KR100850452B1 - Apparatus and method for laminating circuit film on frame - Google Patents

Abstract

The circuit film laminating apparatus according to the present invention includes a retracting portion in which a frame for a semiconductor package is loaded to be introduced into a device, a loading portion for vacuum-adsorbing and moving the loaded frame, and the moved frame is separated from the loading portion. A seated and moving place, the rail part extending in one direction to enable a sequential series of operations, a gripper part for moving the seated frame along the rail part, and a circuit film wound on a reel to be laminated on the frame Circuit film supply part which supplies continuously, temporary adhesion part which cuts the said circuit film to a predetermined form by the punching by a metal mold, and bone which presses the frame to which the said circuit film is temporarily bonded by the rolling motion of a roller. Bonding the frame pressed by the roller with the heater and the upper and lower molds A thermocompression unit, an unloading unit which vacuum-adsorbs the thermocompressed frame to be detached from the rail unit, and a takeout and stacking unit which is mounted so that the detached frame is separated from the unloading unit and taken out of the apparatus; The loading unit is characterized in that the ion blower (ion blower) for removing the static electricity and dust of the frame is provided.

Description

Apparatus and method for laminating circuit film on frame}

1 is a perspective view for explaining the concept of the operation performed by the circuit film laminating apparatus according to the present invention.

2 is a schematic plan view of a circuit film laminating apparatus according to the present invention;

Figure 3 is a schematic cross-sectional view of the loading and loading portion of the circuit film laminating apparatus according to the present invention.

4 is a schematic cross-sectional view of a circuit film supply part and a temporary adhesive part of a circuit film laminating apparatus according to the present invention.

5 and 6 are schematic cross-sectional views of the main compression portion of the circuit film laminating apparatus according to the present invention seen from the front and the side.

7 is a schematic cross-sectional view of a thermocompression part of a circuit film laminating apparatus according to the present invention.

8 is a flow chart schematically showing a circuit film laminating method according to the present invention.

<Brief description of symbols for the main parts of the drawings>

10 ... polyimide film 20 ... double-sided adhesive tape                 

30 ... cover `50 ... strip-shaped frame

100 ... circuit film laminating device 110 ... frame entry

120 ... loading part 140 ... rail part

150 ... circuit film supply 180 ... first bond

210 ... Second Adhesion 240 ... Third Adhesion

270 ... unloading section 290 ...

The present invention relates to an apparatus for laminating a circuit film on a frame for a semiconductor package, and more particularly, to an apparatus for automatically laminating a circuit film printed with a circuit pattern on a frame.

TVS semiconductor packages are known in the field of semiconductor packages. This is a film (hereinafter referred to as a "circuit film") made of a material such as polyimide with a predetermined circuit pattern is bonded to the metal frame, the circuit pattern has a structure electrically connected through the semiconductor chip and wire bonding. These TV packages are mainly used for custom products such as computer graphics cards and game cards because they can accommodate high density circuits, have excellent electrical characteristics, and have high heat dissipation.

In order to manufacture the TV package, the invention requires a process of adhering the circuit film to the frame, and the invention of Korean Application No. 10-1998-0056169 is known. According to this, the process of adhering the circuit film to the frame includes the steps of positioning a frame having a predetermined number of square holes, adhering a double-sided adhesive tape having a cover to one side to the frame, and double-sided adhesive to the frame. Hot pressing the adhesive tape at high temperature, removing the cover from the double-sided adhesive tape, and cutting the circuit film into a predetermined size and shape to adhere the double-sided adhesive tape to the double-sided adhesive tape.

Such a conventional process has the following problems.

First, the step of adhering the adhesive tape to the frame, the step of removing the cover, and the step of adhering the circuit film are separate, thereby increasing the number of manufacturing processes and increasing the manufacturing cost.

Second, since the adhesive tape is attached to the frame and immediately thermally compressed, an air layer is formed on the adhesive surface, and thus the adhesive strength may be reduced.

