CN110098289A - A kind of production method of transfer device and display base plate - Google Patents
A kind of production method of transfer device and display base plate Download PDFInfo
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- CN110098289A CN110098289A CN201910376049.XA CN201910376049A CN110098289A CN 110098289 A CN110098289 A CN 110098289A CN 201910376049 A CN201910376049 A CN 201910376049A CN 110098289 A CN110098289 A CN 110098289A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 206010034960 Photophobia Diseases 0.000 claims abstract description 10
- 208000013469 light sensitivity Diseases 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 38
- 239000003086 colorant Substances 0.000 claims description 22
- 239000011651 chromium Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 238000010586 diagram Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention provides the production method of a kind of transfer device and display base plate, the transfer device includes: transparent carrier, and a side surface of the transparent carrier is provided with multiple adhesion parts being intervally arranged, and the adhesion part uses light sensitivity cohesive material.Transfer device through the embodiment of the present invention can simplify the technique production process of display base plate, and manufacturing yield can be improved.
Description
Technical field
The present invention relates to technical field of liquid crystal display, in particular to the production method of a kind of transfer device and display base plate.
Background technique
During display device is made in Micro LED (light emitting diode) chip, it usually needs a large amount of (will count with hundred
Ten thousand grades) Micro LED chip be transferred in drive substrate and form LED array, be difficult to since Micro LED core chip size is small
It precisely aligns, is easy not being successfully connected with drive substrate in transfer process, causes bad point, reduce manufacturing yield.
Summary of the invention
The embodiment of the invention provides the production methods of a kind of transfer device and display base plate, to solve existing display base
The low problem of the production method manufacturing yield of plate.
In a first aspect, the embodiment of the invention provides a kind of transfer devices, comprising:
Transparent carrier, a side surface of the transparent carrier are provided with multiple adhesion parts being intervally arranged, the adhesion part
Using light sensitivity cohesive material.
Optionally, a side surface of the transparent carrier is provided with multiple protrusions being intervally arranged；The adhesion part is located at
The side of the protrusion far from the transparent carrier.
Optionally, another side surface of the transparent carrier is provided with multiple opaque patterns, the opaque patterns it
Between gap be overlapped in the orthographic projection on the transparent carrier with orthographic projection of the adhesion part on the transparent carrier.
Optionally, the opaque patterns are formed by chromium Cr film.
Second aspect, the embodiment of the invention also provides a kind of production methods of display base plate, comprising:
Light-emitting diode LED chip is adhered to using transfer device as described above, the LED chip is adhered to described viscous
In attached portion；
The LED chip is transferred in drive substrate, far from the side pair of the adhesion part from the transparent carrier
The adhesion part is irradiated so that the adhesiveness of the adhesion part reduces, the LED chip and the adhesion section from.
Optionally, the display base plate includes: the first color LED chip, the second color LED core of successively array setting
Piece ... and N color LED chip, wherein N is the integer more than or equal to 2；
Described that LED chip is transferred to drive substrate, the side from the transparent carrier far from the adhesion part is to viscous
Attached portion is irradiated so that the adhesiveness of adhesion part reduces, LED chip and adhesion section from, comprising:
It puts in order according to LED modules with different colors chip is preset on display base plate, successively turns each color LED chip
Move to drive substrate.
Optionally, described to put in order according to LED modules with different colors chip is preset on display base plate, successively by each face
Color LED chip is transferred to drive substrate, comprising:
It puts in order according to LED modules with different colors chip is preset on display base plate, the i-th color LED chip is turned
The i-th bit for moving to the drive substrate is set and is bonded, wherein 1≤i≤N and i are integer；
Adhesion part is irradiated from the side that the transparent carrier is provided with opaque patterns, so that the adherency of adhesion part
Property reduce, the i-th color LED chip and adhesion section from；
Repeat it is described put in order according to LED modules with different colors chip is preset on display base plate, by the i+1
It the step of color LED chip is transferred to the i+1 position of the drive substrate and is bonded and described is set from the transparent carrier
The side for being equipped with opaque patterns is irradiated adhesion part, so that the adhesiveness of adhesion part reduces, i+1 color LED chip
With adhesion section from the step of, until the LED chip of all N number of colors is transferred in the drive substrate, wherein described i-th
+ 1 position is the adjacent position that the i-th bit is set.
