to a portion of the substrate; a laminating unit for laminating by pressing the first film or the second film temporarily bonded to the substrate to adhere to the upper or lower surface of the substrate; a hot press unit for flattening the first film or the second film in close contact with the substrate; a cooling unit for cooling the substrate on which the first film or the second film is planarized; and a carrier film removal unit configured to remove the carrier film for transferring the substrate from the film connecting unit to the cooling unit from the substrate.

Description

Laminating system and laminating method

The present invention relates to a laminating system and a laminating method, and more particularly, to a laminating system and a laminating method for laminating and planarizing a first film or a second film on an upper or lower surface of a substrate.

Display screens and touch screens of 3C products (Computer, Communication and Consumer electronics) equipped with mobile terminals, PDAs, and audio/video devices that are currently widely used are at least two different types of substrates or films. It is made by laminating together.

In such a conventional substrate laminating apparatus, a target substrate has a laminating surface, and an adhesive is applied thereon. In order to laminate the flexible substrate to the laminating surface of the target substrate, a roller is rolled to apply a pressing force to the flexible wire substrate.

As a result, when the roller is rolled, the flexible substrate is made of a polymer material or a conventional commercial material (eg, PREPREG, ABF, Primer Coated Foil, solder resist, dry film, PID, or a non-photosensitive polymer) through the adhesive. A film such as (non-photopolymer) is gradually laminated to the laminating surface of the target substrate, and in this process, air between the two substrates flows out to the open end between the two substrates.

In the above-described conventional method of laminating two substrates to each other using a roller, the above-described films are sequentially pushed by the roller, and a phenomenon is generated that is slightly separated from the original position of the substrate.

The positional deviation of the film compared to the substrate has a number of problems, such as adversely affecting the subsequent process as the specifications and precision of the product increase, and significantly lowering the performance or yield of the product.

In particular, in the method of loading and transporting the substrate in the first place, in the past, it was common to simply transfer the substrate by a roll-to-roll method using a carrier film over the entire process, but the roll-to-roll transfer method for the entire process is the substrate, Tension applied to the laminating film or the carrier film may be slightly different from each other, and accordingly, the substrate and the laminating film may be easily separated from their respective positions. Due to the nature of the method, it is very difficult to precisely correct or supplement it, so there are problems such as greatly lowering the accuracy, precision and reliability of the alignment of the substrate and the laminating film.

Meanwhile, in the related art, when laminating films on the upper and lower surfaces of the substrate, respectively, the amount of heating applied to the upper and lower surfaces of the substrate is different from each other in the process of sequentially approaching the upper and lower chambers or upper and lower heat sources to the substrate. There was a problem in that the substrate was distorted, the substrate was warped.

The present invention is to solve various problems caused, including the above problems, the substrate is precisely transferred to the correct position using a clamping type shuttle, and the first film or the second film is a vacuum adsorption type flat plate. It facilitates the alignment of the substrate and the first film or the second film by accurately transporting them to the correct position using the head and clamping them again, thereby greatly improving the accuracy, precision and reliability of the equipment. By using the upper chamber and the lower chamber or the upper and lower pressurizers to equalize the amount of heating applied to the upper and lower surfaces of the substrate, distortion of the substrate can be prevented, resulting in lamination defects such as bubble generation or misalignment An object of the present invention is to provide a laminating system and a laminating method capable of preventing the phenomenon. However, these problems are exemplary, and the scope of the present invention is not limited thereto.

Laminating system according to the spirit of the present invention for solving the above problems, a film alignment unit for aligning the first film or the second film on the upper surface or the lower surface of the substrate to contact each other; a film bonding unit for temporarily bonding the aligned first or second film to a portion of the substrate; a laminating unit for laminating by pressing the first film or the second film temporarily bonded to the substrate to adhere to the upper or lower surface of the substrate; a hot press unit for flattening the first film or the second film in close contact with the substrate; a cooling unit for cooling the substrate on which the first film or the second film is planarized; and a carrier film removal unit configured to remove the carrier film for transferring the substrate from the film connecting unit to the cooling unit from the substrate.

In addition, according to the present invention, the first film or the second film is in contact with the first film or the second film from the film alignment unit to the alignment position by using a clamping method to first transfer the substrate to the alignment position, and from the film alignment unit to the film adhesive It may further include a substrate transfer device for secondary transfer of the substrate.

In addition, according to the present invention, the substrate transfer device, the substrate and at least a pair of clamping fingers for clamping the edge portion of the substrate to which the first film or the second film is in contact; a finger drive device for driving the clamping finger; a finger moving device for moving the finger driving device back and forth in a direction of an edge of the substrate in which the substrate and the first film or the second film are in contact; a shuttle on which the finger forward/backward device is installed; and a transport rail capable of guiding the shuttle from the film aligning unit to the film fastener.

In addition, according to the present invention, the film alignment unit, a first unwinding roll or a film cutting device for individualizing by cutting the first film or the second film supplied from the second unwinding roll; and a film adsorption-type elevating device installed above or below the alignment position of the substrate and capable of adsorbing the first film or the second film cut by the film cutting device to ascend and descend in the alignment position direction ; may be included.

In addition, according to the present invention, the film adsorption-type elevating device may vacuum adsorb the first film or the second film so that the cut first film or the second film can be spread flat without being crumpled. It may include a; vacuum adsorption type flat head in which a plurality of suction ports are arranged in M rows and N columns.

Also, according to the present invention, the vacuum adsorption type flat head may have a finger groove capable of accommodating a portion of the clamping finger on one side thereof.

In addition, according to the present invention, a carrier film transport device for transporting the substrate in contact with the first film or the second film from the film adhesive part to the carrier film removal part using the carrier film of the roll-to-roll method; may further include.

In addition, according to the present invention, the carrier film transport device is installed in the film bonding portion, and the carrier film takes over the substrate in contact with the first film or the second film from the substrate transport device and surrounds them. Carrier film unwinding rolls respectively installed above and below the substrate transfer line to make rice; and a carrier film winding installed in the carrier film removal unit, respectively, installed above and below the substrate transfer line to collect the carrier film separated from the substrate to which the first film or the second film is in contact. roll; may include.

In addition, according to the present invention, the film bonding unit, the first film or a portion of the second film by pressing a temporary bonding machine to the upper or lower surface of the substrate; may include a.

In addition, according to the present invention, the laminating unit, the upper chamber is installed above the substrate transfer line; an upper pressing device installed in the upper chamber and pressurizing and heating the first film to be in close contact with the substrate; a lower chamber installed below the substrate transfer line and coupled to the upper chamber to form a vacuum pressure therein; and a lower pressing device installed in the lower chamber and pressing and heating the second film to be in close contact with the substrate.

In addition, according to the present invention, the laminating unit, an upper chamber elevating device capable of elevating the upper chamber; a lower chamber elevating device capable of elevating the lower chamber; and while the upper chamber and the lower chamber are closed while approaching each other, a lowering control signal is applied to the upper chamber elevating device so that the upper and lower surfaces of the substrate can be simultaneously heated to the same degree, and at the same time the lower chamber elevating and lowering. It may further include a chamber simultaneous control unit for applying a rising control signal to the device.