Third, when the adhesive tape is left at room temperature for a certain time, the adhesive resin flows out and sticks to the cutting mold, thereby reducing productivity.

The present invention was devised to solve the above problems, and an object of the present invention is to provide a circuit film laminating apparatus for automatically adhering a circuit film to a frame in a minimum process.

Another object of the present invention is to provide a circuit film laminating apparatus capable of forming a semiconductor package with improved adhesion between a frame and a circuit film.                         

It is still another object of the present invention to provide a circuit film laminating apparatus in which the flow of adhesive resin can be suppressed.

It is also an object of the present invention to provide a method of laminating a circuit film to a frame for a semiconductor package via a circuit film laminating apparatus.

In order to achieve the above technical problem, the circuit film laminating device of the present invention includes a loading part for loading a semiconductor package frame to be drawn into the device, a loading part for vacuum-adsorbing the loaded frame, and the moved frame. The seat is separated and seated from the loading unit, and is moved to, a rail unit extending in one direction to enable a sequential series of operations, a gripper unit for moving the seated frame along the rail unit, and a reel to be laminated to the frame. The circuit film supply part which unwinds a reel and continuously supplies a wound circuit film, the temporary adhesive part which cuts the said circuit film to a predetermined form by the punching by a metal mold | die, and the said circuit film is moved by the rolling motion of a roller. The main bonding portion for pressing the bonded frame, the press pressed by the roller A thermocompression unit for thermocompression bonding with a heater and an up-and-down mold, an unloading unit for vacuum adsorbing the thermocompressed frame to be separated from the rail unit, and the detached frame to be separated from the unloading unit and taken out of the apparatus. It is provided with a loading and stacking portion to be loaded, characterized in that the loading portion is provided with an ion blower (ion blower) for removing the static and dust of the frame.

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The circuit film supply part of the circuit film laminating device of the present invention includes an LM guide, a weight block movable up and down along the LM guide, a roller mounted at one end of the weight block, and a spring connected to the other end of the weight block. It is configured to, characterized in that it further comprises a tension control means for maintaining the tension of the circuit film in a predetermined range.

The provisional bonding portion of the circuit film laminating device of the present invention is further provided with a cooler that cools before punching the circuit film.

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Method In the aspect of the present invention, the circuit film laminating method of the present invention includes removing static electricity and dust from a frame for a semiconductor package and supplying them one by one. A predetermined circuit pattern is formed on an upper layer and a double-sided adhesive tape is bonded to a lower layer. Step of temporarily cutting and temporarily bonding the frame to the frame, pressurizing and bonding the frame to which the circuit film is temporarily bonded with a roller, and heating the frame to which the circuit film is originally bonded by a mold having a heater. And a step of loading the frame on which the circuit film is thermally compressed.

In the circuit film laminating method of the present invention, the frame of the main bonding step is heated by a heater while being pressed by a roller.

Hereinafter, with reference to the accompanying drawings will be described in detail.                     

1 is a schematic perspective view for explaining the concept of the work performed by the circuit film laminating apparatus according to the present invention.

Referring to the drawings, the semiconductor package frame 50 used in this embodiment is in the form of a strip in which four unit frames are formed in a row. The circuit film 10 having the circuit pattern 15 formed thereon is bonded to the unit frame. In the present embodiment, the circuit film 10 has a double-sided adhesive tape 20 bonded to the lower layer, an interlayer sheet for protecting the circuit pattern 15 is interposed on the upper layer of the circuit film 10, and the double-sided adhesive tape ( The lower layer of 20) is rolled up in a reel form with a cover 30 attached to protect an adhesive surface. This circuit film 10 is continuously supplied in reel to reel. On the way, the slip sheet 40 and the cover 30 are separated, punched out by a mold, and adhered to the unit frame. Details of the bonding process will be described later.

2 is a schematic plan view of a circuit film laminating apparatus according to the present invention.