Optionally, the side from the transparent carrier far from the adhesion part is irradiated adhesion part, so that
The adhesiveness of adhesion part reduces, LED chip and adhesion section from, comprising:
Adhesion part is irradiated using ultraviolet light UV from the side that the transparent carrier is provided with opaque patterns, is made
The adhesiveness of adhesion part reduces, LED chip and adhesion section from.
The embodiment of the present invention has the following beneficial effects:
In embodiments of the present invention, in the adhesion part of a side surface of transfer device setting light sensitivity, pass through the adherency
LED chip can be transferred in drive substrate by portion.And it is provided in another side surface of the transparent carrier multiple impermeable
Light figure, it is described it is opaque between gap be transparent figure, the gap between the opaque patterns is in the transparent carrier
On orthographic projection be overlapped with orthographic projection of the adhesion part on the transparent carrier, LED chip is being transferred to drive substrate
After upper, the adhesion part is irradiated from the side that the transparent carrier is provided with opaque patterns, the adhesion part is glued
Attached property reduces, and the LED chip and the adhesion section are from completing the transfer process of LED chip.Through the embodiment of the present invention
Transfer device can simplify the technique production process of display base plate, and manufacturing yield can be improved.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the transfer device of the embodiment of the present invention；
Fig. 2 is the arrangement schematic diagram of the impermeable light image of the embodiment of the present invention；
Fig. 3 is one of the schematic diagram of manufacturing method of display base plate of the embodiment of the present invention；
Fig. 4 is the schematic diagram of the display base plate of the embodiment of the present invention；
Fig. 5 is one of the schematic diagram of step 301 of the embodiment of the present invention；
Fig. 6 is the two of the schematic diagram of the step 301 of the embodiment of the present invention；
Fig. 7 is the three of the schematic diagram of the step 301 of the embodiment of the present invention；
Fig. 8 is one of the schematic diagram of step 302 of the embodiment of the present invention；
Fig. 9 is the two of the schematic diagram of the step 302 of the embodiment of the present invention；
Figure 10 is the three of the schematic diagram of the step 302 of the embodiment of the present invention；
Figure 11 is the structural representation for the display base plate of the embodiment of the present invention obtained according to Fig. 5 to method shown in Fig. 10
Figure；
Figure 12 is the three of the schematic diagram of manufacturing method of the display base plate of the embodiment of the present invention.
Specific embodiment
To keep the technical problem to be solved in the present invention, technical solution and advantage clearer, below in conjunction with attached drawing and tool
Body embodiment is described in detail.
Referring to Fig. 1, the embodiment of the invention provides a kind of transfer devices 1, comprising: transparent carrier 11；The transparent carrier
11 side surface is provided with multiple adhesion parts 12 being intervally arranged, and the adhesion part 12 uses light sensitivity cohesive material；It is described
Another side surface of transparent carrier 11 is provided with multiple opaque patterns 131, and the gap between the opaque patterns 131 is in institute
The orthographic projection stated on transparent carrier 11 is overlapped with orthographic projection of the adhesion part 12 on the transparent carrier 11.
In embodiments of the present invention, the adhesion part 12 is light sensitivity cohesive material, and the adhesion part 12 is without photograph
When penetrating, the adhesiveness of the adhesion part 12 is larger, can adhere to LED (light emitting diode) chip by adhesion part 12, and by LED
Chip is transferred in drive substrate 2.After LED chip is transferred to drive substrate 2, (example can be carried out to the adhesion part 12
It such as: ultraviolet light) irradiates, the adhesiveness of the adhesion part 12 can reduce, so that the adhesion part 12 is separated with LED chip.
