KR100653776B1 - a taping machine for lead frame - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame taping apparatus for attaching a tape to a lead frame as one of the manufacturing processes of the lead frame used in the assembling process of a semiconductor device, comprising: a lead frame having an inner lead constituting a circuit therein; A loading unit for stacking, separating and loading the interlayer protecting the lead frame, a transfer unit for sequentially transferring the lead frame loaded from the loading unit, and a tape disposed perpendicularly to the transfer unit to fix the inner lead Feeding the at least one shape, and matching the inner lead and the tape taken out and bonding the tape; and the moving speed of the tape and the lead frame so that the tape taken out from the feeding device is adhered to the inner lead accurately. By the feed control means to synchronize and the said feeding apparatus It is configured to include an unloading unit for unloading the taped lead frame, it is possible to quickly and accurately taping without thermal deformation of the lead frame, there is an advantage that work time is reduced, quality is improved, production efficiency is increased.

Semiconductor, Lead Frame, Inner Lead, Tape, Mold, Feeding, Hoist, Magazine, Static Electricity, Heater, Preheat

Description

Taping machine for lead frame {a taping machine for lead frame}             

1 is a plan view showing a taping apparatus of a lead frame according to the prior art,

2 is a configuration diagram briefly shown a tape feeding apparatus according to the prior art,

3 is a plan view showing a typical lead frame,

4 is a plan view showing a taping apparatus of a lead frame according to the present invention;

5 is a side view showing a taping apparatus of a lead frame according to the present invention;

6 is a configuration diagram schematically showing the main portion of the tape feeding apparatus according to the present invention,

7 is a schematic diagram showing a tape feeding apparatus according to the present invention;

8 is an enlarged configuration diagram of a part of a feeding apparatus according to the present invention;

9 is an enlarged perspective view of portion A of FIG. 8;

10 is a side view showing a part of the movement limiting means according to the present invention;

11 is a side view showing another part of the movement limiting means according to the present invention;

12 is a block diagram showing the operation of the tape feeding apparatus of the lead frame according to the present invention.

<Explanation of symbols on main parts of the drawings>

110: loading unit 111: the first magazine

113: second magazine 120: transfer unit

115,116 hoist 115a, 116a: adsorption plate

130: feeding device 132: conveyor

140: unloading unit 150: tape supply unit

152: protective film recovery unit 155: antistatic device

156: pneumatic pump 157: cylinder

158: air hose 159: dancing roller

160: tape work portion 162: piercing mold

164: blanking mold 166: main heater

167: preheat heater 168: post heat heater

170: tape discharge portion 180: meandering correction mechanism

182,184: Guide 186: Moxa limiting roller

188: Dustproof Pad

I: Inner Lead L, L1, L2: Lead Frame

T: Tape T1: Adhesive Tape

T2: Protective Film P: Ice Sheet

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame manufacturing apparatus, and more particularly, to a lead frame taping apparatus for attaching a tape to a lead frame as one of the manufacturing processes of the lead frame used in the assembling process of the semiconductor device.

In general, the lead frame is a device having a function of conducting a conductor role that connects the inside and outside of the semiconductor package and simultaneously supporting and dissipating the semiconductor chip. The lead frame is deformed into various shapes as the semiconductor chip is densified and highly integrated.

As the manufacturing method of the lead frame, a physical processing method by stamping (hereinafter referred to as a stamping method) and a chemical processing method by etching (hereinafter referred to as an etching method) are mainly used.

The stamping method is to carry out the lead frame by putting the material into the press mold apparatus to be sequentially transferred, the mass production is suitable, the etching method is capable of fine processing of the pattern requires precision or It is often used for lead frames for sampling operations with low quantities.

Here, the stamping method is also referred to as a taping method, and is an operation of attaching the inner lead by using an adhesive tape to prevent the inner lead finely formed in the lead frame from contacting each other and to prevent deformation.

