TW202035152A - 導電性轉印材料、導電圖案之製造方法、積層體、觸控面板及液晶顯示裝置 - Google Patents

導電性轉印材料、導電圖案之製造方法、積層體、觸控面板及液晶顯示裝置 Download PDF

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Publication number
TW202035152A
TW202035152A TW109100786A TW109100786A TW202035152A TW 202035152 A TW202035152 A TW 202035152A TW 109100786 A TW109100786 A TW 109100786A TW 109100786 A TW109100786 A TW 109100786A TW 202035152 A TW202035152 A TW 202035152A
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TW
Taiwan
Prior art keywords
layer
conductive
transfer material
photosensitive layer
mass
Prior art date
Application number
TW109100786A
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English (en)
Chinese (zh)
Inventor
中村秀之
佐藤守正
Original Assignee
日商富士軟片股份有限公司
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Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202035152A publication Critical patent/TW202035152A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
TW109100786A 2019-03-28 2020-01-09 導電性轉印材料、導電圖案之製造方法、積層體、觸控面板及液晶顯示裝置 TW202035152A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019064594 2019-03-28
JP2019-064594 2019-03-28

Publications (1)

Publication Number Publication Date
TW202035152A true TW202035152A (zh) 2020-10-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW109100786A TW202035152A (zh) 2019-03-28 2020-01-09 導電性轉印材料、導電圖案之製造方法、積層體、觸控面板及液晶顯示裝置

Country Status (3)

Country Link
JP (1) JP7317102B2 (ja)
TW (1) TW202035152A (ja)
WO (1) WO2020194948A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11652052B2 (en) 2021-03-29 2023-05-16 Tpk Advanced Solutions Inc. Contact structure and electronic device having the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024004430A1 (ja) * 2022-06-30 2024-01-04 富士フイルム株式会社 転写フィルム、パターンの形成方法、及び回路配線の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009210972A (ja) * 2008-03-06 2009-09-17 Jsr Corp 転写フィルムおよびパターンの形成方法
JP2012033466A (ja) * 2010-07-02 2012-02-16 Fujifilm Corp 導電層転写材料、及びタッチパネル
JP5662884B2 (ja) * 2011-06-29 2015-02-04 富士フイルム株式会社 導電性フイルム
JP6008519B2 (ja) * 2012-03-08 2016-10-19 国立大学法人東京工業大学 金属ナノ粒子及びその製造方法並びに導電性インク
KR101751588B1 (ko) * 2012-04-04 2017-06-27 히타치가세이가부시끼가이샤 도전 패턴의 형성 방법 및 도전 패턴 기판
JP2016043496A (ja) * 2014-08-19 2016-04-04 国立大学法人名古屋大学 導電性フィルム
JP2016097595A (ja) * 2014-11-21 2016-05-30 日立化成株式会社 積層体及びその製造方法、フィルムセット、感光性導電フィルム、並びに、電子部品
JP2016110726A (ja) * 2014-12-03 2016-06-20 三菱製紙株式会社 光透過性導電材料積層体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11652052B2 (en) 2021-03-29 2023-05-16 Tpk Advanced Solutions Inc. Contact structure and electronic device having the same

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Publication number Publication date
JPWO2020194948A1 (ja) 2021-11-18
WO2020194948A1 (ja) 2020-10-01
JP7317102B2 (ja) 2023-07-28

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