In addition, according to the present invention, the laminating unit, an upper pressure plate elevating device capable of elevating the upper pressure device; a lower pressure plate elevating device capable of elevating the lower pressure device; and applying a lowering control signal to the upper pressurizing plate elevating device so that the upper and lower surfaces of the substrate can be simultaneously heated to the same degree while the upper pressurizing device and the lower pressurizing device approach each other and press the substrate, At the same time, the pressure plate simultaneous control unit for applying a lift control signal to the lower pressure plate elevating device; may further include.

In addition, according to the present invention, the laminating part may include the upper chamber and the lower chamber so that the substrate can be positioned between the upper chamber and the lower chamber at a central position between them while the upper chamber and the lower chamber are closed while approaching each other. It may further include; a pair of chamber interlocking rollers that are interlocked with the movement of the lower chamber to elastically guide the carrier film.

In addition, according to the present invention, the hot press unit, an upper chamber installed above the substrate transfer line; an upper pressing device installed in the upper chamber and pressing and heating the first film to be flattened; a lower chamber installed below the substrate transfer line and coupled to the upper chamber to form a vacuum pressure therein; and a lower pressurizing device installed in the lower chamber and pressurizing and heating the second film to flatten the second film.

In addition, according to the present invention, the cooling unit may include a plurality of blowers installed above and below the line above and below the substrate abnormality line and cooling the substrate by air cooling.

In addition, according to the present invention, the carrier film removal unit, the first film and the carrier film, or the second film and the wedge-shaped cutter inserted into the gap between the carrier film to separate them; may further include.

On the other hand, the laminating method according to the spirit of the present invention for solving the above problems, the first film or the second film by aligning the first film or the second film on the upper surface or the lower surface of the substrate to contact each other, the film alignment unit, the aligned first film or the first film 2 A film bonding unit for temporarily bonding a film to a portion of the substrate, a laminating unit for laminating by pressing the first film or the second film temporarily bonded to the substrate to adhere to the upper or lower surface of the substrate, and to the substrate A hot press unit for flattening the first film or the second film by pressing the adhered first film or the second film, a cooling unit for cooling the substrate on which the first film or the second film is flattened, and from the film bonding unit to the cooling unit A carrier film removal unit for removing a carrier film for transferring a substrate from the substrate, the first transfer of the substrate from the film alignment unit to the alignment position using a clamping method, and the first The first film or the second film from the film adhesive part to the carrier film removal part using a substrate transport device and a roll-to-roll carrier film for secondary transporting the substrate in contact with the first film or the second film In the laminating method of a laminating system having a carrier film transfer device for transferring the contacted substrate, (a) aligning the first film or the second film on the upper surface or the lower surface of the substrate to contact each other; (b) temporarily attaching the aligned first or second film to a portion of the substrate; (c) laminating by pressing the first film or the second film temporarily bonded to the substrate to adhere to the upper or lower surface of the substrate; (d) flattening the first film or the second film in close contact with the substrate by pressing; (e) cooling the substrate on which the first film or the second film is planarized; (f) removing the carrier film from the substrate for transferring the substrate from the film junction part to the cooling part; The first film or the second film is brought into contact with the first film or the second film from the film aligning unit to the film binding unit using the substrate transfer device in the first step of transferring the substrate from the alignment unit to the alignment position. Secondary transfer of the substrate, the steps (c), (d), (e), and (f) are performed from the first The film or the substrate in contact with the second film may be transferred.

In addition, according to the present invention, the substrate transfer device includes at least a pair of clamping fingers for clamping the edge portion of the substrate in contact with the substrate and the first film or the second film, and a finger drive for driving the clamping fingers device, a finger forward/backward device for moving the finger driving device forward and backward in the direction of the edge portion of the substrate in contact with the substrate and the first film or the second film, a shuttle on which the finger forward/backward device is installed, and the shuttle; and a transport rail capable of guiding from the film aligning part to the film folding part, wherein the step (a) includes (a-1) advancing the clamping finger in the direction of the edge of the substrate with the finger forward/backward device thereafter, closing the clamping finger to grip the substrate; (a-2) transferring the substrate to the alignment position along the transfer rail; (a-3) aligning the first film or the second film on the upper or lower surface of the substrate; and (a-4) freeing the substrate by opening the clamping finger, and retracting the clamping finger with the finger retractor device; wherein step (b) comprises: (b-1) before and after the finger advancing the clamping finger toward the edge of the substrate with a gripping device, then closing the clamping finger to re-grip the substrate and the first or second film; (b-2) transferring the substrate and the first film or the second film along the transfer rail to the film fastener; (b-3) freeing the substrate and the first or second film by opening the clamping finger, and retracting the clamping finger with the finger retractor device; and (b-4) transferring, by the carrier film transfer device, the substrate and the first film or the second film to the film bonding unit.

According to some embodiments of the present invention made as described above, the substrate is precisely transferred to the correct position using a clamping shuttle, and the first or second film is moved to the correct position using a vacuum adsorption type flat head. By accurately conveying and re-clamping, it facilitates the alignment of the substrate and the first or second film, which can greatly improve the accuracy, precision and reliability of the equipment, and the upper chamber and lower chamber or upper chamber of the top-down simultaneous approach By using the pressurizing device and the lower pressurizing device to equalize the amount of heating applied to the upper and lower surfaces of the substrate, it is possible to prevent the distortion of the substrate, thereby preventing lamination defects such as bubble generation or misalignment. is to have Of course, the scope of the present invention is not limited by these effects.

1 is a conceptual diagram illustrating a laminating system according to some embodiments of the present invention.
FIG. 2 is a perspective view illustrating a substrate transfer process of the substrate transfer apparatus of the laminating system of FIG. 1 .
3 is a perspective view illustrating a film alignment process of the substrate transport apparatus of the laminating system of FIG. 1 .
4 is a perspective view illustrating a substrate and film transfer process of the substrate transfer apparatus of the laminating system of FIG. 1 .
FIG. 5 is a cross-sectional view illustrating a chamber open state of a laminating unit of the laminating system of FIG. 1 .
6 is a cross-sectional view illustrating a chamber sealing state of the laminating unit of the laminating system of FIG. 5 .
7 is a cross-sectional view illustrating a chamber open state of the hot press unit of the laminating system of FIG. 1 .
8 is a cross-sectional view illustrating a chamber sealing state of the hot press unit of the laminating system of FIG. 5 .
9 is an external perspective view showing a laminating system according to some other embodiments of the present invention.
FIG. 10 is a side view illustrating the laminating system of FIG. 9 .
11 is a perspective view illustrating a film alignment part and a film adhesive part of the laminating system of FIG. 9 .
FIG. 12 is an enlarged perspective view illustrating a film alignment part and a film adhesive part of the laminating system of FIG. 11 .
13 is a perspective view illustrating a laminating unit and a hot press unit of the laminating system of FIG. 9 .
14 is a side view illustrating a laminating unit and a hot press unit of the laminating system of FIG. 13 .
15 is an enlarged perspective view illustrating a laminating unit of the laminating system of FIG. 13 .
16 is a side view illustrating a laminating unit of the laminating system of FIG. 15 .
17 is an enlarged perspective view illustrating a hot press unit of the laminating system of FIG. 13 .
18 is a side view illustrating a hot press unit of the laminating system of FIG. 17 .
19 is an external perspective view illustrating a cooling unit and a carrier film removal unit of the laminating system of FIG. 9 .
20 is an internal perspective view illustrating a cooling unit and a carrier film removal unit of the laminating system of FIG. 19 .
21 is a perspective view illustrating a laminating system according to some other embodiments of the present invention.
22 is a side view illustrating the laminating system of FIG. 21 .