1 is a plan view showing a taping apparatus of a lead frame according to the prior art, FIG. 2 is a schematic view showing a tape feeding apparatus according to the prior art, and FIG. 3 is a plan view showing a typical lead frame.

As shown in FIGS. 1 to 3, a taping apparatus for a lead frame according to the related art includes a loading unit 10 prepared by stacking lead frames before processing, and a lead frame L1 stacked on the loading unit 10. ) By a conveying unit 20 for sequentially conveying, a tape feeding device 30 for adhering the tape T to the lead frame L1 conveyed by the conveying unit 20, and the feeding device 30. It consists of an unloading part 40 for stacking the taped lead frame (L1).

The loading unit 10 includes a first magazine 11 in which a lead frame L1 before processing and an interlayer paper P protecting the lead frame L1 are alternately stacked, and the first magazine 11. The second magazine 13 on which the interleaved paper P stacked thereon is immersed, and the first magazine 11 is repeatedly reciprocated between the first magazine 11, the second magazine 13, and the transfer unit 20. ) Is configured as a loader 14 for transferring the interleaved paper P stacked in the second magazine 13 to the second magazine 13 or injecting the lead frame L1 stacked in the first magazine 11 into the transfer unit 20. do.

Here, the loading unit 10 is arranged in a plurality of rows on both sides of the first magazine 11 and the second magazine 13 on both sides of the transfer unit 20 to shorten the working time.

In addition, the loader 14 includes three hoists 15 to which a plurality of suction plates 16 for sucking air are attached, and the hoists 15 are moved up and down or left and right by the loader 14. And selectively adsorbs or discharges the lead frame L1 or the slip sheet P.

The tape feeding device 30 is a device that is orthogonal to the transfer unit 20 to supply the tape T. As shown in FIG. 2, the tape feeding device 30 is connected to the inner lead I of the lead frame L1. An unwinder 31 in which a tape reel, in which a protective film T2 attached to the tape T is wound in a circular shape, is rotatably coupled to the adhesive tape T1 to be bonded and the tape T; A protective film (T2) rewinder (33) for collecting the protective film (T2) wound on the unwinder (31), and film transfer means (37) for transferring the film from which the protective film (T2) has been removed; And a takeout means (50) disposed on the moving path of the tape (T) to take out the tape (T) in the shape of the inner lead (I) of the upper lid frame (L1), and taken out from the takeout means (50). It comprises a tape rewinder 35 for collecting the tape (T).

The film transfer means 37 is provided with a tension device 38 in the front portion and the rear portion of the take-out means 50 to maintain a predetermined tension when the tape (T) passes through the take-out means (50).

The take-out means 50 removes the piercing mold 52 which extracts the unnecessary portion from the tape T, and the adhesive portion of the tape T from which the unnecessary portion is removed by the piercing mold 52. Consists of a blanking die 54.

On the other hand, the tape T taken out by the blanking die 54 is attached to the inner lead I portion of the lead frame L1 passed through the blanking die 54 at the same time as it is taken out.

In addition, a heater 56 is disposed below the blanking die 54 to apply heat to the tape T to be easily attached to the inner lead I.

However, in the taping apparatus of the lead frame according to the prior art, the tension value is changed according to the moving speed of the tape, so that the moving speed of the tape is not uniform, thereby causing an error in the adhesive position of the tape. In addition, as the transfer position of the tape is deviated, defects are frequently generated during take-out, and static electricity is generated during transfer of the tape, and foreign matters such as dust and dust are attached to each other, thereby deteriorating the quality of the lead frame as well as defects. In the case of increasing the feed rate of the tape, the taken out tape does not adhere well to the inner lead of the lead frame, resulting in poor adhesiveness or weak adhesive strength.

The present invention has been made to solve the above problems of the prior art, it is possible to precisely the feed rate of the tape according to the tension value to ensure that the movement of the tape is interrupted in accordance with the actual amount of movement relative to the feed rate of the tape, the tape Do not move the position during the transfer of the static electricity is removed to prevent the adhesion of foreign substances. It is also an object of the present invention to provide a taping apparatus for a lead frame that can maintain a constant adhesive force even if the feed rate of a tape substrate is increased.

