TW201830169A - Method of transferring micro electronic device - Google Patents
Method of transferring micro electronic device Download PDFInfo
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- TW201830169A TW201830169A TW106145397A TW106145397A TW201830169A TW 201830169 A TW201830169 A TW 201830169A TW 106145397 A TW106145397 A TW 106145397A TW 106145397 A TW106145397 A TW 106145397A TW 201830169 A TW201830169 A TW 201830169A
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- adhesive
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- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000004377 microelectronic Methods 0.000 title claims abstract description 42
- 239000002313 adhesive film Substances 0.000 claims abstract description 239
- 239000012790 adhesive layer Substances 0.000 claims abstract description 214
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 235000012431 wafers Nutrition 0.000 claims description 189
- 239000000853 adhesive Substances 0.000 claims description 85
- 230000001070 adhesive effect Effects 0.000 claims description 84
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 39
- 229920000642 polymer Polymers 0.000 claims description 32
- 125000000524 functional group Chemical group 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 17
- 229920003002 synthetic resin Polymers 0.000 claims description 16
- 239000002952 polymeric resin Substances 0.000 claims description 15
- 239000000654 additive Substances 0.000 claims description 10
- 230000000996 additive effect Effects 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 125000001153 fluoro group Chemical group F* 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 239000004971 Cross linker Substances 0.000 claims 1
- -1 polydimethylsiloxane Polymers 0.000 description 16
- 239000000178 monomer Substances 0.000 description 14
- 238000012546 transfer Methods 0.000 description 14
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- 229920000058 polyacrylate Polymers 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical group C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 3
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920003122 (meth)acrylate-based copolymer Polymers 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical compound NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- VZDDUFFXSBGRMP-UHFFFAOYSA-N 9h-fluoren-1-ylphosphane Chemical compound C12=CC=CC=C2CC2=C1C=CC=C2P VZDDUFFXSBGRMP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920012753 Ethylene Ionomers Polymers 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000005267 main chain polymer Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Abstract
Description
[相關申請案的交叉參考] 本申請案主張於2016年12月26日在韓國智慧財產局提出申請的韓國專利申請案第10-2016-0179493號的優先權，所述韓國專利申請案的全部揭露內容併入本案供參考。[Cross-Reference to Related Application] This application claims priority to Korean Patent Application No. 10-2016-0179493, filed on Dec. 26, 2016 in the Korean Intellectual Property Office. The disclosure is incorporated herein by reference.
本發明是有關於一種傳遞微電子裝置的方法。The present invention is directed to a method of delivering a microelectronic device.
發光二極體（light emitting diode，LED）是其中此裝置中所含有的材料會發光的裝置，並且將藉由使所結合半導體的電子與電洞複合而產生的能量轉換成光能且藉此發出光。目前，發光二極體廣泛地用作燈、顯示裝置及光源，且發光二極體的發展呈加速趨勢。A light emitting diode (LED) is a device in which a material contained in the device emits light, and converts energy generated by recombining electrons and holes of the combined semiconductor into light energy and thereby Light up. At present, light-emitting diodes are widely used as lamps, display devices, and light sources, and the development of light-emitting diodes is accelerating.
近來，已實施對使用微發光二極體（micro-LED）晶片的顯示裝置的開發以達成表現出高影像品質的可撓性顯示器。已開發出微發光二極體晶片的傳遞技術及傳遞方法。舉例而言，美國專利申請公開案第2013-0210194號揭露一種使用靜電傳遞頭（electrostatic transfer head）自晶圓拾取微裝置的一部分的方法，在所述靜電傳遞頭中形成有電極使得對由矽材料製成的頭部施加電壓。然而，根據此種方法，不僅難以在面板生產完成之後偵測有缺陷的畫素，且亦存在面板大小的可擴展性（expandability）低的缺點。此外，亦存在為了防止發光二極體被靜電損壞而需要複雜的發光二極體預處理製程的限制。此外，亦已知一種利用使用彈性聚合物材料（例如聚二甲基矽氧烷（polydimethylsiloxane，PDMS））或類似材料生產的頭來拾取並傳遞微單元發光二極體晶片的方法。然而，存在需要單獨的黏合劑層且需要單獨的製程或類似製程來在傳遞製程期間連續地維持黏合力的限制。Recently, development of display devices using micro-light-emitting diode (micro-LED) wafers has been implemented to achieve flexible displays that exhibit high image quality. Transfer techniques and transfer methods for micro-light emitting diode wafers have been developed. For example, US Patent Application Publication No. 2013-0210194 discloses a method of picking up a portion of a microdevice from a wafer using an electrostatic transfer head in which an electrode is formed such that A voltage is applied to the head made of material. However, according to this method, it is not only difficult to detect a defective pixel after the panel production is completed, but also has a disadvantage that the panel size has low expandability. In addition, there is also a limitation in that a complicated light-emitting diode pretreatment process is required in order to prevent the light-emitting diode from being damaged by static electricity. Further, a method of picking up and transferring a micro-cell light-emitting diode wafer using a head produced using an elastic polymer material such as polydimethylsiloxane (PDMS) or the like is also known. However, there is a need for a separate layer of adhesive and a separate process or similar process is required to continuously maintain the limit of adhesion during the transfer process.
關於拾取並傳遞眾所習知的微發光二極體晶片的方法，存在發光二極體因靜電而被損壞的可能性，無法充分確保傳遞效率，或需要昂貴的加工裝置，且因此難以確保大規模的生產率。Regarding the method of picking up and transferring a conventional micro-light-emitting diode wafer, there is a possibility that the light-emitting diode is damaged by static electricity, the transfer efficiency cannot be sufficiently ensured, or an expensive processing apparatus is required, and thus it is difficult to ensure a large The productivity of scale.
[先前技術文獻] [專利文獻] （專利文獻1）美國專利申請公開案第2013-0210194號 （專利文獻2）韓國專利申請公開案第2009-0098563號 （專利文獻3）韓國專利申請公開案第2005-0062886號 （專利文獻4）日本專利申請公開案第2006-0048393號[Prior Art Document] [Patent Document 1] US Patent Application Publication No. 2013-0210194 (Patent Document 2) Korean Patent Application Publication No. 2009-0098563 (Patent Document 3) Korean Patent Application Publication No. 2005-0062886 (Patent Document 4) Japanese Patent Application Publication No. 2006-0048393
[技術問題] 本發明的一個目的是提供一種傳遞微電子裝置的方法，所述方法能夠更有效地選擇並傳遞微型發光二極體晶片而無需添加價格高的設備或複雜的製程，且能夠防止靜電或異物等損壞發光二極體裝置。[Technical Problem] An object of the present invention is to provide a method of transferring a microelectronic device capable of more efficiently selecting and transmitting a micro light emitting diode wafer without adding a expensive device or a complicated process, and capable of preventing Electrostatic or foreign matter damages the light-emitting diode device.
[技術解決方案] 在本揭露中，提供一種傳遞微電子裝置的方法，所述方法包括以下步驟：將形成於晶圓的一個表面上的多個元件晶片傳遞至第一黏合劑膜的黏合劑層，所述第一黏合劑膜包括透光基板及形成於所述透光基板上的黏合劑層；藉由所述第一黏合劑膜的透光基板對所述黏合劑層的另一表面進行選擇性曝光，所述多個元件晶片被傳遞至所述黏合劑層的另一表面；以及藉由使所述第一黏合劑膜接觸第二黏合劑膜的黏合劑層對所述第一黏合劑膜上的所述多個元件晶片進行選擇性地傳遞，所述第二黏合劑膜包括透光基板以及形成於所述透光基板上的黏合劑層，其中所述第一黏合劑膜的黏合劑層的未曝光部分對所述元件晶片的黏合力大於所述第二黏合劑膜的黏合劑層對所述元件晶片的黏合力，而所述第一黏合劑膜的黏合劑層的被曝光部分對所述元件晶片的黏合力小於所述第二黏合劑膜的黏合劑層對所述元件晶片的黏合力。[Technical Solution] In the present disclosure, there is provided a method of transferring a microelectronic device, the method comprising the steps of: transferring a plurality of component wafers formed on one surface of a wafer to a binder of a first adhesive film a first adhesive film comprising a light transmissive substrate and an adhesive layer formed on the transparent substrate; and another surface of the adhesive layer by the transparent substrate of the first adhesive film Selectively exposing, the plurality of component wafers being transferred to the other surface of the adhesive layer; and the first layer by contacting the first adhesive film with the adhesive layer of the second adhesive film The plurality of component wafers on the adhesive film are selectively transferred, the second adhesive film comprising a light transmissive substrate and an adhesive layer formed on the light transmissive substrate, wherein the first adhesive film The adhesive portion of the unexposed portion of the adhesive layer to the component wafer is greater than the adhesive force of the adhesive layer of the second adhesive film to the component wafer, and the adhesive layer of the first adhesive film The exposed portion is to the component Bonding force of the adhesive sheet is less than the force of the second adhesive layer of the adhesive film element wafer.
所述元件晶片可為具有5微米至300微米的大小的微發光二極體晶片。The component wafer may be a micro-emitting diode wafer having a size of 5 micrometers to 300 micrometers.
所述大小可被定義為所述微發光二極體晶片的最大直徑。The size can be defined as the largest diameter of the micro-light emitting diode wafer.