Hereinafter, several preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Examples of the present invention are provided to more completely explain the present invention to those of ordinary skill in the art, and the following examples may be modified in various other forms, and the scope of the present invention is as follows It is not limited to an Example. Rather, these embodiments are provided so as to more fully and complete the present disclosure, and to fully convey the spirit of the present invention to those skilled in the art. In addition, in the drawings, the thickness or size of each layer is exaggerated for convenience and clarity of description.

Throughout the specification, when referring to one component, such as a film, region, or substrate, being located “on,” “connected,” “stacked,” or “coupled to,” another component, the one component It may be construed that an element may be directly in contact with, “on,” “connected to,” “stacked with,” or “coupled to,” another element, or that there may be other elements intervening therebetween. On the other hand, when it is stated that one element is located "directly on", "directly connected to," or "directly coupled to" another element, it is construed that there are no other elements interposed therebetween. do. Like numbers refer to like elements. As used herein, the term “and/or” includes any one and any combination of one or more of those listed items.

Although the terms first, second, etc. are used herein to describe various members, parts, regions, layers and/or parts, these members, parts, regions, layers, and/or parts are limited by these terms so that they It is self-evident that These terms are used only to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or portion discussed below may refer to a second member, component, region, layer or portion without departing from the teachings of the present invention.

Also, relative terms such as "above" or "above" and "below" or "below" may be used herein to describe the relationship of certain elements to other elements as illustrated in the drawings. It may be understood that relative terms are intended to include other orientations of the element in addition to the orientation depicted in the drawings. For example, if an element is turned over in the figures, elements depicted as being on the face above the other elements will have orientation on the face below the other elements. Thus, the term “top” by way of example may include both “bottom” and “top” directions depending on the particular orientation of the drawing. If the element is oriented in a different orientation (rotated 90 degrees relative to the other orientation), the relative descriptions used herein may be interpreted accordingly.

The terminology used herein is used to describe specific embodiments, not to limit the present invention. As used herein, the singular form may include the plural form unless the context clearly dictates otherwise. Also, as used herein, “comprise” and/or “comprising” refers to the presence of the recited shapes, numbers, steps, actions, members, elements, and/or groups of those specified. and does not exclude the presence or addition of one or more other shapes, numbers, movements, members, elements and/or groups.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically illustrating ideal embodiments of the present invention. In the drawings, variations of the illustrated shape can be envisaged, for example depending on manufacturing technology and/or tolerances. Accordingly, embodiments of the inventive concept should not be construed as limited to the specific shape of the region shown in the present specification, but should include, for example, changes in shape caused by manufacturing.

1 is a conceptual diagram illustrating a laminating system 1000 according to some embodiments of the present invention.

First, as shown in FIG. 1 , the laminating system 1000 according to some embodiments of the present invention is largely a film aligning unit 100 , a film welding unit 200 , and a laminating unit 300 , It may include a hot press unit 400 , a cooling unit 500 , a carrier film removal unit 600 , a substrate transport device 700 , and a carrier film transport device 800 .

For example, as shown in FIG. 1 , the film alignment unit 100 is a module or device for aligning the first film F1 or the second film F2 on the upper or lower surface of the substrate 1 to contact each other. As more specifically, for example, the film alignment unit 100 may include the first film F1 or the second The film cutting device 110 for cutting and individualizing the film F2 and the first film F1 installed above or below the alignment position of the substrate 1 and cut by the film cutting device 110 ) or may include a film adsorption-type elevating device 120 capable of adsorbing the second film (F2) to elevate in the alignment position direction.

Here, for example, the substrate 1 may be loaded and unloaded in the form of individual sheets, and a core layer of a printed circuit board (PCB) in which an epoxy-based resin sheet is formed in multiple layers, or a flexible material of a flexible material. It may be a core layer of a flexible printed circuit board (FPCB).

In addition, for example, the first film F1 or the second film F2 may be made of a material or conductive material having adequate mechanical strength and insulation to sufficiently protect, support, or accommodate various electronic components or components. As can be, various ABF films, dry films, PREPREG, Primer Coated Foil, solder resist, PID, or films such as non-photopolymer can be applied.

Here, according to the laminating system 1000 according to some embodiments of the present invention, it is not limited to the sheet type, and it can be applied to all roll type substrates to increase the versatility and productivity of the equipment, and to increase the versatility and productivity of various types of products. can produce

In addition, here, the film cutting device 110 may be omitted as necessary, and the film adsorption-type elevating device 120 is the existing individualized first film F1 or the first film without a film cutting process. It is also possible to adsorb|suck 2 film F2. Accordingly, the present invention is not necessarily limited to the drawings, and may be modified and changed in a wide variety of forms.

In addition, for example, as shown in FIG. 1 , the width W2 of the first film F1 or the second film F2 is narrower than the substrate width W1 of the substrate 1 , and the second Film stenosis in which the first film (F1) or the second film (F2) is melted when the first film (F1) or the second film (F2) is adhered to exceed the substrate width (W1), and the first film (F1) and the second film (F2) are unnecessary to each other phenomenon can be prevented.

In addition, for example, as shown in FIG. 1 , the film adhesive part 200 temporarily attaches the aligned first film F1 or the second film F2 to a portion of the substrate 1 . As a temporary bonding module or device, more specifically, for example, the film bonding unit 200 presses a portion of the first film F1 or the second film F2 to press the upper surface of the substrate 1 . Alternatively, it may include a temporary folding machine 210 for temporary welding on the lower surface.

In addition, for example, as shown in FIG. 1 , the laminating unit 300 presses the first film F1 or the second film F2 temporarily bonded to the substrate 1 to press the substrate 1 ) may be a module or device for laminating in close contact with the upper or lower surface.

In addition, for example, as shown in FIG. 1 , the hot press unit 400 is a module for flattening by pressing the first film F1 or the second film F2 in close contact with the substrate 1 . or a device.

In addition, for example, as shown in FIG. 1 , the cooling unit 500 is a module or device for cooling the substrate 1 on which the first film F1 or the second film F2 is flattened. can

More specifically, for example, as shown in FIG. 1 , the cooling unit 500 is installed above and below the substrate abnormal line, and a plurality of blowers 510 for cooling the substrate 1 by air cooling. ) may be included.

In addition, for example, as shown in FIG. 1 , the carrier film removing unit 600 includes a carrier film CF for transferring the substrate 1 from the film bonding unit 200 to the cooling unit 500 . may be a module or device for removing the substrate 1 from the substrate 1 .