Referring to the drawings, the apparatus of the present invention is a retracting load unit 110, a loading part (120), a rail unit 140, a circuit film supply unit 150, which is loaded with a frame for a semiconductor package for operation The adhesive part 200, the main adhesive part 230, the thermocompression part 260, the unloading part 270, the unloading part 290, and the gripper part for transferring the frame along the rail part 140. (gripper part, not shown).

The reloading unit 110 and the takeout unit 290 are provided with a cassette for starting a work or for loading a frame (see 50 in FIG. 1) where the work is completed. The cassette stacking unit 110 is provided with three cassettes, among which, the first and second cassettes 111 and 112 are loaded with frames and slip sheets waiting for work, and the third cassette 113 has a frame unit with rails ( 140) and the remaining slip sheets are transferred and loaded. The frame take-out and loading unit 290 is also provided with two cassettes 291 and 292 on which finished frames are loaded, as well as one cassette 293 on which interleaf paper is loaded, to be transferred from the cassette 293 between the stacked frames. Be sure to include interleaved blanks.

The loading unit 120 and the unloading unit 270 move the frames one by one between the cassettes 111 to 113 and 291 to 293 and the rail unit 140. The loading unit 120 and the unloading unit 270 are respectively matched with the servo motors 125 and 275, timing belts 126 and 276 for transmitting driving force thereof, rotatable ball screws 127 and 277 connected thereto, and the ball screws. A mechanism configured to include a body 130 and 280 with a squeezing nut is capable of linear movement in the Z-axis direction.

Figure 3 is a cross-sectional view schematically showing the loading and loading portion of the circuit film laminating apparatus according to the present invention.

Referring to the drawings, the first cassette 111 of the loading portion is open upward, the plate 115 for supporting the loaded frame 50 and the interleaver 60 and the shaft 116 for elevating the plate 115. ). The shaft 116 may be lowered or raised in steps as the frame and the slip sheet are loaded or removed by the driving of the linear motor. Although only the first cassette 111 is shown in the figure, it will be readily understood that the other cassettes 112 and 113 have the same structure.

The loading unit 120 is provided with a vacuum suction nozzle 121. This ensures that the frame 50 can be moved to the suction unit 120 without damage. The loading unit 120 is capable of lifting in the Y-axis direction by a driving mechanism including a cylinder 122 connected to the body 130.

 Referring to the operation of the loading unit 120, first, the loading unit 120 performs a linear movement in the Z-axis direction from the initial position to the position of the frame retracting unit 110, and then moves in the Y-axis direction so as to be close to the frame 50 again. Descend. In this state, the vacuum suction nozzle 121 is operated to attach the frame 50 positioned on the top to the loading unit 120 without damage. As such, the loading unit 120 to which the frame is attached moves again close to the rail unit 140 through a series of linear movements, and the frame 50 is stopped by the operation of the vacuum suction nozzle 121. It may be seated on 140. The loading unit 120 may load the slip sheets 60 interposed between the frames in a separate cassette 113 in the same series of operations.

Although not shown, it will be readily understood that the unloading part 270 and the takeout and loading part 290 of FIG. 2 also have the same structure as the loading part 120. The unloading unit 270 may perform a process of moving the frames, which are completed in operation, from the rail unit 140 to the frame takeout and loading unit 190 one by one in response to the operation of the loading unit 120. For protection, the process can also be interposed between the sheets.

The loading unit 120 is preferably provided with an ion blower (ion blower, not shown). The ion blower generates negative ions and positive ions and sprays them together with air to remove dust and static electricity from the frame to prevent the generation of defective products.                     

In addition, the loading unit 120 is preferably provided with a detection sensor (not shown) to determine the case where a plurality of frames are adsorbed on the vacuum suction nozzle 121. When it is detected that the plurality of frames are adsorbed by the detection sensor, the loading unit 120 moves to the cassette 113 for loading the sheet of paper by a series of control signals and loads the plurality of frames there. Therefore, generation of the frame to which the circuit film is not bonded can be prevented.

Referring to FIG. 2, the rail unit 140 includes a pair of rails extending in the X-axis direction, and only the edge of the strip-shaped frame is moved to each work unit in contact with the rail, thereby damaging the unit frame. This can be prevented.

