TW202118314A - 壓電膜及壓電膜之製造方法 - Google Patents

壓電膜及壓電膜之製造方法 Download PDF

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Publication number
TW202118314A
TW202118314A TW109135428A TW109135428A TW202118314A TW 202118314 A TW202118314 A TW 202118314A TW 109135428 A TW109135428 A TW 109135428A TW 109135428 A TW109135428 A TW 109135428A TW 202118314 A TW202118314 A TW 202118314A
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TW
Taiwan
Prior art keywords
piezoelectric
layer
electrode
electrode layer
film
Prior art date
Application number
TW109135428A
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English (en)
Chinese (zh)
Inventor
香川裕介
平口和男
Original Assignee
日商富士軟片股份有限公司
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Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202118314A publication Critical patent/TW202118314A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
TW109135428A 2019-10-16 2020-10-14 壓電膜及壓電膜之製造方法 TW202118314A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-189074 2019-10-16
JP2019189074 2019-10-16

Publications (1)

Publication Number Publication Date
TW202118314A true TW202118314A (zh) 2021-05-01

Family

ID=75537479

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109135428A TW202118314A (zh) 2019-10-16 2020-10-14 壓電膜及壓電膜之製造方法

Country Status (7)

Country Link
US (1) US12575327B2 (https=)
EP (1) EP4047671A4 (https=)
JP (1) JP7390390B2 (https=)
KR (1) KR20220056865A (https=)
CN (1) CN114521297A (https=)
TW (1) TW202118314A (https=)
WO (1) WO2021075308A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114762140A (zh) * 2019-12-18 2022-07-15 富士胶片株式会社 压电薄膜
KR102867807B1 (ko) * 2020-12-09 2025-10-01 엘지디스플레이 주식회사 장치
KR102904853B1 (ko) * 2020-12-22 2025-12-24 엘지디스플레이 주식회사 진동 장치 및 이를 포함하는 장치
KR102904850B1 (ko) 2020-12-22 2025-12-24 엘지디스플레이 주식회사 진동장치 및 이를 포함하는 장치
KR20230084941A (ko) * 2021-12-06 2023-06-13 엘지디스플레이 주식회사 장치
KR20230096545A (ko) * 2021-12-23 2023-06-30 엘지디스플레이 주식회사 장치
KR20230103751A (ko) * 2021-12-31 2023-07-07 엘지디스플레이 주식회사 장치 및 이를 포함하는 운송 장치

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JPS5825450B2 (ja) * 1978-11-15 1983-05-27 三菱油化株式会社 生体用トランスジユ−サ
JPH0793190B2 (ja) 1987-03-17 1995-10-09 アルプス電気株式会社 エレクトロルミネツセント素子の製造方法
JPH06268274A (ja) * 1993-03-12 1994-09-22 Brother Ind Ltd 積層型圧電素子
JPH11333635A (ja) 1998-05-28 1999-12-07 Amada Co Ltd バリ取り装置
JP3733861B2 (ja) * 2001-02-01 2006-01-11 株式会社村田製作所 積層圧電体の分極方法
JP4508536B2 (ja) 2003-01-30 2010-07-21 大日本印刷株式会社 リチウム電池用包装体
JP2004351579A (ja) 2003-05-30 2004-12-16 Technocoat Co Ltd バリ取り装置及び方法
JP2004363489A (ja) * 2003-06-06 2004-12-24 Ngk Insulators Ltd 圧電／電歪素子、圧電／電歪素子の製造方法、圧電／電歪デバイス及び圧電／電歪デバイスの製造方法
CN1568111A (zh) * 2003-06-16 2005-01-19 铼宝科技股份有限公司 有机电致发光显示器
JP5139672B2 (ja) * 2006-02-07 2013-02-06 富士フイルム株式会社 積層型圧電素子及びその製造方法
US20070182288A1 (en) 2006-02-07 2007-08-09 Fujifilm Corporation Multilayered piezoelectric element and method of manufacturing the same
JP2008218378A (ja) 2007-02-07 2008-09-18 Toyota Motor Corp 電極板、電池、車両、電池搭載機器、電極板の製造方法、および電池の製造方法
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JP6005089B2 (ja) * 2013-03-29 2016-10-12 富士フイルム株式会社 電気音響変換フィルム
JP6199245B2 (ja) * 2014-06-30 2017-09-20 富士フイルム株式会社 電気音響変換フィルムおよび電気音響変換フィルムの導通方法
CN105304856A (zh) 2014-08-01 2016-02-03 中国电子科技集团公司第十八研究所 锂一次电池负极片的制备方法
JP2016072565A (ja) 2014-10-01 2016-05-09 凸版印刷株式会社 回路基板およびその製造方法、および太陽電池モジュール
WO2016121765A1 (ja) * 2015-01-29 2016-08-04 富士フイルム株式会社 電気音響変換フィルムおよび電気音響変換フィルムの製造方法
JP6431984B2 (ja) 2015-07-27 2018-11-28 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
DE112016004292B4 (de) * 2015-10-21 2019-03-07 Fujifilm Corporation Video-Audio-System
JP6861479B2 (ja) 2016-06-24 2021-04-21 東京エレクトロン株式会社 プラズマ成膜方法およびプラズマ成膜装置
WO2019093092A1 (ja) * 2017-11-09 2019-05-16 株式会社村田製作所 圧電部品、センサおよびアクチュエータ
JP7167626B2 (ja) * 2018-03-09 2022-11-09 株式会社リコー アクチュエータ、液体吐出ヘッド、液体吐出ユニット及び液体を吐出する装置

Also Published As

Publication number Publication date
US20220238787A1 (en) 2022-07-28
WO2021075308A1 (ja) 2021-04-22
JPWO2021075308A1 (https=) 2021-04-22
EP4047671A4 (en) 2022-12-21
KR20220056865A (ko) 2022-05-06
US12575327B2 (en) 2026-03-10
CN114521297A (zh) 2022-05-20
JP7390390B2 (ja) 2023-12-01
EP4047671A1 (en) 2022-08-24

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