More specifically, for example, as shown in FIG. 1 , the carrier film removal unit 600 may include the first film F1 and the carrier film CF or the second film F2 and the carrier A wedge-shaped cutter 610 that is inserted into the gap of the film CF to separate them; may include.

Therefore, when explaining the operation process of the laminating system 1000 according to some embodiments of the present invention, first, the first film ( F1) or the second film (F2) is aligned to contact each other, and then, the first film (F1) or the second film (F2) aligned using the film fastener 200 is applied to the substrate 1 ) temporarily bonded to a portion of the substrate, and by pressing the first film F1 or the second film F2 temporarily bonded to the substrate 1 in the laminating unit 300, the upper surface of the substrate 1 or Lamination is carried out in close contact with the lower surface, and in the hot press unit 400, the first film F1 or the second film F2 in close contact with the substrate 1 is pressed to flatten it, and the cooling unit 500 ) to cool the substrate 1 on which the first film F1 or the second film F2 is planarized using The carrier film CF may be removed from the substrate 1 .

On the other hand, for example, as shown in Figure 1, the carrier film transport device 800, the carrier film removal unit 600 in the film adhesive 200 using the carrier film (CF) of the roll-to-roll method. ) as an apparatus for transferring the substrate 1 to which the first film F1 or the second film F2 is in contact, more specifically, for example, the carrier film transfer apparatus 800, the film It is installed in the hinge 200, and the carrier film CF takes over the substrate 1 in contact with the first film F1 or the second film F2 from the substrate transfer device 700. A carrier film unwinding roll 810 installed above and below the substrate transfer line to surround them, and installed in the carrier film removal unit 600, the first film F1 or the second film Guide the carrier film winding roll 820 and the carrier film respectively installed above and below the substrate transfer line to collect the carrier film CF separated from the substrate 1 in contact with (F2). and a carrier film guide rail CG of FIG. 13 to be described later.

Accordingly, the carrier film CF is transferred from the carrier film unwinding roll 810 to the carrier film winding roll 820 by tension while being transferred from the substrate transfer device 700 to the first film F1 or the The substrate 1 to which the second film F2 is temporarily bonded may be taken over and transferred to the carrier film removal unit 600 .

2 is a perspective view illustrating a substrate transfer process of the substrate transfer apparatus 700 of the laminating system 1000 of FIG. 1 , and FIG. 3 is a film alignment process of the substrate transfer apparatus 700 of the laminating system 1000 of FIG. 4 is a perspective view illustrating a substrate and film transfer process of the substrate transfer apparatus 700 of the laminating system 1000 of FIG. 1 .

As shown in FIGS. 1 to 4 , the substrate transfer apparatus 700 of the laminating system 1000 according to some embodiments of the present invention uses a clamping method to move the substrate in the film alignment unit 100 . (1) is primarily transferred to the alignment position, and the first film (F1) or the second film (F2) is in contact with the substrate (1) from the film alignment unit 100 to the film adhesive unit 200 ) may be a module or device for secondary transport.

More specifically, for example, as shown in FIG. 2 , the substrate transfer apparatus 700 includes the substrate 1 and the first film F1 or the second film F2 contacted with the substrate. At least a pair of clamping fingers 710 for clamping the edge of ) or a finger forward/backward device 730 for moving forward and backward in the direction of the edge of the substrate 1 in contact with the second film F2, and a shuttle 740 on which the finger forward/backward device 730 is installed; and A transport rail 750 capable of guiding the shuttle 740 from the film alignment unit 100 to the film fastener 200 may be included.

Here, the pair of clamping fingers 710 may be a type of clamper whose distance between them is narrowed or widened by the finger driving device 720 , and the finger driving device 720 or the finger moving device Reference numeral 730 denotes that various actuators including various power transmission devices and driving sources can be applied. For example, various motors or cylinders can be applied as the driving source, and the power transmission device is at least various gear combinations, belt/pulley combinations. , a screw rod combination, a chain/sprocket wheel combination, a pulley/wire combination, a cam combination, a link combination, various transport devices or robot devices including them, and any one or more of a combination thereof may be selected. In addition, the transfer rail 750 may be a guide rail of a linear motor as well as various guide rods or guide rails.

In addition, for example, as shown in FIG. 2 , the film adsorption type elevating device 120 of the film aligning unit 100 has the cut first film F1 or the second film F2 A vacuum adsorption type flat plate head 121 in which a plurality of suction ports capable of vacuum adsorbing the first film F1 or the second film F2 are arranged in M rows and N columns so that they can be spread flat without being crumpled. can

In addition, the first film F1 or the second film F1 or the second film F1 or the second film F1 is applied to the substrate 1 in a state in which the vacuum adsorption type flat head 121 vacuums the first film F1 or the second film F2. The vacuum adsorption type flat head 121 can accommodate a part of the clamping finger 710 on one side so that the clamping finger 710 can clamp all of them in a state where the film F2 is precisely aligned. A finger groove FG may be formed.

Accordingly, as shown in FIGS. 2 to 4 , the substrate 1 and the first film F1 or the second film F2 of the laminating system 100 according to some embodiments of the present invention. The first substrate transfer process, the secondary film alignment process, and the tertiary substrate and film transfer process of After advancing 710 in the direction of the edge of the substrate 1 , the clamping fingers 710 are closed to grip the substrate 1 , and the substrate 1 is moved along the transfer rail 750 to the alignment position. can be transferred to

Subsequently, as shown in FIG. 3 , the vacuum adsorption type flat plate head 121 which vacuum adsorbed the first film F1 is lowered, and the vacuum adsorption type in which the second film F2 is vacuum adsorbed. When the flat head 121 is raised and the positions of each other are exactly the same, the clamping fingers 710 are opened to free the substrate 1, and the clamping fingers 710 are moved with the finger forward/backward device 730. can be reversed.

Then, as shown in FIG. 4, the clamping finger 710 is advanced in the direction of the edge of the substrate 1 with the finger forward/backward device 730, and then the clamping finger 710 is closed to close the substrate ( 1) and the first film (F1) or the second film (F2) are re-grown, and the substrate (1) and the first film (F1) or the second film (F1) or the second film (F1) or the second film ( F2) is transferred to the film fastener 200, and the clamping finger 710 is opened to free the substrate 1 and the first film F1 or the second film F2, before and after the fingers The clamping finger 710 is retracted by a retracting device 730, and then the carrier film transport device 800 of FIG. 1 moves the substrate 1 and the first film F1 or the second film F2. can be taken over and transferred to the film adhesive 200 .

Therefore, according to the laminating system 1000 according to some embodiments of the present invention, the substrate 1 is precisely transported to the position by using the shuttle 740 of the clamping method, and together with the first film (F1) or the second film (F2) is precisely transported to the correct position using the vacuum adsorption type flat head 121 and clamped again to transfer the substrate 1 and the first film F1 or the second film F1. It facilitates the precise alignment of the film F2, thereby greatly improving the accuracy, precision and reliability of the equipment.

