TW202027971A - 雷射剝離用的積層體、組成物及套組 - Google Patents

雷射剝離用的積層體、組成物及套組 Download PDF

Info

Publication number
TW202027971A
TW202027971A TW108136790A TW108136790A TW202027971A TW 202027971 A TW202027971 A TW 202027971A TW 108136790 A TW108136790 A TW 108136790A TW 108136790 A TW108136790 A TW 108136790A TW 202027971 A TW202027971 A TW 202027971A
Authority
TW
Taiwan
Prior art keywords
layer
composition
laminate
mass
release layer
Prior art date
Application number
TW108136790A
Other languages
English (en)
Chinese (zh)
Inventor
増田誠也
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202027971A publication Critical patent/TW202027971A/zh

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/57Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laminated Bodies (AREA)
TW108136790A 2018-10-16 2019-10-14 雷射剝離用的積層體、組成物及套組 TW202027971A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018195067 2018-10-16
JP2018-195067 2018-10-16

Publications (1)

Publication Number Publication Date
TW202027971A true TW202027971A (zh) 2020-08-01

Family

ID=70284609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108136790A TW202027971A (zh) 2018-10-16 2019-10-14 雷射剝離用的積層體、組成物及套組

Country Status (3)

Country Link
JP (1) JPWO2020080276A1 (https=)
TW (1) TW202027971A (https=)
WO (1) WO2020080276A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6836003B1 (ja) * 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
WO2022210154A1 (ja) * 2021-04-01 2022-10-06 東レ株式会社 積層体および半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6261508B2 (ja) * 2012-09-28 2018-01-17 東京応化工業株式会社 積層体、積層体の分離方法、および分離層の評価方法
KR101994059B1 (ko) * 2014-07-17 2019-06-27 아사히 가세이 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 폴리이미드 수지막, 수지 필름 및 그 제조 방법
JP6649111B2 (ja) * 2016-02-16 2020-02-19 東京応化工業株式会社 積層体、積層体の製造方法、及び基板の処理方法

Also Published As

Publication number Publication date
WO2020080276A1 (ja) 2020-04-23
JPWO2020080276A1 (https=) 2020-04-23

Similar Documents

Publication Publication Date Title
US9881829B2 (en) Adhesive composition, laminate, and stripping method
JP6546783B2 (ja) 積層体の製造方法及び支持体分離方法
JP7175186B2 (ja) 分離層形成用組成物、分離層付き支持基体、積層体及びその製造方法、並びに電子部品の製造方法
TWI701149B (zh) 積層體的製造方法、半導體元件的製造方法
TW202027971A (zh) 雷射剝離用的積層體、組成物及套組
TW201016799A (en) Ink for inkjet and curing film formed form the ink
TW201945199A (zh) 積層體、組成物、積層體之製造方法、構件之製造方法
CN104516197B (zh) 黑色感光性树脂组成物及其硬化膜,以及具有该硬化膜的滤色片及触控面板
TW201807110A (zh) 分離層形成用組成物、層合體、以及層合體之製造方法
TWI725150B (zh) 層間絕緣膜形成用組成物、層間絕緣膜及層間絕緣膜圖型之形成方法與裝置
TW202113060A (zh) 清洗用組成物、淋洗液、清洗套組、清洗體的製造方法及半導體元件的製造方法
KR20190040062A (ko) 적층체 및 반도체 소자의 제조 방법
TW202024271A (zh) 臨時接著用組成物、套組及積層體
CN102372825B (zh) 固化性树脂组合物
JP4983583B2 (ja) 熱硬化性樹脂組成物及び硬化膜
JP7275770B2 (ja) 樹脂組成物および電子デバイス製造方法
TW202415688A (zh) 高折射率材料
EP4205902A1 (en) Method for manufacturing processed substrate, method for manufacturing semiconductor element, and composition for forming temporary adhesive layer
JP6212952B2 (ja) 硬化性樹脂組成物
TW202124145A (zh) 包含暫時接著膜的積層體、暫時接著用組成物、積層體的製造方法以及半導體元件的製造方法
JP7287066B2 (ja) 樹脂組成物および電子デバイス製造方法
TW202035507A (zh) 樹脂組成物、樹脂膜及電子零件
TW202043349A (zh) 樹脂組成物、電子零件及樹脂膜的製造方法
CN100432168C (zh) 可固化树脂组合物
TW202330721A (zh) 分離層形成用組合物、附分離層之支持基體、積層體及其製造方法、以及電子零件之製造方法