TW201843526A - 感光性樹脂組成物及抗蝕劑圖案的形成方法 - Google Patents
感光性樹脂組成物及抗蝕劑圖案的形成方法 Download PDFInfo
- Publication number
- TW201843526A TW201843526A TW107114324A TW107114324A TW201843526A TW 201843526 A TW201843526 A TW 201843526A TW 107114324 A TW107114324 A TW 107114324A TW 107114324 A TW107114324 A TW 107114324A TW 201843526 A TW201843526 A TW 201843526A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- protecting group
- resin composition
- added
- compound
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polyamides (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-087467 | 2017-04-26 | ||
JP2017087467 | 2017-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201843526A true TW201843526A (zh) | 2018-12-16 |
Family
ID=63920166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107114324A TW201843526A (zh) | 2017-04-26 | 2018-04-26 | 感光性樹脂組成物及抗蝕劑圖案的形成方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6733813B2 (ja) |
TW (1) | TW201843526A (ja) |
WO (1) | WO2018199247A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114488693A (zh) * | 2021-12-24 | 2022-05-13 | 苏州理硕科技有限公司 | 聚合物、含有此聚合物的光刻胶及其应用 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7119997B2 (ja) * | 2018-12-28 | 2022-08-17 | 信越化学工業株式会社 | 感光性樹脂組成物、積層体、及びパターン形成方法 |
TW202208511A (zh) * | 2020-08-27 | 2022-03-01 | 日商富士軟片股份有限公司 | 硬化物的製造方法、樹脂組成物、顯影液、積層體的製造方法及半導體器件的製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6951682B1 (en) * | 1998-12-01 | 2005-10-04 | Syntrix Biochip, Inc. | Porous coatings bearing ligand arrays and use thereof |
JP3353292B2 (ja) * | 1999-03-29 | 2002-12-03 | 日本電気株式会社 | 化学増幅系レジスト |
EP1636648B1 (en) * | 2003-06-05 | 2015-08-12 | FujiFilm Electronic Materials USA, Inc. | Novel positive photosensitive resin compositions |
CN102428121B (zh) * | 2009-03-10 | 2014-05-28 | 日产化学工业株式会社 | 聚酰亚胺前体、聚酰亚胺及液晶取向剂 |
-
2018
- 2018-04-26 WO PCT/JP2018/017021 patent/WO2018199247A1/ja active Application Filing
- 2018-04-26 JP JP2019514629A patent/JP6733813B2/ja active Active
- 2018-04-26 TW TW107114324A patent/TW201843526A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114488693A (zh) * | 2021-12-24 | 2022-05-13 | 苏州理硕科技有限公司 | 聚合物、含有此聚合物的光刻胶及其应用 |
Also Published As
Publication number | Publication date |
---|---|
JP6733813B2 (ja) | 2020-08-05 |
JPWO2018199247A1 (ja) | 2019-11-07 |
WO2018199247A1 (ja) | 2018-11-01 |
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