TW201841998A - 含矽膜形成用組成物、含矽膜、圖案形成方法及聚矽氧烷 - Google Patents

含矽膜形成用組成物、含矽膜、圖案形成方法及聚矽氧烷 Download PDF

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Publication number
TW201841998A
TW201841998A TW107106814A TW107106814A TW201841998A TW 201841998 A TW201841998 A TW 201841998A TW 107106814 A TW107106814 A TW 107106814A TW 107106814 A TW107106814 A TW 107106814A TW 201841998 A TW201841998 A TW 201841998A
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TW
Taiwan
Prior art keywords
group
ruthenium
containing film
forming
carbon atoms
Prior art date
Application number
TW107106814A
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English (en)
Chinese (zh)
Inventor
大坪裕介
栗田俊輔
Original Assignee
日商Ｊｓｒ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｊｓｒ股份有限公司 filed Critical 日商Ｊｓｒ股份有限公司
Publication of TW201841998A publication Critical patent/TW201841998A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
TW107106814A 2017-03-02 2018-03-01 含矽膜形成用組成物、含矽膜、圖案形成方法及聚矽氧烷 TW201841998A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017039801 2017-03-02
JP2017-039801 2017-03-02

Publications (1)

Publication Number Publication Date
TW201841998A true TW201841998A (zh) 2018-12-01

Family

ID=63370038

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107106814A TW201841998A (zh) 2017-03-02 2018-03-01 含矽膜形成用組成物、含矽膜、圖案形成方法及聚矽氧烷

Country Status (2)

Country Link
TW (1) TW201841998A (fr)
WO (1) WO2018159356A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11914295B2 (en) 2018-11-21 2024-02-27 Shin-Etsu Chemical Co., Ltd. Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03206461A (ja) * 1990-01-09 1991-09-09 Fuji Photo Film Co Ltd 感光性組成物
GB9124422D0 (en) * 1991-11-14 1992-01-08 Dow Corning Radiation curable compositions
JP4232276B2 (ja) * 1999-05-26 2009-03-04 Ｊｓｒ株式会社 加水分解性シラン化合物およびその製造方法
CN101990551B (zh) * 2008-03-04 2012-10-03 陶氏康宁公司 倍半硅氧烷树脂
JP5237743B2 (ja) * 2008-10-02 2013-07-17 東京応化工業株式会社 レジスト下層膜形成用組成物
WO2012114864A1 (fr) * 2011-02-24 2012-08-30 日産化学工業株式会社 Composé silane et composition pour la formation d'une monocouche ou d'une multicouche à l'aide de celui-ci
US9290623B2 (en) * 2012-12-19 2016-03-22 Nissan Chemical Industries, Ltd. Composition for forming silicon-containing resist underlayer film having cyclic diester group
WO2016111210A1 (fr) * 2015-01-09 2016-07-14 Jsr株式会社 Composition pour former un film contenant du silicium et procédé de formation de motif utilisant ladite composition
JP6455160B2 (ja) * 2015-01-14 2019-01-23 Jsr株式会社 硬化膜形成用感放射線性組成物、硬化膜、表示素子及び硬化膜の形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11914295B2 (en) 2018-11-21 2024-02-27 Shin-Etsu Chemical Co., Ltd. Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process

Also Published As

Publication number Publication date
WO2018159356A1 (fr) 2018-09-07

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