5 is a cross-sectional view illustrating a chamber open state of the laminating unit 300 of the laminating system 1000 of FIG. 1 , and FIG. 6 is a cross-sectional view illustrating a chamber closed state of the laminating unit 300 of the laminating system 1000 of FIG. 5 . to be.

More specifically, for example, as shown in FIG. 5 , the laminating unit 300 according to some embodiments of the present invention includes an upper chamber 310 installed above a substrate transfer line, and the upper chamber. The upper pressing device 320 is installed inside the 310 and the pressing plate PP for pressing and heating so that the first film F1 is in close contact with the substrate 1 is installed, and the substrate transfer line. A lower chamber 330 installed below, coupled to the upper chamber 310 to form a vacuum pressure therein, is installed in the lower chamber 330 , and the second film F2 is formed on the substrate (1) a lower pressurizing device 340 in which a pressurizing plate (PP) for pressurizing and heating is installed to be in close contact with (1), an upper chamber elevating device 350 capable of elevating the upper chamber 310, and the lower While the lower chamber elevating device 360 capable of elevating the chamber 330 and the upper chamber 310 and the lower chamber 330 close while approaching each other, the upper separation distance D1 of the substrate 1 ) and the lower separation distance D2 are always the same, so that the upper and lower surfaces of the substrate 1 can be simultaneously heated to the same degree, a lowering control signal is applied to the upper chamber elevating device 350, and at the same time, the lower It may include a chamber simultaneous control unit 370 for applying a lift control signal to the chamber elevating device (360).

Here, a vacuum line may be installed in the upper chamber 310 or the lower chamber 320 , and a diaphragm may be applied to the pressure plate PP. Accordingly, when the diaphragm is applied, a pneumatic line capable of controlling the internal pressure of the pressing plate PP may be installed in the upper pressing device 320 and the lower pressing device 340 . In addition, although not shown, various sensors, pressure gauges, fixtures, and the like may be installed.

However, the pressure plate PP is not necessarily limited to the diaphragm, and for example, various flat type pressure members such as a flat type silicon pad may be applied.

Therefore, as shown in FIG. 5, using the upper chamber 310 and the lower chamber 330 of the up-and-down simultaneous approach, processing by making the amount of heating applied to the upper and lower surfaces of the substrate 1 the same It is possible to prevent distortion of the heavy substrate, thereby preventing lamination defects such as bubble generation or misalignment.

In addition, for example, as shown in FIGS. 5 and 6 , in the laminating unit 300 , while the upper chamber 310 and the lower chamber 330 are closed while approaching each other, the substrate 1 is Between the upper chamber 310 and the lower chamber 330, the carrier film CF is elastically interlocked with the movement of the upper chamber 310 and the lower chamber 330 so as to be positioned at a central position therebetween. It further includes a pair of chamber interlocking rollers (ER) that can guide the upper chamber 310 and the lower chamber 330 regardless of the relative positions of the upper separation distance D1 and the lower portion of the substrate 1 . The separation distance D2 is always kept the same so that the amount of heating applied to the upper and lower surfaces of the substrate 1 is equal, thereby preventing substrate distortion during processing, thereby preventing the occurrence of bubbles or misalignment. It is possible to prevent lamination defects.

In addition, for example, as shown in FIGS. 5 and 6 , the laminating unit 300 of the laminating system 1000 according to some embodiments of the present invention is not only a position between chambers, but also a position between pressure plates. As can be adjusted at equal intervals at the same time, the upper pressure plate elevating device 380 capable of elevating the upper pressurizing device 320, and the lower pressurizing plate capable of elevating the lower pressurizing device 340. While the elevating device 390 and the upper pressing device 320 and the lower pressing device 340 approach each other and press the substrate 1, the upper separation distance D1 and the lower portion of the substrate 1 are A lowering control signal is applied to the upper pressure plate elevating device 380 so that the upper and lower surfaces of the substrate 1 can be heated to the same degree at the same time as the separation distance D2 is always the same, and at the same time, the lower pressure plate It may further include a pressure plate simultaneous control unit 391 for applying a lift control signal to the elevating device (390).

Therefore, as shown in FIG. 5 , the amount of heating applied to the upper and lower surfaces of the substrate 1 is equalized by using the upper pressing device 320 and the lower pressing device 340 of the up-and-down simultaneous approach. By doing so, it is possible to prevent distortion of the substrate during processing, thereby preventing lamination defects such as bubble generation or misalignment.

Therefore, first, as shown in FIG. 5 , the upper chamber 310 and the lower chamber 330 approach each other at the same time to make the same amount of heating applied to the upper and lower surfaces of the substrate 1 and , then, as shown in FIG. 6 , the upper pressing device 320 and the lower pressing device 340 approach each other at the same time to make the same amount of heating applied to the upper and lower surfaces of the substrate 1 . Therefore, a very precise laminating process can be made throughout the laminating process, and through this, an instantaneous substrate distortion phenomenon can be prevented during the laminating process, and thereby laminating defects such as bubble generation or misalignment can be prevented.

7 is a cross-sectional view showing a chamber open state of the hot press unit 400 of the laminating system 1000 of FIG. 1, and FIG. 8 is a chamber closed state of the hot press unit 400 of the laminating system 1000 of FIG. It is a cross-sectional view showing

As shown in FIGS. 7 and 8 , the hot press unit 400 is formed of the first film F1 or the second film F2 laminated on the substrate 1 in the laminating unit 300 . As a planarization of the surface, the upper chamber fixing method or the lower chamber fixing method may be applied to reduce manufacturing costs because there is relatively little concern about bubble generation or misalignment.

For example, as shown in FIGS. 7 and 8 , the hot press unit 400 includes an upper chamber 410 installed above the substrate transfer line, and an upper chamber 410 installed inside the upper chamber 410 , An upper pressurizing device 420 provided with a pressurizing plate PP for pressurizing and heating the first film F1 so as to flatten the first film F1 is installed below the substrate transfer line, and is coupled to the upper chamber 410 inside The lower chamber 430 for forming a vacuum pressure, and a lower pressurizing device installed inside the lower chamber 430 and provided with a pressurizing plate PP that pressurizes and heats the second film F2 to flatten the second film F2 ( 440), and a lower chamber elevating device 460 capable of elevating the lower chamber 430, and a lower pressure plate elevating device 490 capable of elevating the lower pressurizing device 440. can

Here, a diaphragm may be applied to the pressure plate PP. Accordingly, when the diaphragm is applied, a pneumatic line capable of controlling the internal pressure of the pressing plate PP may be installed in the lower pressing device 440 . In addition, although not shown, various sensors, pressure gauges, fixtures, and the like may be installed.

However, the pressure plate PP is not necessarily limited to the diaphragm, and for example, various flat type pressure members such as a flat type silicon pad may be applied.

Meanwhile, although not shown, the laminating unit 300 and the hot press unit 400 have various cartridge heaters to heat the substrate 1 and the first film F1 or the second film F2. However, various types of heaters such as various planar heating elements or heat medium circulation devices may be installed. In addition, various valves, pressure lines, sensors, camera devices, and the like may be additionally installed.

9 is an external perspective view showing the laminating system 2000 according to some other embodiments of the present invention, and FIG. 10 is a side view showing the laminating system 2000 of FIG. 9 .