所述第一黏合劑膜的所述黏合劑層的所述未曝光部分對所述元件晶片的所述黏合力與所述第二黏合劑膜的所述黏合劑層對所述元件晶片的所述黏合力之間的差值可為5克力/25毫米或大於5克力/25毫米。The adhesive force of the unexposed portion of the adhesive layer of the first adhesive film to the component wafer and the adhesive layer of the second adhesive film to the component wafer The difference between the adhesive forces can be 5 grams force / 25 millimeters or greater than 5 grams force / 25 millimeters.
所述第一黏合劑膜的所述黏合劑層的所述被曝光部分對所述元件晶片的所述黏合力與所述第二黏合劑膜的所述黏合劑層對所述元件晶片的所述黏合力之間的差值可為5克力/25毫米或大於5克力/25毫米。The adhesive force of the exposed portion of the adhesive layer of the first adhesive film to the component wafer and the adhesive layer of the second adhesive film to the component wafer The difference between the adhesive forces can be 5 grams force / 25 millimeters or greater than 5 grams force / 25 millimeters.
更具體而言，所述第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力可為5克力/25毫米至800克力/25毫米，所述第二黏合劑膜的黏合劑層對元件晶片的黏合力可為5克力/25毫米至800克力/25毫米，且所述第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力與所述第二黏合劑膜的黏合劑層對元件晶片的黏合力之間的差值可為5克力/25毫米或大於5克力/25毫米。More specifically, the adhesive force of the unexposed portion of the adhesive layer of the first adhesive film to the component wafer may be 5 gram force / 25 mm to 800 gram force / 25 mm, the second adhesive film The adhesion of the adhesive layer to the component wafer may be 5 gram force / 25 mm to 800 gram force / 25 mm, and the adhesive force of the exposed portion of the adhesive layer of the first adhesive film to the component wafer is The difference between the adhesive layer of the second adhesive film and the adhesive force of the component wafer may be 5 gram force / 25 mm or more than 5 gram force / 25 mm.
此外，所述第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力可為1克力/25毫米至100克力/25毫米。Further, the exposed portion of the adhesive layer of the first adhesive film may have a bonding force to the element wafer of 1 gram force / 25 mm to 100 gram force / 25 mm.
所述藉由所述第一黏合劑膜的透光基板對所傳遞的所述多個元件晶片進行選擇性曝光的步驟可使用形成有大小為5微米至300微米的精細圖案的光罩。The step of selectively exposing the transferred plurality of element wafers by the light transmissive substrate of the first adhesive film may use a photomask formed with a fine pattern having a size of 5 micrometers to 300 micrometers.
所述藉由所述第一黏合劑膜的透光基板對所述多個元件晶片被傳遞至的黏合劑層的另一表面進行選擇性曝光的步驟可包括：利用紫外射線在10毫焦/平方公分至10,000毫焦/平方公分的照射強度下照射所述多個元件晶片被傳遞至的黏合劑層的另一表面的步驟。The step of selectively exposing the other surface of the adhesive layer to which the plurality of element wafers are transferred by the transparent substrate of the first adhesive film may include: using ultraviolet rays at 10 mJ/ The step of illuminating the other surface of the adhesive layer to which the plurality of element wafers are transferred is irradiated with an intensity of square centimeters to 10,000 mJ/cm 2 .
所述透光基板可為在300奈米至600奈米的波長中透射率為50%或大於50%的聚合物樹脂層。The light transmissive substrate may be a polymer resin layer having a transmittance of 50% or more at a wavelength of 300 nm to 600 nm.
所述第一黏合劑膜的黏合劑層及所述第二黏合劑膜的黏合劑層中的每一者可包含黏合黏結劑（adhesive binder）；交聯劑；以及光起始劑。Each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film may include an adhesive binder; a crosslinking agent; and a photoinitiator.
所述第一黏合劑膜的黏合劑層及所述第二黏合劑膜的黏合劑層中的每一者可更包含聚合物添加劑，所述聚合物添加劑包括選自由以下組成的群組的至少一種聚合物：含有(甲基)丙烯酸酯系官能基及非極性官能基的聚合物、含有至少一個氟的(甲基)丙烯酸酯系聚合物、以及含有反應性官能基的矽酮改質(甲基)丙烯酸酯系聚合物。Each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film may further comprise a polymer additive, the polymer additive comprising at least one selected from the group consisting of A polymer: a polymer containing a (meth) acrylate functional group and a nonpolar functional group, a (meth) acrylate polymer containing at least one fluorine, and an fluorenone modification containing a reactive functional group ( Methyl) acrylate-based polymer.
所述第一黏合劑膜及所述第二黏合劑膜中的每一者可更包括透光載體基板，所述透光載體基板接觸所述透光基板的一個表面。Each of the first adhesive film and the second adhesive film may further include a light transmissive carrier substrate that contacts one surface of the light transmissive substrate.
所述傳遞微電子裝置的方法可更包括：在所述藉由使第一黏合劑膜接觸包括透光基板及形成於透光基板上的黏合劑層的第二黏合劑膜的黏合劑層對第一黏合劑膜上的所述多個元件晶片進行選擇性傳遞的步驟之前，藉由使用光罩將紫外射線照射透過第二黏合劑膜的透光基板對第二黏合劑膜的黏合劑層進行選擇性曝光的步驟，所述光罩具有被選擇性曝光的第一黏合劑膜的曝光圖案的倒像（reverse image）。The method of transferring a microelectronic device may further include: bonding the first adhesive film to the adhesive layer of the second adhesive film comprising the light transmissive substrate and the adhesive layer formed on the light transmissive substrate Before the step of selectively transferring the plurality of element wafers on the first adhesive film, the adhesive layer of the second adhesive film is irradiated by ultraviolet rays through the transparent film of the second adhesive film by using the photomask The step of selectively exposing the photomask has a reverse image of the exposure pattern of the first adhesive film that is selectively exposed.
被選擇性曝光的第二黏合劑膜的黏合劑層對元件晶片的黏合力可低於第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力。The adhesive layer of the selectively exposed second adhesive film may have a lower adhesion to the component wafer than the unexposed portion of the adhesive layer of the first adhesive film to the component wafer.
所述傳遞微電子裝置的方法可更包括：將被選擇性地傳遞至所述第二黏合劑膜的黏合劑層的元件晶片傳遞至印刷電路板的步驟。The method of transferring a microelectronic device may further include the step of transferring an element wafer selectively transferred to an adhesive layer of the second adhesive film to a printed circuit board.
所述將被選擇性地傳遞至所述第二黏合劑膜的黏合劑層的元件晶片傳遞至印刷電路板的步驟可更包括：在被選擇性地傳遞至第二黏合劑膜的黏合劑層的所述元件晶片與所述印刷電路板彼此接觸的同時，藉由所述第二黏合劑膜的透光基板對黏合劑層的另一表面進行曝光的步驟，被選擇性傳遞的所述元件晶片結合至所述黏合劑層的另一表面。The step of transferring the component wafer to be selectively transferred to the adhesive layer of the second adhesive film to the printed circuit board may further include: bonding the adhesive layer selectively transferred to the second adhesive film The component wafer and the printed circuit board are in contact with each other, and the component is selectively transferred by the step of exposing the other surface of the adhesive layer by the transparent substrate of the second adhesive film The wafer is bonded to the other surface of the adhesive layer.
被選擇性曝光的第二黏合劑膜的黏合劑層對元件晶片的黏合力可低於所述第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力。The adhesive layer of the selectively exposed second adhesive film may have a lower adhesion to the component wafer than the unexposed portion of the adhesive layer of the first adhesive film to the component wafer.
所述傳遞微電子裝置的方法可更包括：將被選擇性地傳遞至所述第二黏合劑膜的黏合劑層的元件晶片傳遞至印刷電路板的步驟。The method of transferring a microelectronic device may further include the step of transferring an element wafer selectively transferred to an adhesive layer of the second adhesive film to a printed circuit board.
所述將被選擇性地傳遞至所述第二黏合劑膜的黏合劑層的元件晶片傳遞至印刷電路板的步驟可更包括：在被選擇性地傳遞至第二黏合劑膜的黏合劑層的所述元件晶片與所述印刷電路板彼此接觸的同時，藉由所述第二黏合劑膜的透光基板對黏合劑層的另一表面進行曝光的步驟，被選擇性傳遞的所述元件晶片結合至所述黏合劑層的另一表面。The step of transferring the component wafer to be selectively transferred to the adhesive layer of the second adhesive film to the printed circuit board may further include: bonding the adhesive layer selectively transferred to the second adhesive film The component wafer and the printed circuit board are in contact with each other, and the component is selectively transferred by the step of exposing the other surface of the adhesive layer by the transparent substrate of the second adhesive film The wafer is bonded to the other surface of the adhesive layer.
可在與被選擇性地傳遞至所述第二黏合劑膜的黏合劑層的元件晶片接觸的印刷電路板的一個表面上形成各向異性導電膜。An anisotropic conductive film may be formed on one surface of a printed circuit board that is in contact with the element wafer selectively transferred to the adhesive layer of the second adhesive film.
[有利效果] 根據本發明，可提供一種傳遞微電子裝置的方法，所述方法能夠更有效地選擇並傳遞微型發光二極體晶片而無需添加價格高的設備或複雜的製程，且能夠防止靜電或異物等損壞發光二極體裝置。[Advantageous Effects] According to the present invention, it is possible to provide a method of transferring a microelectronic device capable of more efficiently selecting and transferring a micro-light-emitting diode wafer without adding a high-priced device or a complicated process, and capable of preventing static electricity Or foreign matter, etc. damage the light-emitting diode device.