According to another aspect of the present invention, there is provided a taping apparatus for a lead frame according to an embodiment of the present invention, including: a lead frame having an inner lead constituting a circuit therein; A transfer unit for sequentially transferring the lead frame loaded from the loading unit, and a tape arranged to be orthogonal to the transfer unit to take out the tape for fixing the inner lead into at least one shape and coincide with the tape taken out from the inner lead; And a feeding control unit for synchronizing the moving speed of the tape and the lead frame so that the tape taken out from the feeding device is correctly adhered to the inner lead, and unloading the lead frame taped by the feeding device. It is comprised including an unloading part.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

4 is a plan view showing a lead frame taping apparatus according to the present invention, Figure 5 is a side view showing a lead frame taping apparatus according to the present invention, Figure 6 is a main portion of the tape feeding apparatus according to the present invention briefly 7 is a schematic diagram of a tape feeding apparatus according to the present invention.

The taping apparatus for the lead frame according to the present invention is loaded from the loading unit 110 for loading the lead frame L1 having the inner lead I constituting the circuit therein, as shown in FIGS. 4 to 7. The transfer unit 120 for sequentially transferring the lead frame L1 is installed.

The transfer part 120 extracts the necessary portion from the tape T fixing the inner lead I so that the inner lead I of the lead frame L1 transferred by the transfer part 120 is fixed to the inner part. The feeding device 130 for adhering to the lid I is arranged to be orthogonal.

In addition, the lead frame L1 to which the tape T is adhered by the feeding device 130 is transferred to the unloading unit 140 to be unloaded.

On the other hand, the lead frame L1 taping device synchronizes the movement of the tape T and the lead frame L1 so that the tape T taken out from the feeding device 130 is adhered to the inner lead I accurately. Conveying control means is installed.

The transfer unit 120 is provided with a first magazine 111 in which the lead frame L1 is stacked, and the lead frame L1 is interposed between the lead frames L1 so as not to be damaged externally ( P) is laminated alternately.

In addition, a second magazine 113 for accommodating a product is disposed on a side surface of the first magazine 111, and the first magazine 111 and the second magazine 113, or the first magazine 111. And the lead frame L1 and the interleaved paper P, which are sequentially reciprocated between the transfer unit 120 and the first magazine 111, are separated and positioned in the transfer unit 120 or the second magazine 113, respectively. First and second hoists 115 and 116 are provided.

The first and second hoists 115 and 116 are moved in the up, down, left, and right directions and move the lead frame L1 or the slip sheet P, and are in contact with the lead frame L1 or the slip sheet P. Adsorption plates 115a and 116a for adsorbing air are provided in the portion, and the lead frame L1 or the interleaver P is adsorbed by adsorbing air to the adsorption plates 115a and 116a, and the hoist 115 and 116 are moved. Will move.

The transfer part 120 is made of a conveyor 132 continuously moved by a driving means, the conveyor 132 is provided with a roll-shaped roller so that the lead frame (L1) does not fall out.

The loading unit 110 is installed symmetrically so as to be configured in a plurality of rows around the transfer unit 120 to enable a faster and smoother continuous operation.

5 to 7, the tape T supplied from the tape supply unit 150 to which the tape T wound around the circular tape reel is continuously supplied. It is made to take out in the required shape at 160, and the tape T taken out from the tape work unit 160 is configured to be collected through the tape discharge unit 170.

Here, the tape (T) is bonded to the inner lead (I) to protect the inner lead (I) and at the same time to fix the arrangement and the adhesive tape (T1) so that the adhesive tape (T1) is protected from foreign matters It consists of a protective film T2 attached to the surface of the adhesive tape T1.

The tape supply unit 150 further includes a protective film recovery unit 152 separating and recovering the protective film T2 from the tape T supplied to the tape work unit 160.