As shown in FIGS. 9 and 10 , the laminating system 2000 according to some other embodiments of the present invention is a system implemented in the form of equipment in more detail, and is largely a film alignment unit 100 and a film The contact 200 , the laminating unit 300 , the hot press unit 400 , the cooling unit 500 , the carrier film removal unit 600 , the substrate transport device 700 , and the carrier film transport device 800 . ) may be included.

Here, by modularizing each of these modules and devices and assembling each other, a frame made of various protective panels and vertical or horizontal members may be additionally installed to implement it in the form of equipment and protect the inside thereof, The installed film alignment part 100, the film adhesive part 200, the laminating part 300, the hot press part 400, the cooling part 500, and the carrier film removing part ( 600), and components such as the substrate transport device 700 and the carrier film transport device 800 and their roles, the laminating system ( 1000) differs from each other only in shape, form, and ratio, but may be basically the same as each other, and thus a more detailed description will be omitted.

11 is a perspective view showing the film alignment unit 100 and the film adhesive 200 of the laminating system 2000 of FIG. 9 , and FIG. 12 is the film alignment unit 100 and the film of the laminating system 2000 of FIG. 11 . It is an enlarged perspective view showing the temporary welding part 200 .

11 and 12 , for example, the film alignment unit 100 aligns the first film F1 or the second film F2 on the upper or lower surface of the substrate 1 to contact each other. As a module or device, more specifically, for example, the film alignment unit 100 may include the first film F1 supplied from the first unwinding roll R1 or the second unwinding roll R2 or The first film cutting device 110 that cuts and individualizes the second film F2 and is installed above or below the alignment position of the substrate 1, and cut by the film cutting device 110 It may include a film adsorption-type elevating device 120 capable of adsorbing the film (F1) or the second film (F2) to ascend and descend in the direction of the alignment position.

In addition, for example, as shown in FIGS. 11 and 12 , the film adhesive 200 may attach the aligned first film F1 or the second film F2 to a portion of the substrate 1 . As a module or device for temporarily bonding to the substrate, more specifically, for example, the film bonding unit 200 presses a portion of the first film F1 or the second film F2 to press the substrate 1 ) may include a temporary folding machine 210 for temporary welding on the upper surface or the lower surface.

13 is a perspective view illustrating a laminating unit 300 and a hot press unit 400 of the laminating system 2000 of FIG. 9 , and FIG. 14 is a laminating unit 300 and a hot press unit of the laminating system 2000 of FIG. 13 . It is a side view which shows (400).

For example, as shown in FIGS. 13 and 14 , the laminating unit 300 presses the first film F1 or the second film F2 temporarily bonded to the substrate 1 to form the substrate ( 1) may be a module or device for laminating in close contact with the upper surface or lower surface, and the hot press unit 400 is the first film (F1) or the second film (F2) in close contact with the substrate (1) It may be a module or device for flattening by pressing.

15 is an enlarged perspective view illustrating the laminating unit 300 of the laminating system 2000 of FIG. 13 , and FIG. 16 is a side view illustrating the laminating unit 300 of the laminating system 2000 of FIG. 15 .

15 and 16, the laminating unit 300 is coupled to the upper chamber 310 installed above the substrate transfer line, and the upper chamber 310 to form a vacuum pressure therein. It includes a lower chamber 330, an upper chamber elevating device 350 capable of elevating the upper chamber 310, and a lower chamber elevating device 360 capable of elevating the lower chamber 330. can do.

Here, the upper chamber elevating device 350 uses an upper motor and an elevating screw rod, and the lower chamber elevating device 360 elevates and lowers along the surface of the inclined cam moving forward and backward by the lower motor. As the use of the steel strip, it is not necessarily limited thereto, and a wide variety of elevating and lowering devices may be applied.

17 is an enlarged perspective view illustrating the hot press unit 400 of the laminating system 2000 of FIG. 13 , and FIG. 18 is a side view illustrating the hot press unit 400 of the laminating system 2000 of FIG. 17 .

17 and 18 , the hot press unit 400 is coupled to an upper chamber 410 installed above the substrate transfer line and the upper chamber 410 to form a vacuum pressure therein. It may include a lower chamber 430, a lower chamber elevating device 460 and a lower pressure plate elevating device (not shown) capable of elevating the lower pressurizing device 440 .

Here, the lower chamber elevating device 460 uses a elevating platform that elevates and lowers along the surface of the inclined cam moving forward and backward by the lower motor, and is not necessarily limited thereto, and a wide variety of elevating and lowering devices may be applied.

19 is an external perspective view illustrating the cooling unit 500 and the carrier film removing unit 600 of the laminating system 2000 of FIG. 9 , and FIG. 20 is the cooling unit 500 and the carrier of the laminating system 2000 of FIG. 19 . It is an internal perspective view showing the film removal unit 600 .

19 and 20 , the cooling unit 500 may be a module or device for cooling the substrate 1 on which the first film F1 or the second film F2 is flattened. And, more specifically, for example, the cooling unit 500 may include a plurality of blowers 510 installed above and below the substrate abnormality line and cooling the substrate 1 by air cooling. .

However, the cooling unit 500 is not necessarily limited to the blower 510 , and various types of chillers or cooling devices may be applied.

In addition, for example, as shown in FIG. 1 , the carrier film removing unit 600 includes a carrier film CF for transferring the substrate 1 from the film bonding unit 200 to the cooling unit 500 . may be a module or device for removing from the substrate 1, more specifically, for example, the carrier film removal unit 600, the first film (F1) and the carrier film (CF) or the second 2 It may include a wedge-shaped cutter 610 inserted into the gap between the film F2 and the carrier film CF to separate them.

However, the carrier film removal unit 600 is not necessarily limited to the wedge-shaped cutter 610, and a wide variety of laser cutters or cutting presses may be applied.

21 is a perspective view showing a laminating system 3000 according to some other embodiments of the present invention, and FIG. 22 is a side view showing the laminating system 3000 of FIG. 21 .

21 and 22 , the laminating system 3000 according to some other embodiments of the present invention includes the cooling unit 500 and the carrier film removing unit 600 or the cooling unit 500 . And the carrier film winding roll 820 is installed to be vertically overlapped inside one module, it is also possible to increase the space utilization.

In addition, the above-described various components may be modified and changed in a wide variety of forms depending on the space, specifications, production environment, user needs, etc. of the installation location or module. Therefore, it is not necessarily limited to the drawings, and various embodiments may be applied.

Meanwhile, the present invention may include a laminating method using the laminating systems 1000 and 2000 according to various embodiments of the present invention described above.