In embodiments of the present invention, the adhesion part 12 includes at least: by coating or printing type in the transparent load
The adhesion layer formed on body 11.A default spacing is provided between the adjacent adhesion part 12, the default spacing can root
It is determined according to the spacing between LED chip on display base plate.
In embodiments of the present invention, a side surface of the transparent carrier 11 is provided with multiple protrusions 111 being intervally arranged；
Adhesion part 12 is provided on described raised 111, the adhesion part 12 is located at described raised 111 one far from the transparent carrier 11
Side.It is understood that being provided with default spacing between adjacent protrusion 111, raised 111 shape can be with LED core
The shape of piece is identical, and light sensitivity cohesive material is formed adhesion layer on described raised 111 by coating or printing type.
In embodiments of the present invention, mask layer 13, the mask layer are provided on the another side of the transparent carrier 11
13 include: the opaque patterns 131 and transparent figure 132 (as shown in Figure 2) of successively array setting, the opaque patterns 131
Between gap be transparent figure 132, the shape of the transparent figure 132 can be identical as the shape of LED chip, described
Light figure 132 is correspondingly arranged with the protrusion 111 on transparent carrier 11, i.e., the gap between the described opaque patterns 131 is described
Orthographic projection on transparent carrier 11 is overlapped with described raised 111 orthographic projection on the transparent carrier 11.It is wherein described impermeable
Light figure 131 can be formed by chromium Cr film, be of course not solely limited to this.
Due to orthographic projection of the gap between the opaque patterns 131 on the transparent carrier 11 and the adhesion part
12 orthographic projection on the transparent carrier 11 is overlapped, when the side for being provided with opaque patterns 131 from the transparent carrier 11
The adhesion part 12 is irradiated, incident light is injected in the transparent carrier 11 by the gap between opaque patterns 131,
And reached at the adhesion part 12 by the transparent carrier 11, the adhesion part 12 is irradiated by incident light to adjust
The adhesiveness of the adhesion part 12.
In embodiments of the present invention, in the adhesion part 12 of a side surface of transfer device 1 setting light sensitivity, by described viscous
LED chip can be transferred in drive substrate 2 by attached portion 12.And it is provided in another side surface of the transparent carrier 11 more
A opaque patterns 131, it is described it is opaque between gap be transparent figure, the gap between the opaque patterns 131 exists
Orthographic projection on the transparent carrier 11 is overlapped with orthographic projection of the adhesion part 12 on the transparent carrier 11, by LED
After chip is transferred in drive substrate 2, the side of opaque patterns 131 is provided with to the adhesion part from the transparent carrier 11
12 are irradiated, and the adhesiveness of the adhesion part 12 reduces, and the LED chip is separated with the adhesion part 12, complete LED chip
Transfer process.Transfer device 1 through the embodiment of the present invention can simplify the technique production process of display base plate, and can be with
Improve manufacturing yield.
Referring to Fig. 3, the embodiment of the invention also provides a kind of production method of display base plate, detailed process includes following step
It is rapid:
Step 301: adhering to LED chip using transfer device 1 as described above, LED chip is adhered to the adhesion part
On 12；
Wherein, the LED chip can be Micro LED chip, be of course not solely limited to this.
In embodiments of the present invention, the adhesion part 12 is light sensitivity cohesive material, and the adhesion part 12 is without photograph
When penetrating, the adhesiveness of the adhesion part 12 is larger, can adhere to LED chip by adhesion part 12, LED chip is being transferred to drive
After dynamic substrate 2, the adhesion part 12 can be carried out (such as: ultraviolet light) it irradiates, the adhesiveness of the adhesion part 12 can drop
It is low, so that the adhesion part 12 is separated with LED chip.
In embodiments of the present invention, step 301 is related with the structure of the display base plate, if the display base plate includes:
Successively the first color LED chip, the second color LED chip ... and the N color LED chip of array setting, wherein N is big
In or equal to 2 integer.It, can the preset arrangement on display base plate according to LED modules with different colors chip in executing step 301
Sequentially, come determine different colours LED chip adherency sequence.