The tape supply unit 150 or the protective film recovery unit 152 and the tape discharge unit 170 respectively generate static electricity through the adhesive tape T1 or the protective film T2, which affects the quality of the product. The antistatic device 155 is further included to remove the static electricity so as not to interfere.

The antistatic device 155 is a device for removing static electricity by supplying ionized air (W) to the adhesive tape (T1) or the protective film (T2), passing through an ion generator (not shown) and ionized air (W) ) Is composed of a pneumatic pump 156 for supplying the adhesive tape (T1) or the protective film (T2), the static electricity of the adhesive tape (T1) or protective film (T2), as well as the adhesive tape (T1) ) Or overlapping defects between the protective films T2 are suppressed, and the undischarged impurities are removed together.

In addition, the antistatic device 155 further comprises a tension means for adjusting the tension of the adhesive tape (T1) or the protective film (T2), the tension means is the pneumatic pump 156 and the air hose 158 The cylinder 157 is generated by the air is connected to the supplied air is disposed, the cylinder 157 is rolling on the surface of the adhesive tape (T1) or protective film (T2) and the cylinder 157 The dancing roller 159 that pulls the adhesive tape T1 or the protective film T2 at a constant pressure is included in accordance with the pressure. In addition, a pipe line connected to the pneumatic pump is formed inside the dancing roller, and ionized air (W) is injected through the pipe line.

Meanwhile, the tape work part 160 may include a piercing mold 162 for removing an unnecessary portion from the adhesive tape T1 and a necessary portion from the adhesive tape T1 for which unnecessary parts are removed from the piercing mold 162. The piercing mold 162 is pressed into the adhesive tape T1, which is conveyed as a mold formed to correspond to the inner shape of the inner lead I, and punctures unnecessary parts.

Then, the blanking mold 164 removes the necessary portion from the adhesive tape T1 transferred after the unnecessary portion is removed as described above and simultaneously compresses the inner lead I to thereby require the adhesive tape T1. A portion is bonded to the inner lead I and configured to secure it.

In addition, the tape work part 160 is provided with heating means for heating the inner lead I and the adhesive tape T1 so that the adhesive tape T1 can be adhered to the inner lead I well.

The heating means has a main heater 166 for heating the lead frame (L1) passed upwardly is disposed below the blanking mold 164, the lead frame (L1) passed to the upper side of the main heater (166). The inner lead I formed in the heater is heated. As the adhesive tape T1 is compressed to the inner lead I heated as described above, the amount of mutual heat flow is increased and the adhesiveness is improved.

On the other hand, the heating means further increases the amount of heat flow of the inner lead (I) and the adhesive tape (T1) and further auxiliary heating means for preventing the thermal deformation caused by the temperature of the lead frame (L1) is sharply changed further Included.

The auxiliary heating means consists of a preheating heater 167 located in front of the main heater 166 and disposed below the movement path of the lead frame L1, and leads to an upper side of the preheating heater 167. It is configured to heat L1.

Here, the preheating heater 167 is set to a temperature lower than the heating temperature of the main heater 166 so that the lead frame L1 is slowly heated from low temperature to high temperature before being supplied to the main heater 166.

In addition, the auxiliary heating means further includes a after-heat heater 168 located behind the main heater 166 and disposed below the movement path of the lead frame L1, wherein the after-heat heater 168 is the main heater. The heating time of the inner lead I and the adhesive tape T1, which are simultaneously heated by the heater 166, is increased to reduce the adhesion time.

In addition, the post-heat heater 168 is set to a temperature lower than the heating temperature of the main heater 166, the heat generated in the lead frame (L1) during the thermocompression bonding of the inner lead (I) and the adhesive tape (T1) The stress is removed.

8 is an enlarged configuration diagram of a part of a feeding apparatus according to the present invention, and FIG. 9 is an enlarged perspective view of portion A of FIG. 8.