The laminating method using the laminating system (1000) (2000) of the present invention is a film alignment unit (100) for aligning the first film (F1) or the second film (F2) on the upper or lower surface of the substrate (1) to contact each other. ), the first film (F1) or the second film (F2) aligned to a portion of the substrate (1) temporarily bonded to the film (200), the first bonded to the substrate (1) The laminating unit 300 for laminating by pressing the film F1 or the second film F2 in close contact with the upper or lower surface of the substrate 1, the first film F1 in close contact with the substrate 1 Alternatively, a hot press unit 400 for flattening the second film F2 by pressing, a cooling unit 500 for cooling the substrate 1 on which the first film F1 or the second film F2 is flattened. ), a carrier film removal unit 600 for removing the carrier film for transferring the substrate 1 from the film welding unit 200 to the cooling unit 500 from the substrate 1, using a clamping method. The first film (F1) or the second film (F1) or the second film ( F2) the carrier film removal unit 600 in the adhesive film welding unit 200 using a substrate transport device 700 for secondary transport of the contacted substrate 1 and a roll-to-roll carrier film CF. In the laminating method of a laminating system having a carrier film transport device 800 for transporting the substrate 1 with the first film F1 or the second film F2 contacted thereto, (a) the substrate (1) aligning the first film (F1) or the second film (F2) on the upper surface or the lower surface of the contacting each other; (b) temporarily attaching the aligned first film (F1) or the second film (F2) to a portion of the substrate (1); (c) pressing the first film (F1) or the second film (F2) temporarily bonded to the substrate (1) to adhere to the upper or lower surface of the substrate (1) and laminating; (d) flattening by pressing the first film (F1) or the second film (F2) in close contact with the substrate (1); (e) cooling the substrate 1 on which the first film F1 or the second film F2 is planarized; (f) removing the carrier film (CF) for transferring the substrate 1 from the film welding part 200 to the cooling part 500 from the substrate 1; including, (a) In the step, the substrate 1 is primarily transferred from the film alignment unit 100 to the alignment position in a clamping manner using the substrate transfer apparatus 700 , and the step (b) includes the substrate transfer apparatus Secondary transfer of the substrate 1 in contact with the first film F1 or the second film F2 from the film alignment part 100 to the film adhesive part 200 using a 700, , Steps (c), (d), (e), and (f) are performed from the adhesive film 200 to the carrier film removal unit 600 using a roll-to-roll carrier film (CF). The substrate 1 in contact with the first film F1 or the second film F2 may be transferred.

Here, the substrate transfer apparatus 700 includes at least one pair of clamping clamps for clamping the edge portion of the substrate 1 to which the substrate 1 and the first film F1 or the second film F2 are in contact. A finger 710, a finger driving device 720 for driving the clamping finger 710, and the finger driving device 720 to the substrate 1 and the first film F1 or the second film F2 A finger forward/backward device 730 for moving forward and backward in the direction of the edge of the contacted substrate 1 , a shuttle 740 on which the finger forward/backward device 730 is installed, and the shuttle 740 are moved to the film alignment unit It may include a transfer rail 750 that can guide the film from 100 to the folding part 200 .

For example, in step (a), (a-1) advancing the clamping finger 710 in the direction of the edge of the substrate 1 with the finger forward/backward device 730, and then move the clamping finger 710 closing and holding the substrate (1); (a-2) transferring the substrate 1 to the alignment position along the transfer rail 750; (a-4) aligning the first film (F1) or the second film (F2) on the upper or lower surface of the substrate (1); and (a-3) opening the clamping finger (710) to free the substrate (1), and retracting the clamping finger (710) with the finger retractor device (730); In step (b-1), the clamping finger 710 is advanced in the direction of the edge of the substrate 1 with the finger forward/backward device 730, and then the clamping finger 710 is closed to close the substrate 1 ) and re-holding the first film (F1) or the second film (F2); (b-2) transferring the substrate 1 and the first film F1 or the second film F2 along the transfer rail 750 to the film fastener 200; (b-3) open the clamping finger 710 to free the substrate 1 and the first film F1 or the second film F2, and use the finger forward/backward device 730 to release the clamping finger reversing (710); and (b-4) the carrier film transport device 800 takes over the substrate 1 and the first film F1 or the second film F2 and transfers it to the film adhesive 200 ; may be included.

Although the present invention has been described with reference to the embodiment shown in the drawings, which is only exemplary, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

1: substrate
F1: first film
F2: second film
CF: carrier film
W1: board width
W2: second film width
100: film alignment unit
110: film cutting device
120: film adsorption type elevating device
121: vacuum adsorption type flat head
FG: finger groove
200: film adhesive
210: Tweak
300: laminating unit
310: upper chamber
320: upper pressure device
PP: press plate
330: lower chamber
340: lower pressure device
350: upper chamber elevating device
360: lower chamber elevating device
370: chamber simultaneous control
D1: upper separation distance
D2: lower separation distance
380: upper pressure plate elevating device
390: lower pressure plate elevating device
391: pressure plate simultaneous control unit
ER: Chamber Interlocking Roller
400: hot press unit
410: upper chamber
420: upper pressure device
430: lower chamber
440: lower pressure device
460: lower chamber elevating device
490: lower pressure plate elevating device
500: cooling unit
510: blower
600: carrier film removal unit
610: wedge cutter
700: substrate transfer device
710: clamping finger
720: finger drive device
730: finger forward/backward device
740: shuttle
750: transport rail
R1: first unwinding roll
R2: second unwinding roll
800: carrier film transfer device
810: carrier film unwinding roll
820: carrier film winding roll
CG: carrier film guide rail
1000, 2000, 3000: laminating system

Claims (19)