The frame seated on the rail part 140 moves between the respective work parts by the gripper. From the point where the frame is seated to the temporary adhesive part 200, from the temporary adhesive part 200 to the main adhesive part 230, from the main adhesive part 230 to the thermocompression part 260, and unloading at the thermocompression part 260 Separate grippers move the frame to the point where unit 270 adsorbs the frame.

The grippers are similar to the loading part 120 in the X-axis direction along the rail part 140 by a mechanism configured to include a servo motor, a ball screw connected thereto, and a nut moving with and engaged with the ball screw. Linear motion is possible. Furthermore, the lifting mechanism in the Y-axis direction (the direction perpendicular to the X-axis and Z-axis) is possible by the mechanism provided with the cylinder. In the present embodiment, the frame is moved by the pin gripper from the temporary adhesive part 200 to the main adhesive part 230, and by the vacuum gripper from the main adhesive part 230 to the thermocompression part 260. Both can be connected to the same servomotor and ball screw and moved simultaneously in the X direction.

4 is a schematic cross-sectional view of a circuit film supply part and a temporary adhesive part of a circuit film laminating apparatus according to the present invention. 4 illustrates the relationship between the temporary adhesive part 200 and the reels 151 to 154 in more detail.

Referring to the drawings, the circuit film supply unit 150 is a circuit in which the circuit film 10, the double-sided adhesive tape 20, the cover 30, and the slip sheet 40 as described above in FIG. 1 are rolled and stacked. A film supply reel 152, a slip paper recovery reel 153 for recovering the slippers, a cover recovery reel 151 for recovering the covers, and a circuit film recovery reel 154 for recovering the remaining circuit film after the temporary bonding operation is completed. Equipped. Referring to FIG. 2, each of the reels 151 to 154 may be connected to the servo motors 155 to 158 to be driven. Through this, the circuit film on which the double-sided adhesive tape is laminated (hereinafter referred to as the circuit films 10 and 20) is continuously supplied to the temporary adhesive part 180 in a reel to reel manner.

In the circuit film supply unit 150, tension control means 160 and 180 for tension control of the circuit film 10 are provided on the circuit film supply reel 152 side and the circuit film recovery reel 154 side, respectively. The tension adjusting means (160, 180) are LM guides (161, 181), the weight block (163, 183) coupled to be lifted along the LM guide, the rollers (162, 182) are mounted on one side end of the weight block and can be moved up and down, and Springs 164 and 184 are connected to the other end of the weight block to maintain balance. With such a configuration, when the tension of the circuit films 10 and 20 traveling along the circumferential surfaces of the rollers 162 and 182 decreases, the rollers 162 and 182 lower, and conversely, the tension of the circuit films 10 and 20 is increased. Increasing increases the rollers 162 and 182 so that the circuit films 10 and 20 can maintain proper tension.

The circuit film supply unit 150 is preferably provided with roll feeders 166 and 186 on the circuit film supply reel 152 side and the circuit film recovery reel 154 side, respectively. The roll feeders 166 and 186 have a pinch roller 168 and 188 for pressing the circuit films 10 and 20 by driving the cylinders 167 and 187, and a driving roller 170 and 190 which are rotated by the rotational force of the servo motors 169 and 189. The configuration facing each other with (10,20) interposed therebetween helps to convey by the traction of the circuit film (10,20).

Before being supplied to the temporary adhesive part 200, the circuit films 10 and 20 are inspected by a detection sensor 171 capable of detecting a defect mark indicating when a circuit pattern is defective. As a result, the bad circuit pattern can be recovered without being blown into the frame, thereby reducing the occurrence of defects in the semiconductor package.

The series of guide rollers 175 to 177, 191, 192 in which the circuit films 10 and 20 travel along the circumferential surface is preferably a sprocket roller to prevent the circuit films 10 and 20 from deviating sideways during transportation. . Referring to FIG. 1, it can be seen that the through holes 11 are regularly formed at the edges of the circuit films 10 and 20 to engage the teeth of the sprocket.