以下，將更詳細地闡述根據本發明具體實施例的傳遞微電子裝置的方法。然而，給出對以下實施例的說明僅用於說明性目的，且本發明的具體細節並非旨在受該些實施例限制。Hereinafter, a method of transferring a microelectronic device according to an embodiment of the present invention will be explained in more detail. However, the description of the following examples is given for illustrative purposes only, and the specific details of the invention are not intended to be limited by the embodiments.
根據本發明的一個實施例，可提供一種傳遞微電子裝置的方法，所述方法包括以下步驟：將形成於晶圓的一個表面上的多個元件晶片傳遞至第一黏合劑膜的黏合劑層，所述第一黏合劑膜包括透光基板及形成於所述透光基板上的黏合劑層；藉由所述第一黏合劑膜的透光基板對所述黏合劑層的另一表面進行選擇性曝光，所述多個元件晶片被傳遞至所述黏合劑層的另一表面；以及藉由使所述第一黏合劑膜接觸第二黏合劑膜的黏合劑層對所述第一黏合劑膜上的所述多個元件晶片進行選擇性地傳遞，所述第二黏合劑膜包括透光基板以及形成於所述透光基板上的黏合劑層，其中所述第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力大於所述第二黏合劑膜的黏合劑層對元件晶片的黏合力，而所述第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力小於所述第二黏合劑膜的黏合劑層對元件晶片的黏合力。According to an embodiment of the present invention, there is provided a method of transferring a microelectronic device, the method comprising the steps of: transferring a plurality of component wafers formed on one surface of a wafer to an adhesive layer of a first adhesive film The first adhesive film includes a transparent substrate and an adhesive layer formed on the transparent substrate; and the other surface of the adhesive layer is performed by the transparent substrate of the first adhesive film Selectively exposing, the plurality of component wafers being transferred to the other surface of the adhesive layer; and the first bonding by contacting the first adhesive film with the adhesive layer of the second adhesive film The plurality of component wafers on the film are selectively transferred, the second adhesive film comprising a light transmissive substrate and an adhesive layer formed on the light transmissive substrate, wherein the first adhesive film The adhesive portion of the unexposed portion of the adhesive layer to the component wafer is greater than the adhesive force of the adhesive layer of the second adhesive film to the component wafer, and the exposed portion of the adhesive layer of the first adhesive film is opposite to the component Wafer adhesion Second bonding force to the adhesive layer of adhesive film to the wafer element.
本發明人已發現了使用具有黏合劑層的黏合劑膜容易及有效地傳遞微電子裝置的方法，所述黏合劑層可藉由曝光量（light exposure）來控制其黏合力。The present inventors have discovered a method of easily and efficiently transferring a microelectronic device using an adhesive film having an adhesive layer which can control its adhesion by light exposure.
具體而言，將形成於晶圓的一個表面上的所述多個元件晶片傳遞至包括透光基板以及形成於所述基板上的黏合劑層的第一黏合劑膜的黏合劑層，且藉由第一黏合劑膜的透光基板對所述多個元件晶片被傳遞至的黏合劑層的另一表面進行選擇性曝光，以使得第一黏合劑層的黏合劑層的每一部分的黏合力可根據曝光圖案而變化。此外，使包括形成於透光基板上的黏合劑層的第二黏合劑膜的黏合劑層接觸第一黏合劑膜上的所述多個元件晶片的另一表面，藉此僅將根據黏合力的差值而選擇的元件晶片傳遞至第二黏合劑膜。Specifically, the plurality of component wafers formed on one surface of the wafer are transferred to an adhesive layer of the first adhesive film including the light-transmitting substrate and the adhesive layer formed on the substrate, and Selectively exposing the other surface of the adhesive layer to which the plurality of component wafers are transferred by the light transmissive substrate of the first adhesive film such that the adhesion of each portion of the adhesive layer of the first adhesive layer It can vary depending on the exposure pattern. Further, the adhesive layer of the second adhesive film including the adhesive layer formed on the light-transmitting substrate is brought into contact with the other surface of the plurality of element wafers on the first adhesive film, whereby only the adhesive force is used. The selected component wafer is transferred to the second adhesive film.
本文中，形成於晶圓的一個表面上的所述多個元件晶片被傳遞至第一黏合劑膜的黏合劑層，且當對與所述多個元件晶片中的欲傳遞的元件晶片接觸的第一黏合劑膜的黏合劑層的一部分進行選擇性曝光時，被曝光的所述第一黏合劑膜的黏合劑層的所述部分對元件晶片的黏合力變得更低。Herein, the plurality of element wafers formed on one surface of the wafer are transferred to the adhesive layer of the first adhesive film, and when in contact with the element wafer to be transferred in the plurality of element wafers When a part of the adhesive layer of the first adhesive film is selectively exposed, the adhesive force of the portion of the adhesive layer of the exposed first adhesive film to the element wafer becomes lower.
此外，當第二黏合劑膜的黏合劑層接觸第一黏合劑膜上的所述多個元件晶片的另一表面時，第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力小於第二黏合劑膜的黏合劑層對元件晶片的黏合力，且因此，可僅將已與被選擇性曝光的第一黏合劑的黏合劑層接觸的元件晶片傳遞至第二黏合劑膜。In addition, when the adhesive layer of the second adhesive film contacts the other surface of the plurality of component wafers on the first adhesive film, the exposed portion of the adhesive layer of the first adhesive film adheres to the component wafer The force is less than the adhesion of the adhesive layer of the second adhesive film to the component wafer, and therefore, only the component wafer that has been in contact with the adhesive layer of the selectively exposed first adhesive can be transferred to the second adhesive film .
同時，為了僅將已與被選擇性曝光的第一黏合劑接觸的元件晶片傳遞至第二黏合劑膜，第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力大於第二黏合劑膜的黏合劑層對元件晶片的黏合力，因而僅將已與被選擇性曝光的第一黏合劑接觸的元件晶片傳遞至第二黏合劑膜，且使得已與被選擇性曝光的第一黏合劑接觸的元件晶片能夠保留在第一黏合劑膜中。Meanwhile, in order to transfer only the component wafer that has been in contact with the selectively exposed first adhesive to the second adhesive film, the adhesive force of the unexposed portion of the adhesive layer of the first adhesive film to the component wafer is greater than the second The adhesive force of the adhesive layer of the adhesive film to the component wafer, and thus only the component wafer that has been in contact with the selectively exposed first adhesive is transferred to the second adhesive film, and has been selectively exposed An element wafer in contact with an adhesive can remain in the first adhesive film.
第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力與第二黏合劑膜的黏合劑層對元件晶片的黏合力之間的差值可根據所使用的元件晶片的類型及大小來變化。然而，為了有效及容易地傳遞元件晶片，第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力與第二黏合劑膜的黏合劑層對元件晶片的黏合力之間的差值可為5克力/25毫米或大於5克力/25毫米或者10克力/25毫米至50克力/25毫米。The difference between the adhesive force of the unexposed portion of the adhesive layer of the first adhesive film to the component wafer and the adhesive force of the adhesive layer of the second adhesive film to the component wafer may be depending on the type of the component wafer used and The size changes. However, in order to efficiently and easily transfer the component wafer, the difference between the adhesive force of the unexposed portion of the adhesive layer of the first adhesive film to the component wafer and the adhesive force of the adhesive layer of the second adhesive film to the component wafer The value can be 5 grams force / 25 millimeters or greater than 5 grams force / 25 millimeters or 10 grams force / 25 millimeters to 50 grams force / 25 millimeters.
當第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力與第二黏合劑膜的黏合劑層對元件晶片的黏合力之間的差值太小時，除欲被選擇性傳遞的元件晶片以外的元件晶片亦可被傳遞至第二黏合劑膜。When the difference between the adhesive force of the unexposed portion of the adhesive layer of the first adhesive film to the component wafer and the adhesive force of the adhesive layer of the second adhesive film to the component wafer is too small, in addition to being selectively transmitted The component wafer other than the component wafer can also be transferred to the second adhesive film.
第一黏合劑膜的黏合劑層的曝光部分對元件晶片的黏合力與第二黏合劑膜的黏合劑層對元件晶片的黏合力之間的差值亦可根據所使用的元件晶片的類型及大小來變化，且所述差值較佳地可為5克力/25毫米或大於5克力/25毫米或者10克力/25毫米至50克力/25毫米。The difference between the adhesive force of the exposed portion of the adhesive layer of the first adhesive film to the component wafer and the adhesive force of the adhesive layer of the second adhesive film to the component wafer may also be according to the type of the component wafer used and The size varies, and the difference may preferably be 5 grams force / 25 millimeters or greater than 5 grams force / 25 millimeters or 10 grams force / 25 millimeters to 50 grams force / 25 millimeters.
當第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力與第二黏合劑膜的黏合劑層對元件晶片的黏合力之間的差值太小時，欲被選擇性傳遞的元件晶片可不被傳遞至第二黏合劑膜。When the difference between the adhesive force of the exposed portion of the adhesive layer of the first adhesive film to the component wafer and the adhesive force of the adhesive layer of the second adhesive film to the component wafer is too small, to be selectively transferred The component wafer may not be transferred to the second adhesive film.
