TW202021433A - 金屬基底電路基板的製造方法 - Google Patents

金屬基底電路基板的製造方法 Download PDF

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Publication number
TW202021433A
TW202021433A TW108141259A TW108141259A TW202021433A TW 202021433 A TW202021433 A TW 202021433A TW 108141259 A TW108141259 A TW 108141259A TW 108141259 A TW108141259 A TW 108141259A TW 202021433 A TW202021433 A TW 202021433A
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TW
Taiwan
Prior art keywords
circuit pattern
circuit
intermediate transfer
metal
adhesive sheet
Prior art date
Application number
TW108141259A
Other languages
English (en)
Chinese (zh)
Inventor
星野秀一
齋藤慎二
瓦林朋弘
佐藤惠
Original Assignee
日商日本發條股份有限公司
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Publication date
Application filed by 日商日本發條股份有限公司 filed Critical 日商日本發條股份有限公司
Publication of TW202021433A publication Critical patent/TW202021433A/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/44Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
TW108141259A 2018-11-26 2019-11-13 金屬基底電路基板的製造方法 TW202021433A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-220007 2018-11-26
JP2018220007A JP2020088149A (ja) 2018-11-26 2018-11-26 金属ベース回路基板の製造方法

Publications (1)

Publication Number Publication Date
TW202021433A true TW202021433A (zh) 2020-06-01

Family

ID=70853953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108141259A TW202021433A (zh) 2018-11-26 2019-11-13 金屬基底電路基板的製造方法

Country Status (3)

Country Link
JP (1) JP2020088149A (fr)
TW (1) TW202021433A (fr)
WO (1) WO2020111045A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6897847B1 (ja) * 2020-06-02 2021-07-07 三菱マテリアル株式会社 絶縁樹脂回路基板の製造方法
EP4299550A1 (fr) * 2021-03-30 2024-01-03 Denka Company Limited Procédé de fabrication de carte de circuit imprimé, et carte de circuit imprimé

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3196446B2 (ja) * 1993-09-10 2001-08-06 松下電器産業株式会社 パワー回路用配線基板及びその製造方法
JP2002026475A (ja) * 2000-07-07 2002-01-25 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔回路及びそれを用いたプリント配線板の製造方法並びにプリント配線板
JP3443808B2 (ja) * 2001-02-05 2003-09-08 Tdk株式会社 積層基板および電子部品の製造方法
JP4001112B2 (ja) * 2002-03-29 2007-10-31 松下電器産業株式会社 熱伝導性基板の製造方法
US10192818B2 (en) * 2014-11-20 2019-01-29 Nsk Ltd. Electronic part mounting heat-dissipating substrate

Also Published As

Publication number Publication date
WO2020111045A1 (fr) 2020-06-04
JP2020088149A (ja) 2020-06-04

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