Step 302: the LED chip being transferred in drive substrate 2, far from the adherency from the transparent carrier 11
The side in portion 12 is irradiated the adhesion part 12, so that the adhesiveness of the adhesion part 12 reduces, the LED chip and institute
State the separation of adhesion part 12.
In embodiments of the present invention, another side surface of the transparent carrier 11 is provided with multiple opaque patterns 131, institute
Orthographic projection of the gap on the transparent carrier 11 between opaque patterns 131 is stated with the adhesion part 12 in the transparent load
Orthographic projection on body is overlapped, and the side of opaque patterns 131 can be provided with from the transparent carrier 11 to the adhesion part 12
It is irradiated, to adjust the adhesiveness of the adhesion part 12.In this way, can prevent from entering when being irradiated the adhesion part 12
It penetrates light and adverse effect is caused to other light-sensitive devices in the drive substrate 2.
In embodiments of the present invention, it after the LED chip being transferred in drive substrate 2, is set from the transparent carrier 11
It is equipped with the side projection incident light (such as: ultraviolet light) of opaque patterns 131, incident light passes through the opaque patterns 131
Between gap be incident in the transparent carrier 11, since the gap between the opaque patterns 131 is in the transparent load
Orthographic projection on body 11 is overlapped with orthographic projection of the adhesion part 12 on the transparent carrier 11, so that incident light is further thrown
It is incident upon at the adhesion part 12, the adhesion part 12 is irradiated by incident light to adjust the adherency of the adhesion part 12
Property.
In embodiments of the present invention, step 302 is equally related with the structure of the display base plate, if the display base plate packet
It includes: successively the first color LED chip, the second color LED chip ... and the N color LED chip of array setting, wherein N
For the integer more than or equal to 2.It, can be preset on display base plate according to LED modules with different colors chip in executing step 302
It puts in order, to determine transfer sequence that the LED chip of different colours is transferred in drive substrate 2.I.e. according to LED modules with different colors
Chip is preset on display base plate to put in order, and each color LED chip is successively transferred to drive substrate 2.
Such as: referring to fig. 4, the display base plate includes: the first color LED chip 41, the second face of successively array setting
Color LED chip 42 and third color LED chip 43, the first color LED chip 41 can be blue LED die, described the
Second colors LED chip 42 can be green LED chip, and the third color LED chip 43 can be red LED chips.Referring to
Fig. 6 and Fig. 7 first can selectively grab the first color LED chip 41 of adherency when executing step 301 on bearing substrate 4.
Referring to Fig. 8 to Figure 10, when executing step 302, after the first color LED chip 41 is transferred to drive substrate 2 and is bonded, pass through
Incident light 3 (such as: ultraviolet light) is provided with the side of opaque patterns 131 to the adhesion part 12 from the transparent carrier 11
It is irradiated, so that 12 material solidification of adhesion part, the i.e. adhesiveness of adhesion part 12 are greatly lowered, so that the adhesion part
12 separate with the first color LED chip 41.The above manufacturing process is repeated, is executed later by the second color LED chip
42 the step of being transferred to drive substrate 2 and being bonded, after the adhesion part 12 is separated with the second color LED chip 42,
Execute the step of third color LED chip 43 is transferred to drive substrate 2 and is bonded again, then by the adhesion part 12 and described the
The separation of three color LED chips 43, completes the transfer process of the LED chip of display base plate shown in Fig. 4, and wherein Figure 11 is according to figure
The structural schematic diagram of 5 display base plates obtained to method shown in Fig. 10.