The temporary adhesive part 200 includes a die 203 on which a frame 50 entering in the X-axis direction (a direction perpendicular to the Y-axis direction and the Z-axis direction) is supported. In addition, the frame 50 is punched by forming the first punching mold 201a and 201b and the circuit pattern (15 of FIG. 1) which are male and female to form a cavity (12 of FIG. 1) in the circuit films 10 and 20. And a second punching die 202 for temporarily attaching the same. Although not shown, the punching dies 201 and 202 may be driven by a cylinder, respectively, and a dotted line indicates the position at the time of the punching. Scrap of the circuit film removed by the first punching die 201 may be sucked and recovered through the scrap recovery unit 206.

When the circuit films 10 and 20 are punched out by the second punching die 202, only the circuit pattern (15 of FIG. 1) is cut and attached to the frame 50. However, in practice, the circuit pattern 15 is formed by adhesive force. The outer part of the bottom is often attached to the frame 50 comes down. The die 203 is preferably provided with a film lifter 205 in order to prevent work interruption. It can move in the Y-axis direction by cylinder (not shown) drive, and the dotted line shows the position at the time of ascending. Immediately after the punching of the second punching die 202, the film lifter 205 is raised so that the circuit films 10 and 20 can be smoothly transferred to the recovery reel 154. The end of the film lifter 205 may be provided with a small roller (not shown) to minimize the contact area with the adhesive tape (20 in FIG. 1).

The provisional adhesive 200 includes a cooler 210 to cool the circuit films 10 and 20 before they are punched out. As a result, the adhesive resin of the adhesive tape (20 in FIG. 1) may be prevented from sticking to the punching dies 201 and 202 in the room temperature atmosphere, thereby preventing work. The cooler 210 may have a tunnel structure having a thermoelectric semiconductor.

5 and 6 are schematic cross-sectional views of the main compression portion of the circuit film laminating device according to the present invention seen from the front and side. This is shown in detail by the reference numeral 230 in FIG.

Referring to the drawings, the frame 50 to which the circuit films 10 and 20 are temporarily bonded is entered into the main compression unit 230 in the negative X-axis direction and positioned for work on the plate 240. The plate 240 is a vacuum adsorption atmosphere is formed so that the frame 50 can be fixed and supported without damage.

The frame 50 to which the circuit films 10 and 20 are temporarily bonded is pressed by rolling the roller 231 in which the heater 232 is built therein. The rolling of the roller 231 can ensure a firm adhesion without the generation of an air layer between the circuit film 10, 20 and the frame 50. The heater 232 embedded in the roller 231 helps the main bonding operation by improving the flexibility of the circuit films 10 and 20 and the viscosity of the adhesive resin. The heater 241 may also be installed at the bottom of the plate 240, which also helps to improve workability.

A main cylinder 235 is provided at the center of the roller 231 to elevate the roller 231 in the Y-axis direction. In addition, sub-cylinders 236 and 237 are provided at both ends of the roller 231 to maintain fine adjustment and balance of the pressing force by the roller 231. Although not shown, it is preferable to control with a precision regulator for precise pressing force control, and the lifting height of the roller 231 is adjusted to a micrometer.

Referring to FIG. 6, the roller housing 238 covering the roller 231 includes a nut (not shown), which is engaged with the ball screw 252 extending in the Z-axis direction. The ball screw 252 is rotated by receiving the driving force of the servo motor 250 through the timing belt 251, whereby the roller housing 238 is capable of linear movement in the Z-axis direction.

When the main bonding process of the main bonding unit 230 described above is briefly summarized, first, the temporarily bonded frame 50 is vacuum-adsorbed and fixed on the plate 240, and the roller 231 is driven by the cylinders 235 to 237. Is lowered in the Y-axis direction to pressurize the frame 50 appropriately, and in this state, the roller housing 238 moves in the Z-axis direction, so that the main bonding is performed by rolling the roller 231.