第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力、第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力及第二黏合劑膜的黏合劑層對元件晶片的黏合力中的每一者可依據元件晶片的類型及大小以及傳遞微電子裝置的方法的具體條件在處於滿足上述元件之間的黏合力差值的上述範圍內變化。The adhesive force of the unexposed portion of the adhesive layer of the first adhesive film to the device wafer, the adhesion of the exposed portion of the adhesive layer of the first adhesive film to the device wafer, and the adhesive layer of the second adhesive film Each of the adhesive forces of the component wafers may vary within the above range that satisfies the difference in adhesion between the above components depending on the type and size of the component wafers and the specific conditions of the method of transferring the microelectronic devices.
舉例而言，第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力可為50克力/25毫米至800克力/25毫米，且第二黏合劑膜的黏合劑層對元件晶片的黏合力可為50克力/25毫米至800克力/25毫米。本文中，如上所述，第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力大於第二黏合劑膜的黏合劑層對元件晶片的黏合力，且所述第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力與第二黏合劑膜的黏合劑層對元件晶片的黏合力之間的差值可為5克力/25毫米或大於5克力/25毫米。For example, the unexposed portion of the adhesive layer of the first adhesive film may have an adhesive force to the component wafer of 50 gram force / 25 mm to 800 gram force / 25 mm, and the adhesive layer of the second adhesive film layer The bonding force of the component wafer can be 50 gram force / 25 mm to 800 gram force / 25 mm. Herein, as described above, the adhesive force of the unexposed portion of the adhesive layer of the first adhesive film to the component wafer is greater than the adhesive force of the adhesive layer of the second adhesive film to the component wafer, and the first adhesive The difference between the adhesive force of the unexposed portion of the adhesive layer of the film to the component wafer and the adhesive force of the adhesive layer of the second adhesive film to the component wafer may be 5 gram force / 25 mm or more than 5 gram force / 25 mm.
另外，第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力可為1克力/25毫米至100克力/25毫米。In addition, the exposed portion of the adhesive layer of the first adhesive film may have a bonding force to the element wafer of 1 gram force / 25 mm to 100 gram force / 25 mm.
如本文中所界定，黏合力被界定為當寬度為25毫米的黏合劑樣本彎曲180°時施加的力（克力/25毫米）。As defined herein, the adhesion is defined as the force (gram force / 25 mm) applied when a 25 mm wide adhesive sample is bent 180°.
同時，所述傳遞微電子裝置的方法可使用在以下步驟中形成有精細圖案的光罩來達成具有5微米至300微米大小的節距：藉由第一黏合劑膜的透光基板對所述多個元件晶片被傳遞至的黏合劑層的另一表面進行選擇性曝光的步驟。因此，可對具有5微米至300微米的微小大小的元件晶片進行傳遞。Meanwhile, the method of transferring the microelectronic device may achieve a pitch having a size of 5 micrometers to 300 micrometers using a photomask formed with a fine pattern in the following steps: by the transparent substrate of the first adhesive film The step of selectively exposing the other surface of the adhesive layer to which the plurality of element wafers are transferred. Therefore, it is possible to transfer a small-sized element wafer having a size of 5 μm to 300 μm.
更具體而言，藉由第一黏合劑膜的透光基板對所傳遞的所述多個元件晶片進行選擇性曝光的步驟可使用形成有大小為5微米至300微米的精細圖案的光罩。More specifically, the step of selectively exposing the transferred plurality of element wafers by the light-transmitting substrate of the first adhesive film may use a photomask formed with a fine pattern having a size of 5 micrometers to 300 micrometers.
欲傳遞的元件晶片可為具有5微米至300微米大小的微發光二極體晶片。The component wafer to be transferred may be a micro-light emitting diode wafer having a size of 5 micrometers to 300 micrometers.
同時，在藉由第一黏合劑膜的透光基板對所傳遞的所述多個元件晶片進行選擇性曝光的步驟中，可藉由控制曝光的強度及時間來調節第一黏合劑膜的黏合劑層的黏合力。Meanwhile, in the step of selectively exposing the transferred plurality of element wafers by the transparent substrate of the first adhesive film, the adhesion of the first adhesive film can be adjusted by controlling the intensity and time of exposure. The adhesion of the agent layer.
具體而言，藉由第一黏合劑膜的透光基板對所述多個元件晶片被傳遞至的黏合劑層的另一表面進行選擇性曝光的步驟可包括：利用紫外射線在10毫焦/平方公分至10,000毫焦/平方公分的照射強度下照射所述多個元件晶片被傳遞至的黏合劑層的另一表面的步驟。Specifically, the step of selectively exposing the other surface of the adhesive layer to which the plurality of element wafers are transferred by the transparent substrate of the first adhesive film may include: using ultraviolet rays at 10 mJ/ The step of illuminating the other surface of the adhesive layer to which the plurality of element wafers are transferred is irradiated with an intensity of square centimeters to 10,000 mJ/cm 2 .
同時，當在傳遞微電子裝置的方法中第一黏合劑膜包括透光基板時，可對所述多個元件晶片被傳遞至的黏合劑層的另一表面進行選擇性曝光。Meanwhile, when the first adhesive film includes a light-transmitting substrate in the method of transferring the microelectronic device, the other surface of the adhesive layer to which the plurality of element wafers are transferred may be selectively exposed.
儘管透光基板的具體類型及其性質不受限制，然而為了有效地實施選擇性曝光，所述透光基板可為在300奈米至600奈米的波長中透射率為50%或大於50%的聚合物樹脂層。可用作透光基板的聚合物樹脂層的類型無特別限制，且舉例而言，所述聚合物樹脂層可為包含以下物質的聚合物樹脂層：聚酯（例如聚對苯二甲酸乙二酯（polyethylene terephthalate，PET））、纖維素（例如三乙醯基纖維素）、環烯烴系（共）聚合物、聚醯亞胺、苯乙烯丙烯腈共聚物（styrene acrylonitrile copolymer，SAN）、低密度聚乙烯、線狀聚乙烯、中密度聚乙烯、高密度聚乙烯、超低密度聚乙烯、聚丙烯的無規共聚物、聚丙烯的嵌段共聚物、均聚聚丙烯、聚甲基戊烯（polymethylpentene）、乙烯-乙酸乙酯共聚物、乙烯-甲基丙烯酸共聚物、乙烯-甲基丙烯酸甲酯共聚物、乙烯-離聚物共聚物、乙烯-乙烯醇共聚物、聚丁烯、苯乙烯的共聚物、或其二或更多者的混合物等。Although the specific type of the light-transmitting substrate and its properties are not limited, in order to effectively perform selective exposure, the light-transmitting substrate may have a transmittance of 50% or more in a wavelength of 300 nm to 600 nm. Polymer resin layer. The type of the polymer resin layer which can be used as the light-transmitting substrate is not particularly limited, and for example, the polymer resin layer may be a polymer resin layer containing a polyester (for example, polyethylene terephthalate) Polyester terephthalate (PET), cellulose (eg, triethyl fluorenyl cellulose), cycloolefin (co)polymer, polythenimine, styrene acrylonitrile copolymer (SAN), low Density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer of polypropylene, block copolymer of polypropylene, homopolypropylene, polymethyl pentane Polymethylpentene, ethylene-ethyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer, ethylene-ionomer copolymer, ethylene-vinyl alcohol copolymer, polybutene, a copolymer of styrene, a mixture of two or more thereof, and the like.
同時，第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者可包含黏合黏結劑；交聯劑；以及光起始劑。Meanwhile, each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film may include an adhesive bonding agent; a crosslinking agent; and a photoinitiator.
作為黏合黏結劑，可使用已知用於形成切割膜的黏合劑層的聚合物樹脂，而無特別限制。舉例而言，可使用其中預定反應性官能基經取代的聚合物樹脂或含有反應性官能基的主鏈聚合物樹脂。As the adhesive bonding agent, a polymer resin known to be used for forming a binder layer of a dicing film can be used without particular limitation. For example, a polymer resin in which a predetermined reactive functional group is substituted or a main chain polymer resin containing a reactive functional group can be used.
具體而言，黏合黏結劑可包括其中選自由羥基、異氰酸酯基、乙烯基及(甲基)丙烯酸酯基組成的群組的至少一個官能基至少經單取代或未經取代的(甲基)丙烯酸酯系聚合物或(甲基)丙烯酸酯系共聚物。Specifically, the adhesive bonding agent may include (meth)acrylic acid in which at least one functional group selected from the group consisting of a hydroxyl group, an isocyanate group, a vinyl group, and a (meth) acrylate group is at least monosubstituted or unsubstituted An ester polymer or a (meth) acrylate copolymer.
另外，黏合黏結劑可為藉由向(甲基)丙烯酸酯樹脂的側鏈中添加具有碳-碳雙鍵的丙烯酸酯而得到的固有黏合黏結劑。舉例而言，作為固有黏合黏結劑，可使用藉由向(甲基)丙烯酸酯系樹脂的主鏈中添加1重量%至45重量%的量的(甲基)丙烯酸酯官能基作為側鏈而得到的聚合物樹脂。Further, the adhesive bonding agent may be an intrinsic bonding adhesive obtained by adding an acrylate having a carbon-carbon double bond to a side chain of a (meth) acrylate resin. For example, as the intrinsic binder, a (meth) acrylate functional group may be used as a side chain by adding an amount of 1% by weight to 45% by weight to the main chain of the (meth) acrylate-based resin. The resulting polymer resin.
黏合黏結劑可包括重量平均分子量為100,000至1,500,000的聚合物樹脂。The adhesive binder may include a polymer resin having a weight average molecular weight of from 100,000 to 1,500,000.