In addition, the tape work part 160 further includes a meandering correction mechanism 180 for guiding the transport so that the adhesive tape T1 is linearly supplied as shown in FIGS. 8 and 9. The meandering correction mechanism 180 restricts both sides of the adhesive tape T1 from being moved left and right so that the meandering correction mechanism 180 moves linearly, and both side surfaces of the adhesive tape T1 are in close contact with the left and right guides 182 and 184. It is installed.

In addition, the left and right side guides 182 and 184 are installed on the upper surface of the adhesive tape T1 so that the adhesive tape T1 does not float. On the lower side of the anti-vibration pad 188 is installed to absorb the vibration generated during the progress of the adhesive tape (T1).

The anti-vibration pad 188 is made of an elastic material that can absorb vibration, and in the embodiment of the present invention is made of a rubber material.

10 is a side view showing a part of the movement limiting means according to the present invention, and FIG. 11 is a side view showing another portion of the movement limiting means according to the present invention.

The movement limiting means described in the present invention, as shown in Figure 10 and 11, when the momentum of the adhesive tape (T1) and the lead frame (L1) by the feeding device 130 is moved at a constant rate The position of the adhesive tape T1 adhered to the inner lead I is always met at the same phase. To this end, the movement limiting means is provided with a first fixing link 191 is installed in the drive unit for driving the conveying unit 120 is operated in conjunction with the operation of the drive unit, the first fixing link 191 cam cam linear motion The first gripper 193, which is switched to motion and periodically bites, is connected.

Here, the first gripper 193 is designed to be bitten when the inner lead I of the lead frame L1 is positioned below the feeding device 130.

That is, the first gripper 193 is operated in conjunction with the driving unit is operated at a constant speed, the cam is moved by the first fixing link 191 is configured to periodically bite the lead frame (L1), Even if no separate distance control means is provided, continuous operation is possible according to the amount of motion of the lead frame L1.

Meanwhile, the movement limiting means fixes the adhesive tape T1 such that the adhesive tape T1 is positioned in the inner lead I when the first gripper 193 is bitten by the lead frame L1. The second gripper 198 is further included, and the second gripper 198 is connected to the driving unit so as to be interlocked with the first gripper 193 to fix the second gripper 198 to cam movement. It consists of 196.

That is, the movement limiting means makes constant the amount of motion of the lead frame L1 and the adhesive tape T1 moved by the first gripper 193 and the second gripper 198 operated in synchronization with the driving unit. The adhesive tape T1 is bonded to the inner lead I of the lead frame L1 at the correct position.

Looking at the operation of the present invention configured as described above are as follows.

First, the operator arranges the two first magazines 111 in which the lead frame L1 and the slip sheet P are alternately stacked on both sides of the transfer part 120, and the product is provided on both sides of the first magazine 111. Place the second magazine 113 that can accommodate.

Then, the first and second hoists 115 and 116 are operated to move the suction plates 115a and 116a of the hoists 115 and 116 between the first magazine 111 and the second magazine 113, and the lead frame L1 or Move the slip sheet (P).

Here, the lead frame L1 is positioned by removing the interleaving paper P at the uppermost end of the first magazine 111 so that the lead frame L1 is moved.

In more detail, during the initial driving, the first and second hoists 115 and 116 are lowered to the upper sides of the first and second magazines, respectively. In this case, the first and second hoists 115 and 116 are respectively attached to the suction plates 115a and 116a of the first hoist 115 and 116a. The lead frame L1 raised above the one magazine 111 is adsorbed.

Thereafter, the first and second hoists 115 and 116 are moved upwards and then laterally lowered, and the lead frames L1 adsorbed by the first hoists 115 and 116 are seated on the transfer part 120.

At the same time, the first hoists 115 and 116 adsorb the slip sheets P stacked on the upper ends of the first magazines 111. The first and second hoists 115 and 116 are raised again and then moved back to their original positions.

The first and second hoists 115 and 116 moved to their original positions are lowered, and the first hoists 115 and 116 are lead frames L1 which are positioned at the top by removing the slippers P by the second hoists 115 and 116. At the same time, the second hoist (115, 116) laminates the adsorbed slip sheet (P) in the second magazine (113).