In embodiments of the present invention, in the adhesion part 12 of a side surface of transfer device 1 setting light sensitivity, by described viscous
LED chip can be transferred in drive substrate 2 by attached portion 12.And it is provided in another side surface of the transparent carrier 11 more
A opaque patterns 131, it is described it is opaque between gap be transparent figure, the gap between the opaque patterns 131 exists
Orthographic projection on the transparent carrier 11 is overlapped with orthographic projection of the adhesion part 12 on the transparent carrier 11, by LED
After chip is transferred in drive substrate 2, the side of opaque patterns 131 is provided with to the adhesion part from the transparent carrier 11
12 are irradiated, and the adhesiveness of the adhesion part 12 reduces, and the LED chip is separated with the adhesion part 12, complete LED chip
Transfer process.
Currently, the transfer techniques of LED chip include: Electrostatic Absorption, electromagnetic adsorption, fluid assembly, micro- transfer, radium-shine transfer
Etc. technologies, every kind of transfer techniques have advantage and disadvantage.Wherein in micro- transfer, by changing the speed of print head, the property of can choose
Change Van der Waals force between print head and Micro LED chip, to realize the transfer of Micro LED chip, and print head with
Molecular force control is complicated between Micro LED chip, and elastic print head is easy to happen deformation, then will cause and misroutes shifting.
Compared with the transfer techniques of existing existing LED chip, the production method of the embodiment of the present invention is by using as above
The transfer device 1 can simplify the technique production process of display base plate, and manufacturing yield can be improved.
Referring to Figure 12, the embodiment of the invention also provides the production methods of another display base plate, wherein the display base
Plate includes: the first color LED chip 41, the second color LED chip 42 ... and the N color LED core of successively array setting
Piece, wherein N is integer more than or equal to 2, the detailed process of the production method of the display base plate the following steps are included:
Step 1201: putting in order according to LED modules with different colors chip is preset on display base plate, using as described above
Transfer device 1 adheres to the i-th color LED chip, and the i-th color LED chip is adhered in the adhesion part 12；
Step 1202: putting in order according to LED modules with different colors chip is preset on display base plate, by i-th color
The i-th bit that LED chip is transferred to the drive substrate 2 is set and is bonded, wherein 1≤i≤N and i are integer；
Step 1203: adhesion part 12 is irradiated from the side that the transparent carrier 11 is provided with opaque patterns 131,
So that the adhesiveness of adhesion part 12 reduces, the i-th color LED chip is separated with adhesion part 12；
Step 1204: judging whether i+1 is less than N；If i+1 is equal to N, terminate process, if i+1 is less than N, repeats
Step 1201 puts in order, by the i+1 to step 1203 according to LED modules with different colors chip is preset on display base plate
Color LED chip is transferred to the i+1 position of the drive substrate 2 and is bonded, and is provided with not from the transparent carrier 11
The side of transparent figure 131 is irradiated adhesion part 12, so that the adhesiveness of adhesion part 12 reduces, i+1 color LED chip
It is separated with adhesion part 12, until the LED chip of all N number of colors is transferred in the drive substrate.
In embodiments of the present invention, the i+1 position is the adjacent position that the i-th bit is set.
In embodiments of the present invention, it can use ultraviolet light UV, the transparent carrier 11 be provided with opaque patterns
131 side is irradiated adhesion part 12, so that the adhesiveness of adhesion part 12 reduces, LED chip is separated with adhesion part 12.
In embodiments of the present invention, it can put in order according to LED modules with different colors chip is preset on display base plate, according to
It is secondary to adhere to each color LED chip in adhesion part 12, then each color LED chip is transferred to by driving by adhesion part 12
Substrate 2, to complete the transfer process of the LED chip of different colours.The production method of the embodiment of the present invention is by using as above
The transfer device 1 can simplify the technique production process of display base plate, and manufacturing yield can be improved.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (8)
1. a kind of transfer device characterized by comprising
Transparent carrier, a side surface of the transparent carrier are provided with multiple adhesion parts being intervally arranged, and the adhesion part uses
Light sensitivity cohesive material.
