TW201944868A - 配線修正裝置及配線修正方法 - Google Patents

配線修正裝置及配線修正方法 Download PDF

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Publication number
TW201944868A
TW201944868A TW108112621A TW108112621A TW201944868A TW 201944868 A TW201944868 A TW 201944868A TW 108112621 A TW108112621 A TW 108112621A TW 108112621 A TW108112621 A TW 108112621A TW 201944868 A TW201944868 A TW 201944868A
Authority
TW
Taiwan
Prior art keywords
ink
nanoparticle ink
dry ice
metal nanoparticle
laser beam
Prior art date
Application number
TW108112621A
Other languages
English (en)
Chinese (zh)
Inventor
田之岡大輔
Original Assignee
日商Ｖ科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｖ科技股份有限公司 filed Critical 日商Ｖ科技股份有限公司
Publication of TW201944868A publication Critical patent/TW201944868A/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108112621A 2018-04-16 2019-04-11 配線修正裝置及配線修正方法 TW201944868A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-078101 2018-04-16
JP2018078101A JP2019186464A (ja) 2018-04-16 2018-04-16 配線修正装置および配線修正方法

Publications (1)

Publication Number Publication Date
TW201944868A true TW201944868A (zh) 2019-11-16

Family

ID=68240041

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108112621A TW201944868A (zh) 2018-04-16 2019-04-11 配線修正裝置及配線修正方法

Country Status (3)

Country Link
JP (1) JP2019186464A (ja)
TW (1) TW201944868A (ja)
WO (1) WO2019203050A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845820B (zh) * 2020-04-10 2024-06-21 大陸商東莞東陽光科研發有限公司 電極結構材料及製備電極結構材料的方法、電解電容器

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7365047B2 (ja) * 2020-01-14 2023-10-19 株式会社ブイ・テクノロジー 表面分析方法、表面分析装置
KR102468061B1 (ko) * 2020-11-24 2022-11-18 참엔지니어링(주) 리페어 장치 및 방법
CN112557417B (zh) * 2021-02-28 2021-05-11 深圳宜美智科技股份有限公司 基于图像检测的pcb激光修补方法及设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144697A (ja) * 1987-11-30 1989-06-06 Aisin Seiki Co Ltd 回路基板の配線パターン修復方法
JP4241302B2 (ja) * 2003-09-30 2009-03-18 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2009071037A (ja) * 2007-09-13 2009-04-02 Konica Minolta Holdings Inc 導電膜パターンの形成方法
JP6065357B2 (ja) * 2011-11-08 2017-01-25 凸版印刷株式会社 プリント配線板の製造方法
JP2017218469A (ja) * 2016-06-03 2017-12-14 株式会社Ｄｎｐファインケミカル 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845820B (zh) * 2020-04-10 2024-06-21 大陸商東莞東陽光科研發有限公司 電極結構材料及製備電極結構材料的方法、電解電容器

Also Published As

Publication number Publication date
JP2019186464A (ja) 2019-10-24
WO2019203050A1 (ja) 2019-10-24

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