By repeating the above process and separating the lead frame (L1) and the slip sheet (P) stacked in the first magazine 111, the lead frame (L1) is moved to the transfer unit 120, the slip sheet (P) The second magazine 113 is laminated.

The lead frame L1 separated and conveyed as described above is moved and controlled by the gripper intermittently, and the lead frame L1 is preheated heater 167 disposed on the movement path of the lead frame L1. Will pass through and warm up.

On the other hand, the adhesive tape (T1) for fixing the inner lead (I) of the lead frame (L1) is installed in the tape supply unit 150, then the adhesive tape (T1) and the adhesive tape (bonded to the inner lead (I) After separating into a protective film (T2) to protect the T1), the protective film (T2) is recovered to a separate protective film recovery unit 152, the adhesive tape (T1) by blowing the ionized air to discharge static electricity After the static electricity is removed by the static eliminating means to remove, it is maintained by the tension means is automatically adjusted to the appropriate pressure by the pneumatic pressure is conveyed to the tape work unit 160.

The adhesive tape T1 supplied to the tape work part 160 passes through a piercing mold, and removes unnecessary parts therein, passes through a blanking mold 164, and pulls out a necessary part, and at the same time, the lead frame L1. The inner lead (I) of the thermocompression bonding is to be bonded.

As described above, the lead frame L1 to which the adhesive tape T1 is adhered continues and is reheated by the post-heater 168 to be firmly bonded in a short time.

Meanwhile, the third and fourth hoists 115 and 116 positioned in the unloading unit 140 are lowered. At this time, the fourth hoist 116 is to suck the interlayer paper (P) laminated in the fourth magazine. In addition, the third and fourth hoists 115 and 116 are moved laterally after being raised, and then lowered again.

At this time, the fourth hoist 116 stacks the interleaved paper P attached to the adsorption plates 115a and 116a to the third magazine, and at the same time, the third hoist 115 is a lead to which the adhesive tape T1 is adhered. The frame L1 is sucked.

Thereafter, the third hoist 115 and the fourth hoist 116 are returned to their original positions, and then are lowered again. The third hoist 115 attaches the adsorbed lead frame L1 to the third magazine. The fourth slipper 116 is placed on the stacked slip sheets P, and the fourth hoist 116 sucks the stacked slip sheets P again in the fourth magazine.

This process is repeatedly performed, and the transferred lead frame L1 is alternately stacked with the slip sheet P. FIG.

As described above, the taping apparatus for the lead frame according to the present invention has been described with reference to the illustrated drawings. However, the present invention is not limited by the embodiments and drawings disclosed herein, and is made by those skilled in the art within the technical scope of the present invention. Various modifications can be made, including, of course.

As described above, the taping apparatus of the lead frame according to the present invention comprises a feed control means for synchronizing the movement of the tape and the lead frame such that the tape taken out from the feeding apparatus is adhered to the inner lead accurately, the tape and Since the lead frame is mechanically operated and synchronized by the cam motion, the working speed is increased, and since it is bonded without error, the defect rate is reduced and the production rate is increased.

In addition, a preheating heater is provided to preheat the lead frame before the lead frame is thermocompressed, so that the heat flow amount of the lead frame is gradually increased without sudden thermal fluctuation, thereby increasing the adhesion efficiency and reducing the working time. There is an effect that the heat deformation generated in the frame is reduced.

In addition, after the lead frame is thermally compressed, a post-heater for reheating the lead frame is provided to remove thermal stress generated by high temperature, thereby reducing a defective rate and improving quality.