2. transfer device according to claim 1, which is characterized in that another side surface of the transparent carrier is provided with more
A opaque patterns, orthographic projection and the adhesion part of the gap on the transparent carrier between the opaque patterns are in institute
The orthographic projection stated on transparent carrier is overlapped.
3. transfer device according to claim 1, which is characterized in that a side surface of the transparent carrier is provided with multiple
The protrusion being intervally arranged；The adhesion part is located at the side of the protrusion far from the transparent carrier.
4. transfer device according to claim 2, which is characterized in that the opaque patterns are formed by chromium Cr film.
5. a kind of production method of display base plate characterized by comprising
Light-emitting diode LED chip is adhered to using the described in any item transfer devices of such as Claims 1-4, by the LED chip
It is adhered in the adhesion part；
The LED chip is transferred in drive substrate, the side from the transparent carrier far from the adhesion part is to described
Adhesion part is irradiated so that the adhesiveness of the adhesion part reduces, the LED chip and the adhesion section from.
6. the production method of display base plate according to claim 5, which is characterized in that the display base plate includes: successively
Array setting the first color LED chip, the second color LED chip ... and N color LED chip, wherein N be greater than or
Integer equal to 2；
Described that LED chip is transferred to drive substrate, the side from the transparent carrier far from the adhesion part is to adhesion part
Be irradiated so that the adhesiveness of adhesion part reduces, LED chip and adhesion section from, comprising:
It puts in order according to LED modules with different colors chip is preset on display base plate, is successively transferred to each color LED chip
Drive substrate.
7. the production method of display base plate according to claim 6, which is characterized in that described according to LED modules with different colors core
Piece is preset on display base plate to put in order, and each color LED chip is successively transferred to drive substrate, comprising:
It puts in order, the i-th color LED chip is transferred to described according to LED modules with different colors chip is preset on display base plate
The i-th bit of drive substrate is set and is bonded, wherein 1≤i≤N and i are integer；
Adhesion part is irradiated from the side that the transparent carrier is provided with opaque patterns, so that the adhesiveness of adhesion part drops
It is low, the i-th color LED chip and adhesion section from；
Repeat it is described put in order according to LED modules with different colors chip is preset on display base plate, by the i+1 color
It the step of LED chip is transferred to the i+1 position of the drive substrate and is bonded and described is provided with from the transparent carrier
The side of opaque patterns is irradiated adhesion part, so that the adhesiveness of adhesion part reduces, i+1 color LED chip and viscous
Attached part from the step of, until the LED chip of all N number of colors is transferred in the drive substrate, wherein the i+1 position
It is set to the adjacent position that the i-th bit is set.
8. the production method of display base plate according to claim 6, which is characterized in that described remote from the transparent carrier
Side from the adhesion part is irradiated adhesion part, so that the adhesiveness of adhesion part reduces, LED chip and adhesion section
From, comprising:
Adhesion part is irradiated using ultraviolet light UV from the side that the transparent carrier is provided with opaque patterns, so that viscous
The adhesiveness in attached portion reduces, LED chip and adhesion section from.
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| CN201910376049.XA CN110098289A (en) | 2019-05-07 | 2019-05-07 | A kind of production method of transfer device and display base plate |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341710A (en) * | 2020-03-12 | 2020-06-26 | Tcl华星光电技术有限公司 | LED chip transfer system and LED chip transfer method |
| CN112530853A (en) * | 2019-09-19 | 2021-03-19 | 株式会社日本显示器 | Component transfer apparatus and method for manufacturing component assembly |
| CN112701076A (en) * | 2019-10-23 | 2021-04-23 | 北京小米移动软件有限公司 | Display screen manufacturing method and system |
| CN113345829A (en) * | 2021-06-07 | 2021-09-03 | 厦门乾照半导体科技有限公司 | Mass transfer method of micro light-emitting diode, display device and manufacturing method thereof |
| CN113611787A (en) * | 2021-08-02 | 2021-11-05 | 东莞市中麒光电技术有限公司 | Chip transfer structure and Micro LED display module repair method |
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