具體而言，其中選自由羥基、異氰酸酯基、乙烯基及(甲基)丙烯酸酯基組成的群組的至少一個官能基至少經單取代或未經取代的(甲基)丙烯酸酯系聚合物或(甲基)丙烯酸酯系共聚物可具有100,000至1,500,000的重量平均分子量。Specifically, at least one functional group selected from the group consisting of a hydroxyl group, an isocyanate group, a vinyl group, and a (meth) acrylate group is at least a mono- or unsubstituted (meth) acrylate-based polymer or The (meth) acrylate-based copolymer may have a weight average molecular weight of from 100,000 to 1,500,000.
在本揭露中，(甲基)丙烯酸酯是指丙烯酸酯（acrylate）及(甲基)丙烯酸酯（(meth)acrylate）二者。In the present disclosure, (meth) acrylate refers to both acrylate and (meth) acrylate.
(甲基)丙烯酸酯（(meth)acrylate）系聚合物或(甲基)丙烯酸酯系共聚物可為例如(甲基)丙烯酸酯（(meth)acrylic acid ester）系單體與含可交聯官能基的單體的聚合物或共聚物。The (meth)acrylate polymer or the (meth)acrylate copolymer may be, for example, a (meth)acrylic acid ester monomer and crosslinkable A polymer or copolymer of a functional group of monomers.
本文中，(甲基)丙烯酸酯系單體的實例包括烷基(甲基)丙烯酸酯，且更具體而言包括以下中的任一者作為含有具有1至12個碳原子的烷基的單體：(甲基)丙烯酸戊酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸十二烷基酯或(甲基)丙烯酸癸酯、或者其二或更多者的混合物。當使用具有碳數大的烷基的單體時，最終共聚物的玻璃轉化溫度降低，且因此，可根據所期望的玻璃轉化溫度來選擇合適的單體。Here, examples of the (meth) acrylate type monomer include an alkyl (meth) acrylate, and more specifically, any of the following as a single group having an alkyl group having 1 to 12 carbon atoms Body: amyl (meth)acrylate, n-butyl (meth)acrylate, ethyl (meth)acrylate, methyl (meth)acrylate, hexyl (meth)acrylate, n-octyl (meth)acrylate Ester, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, dodecyl (meth)acrylate or decyl (meth)acrylate, or two or more thereof mixture. When a monomer having an alkyl group having a large carbon number is used, the glass transition temperature of the final copolymer is lowered, and therefore, a suitable monomer can be selected depending on the desired glass transition temperature.
此外，含可交聯官能基的單體的實例包括含羥基的單體、含羧基的單體或含氮的單體、或者其二或更多者的混合物中的任一者。本文中，含羥基的單體的實例包括2-羥乙基(甲基)丙烯酸酯或2-羥丙基(甲基)丙烯酸酯，含羧基的單體的實例包括(甲基)丙烯酸及類似單體，且含氮的單體的實例包括(甲基)丙烯腈、N-乙烯基吡咯啶酮或N-乙烯基己內醯胺，但並非僅限於此。(甲基)丙烯酸酯系樹脂可更包括含碳-碳雙鍵的低分子量化合物（例如乙酸乙烯酯、苯乙烯或丙烯腈），以改善其他功能（例如相容性）。Further, examples of the monomer having a crosslinkable functional group include any one of a hydroxyl group-containing monomer, a carboxyl group-containing monomer or a nitrogen-containing monomer, or a mixture of two or more thereof. Herein, examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate or 2-hydroxypropyl (meth) acrylate, and examples of the carboxyl group-containing monomer include (meth)acrylic acid and the like. Examples of the monomer, and the nitrogen-containing monomer include (meth)acrylonitrile, N-vinylpyrrolidone or N-vinylcaprolactam, but are not limited thereto. The (meth) acrylate-based resin may further include a low molecular weight compound containing a carbon-carbon double bond such as vinyl acetate, styrene or acrylonitrile to improve other functions such as compatibility.
另外，其中向(甲基)丙烯酸酯樹脂的側鏈中添加具有碳-碳雙鍵的丙烯酸酯的固有黏合黏結劑可具有100,000至1,500,000的重量平均分子量。Further, the intrinsic binder which adds an acrylate having a carbon-carbon double bond to the side chain of the (meth) acrylate resin may have a weight average molecular weight of 100,000 to 1,500,000.
當包含於黏合黏結劑中的聚合物樹脂的重量平均分子量太低時，第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者的塗佈性質或內聚力（cohesive force）可能劣化，且當黏合劑層被剝離時，殘餘物可能殘留在黏附體上，或者黏合劑層可被破壞。When the weight average molecular weight of the polymer resin contained in the adhesive binder is too low, the coating property or cohesion of each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film ( The cohesive force may deteriorate, and when the adhesive layer is peeled off, the residue may remain on the adherend, or the adhesive layer may be destroyed.
此外，當包含於黏合黏結劑中的聚合物樹脂的重量平均分子量太高時，可能無法對第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者進行充分地紫外線固化，且因此黏合劑層力或剝離力在選擇性曝光期間可能無法充分降低，因而使傳遞成功率（yield）劣化。Further, when the weight average molecular weight of the polymer resin contained in the binder is too high, it may not be sufficient for each of the binder layer of the first binder film and the binder layer of the second binder film. The ultraviolet light is cured, and thus the adhesive layer force or peeling force may not be sufficiently lowered during selective exposure, thereby deteriorating the transfer yield.
包含於第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者中的光起始劑的具體實例不受限制，且可使用此項技術中眾所習知的光起始劑而無特別限制。舉例而言，作為光起始劑，可使用安息香及其烷基醚、苯乙酮、蒽醌、噻噸酮、縮酮、二苯甲酮、α-胺基苯乙酮、醯基氧化膦、肟酯、或者其二或更多者的混合物。Specific examples of the photoinitiator included in each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film are not limited and can be used as known in the art. The photoinitiator is not particularly limited. For example, as a photoinitiator, benzoin and its alkyl ether, acetophenone, anthraquinone, thioxanthone, ketal, benzophenone, α-aminoacetophenone, fluorenylphosphine oxide can be used. , oxime ester, or a mixture of two or more thereof.
可藉由考量所生產的黏合劑層的物理性質及特性以及所使用的黏合黏結劑的類型及特性來確定光起始劑的量。舉例而言，以100重量份的黏合黏結劑計，第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者可含有0.01重量份至8重量份的量的光起始劑。The amount of photoinitiator can be determined by considering the physical properties and characteristics of the adhesive layer produced and the type and characteristics of the adhesive used. For example, each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film may contain 0.01 to 8 parts by weight based on 100 parts by weight of the adhesive. Photoinitiator.
第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者可包含固化劑。當利用第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者對基底膜進行塗佈時，固化劑可在室溫下或在30℃至50℃的溫度下與黏合黏結劑的反應性基團發生反應以形成交聯。另外，包含於固化劑中的預定反應劑（rector）可保持處於未反應狀態，且可在拾取之前藉由紫外線照射來實施額外的交聯以減小黏合劑層的黏合力。Each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film may contain a curing agent. When the base film is coated with each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film, the curing agent may be at room temperature or at a temperature of 30 ° C to 50 ° C The reactive groups under the binder are reacted to form a crosslink. In addition, the predetermined reactant contained in the curing agent can remain in an unreacted state, and additional crosslinking can be performed by ultraviolet irradiation before pickup to reduce the adhesion of the adhesive layer.
固化劑可包括選自由異氰酸酯系化合物、氮丙啶（aziridine）系化合物、環氧系化合物及金屬螯合物系化合物組成的群組的至少一者。The curing agent may include at least one selected from the group consisting of an isocyanate compound, an aziridine compound, an epoxy compound, and a metal chelate compound.
可藉由考量所生產的黏合劑層的物理性質及特性以及所使用的黏合黏結劑的類型及特性來確定固化劑的量。舉例而言，以100重量份的黏合黏結劑計，第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者可含有0.1重量份至30重量份的量的固化劑。The amount of curing agent can be determined by considering the physical properties and characteristics of the adhesive layer produced and the type and characteristics of the adhesive used. For example, each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film may contain 0.1 to 30 parts by weight based on 100 parts by weight of the adhesive. Hardener.
同時，第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者可更包含紫外線可固化化合物。Meanwhile, each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film may further comprise an ultraviolet curable compound.
紫外線可固化化合物的類型無特別限制，且舉例而言，可使用重量平均分子量為約500至300,000的多官能化合物（例如，多官能胺基甲酸酯丙烯酸酯、多官能丙烯酸酯單體或寡聚物及類似物）。熟習此項技術者可根據預期用途容易地選擇適當的化合物。The type of the ultraviolet curable compound is not particularly limited, and for example, a polyfunctional compound having a weight average molecular weight of about 500 to 300,000 (for example, a polyfunctional urethane acrylate, a polyfunctional acrylate monomer or an oligo may be used). Polymers and analogs). Those skilled in the art will readily be able to select the appropriate compound for the intended use.
以100重量份的上述黏合黏結劑計，紫外線可固化化合物的量可為5重量份至400重量份、較佳為10重量份至200重量份。當紫外線可固化化合物的量少於5重量份時，在固化之後黏合力的減小不夠，因而可使拾取性質劣化，而當所述量超過400重量份時，存在在紫外線照射之前黏合力的內聚力可能不夠或者脫模膜或類似膜可能不易於被剝離的顧慮。The amount of the ultraviolet curable compound may be from 5 parts by weight to 400 parts by weight, preferably from 10 parts by weight to 200 parts by weight, per 100 parts by weight of the above-mentioned binder. When the amount of the ultraviolet curable compound is less than 5 parts by weight, the reduction in the adhesive force after curing is insufficient, and thus the pickup property may be deteriorated, and when the amount exceeds 400 parts by weight, there is adhesion before the ultraviolet irradiation. The cohesion may be insufficient or the release film or the like may not be easily peeled off.