Claims (16)

A lead frame having an inner lead constituting a circuit therein, and a loading unit for stacking and separating loads of interlayer paper protecting the lead frame; A transfer unit for sequentially transferring the lead frame loaded from the loading unit; A feeding device which is arranged to be orthogonal to the conveying unit, to take out the tape for fixing the inner lead into at least one shape, and to match and adhere the inner lead to the taken out tape; Transfer control means for synchronizing the moving speeds of the tape and lead frame such that the tape taken out from the feeding device is adhered to the inner lead accurately; And an unloading part for unloading the lead frame taped by the feeding device. The method of claim 1, The loading unit comprises: a first magazine in which the lead frame and the interleaving paper protecting the lead frame are alternately stacked; A second magazine disposed on a side of the first magazine, The first and second hoists, which are sequentially reciprocated between the first magazine and the second magazine or the first magazine and the transfer part, separate lead frames and slippers stacked on the first magazine, respectively, and are located in the transfer part or the second magazine. Taping apparatus of the lead frame, characterized in that configured to include. The method of claim 1, The feeding device includes a tape supply unit to which the tape is continuously supplied; A tape work part which takes out the tape supplied from the tape supply part into a required shape; And a tape discharge part for collecting the remaining tape after being taken out of the tape work part. The method of claim 3, wherein The tape is made of an adhesive tape adhered to the inner lead and a protective film protecting the adhesive tape, And the tape supply unit further comprises a protective film recovery unit for separating and recovering the protective film from the tape supplied to the tape work unit. The method according to claim 3 or 4, The tape supply unit or the protective film recovery unit or the tape discharge unit is a tape of the lead frame characterized in that it further comprises an antistatic means for supplying the ionized air to the recovered adhesive tape or protective film to remove the static electricity. The method of claim 5, The antistatic means includes an ion generator for ionizing air; And a pneumatic pump for supplying air ionized by the ion generator to the adhesive tape or the protective film. The method of claim 5, The antistatic means is a taping apparatus for a lead frame, characterized in that further comprises a tension means for adjusting the tension of the adhesive tape or protective film. The method of claim 7, wherein The tension device may include a cylinder in which pressure is generated by air supplied with the pneumatic pump; And a dancing roller connected to the cylinder and rolling on the surface of the adhesive tape or the protective film and pulling the adhesive tape or the protective film at a constant pressure in accordance with the pressure of the cylinder. The method of claim 3, wherein The tape work piece includes a piercing mold for removing unnecessary portions of the adhesive tape to be conveyed; And a blanking mold for extracting the necessary portion from the adhesive tape from which the unnecessary portion is removed from the piercing mold and pressing the inner lead. The method of claim 9, The tape work unit may include: a main heater disposed under the blanking mold to heat a lead frame passed upward; And an auxiliary heating means for increasing the amount of heat flow so that the adhesive force of the adhesive tape adhered to the inner lead of the lead frame is further increased. The method of claim 10, The auxiliary heating means is a taping apparatus of the lead frame, characterized in that consisting of a preheater for preheating the lead frame is located in front of the main heater and disposed under the movement path of the lead frame passed. The method of claim 10, The auxiliary heating means is a tape of the lead frame is characterized in that the rear heater is located in the rear of the main heater and disposed below the path of the lead frame reheating the lead frame passed through. The method of claim 3, wherein And the tape work part further comprises a meandering correction mechanism for guiding the adhesive tape to be linearly supplied. The method of claim 13, The meandering correction mechanism is left and right side guides in close contact with both sides of the adhesive tape, A moxa limiting roller which is rotatably installed on the left and right side guides and clouded on an upper surface of the adhesive tape so that the adhesive tape does not float; And a dustproof pad disposed under the adhesive tape to absorb vibration of the adhesive tape. The method of claim 14, The anti-vibration pad is a tape of the lead frame, characterized in that made of a rubber material. The method of claim 1, The movement limiting means may include a first fixed link linearly interlocked with a drive unit for driving the transfer unit; A first gripper coupled to the first fixing link to be bitten when the inner lead of the lead frame passed by converting the linear motion to the cam motion is positioned below the feeding device; A second gripper for fixing the tape so that the tape is fixed to the inner lead when the first gripper is bitten by the lead frame; And a second fixing link connected to the driving unit so that the second gripper is interlocked with the first gripper to cam-move the second gripper.

Images