JPWO2020080276A1 - - Google Patents

Info

Publication number
JPWO2020080276A1
JPWO2020080276A1 JP2020553144A JP2020553144A JPWO2020080276A1 JP WO2020080276 A1 JPWO2020080276 A1 JP WO2020080276A1 JP 2020553144 A JP2020553144 A JP 2020553144A JP 2020553144 A JP2020553144 A JP 2020553144A JP WO2020080276 A1 JPWO2020080276 A1 JP WO2020080276A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2020553144A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020080276A1 publication Critical patent/JPWO2020080276A1/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laminated Bodies (AREA)
JP2020553144A 2018-10-16 2019-10-11 Withdrawn JPWO2020080276A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018195067 2018-10-16
PCT/JP2019/040182 WO2020080276A1 (ja) 2018-10-16 2019-10-11 レーザ剥離用の積層体、組成物およびキット

Publications (1)

Publication Number Publication Date
JPWO2020080276A1 true JPWO2020080276A1 (ja) 2020-04-23

Family

ID=70284609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020553144A Withdrawn JPWO2020080276A1 (ja) 2018-10-16 2019-10-11

Country Status (3)

Country Link
JP (1) JPWO2020080276A1 (ja)
TW (1) TW202027971A (ja)
WO (1) WO2020080276A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6836003B1 (ja) 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
CN116847981A (zh) * 2021-04-01 2023-10-03 东丽株式会社 层叠体及半导体装置的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6261508B2 (ja) * 2012-09-28 2018-01-17 東京応化工業株式会社 積層体、積層体の分離方法、および分離層の評価方法
KR101992525B1 (ko) * 2014-07-17 2019-06-24 아사히 가세이 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 폴리이미드 수지막, 수지 필름 및 그 제조 방법
JP6649111B2 (ja) * 2016-02-16 2020-02-19 東京応化工業株式会社 積層体、積層体の製造方法、及び基板の処理方法

Also Published As

Publication number Publication date
WO2020080276A1 (ja) 2020-04-23
TW202027971A (zh) 2020-08-01

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Legal Events

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