同時，第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者可更包含聚合物添加劑，所述聚合物添加劑包括選自由以下組成的群組的至少一種聚合物：含有(甲基)丙烯酸酯系官能基及非極性官能基的聚合物、含有至少一個氟的(甲基)丙烯酸酯系聚合物以及含有反應性官能基的矽酮改質(甲基)丙烯酸酯系聚合物。Meanwhile, each of the adhesive layer of the first adhesive film and the adhesive layer of the second adhesive film may further comprise a polymer additive, the polymer additive comprising at least one polymerization selected from the group consisting of A polymer containing a (meth) acrylate functional group and a nonpolar functional group, a (meth) acrylate polymer containing at least one fluorine, and an fluorenone modified (methyl) containing a reactive functional group. Acrylate based polymer.
含有(甲基)丙烯酸酯系官能基及非極性官能基的聚合物、含有至少一個氟的(甲基)丙烯酸酯系聚合物以及含有反應性官能基的矽酮改質(甲基)丙烯酸酯系聚合物中的每一者與黏合劑層的表面上的黏合黏結劑更相容，且因此可易於混合，並且此外，存在於分子內的預定非極性部分被暴露至由此組成物製備的黏合劑層的上部，藉此賦予脫模性質及滑移性質。a polymer containing a (meth) acrylate functional group and a nonpolar functional group, a (meth) acrylate polymer containing at least one fluorine, and an fluorenone modified (meth) acrylate containing a reactive functional group Each of the polymers is more compatible with the adhesive bonding agent on the surface of the adhesive layer, and thus can be easily mixed, and further, a predetermined non-polar portion present in the molecule is exposed to the composition prepared therefrom. The upper portion of the adhesive layer, thereby imparting release properties and slip properties.
因此，聚合物添加劑可在非極性部分位於黏合劑層的表面上時在藉由與黏合黏結劑發生反應而使傳遞最小化的同時更有效地賦予脫模性質及滑移性質。Therefore, the polymer additive can more effectively impart release properties and slip properties while minimizing transfer by reacting with the adhesive binder while the non-polar portion is on the surface of the adhesive layer.
具體而言，以黏合黏結劑計，可以0.01%至4.5%或0.1%至2%的重量比來使用聚合物添加劑，且儘管使用相對少的量，然而由第一黏合劑膜的黏合劑層及第二黏合劑膜的黏合劑層中的每一者製備的切割膜的黏合劑層的剝離力可大大增加。Specifically, the polymer additive may be used in a weight ratio of 0.01% to 4.5% or 0.1% to 2%, based on the adhesive, and the adhesive layer of the first adhesive film may be used although a relatively small amount is used. The peeling force of the adhesive layer of the dicing film prepared by each of the adhesive layers of the second adhesive film can be greatly increased.
含有(甲基)丙烯酸酯系官能基及非極性官能基的聚合物的市售產品的實例包括畢克（BYK）0-350、BYK-352、BYK-354、BYK-355、BYK-356、BYK-358N、BYK-361N、BYK-380、BYK-392或BYK-394，但此聚合物添加劑的具體實例並非僅限於此。Examples of commercially available products of polymers containing (meth) acrylate functional groups and non-polar functional groups include BYK 0-350, BYK-352, BYK-354, BYK-355, BYK-356, BYK-358N, BYK-361N, BYK-380, BYK-392 or BYK-394, but specific examples of the polymer additive are not limited thereto.
含有至少一個氟的(甲基)丙烯酸酯系聚合物可包括其中具有1至10個碳原子的全氟烷基或具有1至10個碳原子的氟化烯基經取代的(甲基)丙烯酸酯系聚合物。The (meth) acrylate-based polymer containing at least one fluorine may include a perfluoroalkyl group having 1 to 10 carbon atoms therein or a fluorinated alkenyl group substituted with 1 to 10 carbon atoms (meth)acrylic acid Ester polymer.
含有至少一個氟的(甲基)丙烯酸酯系聚合物的市售產品的實例包括福傑特（Ftergent）222F（由尼歐斯公司（Neos）製造）、F470（由迪愛生公司（DIC）製造）、F489（由迪愛生公司製造）或V-8FM，但此聚合物添加劑的具體實例並非僅限於此。Examples of commercially available products containing at least one fluorine (meth) acrylate-based polymer include Ftergent 222F (manufactured by Neos) and F470 (manufactured by DIC) ), F489 (manufactured by Die Air Co., Ltd.) or V-8FM, but specific examples of the polymer additive are not limited thereto.
含有反應性官能基的矽酮改質(甲基)丙烯酸酯系聚合物可包括其中選自由羥基、具有1至10個碳原子的伸烷基醇、環氧基、胺基、硫醇基或羧基組成的群組的至少一個反應性官能基經取代的矽酮改質(甲基)丙烯酸酯系聚合物。The fluorenone modified (meth) acrylate type polymer containing a reactive functional group may include a alkylene group selected from a hydroxyl group, having 1 to 10 carbon atoms, an epoxy group, an amine group, a thiol group or At least one reactive functional group of the group consisting of carboxyl groups is substituted with an anthrone-modified (meth)acrylate-based polymer.
含有反應性官能基的矽酮改質(甲基)丙烯酸酯系聚合物的更具體實例包括羥基官能矽酮改質聚丙烯酸酯。其市售產品的實例包括畢克希爾-克林（BYK SIL-CLEAN）3700及類似產品，但此聚合物添加劑的具體實例並非僅限於此。More specific examples of the fluorenone-modified (meth) acrylate-based polymer containing a reactive functional group include a hydroxy-functional fluorenone-modified polyacrylate. Examples of the commercially available product thereof include BYK SIL-CLEAN 3700 and the like, but specific examples of the polymer additive are not limited thereto.
同時，第一黏合劑膜及第二黏合劑膜中的每一者可更包括透光載體基板，所述透光載體基板接觸透光基板的一個表面。Meanwhile, each of the first adhesive film and the second adhesive film may further include a light transmissive carrier substrate that contacts one surface of the light transmissive substrate.
第一黏合劑膜及第二黏合劑膜中的每一者中所包括的透光基板可用作半導體裝置或顯示裝置中的載體基板，但透光載體基板可根據製造製程中所需要的製程的類型及製程條件而更被選擇性地包括。The light-transmitting substrate included in each of the first adhesive film and the second adhesive film can be used as a carrier substrate in a semiconductor device or a display device, but the light-transmitting carrier substrate can be processed according to a process required in the manufacturing process The type and process conditions are more selectively included.
透光載體基板的類型不受限制，且舉例而言，可使用玻璃或透光聚合物樹脂膜。更具體而言，可使用在300奈米至600奈米的波長中透射率為50%或大於50%的玻璃或透光聚合物樹脂。The type of the light-transmitting carrier substrate is not limited, and for example, a glass or a light-transmitting polymer resin film can be used. More specifically, a glass or light-transmitting polymer resin having a transmittance of 50% or more in a wavelength of 300 nm to 600 nm can be used.
同時，為了在藉由對第一黏合劑膜進行選擇性曝光來選擇性地傳遞所述多個元件晶片的製程期間達成更有效的傳遞，可藉由經由曝光局部地改變第二黏合劑膜的黏合劑層的黏合力來提高僅將已與被選擇性曝光的第一黏合劑的黏合劑層接觸的元件晶片傳遞至第二黏合劑膜的製程期間的效率及準確性。Meanwhile, in order to achieve more efficient transfer during the process of selectively transferring the plurality of element wafers by selective exposure of the first adhesive film, the second adhesive film may be locally changed by exposure. The adhesion of the adhesive layer enhances the efficiency and accuracy of the process of transferring only the component wafer that has been in contact with the adhesive layer of the first adhesive that is selectively exposed to the second adhesive film.
更具體而言，所述傳遞微電子裝置的方法可更包括：在所述藉由使第一黏合劑膜接觸包括透光基板及形成於透光基板上的黏合劑層的第二黏合劑膜的黏合劑層對第一黏合劑膜上的所述多個元件晶片進行選擇性傳遞的步驟之前，藉由使用光罩將紫外射線照射透過第二黏合劑膜的透光基板對第二黏合劑膜的黏合劑層進行選擇性曝光的步驟，所述光罩具有被選擇性曝光的第一黏合劑膜的曝光圖案的倒像。More specifically, the method of transferring the microelectronic device may further include: contacting the first adhesive film with the second adhesive film including the light-transmitting substrate and the adhesive layer formed on the light-transmitting substrate Before the step of selectively transferring the plurality of component wafers on the first adhesive film by the adhesive layer, the ultraviolet light is irradiated through the transparent substrate of the second adhesive film to the second adhesive by using the photomask The adhesive layer of the film is subjected to a selective exposure process, the reticle having an inverted image of the exposure pattern of the first adhesive film that is selectively exposed.
在藉由將紫外射線照射透過第二黏合劑膜的透光基板對第二黏合劑膜的黏合劑層進行選擇性曝光的步驟中，可利用在藉由第一黏合劑膜的透光基板對所述多個元件晶片被傳遞至的黏合劑層的另一表面進行選擇性曝光的步驟中所利用的曝光方法或類似方法。In the step of selectively exposing the adhesive layer of the second adhesive film by irradiating ultraviolet rays through the transparent substrate of the second adhesive film, the transparent substrate pair by the first adhesive film may be utilized. An exposure method or the like used in the step of selectively exposing the other surface of the adhesive layer to which the plurality of element wafers are transferred.