a film alignment unit for aligning the first film or the second film on the upper surface or the lower surface of the substrate to contact each other;
a film bonding unit for temporarily bonding the aligned first or second film to a portion of the substrate;
a laminating unit for laminating by pressing the first film or the second film temporarily bonded to the substrate to adhere to the upper or lower surface of the substrate;
a hot press unit for flattening the first film or the second film in close contact with the substrate;
a cooling unit for cooling the substrate on which the first film or the second film is planarized; and
a carrier film removal unit for removing a carrier film for transferring the substrate from the film bonding unit to the cooling unit from the substrate;
Primary transfer of the substrate from the film alignment unit to the alignment position by using a clamping method, and secondary transfer of the substrate in contact with the first film or the second film from the film alignment unit to the film fastener substrate transfer device; and
A carrier film transport device for transporting the substrate in contact with the first film or the second film from the film adhesive part to the carrier film removal part using a roll-to-roll type carrier film; including,
The film alignment unit,
First transfer the substrate from the film alignment unit to the alignment position in a clamping manner using the substrate transfer device,
The film adhesive portion,
Secondary transfer of the substrate in contact with the first film or the second film from the film alignment part to the film adhesive part using the substrate transport device, a laminating system. delete The method of claim 1,
The substrate transfer device,
at least one pair of clamping fingers clamping the substrate and the edge portion of the substrate in contact with the first film or the second film;
a finger drive device for driving the clamping finger;
a finger moving device for moving the finger driving device back and forth in the direction of the edge of the substrate in contact with the substrate and the first film or the second film;
a shuttle on which the finger forward/backward device is installed; and
a transport rail capable of guiding the shuttle from the film aligning unit to the film fastener;
Including, laminating system. 4. The method of claim 3,
The film alignment unit,
a film adsorption-type elevating device installed above or below the alignment position of the substrate and capable of adsorbing the first film or the second film to ascend and descend in the alignment position direction;
Including, laminating system. 5. The method of claim 4,
a film cutting device for cutting and individualizing the first film or the second film supplied from the first unwinding roll or the second unwinding roll;
Further comprising a, laminating system. 5. The method of claim 4,
The film adsorption type elevating device,
A vacuum adsorption type flat plate head in which a plurality of suction ports capable of vacuum adsorbing the first or second film are arranged in M rows and N columns so that the cut first or second film can be spread flat without being crumpled. ; Laminating system, including. 7. The method of claim 6,
The vacuum adsorption type flat head, the laminating system, a finger groove capable of accommodating a portion of the clamping finger is formed on one side. delete The method of claim 1,
The carrier film transport device,
It is installed in the film junction part, and the carrier film is installed above and below the substrate transfer line so as to take over the substrate in contact with the first film or the second film from the substrate transfer device and surround them. carrier film unwinding roll; and
Carrier film winding rolls installed in the carrier film removal unit and respectively installed above and below the substrate transfer line so as to collect the carrier film separated from the substrate to which the first film or the second film is in contact ;
Including, laminating system. The method of claim 1,
The film adhesive portion,
Including, a laminating system comprising a; pressurizing a portion of the first film or the second film for temporary temporary bonding to the upper surface or the lower surface of the substrate. The method of claim 1,
The laminating unit,
an upper chamber installed above the substrate transfer line;
an upper pressing device installed in the upper chamber and pressurizing and heating the first film to be in close contact with the substrate;
a lower chamber installed below the substrate transfer line and coupled to the upper chamber to form a vacuum pressure therein; and
a lower pressing device installed in the lower chamber and pressurizing and heating the second film to be in close contact with the substrate;
Including, laminating system. 12. The method of claim 11,
The laminating unit,
an upper chamber elevating device capable of elevating the upper chamber;
a lower chamber elevating device capable of elevating the lower chamber; and
While the upper chamber and the lower chamber are closed while approaching each other, a lowering control signal is applied to the upper chamber elevating device so that the upper and lower surfaces of the substrate can be simultaneously heated to the same extent, and at the same time the lower chamber elevating and lowering device a chamber simultaneous control unit for applying a rising control signal to;
Further comprising a, laminating system. 12. The method of claim 11,
The laminating unit,
an upper pressure plate elevating device capable of elevating the upper pressure device;
a lower pressure plate elevating device capable of elevating the lower pressure device; and
While the upper pressurizing device and the lower pressurizing device approach each other and press the substrate, a lowering control signal is applied to the upper pressurizing plate elevating device so that the upper and lower surfaces of the substrate can be simultaneously heated to the same degree, and this a pressure plate simultaneous control unit for applying a lift control signal to the lower pressure plate elevating device at the same time;
Further comprising a, laminating system. 12. The method of claim 11,
The laminating unit,
While the upper chamber and the lower chamber are closed while approaching each other, the carrier film is interlocked with the movement of the upper chamber and the lower chamber so that the substrate can be positioned between the upper chamber and the lower chamber at a central position therebetween. A pair of chamber interlocking rollers that can be elastically guided;
Further comprising a, laminating system. The method of claim 1,
The hot press unit,
an upper chamber installed above the substrate transfer line;
an upper pressing device installed in the upper chamber and pressing and heating the first film to be flattened;
a lower chamber installed below the substrate transfer line and coupled to the upper chamber to form a vacuum pressure therein; and
a lower pressing device installed in the lower chamber and pressurizing and heating the second film to flatten it;
Including, laminating system. The method of claim 1,
The cooling unit,
A laminating system comprising, a plurality of blowers installed above and below the substrate transfer line and cooling the substrate by air cooling. The method of claim 1,
The carrier film removal unit,
and a wedge-shaped cutter for separating the first film and the carrier film by inserting a gap between the first film and the carrier film or the second film and the carrier film. A film aligning unit for aligning the first or second film on the upper or lower surface of a substrate to contact each other, a film fastener for temporarily attaching the aligned first film or the second film to a portion of the substrate, the substrate A laminating unit for laminating by pressing the first film or the second film temporarily bonded to the upper surface or lower surface of the substrate for laminating, a hot press for flattening the first film or the second film in close contact with the substrate A cooling unit for cooling the substrate on which the first film or the second film is flattened, a carrier film removal unit for removing the carrier film for transferring the substrate from the film bonding unit to the cooling unit from the substrate, clamping First transfer of the substrate from the film aligning unit to the alignment position using a method, and secondary transfer of the substrate in contact with the first film or the second film from the film aligning unit to the film adhesive A laminating system comprising a carrier film transport device for transporting the substrate in contact with the first film or the second film from the film adhesive part to the carrier film removal part using a transport device and a roll-to-roll type carrier film. In the laminating method,
(a) aligning the first film or the second film on the upper surface or the lower surface of the substrate to contact each other;
(b) temporarily attaching the aligned first or second film to a portion of the substrate;
(c) laminating by pressing the first film or the second film temporarily bonded to the substrate to adhere to the upper or lower surface of the substrate;
(d) flattening the first film or the second film in close contact with the substrate by pressing;
(e) cooling the substrate on which the first film or the second film is planarized;
(f) removing the carrier film from the substrate for transferring the substrate from the film welding part to the cooling part;
In the step (a), the substrate is primarily transferred from the film alignment unit to the alignment position in a clamping manner using the substrate transfer device,
In the step (b), the substrate in contact with the first film or the second film is secondarily transferred from the film alignment unit to the film adhesive unit using the substrate transfer device,
In the steps (c), (d), (e), (f), the first film or the second film is in contact from the film adhesive part to the carrier film removal part using a carrier film of a roll-to-roll method. A laminating method for transferring the substrate. 19. The method of claim 18,
The substrate transport device includes at least a pair of clamping fingers for clamping an edge portion of the substrate in contact with the substrate and the first film or the second film, a finger driving device for driving the clamping fingers, and the finger driving device. A finger forward/backward device for moving forward and backward in the direction of the edge portion of the substrate in which the substrate and the first film or the second film are in contact, a shuttle on which the finger forward/backward device is installed, and the shuttle are installed in the film aligning unit with the film It includes a transfer rail that can guide to the hinged part,
The step (a) is,
(a-1) advancing the clamping finger toward the edge of the substrate with the finger forward/backward device, then closing the clamping finger to grip the substrate;
(a-2) transferring the substrate to the alignment position along the transfer rail;
(a-3) aligning the first film or the second film on the upper or lower surface of the substrate; and
(a-4) freeing the substrate by opening the clamping finger and retracting the clamping finger with the finger retractor device;
including,
Step (b) is,
(b-1) advancing the clamping finger in the direction of the edge of the substrate with the finger forward/backward device, then closing the clamping finger to re-grip the substrate and the first or second film;
(b-2) transferring the substrate and the first film or the second film along the transfer rail to the film fastener;
(b-3) freeing the substrate and the first or second film by opening the clamping finger, and retracting the clamping finger with the finger retractor device; and
(b-4) the carrier film transport device taking over the substrate and the first film or the second film and transporting the substrate to the film bonding unit; including, a laminating method.

Images