7 is a schematic cross-sectional view of a thermocompression bonding part of the circuit film laminating apparatus according to the present invention. This corresponds to the part indicated by reference numeral 260 in FIG.

Referring to the drawings, when the frame 50 to which the circuit films 10 and 20 are bonded is drawn in the negative direction of the X axis, the upper and lower press molds 261 and 262 respectively descend and rise in the Y axis direction, so that the frame ( Squeeze 50). The upper and lower molds 261 and 262 are each a heating block with a built-in heater to help enhance adhesion.

8 schematically shows a method of laminating a circuit film on a frame for a semiconductor package according to the present invention. This method may be performed using the apparatus described in FIGS.

Referring to the drawings, the method of supplying the frames one by one (S110), the step of punching the circuit film, the temporary bonding to the frame (S120), the main bonding step of pressing the temporary bonded frame with a roller (S130) ), The step of thermally pressing the main bonded frame into a mold in which a heater is built (S140), and the step of loading the thermally pressed frame into a cassette (S150). The circuit film is released from the reel and continuously supplied for the temporary adhesion (S210).

Compared with Figure 2, the frame supply step (S110) is by the loading and loading portion (110, 120) of the apparatus of the present invention, the provisional bonding step (S120) by the temporary adhesion unit 200, the main bonding step ( S130 is by the main bonding portion 230, the thermocompression step (S140) by the thermocompression unit 260, the frame loading step (S150) by the unloading unit and take-out stacking unit (280,290), and the circuit film Supply (S210) of the may be performed by the circuit film supply unit 150, respectively. Detailed description of each step is omitted since it has already been described above with reference to FIGS.

The circuit film laminating apparatus and method of the present invention described above have the following effects.

First, productivity can be improved by automating the task of laminating the circuit film to the frame.

Second, the formation of the air layer on the bonding portion of the circuit film and the frame is suppressed to increase the adhesive strength can be improved quality.

Third, the phenomenon that the adhesive resin flows out and sticks to the punching die can be suppressed, so that the productivity of the work can be improved.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (7)

A retraction stacking portion for loading the frame for the semiconductor package into the device; A loading unit for moving the loaded frame; A rail unit having at least one pair of rails extending in one direction so as to allow a sequential series of operations; A gripper unit for moving the seated frame along the rail unit; A circuit film supply unit for continuously supplying a circuit film wound on a reel to be laminated to the frame; A temporary adhesive part which cuts the circuit film into a predetermined shape by punching by a metal mold and temporarily attaches to the frame; A main bonding part for pressing the frame to which the circuit film is temporarily bonded by rolling motion of a roller; A thermocompression unit for thermocompression bonding the frame pressurized by the roller with a heater and an upper and lower molds; An unloading part which vacuum-adsorbs the thermo-compressed frame and is separated from the rail part; and And a takeout-loading part in which the separated frame is separated from the unloading part and loaded to be taken out of the apparatus. The loading unit, the circuit film laminating device, characterized in that the ion blower (ion blower) for removing the static electricity and dust of the frame is provided. delete The method of claim 1, The circuit film supply unit includes an LM guide, a weight block movable up and down along the LM guide, a roller mounted at one end of the weight block, and a spring connected to the other side end of the weight block. The circuit film laminating device further comprises a tension adjusting means for maintaining the tension of the predetermined range. The method of claim 1, The temporary adhesive part further comprises a cooler for cooling prior to punching the circuit film. delete Removing static electricity and dust from the frame for the semiconductor package and supplying them one by one; Forming a circuit pattern on an upper layer, and cutting and cutting a circuit film to which a double-sided adhesive tape is attached to the lower layer, and temporarily attaching the circuit film to the frame; Pressing the frame to which the circuit film is temporarily bonded with a roller to bond the main body; Thermally compressing the frame on which the circuit film is main bonded by a mold having a heater; And And loading the frame on which the circuit film is thermocompression-bonded. The method of claim 6, The frame of the main bonding step is a circuit film laminating method, characterized in that being heated by a heater while being pressed by a roller.

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