第二黏合劑膜的黏合劑層的被選擇性曝光的部分對元件晶片的黏合力可低於第一黏合劑膜的黏合劑層的未曝光部分對元件晶片的黏合力，因而僅將已與被選擇性曝光的第一黏合劑接觸的元件晶片傳遞至第二黏合劑膜，且使得已與未選擇性曝光的第一黏合劑的黏合劑層以及第二黏合劑膜的黏合劑層的被選擇性曝光的部分接觸的元件晶片能夠保留在第一黏合劑膜中。The selectively exposed portion of the adhesive layer of the second adhesive film may have a lower adhesive force to the component wafer than the unexposed portion of the adhesive layer of the first adhesive film, and thus will only be The element wafer contacted by the selectively exposed first adhesive is transferred to the second adhesive film, and the adhesive layer of the first adhesive that has not been selectively exposed and the adhesive layer of the second adhesive film are The selectively exposed partially contacted component wafer can remain in the first adhesive film.
同時，所述傳遞微電子裝置的方法可更包括：將被傳遞至第二黏合劑膜的元件晶片傳遞至印刷電路板的步驟。Meanwhile, the method of transferring the microelectronic device may further include the step of transferring the component wafer transferred to the second adhesive film to the printed circuit board.
在所述傳遞微電子裝置的方法中，大小為5微米至300微米的元件晶片（例如，微發光二極體晶片或類似晶片）可以所期望的圖案形狀及大小來傳遞，且因此，被傳遞至第二黏合劑膜的元件晶片可易於傳遞至被設計成具有預定形狀及大小的印刷電路板。In the method of transferring a microelectronic device, an element wafer (for example, a micro light emitting diode wafer or the like) having a size of 5 micrometers to 300 micrometers can be transferred in a desired pattern shape and size, and thus, is transmitted The component wafer to the second adhesive film can be easily transferred to a printed circuit board designed to have a predetermined shape and size.
在將被傳遞至第二黏合劑膜的元件晶片傳遞至印刷電路板的步驟中，可使用此項技術中眾所習知的裝置及設備。舉例而言，可藉由各向異性導電膜與第二黏合劑膜之間的黏合力差值或在曝光之後黏合力減小的各向異性導電膜與第二黏合劑膜之間的黏合力差值來實施所述傳遞。In the step of transferring the component wafer to be transferred to the second adhesive film to the printed circuit board, devices and equipment well known in the art can be used. For example, the adhesion between the anisotropic conductive film and the second adhesive film can be reduced by the difference in the adhesive force between the anisotropic conductive film and the second adhesive film or the adhesive force after the exposure. The difference is used to implement the delivery.
同時，在將被選擇性地傳遞至第二黏合劑膜的黏合劑層的元件晶片傳遞至印刷電路板的步驟中，被選擇性傳遞的元件晶片可直接結合至印刷電路板，且此外，當藉由在元件晶片接觸印刷電路板的狀態下將紫外射線透射至元件在第二黏合劑膜中所結合的相對的表面來減小第二黏合劑膜的黏合劑層的黏合力時，可更有效地實施元件晶片向印刷電路板的傳遞。Meanwhile, in the step of transferring the element wafer to be selectively transferred to the adhesive layer of the second adhesive film to the printed circuit board, the selectively transferred element wafer can be directly bonded to the printed circuit board, and further, when When the adhesive force of the adhesive layer of the second adhesive film is reduced by transmitting the ultraviolet rays to the opposite surfaces of the elements bonded in the second adhesive film in a state where the component wafer contacts the printed circuit board, The transfer of the component wafer to the printed circuit board is effectively performed.
具體而言，將被選擇性地傳遞至第二黏合劑膜的黏合劑層的元件晶片傳遞至印刷電路板的步驟可更包括：在被選擇性地傳遞至第二黏合劑膜的黏合劑層的元件晶片與印刷電路板彼此接觸的同時，藉由第二黏合劑膜的透光基板對黏合劑層的另一表面進行曝光的步驟，被選擇性傳遞的元件晶片結合至所述黏合劑層的另一表面。Specifically, the step of transferring the component wafer selectively transferred to the adhesive layer of the second adhesive film to the printed circuit board may further include: bonding the adhesive layer selectively transferred to the second adhesive film While the component wafer and the printed circuit board are in contact with each other, the selectively transferred element wafer is bonded to the adhesive layer by the step of exposing the other surface of the adhesive layer by the transparent substrate of the second adhesive film The other surface.
印刷電路板的具體實例不受限制，且可使用常見的剛性印刷電路板（Rigid Printed Circuit Board，RPCB）或可撓性印刷電路板（Flexible Printed Circuit Board，FPCB）。Specific examples of the printed circuit board are not limited, and a common Rigid Printed Circuit Board (RPCB) or a Flexible Printed Circuit Board (FPCB) can be used.
可在與被選擇性地傳遞至第二黏合劑膜的黏合劑層的元件晶片接觸的印刷電路板的一個表面上形成各向異性導電膜。An anisotropic conductive film may be formed on one surface of the printed circuit board that is in contact with the element wafer selectively transferred to the adhesive layer of the second adhesive film.
以下，將參照圖式詳細地闡述本發明具體實施例的傳遞微電子裝置的方法。Hereinafter, a method of transferring a microelectronic device according to a specific embodiment of the present invention will be described in detail with reference to the drawings.
如圖1所示，使形成於晶圓的一個表面上的多個元件晶片移動（1）並接觸包括透光基板以及形成於透光基板上的黏合劑層的第一黏合劑膜的黏合劑層（2），且可根據黏合劑層的黏合力將形成於晶圓上的所述多個元件晶片傳遞至第一黏合劑膜的黏合劑層（3）。分別將形成於晶圓的一個表面上的所述多個元件分份（fractionate）並以所述多個元件晶片可被傳遞至第一黏合劑膜的黏合劑層的強度結合至晶圓。As shown in FIG. 1, the plurality of component wafers formed on one surface of the wafer are moved (1) and contacted with the adhesive of the first adhesive film including the light-transmitting substrate and the adhesive layer formed on the light-transmitting substrate. The layer (2), and the plurality of component wafers formed on the wafer are transferred to the adhesive layer (3) of the first adhesive film according to the adhesive force of the adhesive layer. The plurality of components formed on one surface of the wafer are separately fractionated and bonded to the wafer with the strength of the adhesive layer of the plurality of component wafers that can be transferred to the first adhesive film.
此外，可使用具有預定形狀及大小的圖案的光罩來照射紫外射線。此時，可根據光罩的圖案藉由第一黏合劑膜的透光基板對所述多個元件晶片被傳遞至的黏合劑層的另一表面進行選擇性曝光（4）。Further, a reticle having a pattern of a predetermined shape and size may be used to illuminate the ultraviolet rays. At this time, the other surface of the adhesive layer to which the plurality of element wafers are transferred may be selectively exposed (4) by the light-transmitting substrate of the first adhesive film according to the pattern of the reticle.
此外，當與所述多個元件晶片中的欲被傳遞的元件晶片接觸的第一黏合劑膜的黏合劑層的部分被選擇性曝光時，被曝光的第一黏合劑膜的黏合劑層的部分對元件晶片的黏合力會減小，而當第二黏合劑膜的黏合劑層接觸所述多個元件晶片的另一表面時，第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力變得小於第二黏合劑膜的黏合劑層對元件晶片的黏合力，因而僅傳遞已與被選擇性曝光的第一黏合劑的黏合劑層接觸的元件晶片。Further, when a portion of the adhesive layer of the first adhesive film that is in contact with the component wafer to be transferred among the plurality of component wafers is selectively exposed, the adhesive layer of the exposed first adhesive film Part of the adhesion to the component wafer is reduced, and when the adhesive layer of the second adhesive film contacts the other surface of the plurality of component wafers, the exposed portion of the adhesive layer of the first adhesive film is opposite to the component The adhesion of the wafer becomes less than the adhesion of the adhesive layer of the second adhesive film to the component wafer, and thus only the component wafer that has been in contact with the adhesive layer of the first adhesive that is selectively exposed is transferred.
亦即，可藉由使包括透光基板以及形成於透光基板上的黏合劑層的第二黏合劑膜的黏合劑層根據曝光部分接觸被傳遞至第一黏合劑膜的所述多個元件晶片對所述第二黏合劑膜的黏合劑層進行選擇性地傳遞（圖1的4、5及6）。That is, the adhesive layer of the second adhesive film including the light-transmitting substrate and the adhesive layer formed on the light-transmitting substrate can be transferred to the plurality of components of the first adhesive film according to the exposed portion contact. The wafer selectively transfers the adhesive layer of the second adhesive film (4, 5, and 6 of FIG. 1).
另外，使被選擇性地傳遞至第二黏合劑膜的黏合劑層的元件晶片接觸根據各向異性導電膜的圖案定位的印刷電路板，且因此可將所述元件晶片傳遞至印刷電路板（圖1的7、8及9）。In addition, the element wafer that is selectively transferred to the adhesive layer of the second adhesive film contacts the printed circuit board positioned according to the pattern of the anisotropic conductive film, and thus the element wafer can be transferred to the printed circuit board ( 7, 8, and 9) of Figure 1.
