TW202107645A - 電路基板及封裝方法 - Google Patents

電路基板及封裝方法 Download PDF

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Publication number
TW202107645A
TW202107645A TW109119860A TW109119860A TW202107645A TW 202107645 A TW202107645 A TW 202107645A TW 109119860 A TW109119860 A TW 109119860A TW 109119860 A TW109119860 A TW 109119860A TW 202107645 A TW202107645 A TW 202107645A
Authority
TW
Taiwan
Prior art keywords
circuit
heat
solder
conductive pad
terminal
Prior art date
Application number
TW109119860A
Other languages
English (en)
Chinese (zh)
Inventor
杉山和弘
佐藤彰
福田光樹
Original Assignee
日商萬達修查股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商萬達修查股份有限公司 filed Critical 日商萬達修查股份有限公司
Publication of TW202107645A publication Critical patent/TW202107645A/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW109119860A 2019-06-14 2020-06-12 電路基板及封裝方法 TW202107645A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/023686 WO2020250427A1 (ja) 2019-06-14 2019-06-14 回路基板及び実装方法
WOPCT/JP2019/023686 2019-06-14

Publications (1)

Publication Number Publication Date
TW202107645A true TW202107645A (zh) 2021-02-16

Family

ID=71949416

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109119860A TW202107645A (zh) 2019-06-14 2020-06-12 電路基板及封裝方法

Country Status (5)

Country Link
JP (1) JP6738057B1 (ja)
KR (1) KR20210151872A (ja)
CN (1) CN113994771A (ja)
TW (1) TW202107645A (ja)
WO (1) WO2020250427A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230110736A (ko) 2020-11-26 2023-07-25 가부시키가이샤 원더 퓨쳐 코포레이션 실장 구조체

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183513A (ja) * 1998-12-16 2000-06-30 Nec Corp 回路基板と電子部品との接続解除装置及びその解除方法
JP4970292B2 (ja) * 2008-01-08 2012-07-04 富士通株式会社 電子部品のリペア方法、リペア装置および配線板ユニット
JP3163841U (ja) * 2010-08-23 2010-11-04 黄顯榮 モジュール化したｌｅｄディスプレイ及びそのシステム
JP2013171863A (ja) * 2012-02-17 2013-09-02 Panasonic Corp 電子部品実装構造体及びその製造方法
CN109937110B (zh) 2016-09-16 2021-06-08 株式会社旺得未来 焊接接合方法和焊接接合装置
JP6915843B2 (ja) 2017-03-08 2021-08-04 株式会社ワンダーフューチャーコーポレーション 半田接合装置

Also Published As

Publication number Publication date
WO2020250427A1 (ja) 2020-12-17
JP6738057B1 (ja) 2020-08-12
JPWO2020250427A1 (ja) 2021-09-13
KR20210151872A (ko) 2021-12-14
CN113994771A (zh) 2022-01-28

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