同時，如圖2所示，在此實施例的所述傳遞微電子裝置的方法中，在藉由使第一黏合劑膜接觸包括透光基板及形成於透光基板上的黏合劑層的第二黏合劑膜的黏合劑層對第一黏合劑膜上的所述多個元件晶片進行選擇性傳遞的步驟（圖2的4）之前，可藉由使用光罩將紫外射線照射透過第二黏合劑膜的透光基板對第二黏合劑膜的黏合劑層進行選擇性曝光，所述光罩具有被選擇性曝光的第一黏合劑膜的曝光圖案的倒像。Meanwhile, as shown in FIG. 2, in the method for transferring a microelectronic device of this embodiment, the first adhesive film is brought into contact with the adhesive layer including the light-transmitting substrate and the light-transmitting substrate. Before the step of selectively transferring the plurality of component wafers on the first adhesive film (4 of FIG. 2), the adhesive layer of the second adhesive film can irradiate the ultraviolet rays through the second adhesive by using the photomask. The light transmissive substrate of the film is selectively exposed to the adhesive layer of the second adhesive film having an inverted image of the exposure pattern of the first adhesive film that is selectively exposed.
就此而言，當藉由將紫外射線照射透過第二黏合劑膜的透光基板對第二黏合劑膜的黏合劑層進行選擇性曝光時，第二黏合劑膜的黏合劑層的被選擇性曝光的部分的黏合力會減小。因此，藉由使用具有被選擇性曝光的第一黏合劑膜的曝光圖案的倒像的光罩使已與被選擇性曝光的第一黏合劑的黏合劑層接觸的元件晶片接觸第二黏合劑膜的黏合劑層的未選擇性曝光的部分。In this regard, when the adhesive layer of the second adhesive film is selectively exposed by irradiating ultraviolet rays through the transparent substrate of the second adhesive film, the adhesive layer of the second adhesive film is selectively selected. The adhesion of the exposed portion is reduced. Therefore, the element wafer that has been in contact with the adhesive layer of the selectively exposed first adhesive is brought into contact with the second adhesive by using a photomask having an inverted image of the exposure pattern of the first adhesive film selectively exposed. The portion of the adhesive layer of the film that is not selectively exposed.
如圖2所示，具有被選擇性曝光的第一黏合劑膜的曝光圖案的倒像的光罩是指能夠在第二黏合劑膜的黏合劑層上形成與被選擇性曝光的第一黏合劑膜的曝光圖案相反的曝光圖案的光罩。As shown in FIG. 2, the photomask having the inverted image of the exposure pattern of the selectively exposed first adhesive film means that the first adhesive bond capable of being selectively exposed is formed on the adhesive layer of the second adhesive film. The mask of the exposure pattern of the film of the opposite exposure pattern is exposed.
同時，如圖2所示，第一半導體膜及第二半導體膜中的每一者更更包括透光載體基板，例如玻璃或透光聚合物樹脂膜。Meanwhile, as shown in FIG. 2, each of the first semiconductor film and the second semiconductor film further includes a light transmissive carrier substrate such as a glass or a light transmissive polymer resin film.
同時，如圖3所示，在此實施例的所述傳遞微電子裝置的方法中，在將被選擇性地傳遞至第二黏合劑膜的黏合劑層的元件晶片傳遞至印刷電路板之後，可藉由再次使用第二黏合劑膜對形成於第一黏合劑膜上的元件晶片進行選擇性地重新傳遞。Meanwhile, as shown in FIG. 3, in the method of transferring a microelectronic device of this embodiment, after the component wafer to be selectively transferred to the adhesive layer of the second adhesive film is transferred to the printed circuit board, The component wafer formed on the first adhesive film can be selectively retransmitted by using the second adhesive film again.
此時，藉由移動光罩或將具有不同形狀的光罩定位於第一黏合劑膜的透光基板的下部處，可對與先前未傳遞的元件晶片的下部接觸的第一黏合劑膜的黏合劑層進行曝光。At this time, by moving the reticle or positioning the reticle having a different shape at the lower portion of the transparent substrate of the first adhesive film, the first adhesive film that is in contact with the lower portion of the previously untransmitted component wafer can be The adhesive layer is exposed.
另外，相似於圖1及圖2，當與所述多個元件晶片中的欲被傳遞的元件晶片接觸的第一黏合劑膜的黏合劑層的部分被選擇性曝光時，被曝光的第一黏合劑膜的黏合劑層的部分對元件晶片的黏合力會減小，而當第二黏合劑膜的黏合劑層接觸第一黏合劑膜上的所述多個元件晶片的另一表面時，第一黏合劑膜的黏合劑層的被曝光部分對元件晶片的黏合力變得小於第二黏合劑膜的黏合劑層對元件晶片的黏合力，因而僅傳遞已與被選擇性曝光的第一黏合劑的黏合劑層接觸的元件晶片。In addition, similar to FIG. 1 and FIG. 2, when a portion of the adhesive layer of the first adhesive film that is in contact with the component wafer to be transferred among the plurality of component wafers is selectively exposed, the first exposed The adhesive layer of the adhesive film may have a reduced adhesion to the component wafer, and when the adhesive layer of the second adhesive film contacts the other surface of the plurality of component wafers on the first adhesive film, The adhesive portion of the exposed portion of the adhesive layer of the first adhesive film becomes less than the adhesive force of the adhesive layer of the second adhesive film to the device wafer, and thus only transmits the first contact that has been selectively exposed The component wafer that the adhesive layer of the adhesive contacts.
同時，如圖4所示，被選擇性地傳遞至第二黏合劑膜的黏合劑層的元件晶片（1）在接觸印刷電路板（2）的同時將紫外射線透射所述裝置在第二黏合劑膜中所結合的相對的表面上，以減小第二黏合劑膜的黏合劑層的黏合力，且可因此易於傳遞至印刷電路板。Meanwhile, as shown in FIG. 4, the element wafer (1) selectively transferred to the adhesive layer of the second adhesive film transmits the ultraviolet ray to the device at the second bonding while contacting the printed circuit board (2). The opposing surfaces of the film are bonded to reduce the adhesion of the adhesive layer of the second adhesive film and can thus be easily transferred to the printed circuit board.
當藉由第二黏合劑膜的透光基板對被選擇性地傳遞的元件晶片所結合的黏合劑層的另一表面進行曝光時，第二黏合劑膜的黏合劑層的黏合力可大大減小，且因此，可容易地及高效地對元件晶片進行選擇並自第二黏合劑膜傳遞至印刷電路板，而無需利用單獨的剝離製程或用於額外傳遞的裝置。When the other surface of the adhesive layer bonded by the selectively transferred element wafer is exposed by the light-transmitting substrate of the second adhesive film, the adhesive force of the adhesive layer of the second adhesive film can be greatly reduced Small, and therefore, the component wafer can be easily and efficiently selected and transferred from the second adhesive film to the printed circuit board without the need for a separate stripping process or means for additional transfer.
1‧‧‧元件晶片1‧‧‧Component wafer
2‧‧‧印刷電路板2‧‧‧Printed circuit board
3‧‧‧黏合劑層3‧‧‧Binder layer
4‧‧‧光罩4‧‧‧Photomask
①、②、③、④、⑤、⑥、⑦、⑧、⑨‧‧‧步驟1, 2, 3, 4, 5, 6, 7, 8, 9‧ ‧ steps
圖1示意性地示出根據本發明實施例的傳遞微電子裝置的方法的一個實例。 圖2示意性地示出根據本發明實施例的傳遞微電子裝置的方法的另一實例。 圖3示意性地示出根據本發明實施例的傳遞微電子裝置的方法的再一實例。 圖4示意性地示出根據本發明實施例的傳遞微電子裝置的方法的又一實例。FIG. 1 schematically illustrates an example of a method of transferring a microelectronic device in accordance with an embodiment of the present invention. FIG. 2 schematically illustrates another example of a method of transferring a microelectronic device in accordance with an embodiment of the present invention. FIG. 3 schematically illustrates still another example of a method of transferring a microelectronic device in accordance with an embodiment of the present invention. FIG. 4 schematically illustrates yet another example of a method of transferring a microelectronic device in accordance with an embodiment of the present invention.
Claims (17)
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| ??10-2016-0179493 | 2016-12-26 | ||
| KR1020160179493A KR20180075310A (en) | 2016-12-26 | 2016-12-26 | Method of transferring micro electronic device |
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| JP4548087B2 (en) * | 2003-10-29 | 2010-09-22 | セイコーエプソン株式会社 | device |
| US7662545B2 (en) * | 2004-10-14 | 2010-02-16 | The Board Of Trustees Of The University Of Illinois | Decal transfer lithography |
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| KR20140042317A (en) * | 2012-09-28 | 2014-04-07 | 하나 마이크론(주) | Apparatus of transferring flexible integrated circuit device for manufacturing package |
| KR101632504B1 (en) * | 2014-10-29 | 2016-06-21 | 한국과학기술원 | method for the fabrication of nanostructures based on adhesion control using solvent vapor and nanotransfer printing using the same |
| KR101605317B1 (en) * | 2014-11-20 | 2016-03-23 | 한국기계연구원 | Optical selective transferring apparatus and its method for thin film devices |
| JP2018515942A (en) * | 2015-10-20 | 2018-06-14 | ゴルテック インコーポレイテッド | Micro light-emitting diode transport method, manufacturing method, apparatus, and electronic apparatus |
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| TWI658340B (en) | 2019-05-01 |
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